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DATA SH EET

Preliminary speciﬁcation

File under Integrated Circuits, IC24 2001 Oct 30

INTEGRATED CIRCUITS

74ALVC244

Octal buffer/line driver; 3-state

2001 Oct 30 2

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

FEATURES

•Wide supply voltage range of 1.65 to 3.6 V

•Complies with JEDEC standard:

– JESD8-7 (1.65 to 1.95 V)

– JESD8-5 (2.3 to 2.7 V)

– JESD8B/JESD36 (2.7 to 3.6 V).

•3.6 V tolerant inputs/outputs

•CMOS LOW power consumption

•Direct interface with TTL levels (2.7 to 3.6 V)

•Power-down mode

•Latch-up performance exceeds ≤250 mA

•ESD protection:

– Human Body Model (HBM) (A 114-A) exceeds

2000 V

– Machine Model (MM) (A 115-A) exceeds 200 V.

DESCRIPTION

The 74ALVC244 is a high-performance, low-power,

low-voltage, Si-gate CMOS device and superior to most

advanced CMOS compatible TTL families.

The 74ALVC244 is an octal non-inverting buffer/line driver

with 3-state outputs. The 3-state outputs are controlled by

the output enable inputs 1OE and 2OE. A HIGH on nOE

causes the outputs to assume a HIGH impedance

OFF-state. Schmitt-trigger action at all inputs makes the

circuit highly tolerant for slower input rise and fall times.

QUICK REFERENCE DATA

GND = 0 V; Tamb =25°C.

Notes

1. CPD is used to determine the dynamic power dissipation (PDin µW).

PD=C

PD ×VCC2×fi+(C

L×V

CC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in Volts.

2. The condition is VI= GND to VCC.

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

tPHL/tPLH propagation delay inputs

nAnto output nYn

VCC = 1.8 V; CL= 30 pF; RL=1kΩ− ns

VCC = 2.5 V; CL= 30 pF; RL= 500 Ω− ns

VCC = 2.7 V; CL= 50 pF; RL= 500 Ω− ns

VCC = 3.3 V; CL= 50 pF; RL= 500 Ω− ns

CIinput capacitance 3.5 pF

CPD power dissipation capacitance per buffer VCC = 3.3 V; notes 1 and 2 20 pF

2001 Oct 30 3

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

FUNCTION TABLE

See note 1.

Note

1. H = HIGH voltage level;

L = LOW voltage level;

X = don’t care;

Z = HIGH-impedance OFF-state.

ORDERING INFORMATION

PINNING

INPUT OUTPUT

nOE nAnnYn

LLL

LHH

HXZ

TYPE NUMBER PACKAGES

PINS PACKAGE MATERIAL CODE

74ALVC244D 20 SO plastic SOT163-1

74ALVC244PW 20 TSSOP plastic SOT360-1

PIN SYMBOL DESCRIPTION

OE output enable input (active LOW)

2, 4, 6 and 8 1A0to 1A3data inputs

3, 5, 7 and 9 2Y0to 2Y3bus outputs

10 GND ground (0 V)

11, 13, 15 and 17 2A3to 2A0data inputs

12, 14, 16 and 18 1Y3to 1Y0bus outputs

19 2OE output enable input (active LOW)

20 VCC supply voltage

2001 Oct 30 4

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

handbook, halfpage

1OE

1A0

2Y0

1A1

2Y1

1A2

2Y2

1A3

2Y3

GND

VCC

2OE

1Y0

2A0

2A1

1Y2

1Y1

2A2

1Y3

2A3

10 11

244

MNA162

Fig.1 Pin configuration.

handbook, halfpage

MNA168

1A3

1A2

1A1

1A0

1Y0

1Y1

1Y2

1Y3

1OE

2A3

2A2

2A1

2A0

2Y0

2Y1

2Y2

2Y3

2OE

Fig.2 Logic symbol.

handbook, halfpage

1EN

MNA169

19 EN

Fig.3 IEE/IEC logic symbol.

handbook, halfpage

MNA170

1A3

1A2

1A1

1A0

1Y0

1Y1

1Y2

1Y3

1OE

2A3

2A2

2A1

2A0

2Y0

2Y1

2Y2

2Y3

2OE

Fig.4 Logic diagram.

2001 Oct 30 5

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

RECOMMENDED OPERATING CONDITIONS

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage 1.65 3.6 V

VIinput voltage 0 3.6 V

VOoutput voltage VCC = 1.65 to 3.6 V; enable mode 0 VCC V

VCC = 1.65 to 3.6 V; disable mode 0 3.6 V

VCC = 0 V; Power-down mode 0 3.6 V

Tamb operating ambient temperature −40 +85 °C

tr,t

finput rise and fall times VCC = 1.65 to 2.7 V 0 20 ns/V

VCC = 2.7 to 3.6 V 0 10 ns/V

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage −0.5 +4.6 V

IIK input diode current VI<0 −−50 mA

VIinput voltage −0.5 +4.6 V

IOK output diode current VO>V

CC or VO<0 −±50 mA

VOoutput voltage enable mode; notes 1 and 2 −0.5 VCC + 0.5 V

disable mode −0.5 +4.6 V

Power-down mode; note 2 −0.5 +4.6 V

IOoutput diode current VO=0toV

CC −±50 mA

IGND, ICC VCC or GND current −±100 mA

Tstg storage temperature −65 +150 °C

Ptot power dissipation per package

SO package above 70 °C derate linearly with

8 mW/K −500 mW

TSSOP package above 60 °C derate linearly with

5.5 mW/K −500 mW

2001 Oct 30 6

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

DC CHARACTERISTICS

At recommended operating conditions; voltages are referenced to GND (ground=0V).

