1. General description
The PN533 is a highly integrated transceiver module for contactless communication at
13.56 MHz based on the 80C51 microcontroller core. A dedicated ROM code is
implemented to handle different RF protocols.
1.1 RF protocols
The PN533 supports four main operating modes:
ISO/IEC 14443A Reader/Writer (including MIFARE product family)
ISO/IEC 14443B Reader/Writer
FeliCa Reader/Writer
ISO/IEC 18092, ECMA 340 Peer-to-Peer
The PN533 hardware implements a demodulator and decoder for signals from
ISO/IEC 14443A compatible cards and transponders. The PN533 hardware handles the
complete ISO/IEC 14443A framing and error detection and upper layers of this protocol
(i.e. ISO/IEC 14443-4) are implemented in firmware.
The PN533 supports all MIFARE products (e.g. MIFARE crypto method). It supports
contactless communication using higher transfer speeds up to 848 kbit/s in both
directions.
The PN533 hardware supports layers 2 and 3 of the ISO/IEC 14443B Reader/Writer
communication scheme, except anticollision. Anticollision is implemented in firmware as
well as upper layers (i.e. ISO/IEC 14443-4).
The PN533 can demodulate and decode FeliCa coded signals. The PN533 handles the
FeliCa framing and error detection. It supports contactless communication using FeliCa
Higher transfer speeds up to 424 kbit/s in both directions.
Compliant to ECMA 340 a nd ISO/IEC 18092 NFCIP- 1 Passive and Active communi cation
modes, the PN5331B3HN/C270 offers the possibility to communicate to another NFCIP-1
compliant device, at transfer speeds up to 424 kbit/s. The PN533 handles the complete
NFCIP-1 framing and error detection.
1.2 Interfaces
The PN533 supports USB 2.0 full speed interface (bus powered or host powered mode).
PN533 also has a master I2C interface enabling the drive of following peripherals:
An external EEPROM
A TDA8029 smart card reader
PN533
Near Field Communication (NFC) controller
Rev. 3.3 — 16 July 2012
158233 Product short data sheet
PUBLIC
PN533_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC Rev. 3.3 — 16 July 2012
158233 2 of 9
NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
1.3 Standards compliancy
PN533 offers commands in order for applications to be compliant in reader mode with
“Paypass-ISO/IEC 14443 Implementation v1.1”.
PN533 support s RF protocols ISO/IEC 14443A an d B such as compliancy with Sm art eID
standard can be achieved at application level.
A dedicated command is implemented in PN533 firmware to support NFC secur e
applications in accordance with “N FC sec Security layer for NFC” specification in order to
enable USB wireless or BT enabler applications in a host baseband.
2. Features and benefits
80C51 microcontroller core with 45056 bytes ROM and 12 24 bytes RAM
Highly integrated demodulator and decoder
Buffered output drivers to connect an antenna with minimum number of external
components
Integrated RF level detector
Integrated data mode detector
Supports ISO/IEC 14443A Reader/Writer mode up to 848 kbit/s
Supports ISO/IEC 14443B Reader/Writer mode up to 848 kbit/s
Supports MIFARE enc ryp tio n in Read er /Writer mo de an d hig h er tran sf er speed
communicat ion at 21 2 kb it/s, 424 kbit/s and 848kbit/s
Supports contactless communication according to the FeliCa protocol at 212 kbit/s and
424 kbit/s
Typical operating distance in Reader/Writer mode for communication to
ISO/IEC 14443A/MIFARE, ISO/IEC 14443B or FeliCa cards up to 50 mm depending
on antenna size and tuning
Support NFCIP-1 mo d e up to 424 kbit /s
Typical operating dist ance in NFCIP- 1 mode up to 50 mm depen ding on ante nna size ,
tuning and power supply
Supported USB 2. 0 full spee d int er fa ce
Restricted I2C master interface to control an external I2C EEPROM or TDA8029 smart
card reader
Low-power mod es
Hard-Power-Down mode
Soft-Power-Down mode
27.12 MHz Crystal oscillator
On-Chip PLL to generate internally 96 MHz for the USB interface
Power modes
USB bus power mode
2.5 V to 3.6 V power supply operating range in non-USB bus power mode
Dedicated IO ports for external device control
PN533_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC Rev. 3.3 — 16 July 2012
158233 3 of 9
NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
3. Quick reference data
[1] VDDD, VDDA and VDD(TVDD) must always be at the same supply voltage.
4. Ordering information
[1] 70 refers to the ROM code version described in User Manual.
