DESCRIPTION
HyperX HX316C10FK2/8 is a kit of two 512M x 64-bit (4GB)
DDR3-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory
modules, based on eight 512M x 8-bit DDR3 FBGA components
per module. Total kit capacity is 8GB. Each module kit has
been tested to run at DDR3-1600 at a low latency timing of
10-10-10 at 1.5V. Additional timing parameters are shown in
the PnP Timing Parameters section below. The JEDEC stan-
dard electrical and mechanical specifications are as follows:
Document No. 4807011-001.B00 04/23/15 Page 1
SPECIFICATIONS
selcyc 01)DDI(LC
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 37.5ns (min.)
Maximum Operating Power TBD W* (per module)
0 - V 49gnitaR LU
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
FEATURES
•JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
•VDDQ = 1.5V (1.425V ~ 1.575V)
•800MHz fCK for 1600Mb/sec/pin
•8 independent internal bank
•Programmable CAS Latency: 11, 10, 9, 8, 7, 6
•Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•8-bit pre-fetch
•Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
•Bi-directional Differential Data Strobe
•Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•On Die Termination using ODT pin
•Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95 ° C
•Asynchronous Reset
•Height 1.291” (32.80mm) w/heatsink, single sided
component
HX316C10FK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL10 240-Pin DIMM Kit
Continued >>
kingston.com/hyperx
PnP JEDEC TIMING PARAMETERS:
•DDR3-1600 CL10-10-10 @1.5V
•DDR3-1333 CL9-9-9 @1.5V
•DDR3-1066 CL7-7-7 @1.5V
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
Document No. 4807011-001.B00 Page 2
continued HyperX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
kingston.com/hyperx
7.08 mm
133.35 mm
32.8 mm
MODULE DIMENSIONS
MODULE WITH HEAT SPREADER
