CREAT BY ART
- Glass passivated chip junction
- High efficiency, Low VF
- High current capability
- High surge current capability
- Low power loss
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
Cj pF
R
θjA O
C/W
T
JO
C
T
STG O
C
Note 2: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Document Number: DS_D1405013 Version: E14
PARAMETER SYMBOL 1N
5391G
1N
5392G
1N
5393G
1N5391G thru 1N5399G
Glass Passivated Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
1N
5395G
1N
5397G
1N
5398G
1N
5399G UNIT
MECHANICAL DATA
Case: DO-204AC (DO-15) DO-204AC (DO-15)
Weight: 0.4g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
V
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 1.5
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
50
Taiwan Semiconductor
Typical junction capacitance (Note 2) 15
Typical thermal resistance 65
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
μA
A
Maximum instantaneous forward voltage (Note 1)
@ 1.5 A
Note 1: Pulse test with PW=300 μs, 1% duty cycle
1.1 1.0
5
100
- 55 to +150Operating junction temperature range
Storage temperature range - 55 to +150
V
F