Schnelle IR-Lumineszenzdiode High Speed Infrared Emitter SFH 4000 Vorlaufige Daten / Preliminary Data Wesentliche Merkmale Features * Hohe Ausgangsleistung: 28mW * Sehr kleines Gehause: (LxBxH) 1,7 mm x 0,8 mm x 0,65 mm * Sehr kurze Schaltzeiten (10ns) * Hohe Impulsbelastbarkeit * IR Reflow Loten geeignet * Gegurtet lieferbar * High output power: 28mW * Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm * Very short switching times (10ns) * High pulse handling capability * Suitable for IR reflow soldering * Available on tape and reel Anwendungen Applications * Miniaturlichtschranken fur Gleich- und Wechsellichtbetrieb, Lochstreifenleser * Industrieelektronik * Messen/Steuern/Regeln" * Sensorik2002-04-26 * Alarm- und Sicherungssysteme * IR-Freiraumubertragung * * * * * * Miniature photointerrupters Industrial electronics For drive and control circuits Sensor technology Alarm and safety equipment IR free air transmission 3.5 Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) SFH 4000 on request > 1.6 (typ. 3.5) 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2002-04-26 1 SFH 4000 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 3 V Durchlastrom Forward current IF 100 mA Stostrom, = 10 s, D = 0 Surge current IFSM 2.2 A Verlustleistung Power dissipation Ptot 180 mW 450 K/W 250 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block 2002-04-26 2 SFH 4000 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 m A 40 nm Abstrahlwinkel Half angle 80 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimensions of the active chip area LxB LxW 0.3 x 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr, tf 10 ns Kapazitat, Capacitance VR = 0 V, f = 1 MHz Co 15 pF VF VF 1.5 ( 1.8) 3.2 ( 4.0) V V Sperrstrom, Reverse current VR = 3 V IR 0.01 ( 1) A Gesamtstrahlungsflu, Total radiant flux IF = 100 mA, tp = 20 ms e 28 mW Temperaturkoeffizient von Ie bzw. e, TCI - 0.44 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 1.5 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.2 nm/K Durchlaspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA 2002-04-26 3 SFH 4000 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie typ 1.6 3.5 mW/sr mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ 20 mW/sr 2002-04-26 4 SFH 4000 Relative Spectral Emission Irel = f () Single pulse, tp = 20 s OHF00777 100 e = f (IF ) e 100 mA Radiant Intensity OHF00809 10 2 erel OHR00883 120 F mA e e (100 mA) 80 Max. Permissible Forward Current IF = f (T A ) 100 80 60 10 0 R thjA = 450 K/W 60 40 10 -1 40 20 0 10 -2 800 850 900 950 1000 10 -3 10 0 nm 1100 F 10 1 10 2 OHF00784 IF 10 3 OHF00040 10 1 A t D = TP 5 10 2 tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 10 1 10 0 10 10 3 mA 10 4 F Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter Forward Current IF = f (VF) single pulse, tp = 20 s 10 4 mA 20 0 5 10 -1 10 -2 10 -3 0 0.5 1 1.5 2 2.5 3 3.5 10 -1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 V 4.5 tp VF Radiation Characteristics Irel = f () 40 30 20 10 0 OHF00614 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2002-04-26 0.8 0.6 0.4 0 20 40 60 80 5 100 120 0 0 20 40 60 80 100 C 120 TA SFH 4000 Mazeichnung Package Outlines 0.3 (0.012) 5 7 max Package marking 1.3 (0.051) 0.1 (0.004) Package marking (0.002) 0.125 (0.005) +0.05 -0.03 (0.001) 1.7 (0.067) 0.1 (0.004) 0.8 (0.031) 0.1 (0.004) (0.001) 0.65 (0.026) +0.02 -0.05 (0.002) GPLY6089 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Package Epoxy, SmartLED (SCD 80) Colour colourless, light diffused Package marking Anode 2002-04-26 6 SFH 4000 IR-Reflow Lotprofil (nach IPC 9501) IR Reflow Soldering profile (acc. to IPC 9501) OHLA0685 250 Tmax = 245 C C T 200 t = 70 s T = 183 C 150 2-3 K/s 100 2-3 K/s 50 0 0:00 0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 min 5:30 t Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2002-04-26 7