[2] Refer to Section 9.4 “Licenses
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VBUS bus supply voltage 4.02 5 5.25 V
(non-USB mode);
VBUS =V
DDD; VSSD =0V 2.5 3.3 3.6 V
VDDA analog supply voltage VDDA = VDDD = VDD(TVDD) =
VDD(PVDD); VSSA = VSSD =
VSS(PVSS) = VSS(TVSS) = 0 V
[1] 2.5 3.3 3.6 V
VDDD digital supply voltage [1] 2.5 3.3 3.6 V
VDD(TVDD) TVDD supply voltage [1] 2.5 3.3 3.6 V
VDD(PVDD) PVDD supply voltage 1.6 - 3.6 V
VDD(SVDD) SVDD supply voltage VSSA = VSSD = VSS(PVSS) =
VSS(TVSS) = 0 V; reserved for
future use
VDDD0.1 - VDDD V
IBUS bus supply current maximum load current (USB
mode); measured on VBUS
150 mA
maximum inrush current
limitation; at power-up
(curlimoff = 0)
100 mA
Ipd power-down current VDDA = VDDD = VDD(TVDD) = VDD(PVDD) = 3 V; not powered from USB
hard power-down; RF
level detector off 10 A
soft power-down; RF level
detector on 30 A
ICCSL suspended low-power
device supply current RF level detector on,
(without resistor on DP/DM) [1] --250A
IDDD digital supply current RF level detector on,
VDD(SVDD) switch off [1] -15-mA
IDD(SVDD) SVDD supply current VDDS = 3 V - - 30 mA
IDDA analog supply current RF level detector on - 6 - mA
IDD(TVDD) TVDD supply curren t during RF transmission;
VDD(TVDD) =3 V -60100mA
Ptot total power dissipation Tamb =30 Cto+85C--0.55W
Tamb ambient temperature 30 - +85 C
Table 2. Ordering information
Type number Package
Name Description Version
PN5331B3HN/C270[1][2] HVQFN40 plastic thermal enhanced very thin quad flat package; no
leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618-1
PN533_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC Rev. 3.3 — 16 July 2012
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NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
5. Block diagram
The following block diagram describes hardware blocks controlled by PN533 firmware or
which can be accessible for data transaction by a host baseband.
Fig 1. Block diagram
001aai112
SUPPLY
SUPER
VISOR
27 MHz OSC
AND
FRAC N
PLL
SVDD
SWITCH
NFC
ANALOG
FRONT END
AND
CLUART
80C51 CPU
44 k ROM
1.2 k BYTES RAM
USB
DEVICE
I2C
MASTER
MATX
RSTPD
PVDD
SVDD
VBUS
P30 P31 P32
GPIOs
P33 P35
RSTOUT DVDD IRQ GND
VGND
XTAL1
XTAL2
NSS
MOSI
I0
I1
SDA
SCL
Delatt
48 MHz
SIGIN
SIGOUT
P34
TVDD
AVDD
RX
VMID
TX1
TGND
TX2
REGULATOR
3.3 V
PCR
PN533_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC Rev. 3.3 — 16 July 2012
158233 5 of 9
NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
6. Limiting values
[1] 1500 , 100 pF; EIA/JESD22-A114-A
[2] 0.75 mH, 200 pF; EIA/JESD22-A115-A
[3] Field induced model; EIA/JESC22-C101-C
7. Abbreviations
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDDA analog supply voltage 0.5 +4 V
VDDD digital supply voltage 0.5 +4 V
VDD(TVDD) TVDD supply voltage 0.5 +4 V
VDD(PVDD) PVDD supply voltage 0.5 +4 V
VDD(SVDD) SVDD supply voltage 0.5 +4 V
VBUS bus supply voltage 0.5 +5.5 V
Ptot total power dissipation - 500 mW
IDD(SVDD) SVDD supply current maximum current in
VDDS switch -30mA
Viinput voltage TX1, TX2, RX pins 0.5 +4 V
VESD electrostatic discharge
voltage HBM [1] 2.0 kV
MM [2] -200V
CDM [3] -1kV
Tstg storage temperature 55 +150 C
Tjjunction temperature 40 +125 C
Table 4. Abbreviations
Acronym Description
CDM Charge Device Model
CRC Cyclic Redundancy Check
EEPROM Electrically Erasable Programmable Read-Only Memory
HBM Human Body Model
HPD Hard Power Dow n
MM Machine Model
NFC Near Field Communication
SPD Soft Power-Down Mode
PN533_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC Rev. 3.3 — 16 July 2012
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NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
8. Revision history
Table 5. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PN533_SDS v.3.3 20120716 Product short data sheet - PN533_SDS v.3.2
Modifications: Section 9.4 “Licenses: updated
PN533_SDS v.3.2 20120202 Product short data sheet - PN5331B3HN_ SDS_N_1
Modifications: Section 1 “General description: updated
PN5331B3HN_SDS_N_1 20081231 Product short data sheet
PUBLIC --
PN533_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product short data sheet
PUBLIC Rev. 3.3 — 16 July 2012
158233 7 of 9
NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ionThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
9.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
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completeness of such information and shall have no liability for the
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
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damage. NXP Semiconductors and its suppliers accept no liability for
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Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
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applications and products.
NXP Semiconductors does not accept any liability rela ted to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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agreed in a valid written individua l agreement. In case an individual
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agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
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conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Producti on This document contains the product specification.
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Product short data sheet
PUBLIC Rev. 3.3 — 16 July 2012
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NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a pri or
authorization from competent authorities.
Quick reference data The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qua lified nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
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Translations — A non-English (translated ) version of a document is for
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between the translated and English version s.
9.4 Licenses
9.5 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
MIFARE — is a trademark of NXP B.V.
I2C-bus — logo is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Purchase of NXP ICs with ISO/IEC 14443 type B functionalit y
This NXP Semiconductors IC is ISO/IEC 14443 T ype B
software enabled and is licensed under Innovatron’s
Contactless Card p atents license for ISO/IEC 14443 B.
The license includes the right to use the IC in systems
and/or end-user equipment.
RATP/Innovatron
Technology
Purchase of NXP ICs with NFC technology
Purchase of an NXP Semiconductors IC that complies with one of the Near
Field Communication (NFC) standards ISO/IEC 18092 and ISO/IE C 21481
does not convey an implied license under any paten t right infringed by
implementat i on of any of those standards.
NXP Semiconductors PN533
Near Field Communi ca ti o n (NFC ) cont rol le r
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 July 2012
158233
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.1 RF protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Standards compliancy. . . . . . . . . . . . . . . . . . . . 2
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
9.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
9.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9