Notes

1. All typical values are measured at VCC = 3.3 V and Tamb =25°C.

2. For transceivers, the parameters IOZ includes the input leakage current.

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

OTHER VCC (V) −40 to +85

MIN. TYP.(1) MAX.

VIH HIGH-level input

voltage 1.65 to 1.95 0.65 ×VCC −− V

2.3 to 2.7 1.7 −− V

2.7 to 3.6 2 −− V

IL LOW-level input

voltage 1.65 to 1.95 −−0.35 ×VCC V

2.3 to 2.7 −−0.7 V

2.7 to 3.6 −−0.8 V

VOL LOW-level output

voltage VI=V

IH or VIL; IO= 100 µA 1.65 to 3.6 −−0.2 V

VI=V

IH or VIL; IO= 6 mA 1.65 −−0.3 V

VI=V

IH or VIL; IO= 12 mA 2.3 −−0.4 V

VI=V

IH or VIL; IO= 18 mA 2.3 −−0.6 V

VI=V

IH or VIL; IO= 12 mA 2.7 −−0.4 V

VI=V

IH or VIL; IO= 18 mA 3.0 −−0.4 V

VI=V

IH or VIL; IO= 24 mA 3.0 −−0.55 V

VOH HIGH-level output

voltage VI=V

IH or VIL; IO=−100 µA 1.65 to 3.6 VCC −0.2 −− V

IH or VIL; IO=−6 mA 1.65 1.25 −− V

IH or VIL; IO=−12 mA 2.3 1.8 −− V

IH or VIL; IO=−18 mA 2.3 1.7 −− V

IH or VIL; IO=−12 mA 2.7 2.2 −− V

IH or VIL; IO=−18 mA 3.0 2.4 −− V

IH or VIL; IO=−24 mA 3.0 2.2 −− V

Iinput leakage

current VI= 3.6 Vor GND 3.6 −±0.1 ±5µA

IOZ 3-state output

OFF-state current VI=V

IH or VIL;

VO= 3.6 V or GND; note 2 3.6 −0.1 ±10 µA

Ioff powerOFFleakage

current VIor VO= 3.6 V 0.0 −±0.1 ±10 µA

ICC quiescent supply

current VI=V

CC or GND; IO= 0 3.6 −0.2 20 µA

∆ICC additional

quiescent supply

current per input

VI=V

CC −0.6 V; IO= 0 3.0 to 3.6 −5 750 µA

2001 Oct 30 7

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

AC CHARACTERISTICS

Note

1. All typical values are measured at Tamb =25°C.

AC WAVEFORMS

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS VCC (V) −40 to +85

MIN. TYP.(1) MAX.

tPHL/tPLH propagation delay

input nAnto output nYn

see Figs 5 and 7 1.65 to 1.95 1.0 −4.4 ns

2.3 to 2.7 1.0 −3.1 ns

2.7 1.0 −3.1 ns

3.0 to 3.6 1.0 −2.8 ns

tPZH/tPZL 3-state output enable time

input nOE to output nYn

see Figs 6 and 7 1.65 to 1.95 1.0 −6.9 ns

2.3 to 2.7 1.0 −5.4 ns

2.7 1.0 −5.3 ns

3.0 to 3.6 1.0 −4.5 ns

tPHZ/tPLZ 3-state output disable time

input nOE to output nYn

see Figs 6 and 7 1.65 to 1.95 1.0 −5.9 ns

2.3 to 2.7 1.0 −4.1 ns

2.7 1.0 −4.4 ns

3.0 to 3.6 1.0 −4.2 ns

handbook, halfpage

MNA171

nAn INPUT

nYn OUTPUT

tPLH tPHL

GND

VOH

VOL

Fig.5 Input nAn to output nYn propagation delay times.

VCC VMINPUT

VItr=t

1.65 to 1.95 V 0.5 ×VCC VCC ≤2.0 ns

2.3 to 2.7 V 0.5 ×VCC VCC ≤2.0 ns

2.7 V 1.5 V 2.7 V ≤2.5 ns

3.0 to 3.6 V 1.5 V 2.7 V ≤2.5 ns

2001 Oct 30 8

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

handbook, full pagewidth

MNA654

tPLZ

tPHZ

outputs

disabled outputs

enabled

outputs

enabled

output

LOW-to-OFF

OFF-to-LOW

output

HIGH-to-OFF

OFF-to-HIGH

nOE input

VCC

VOL

VOH

GND

tPZL

tPZH

Fig.6 3-state enable and disable times.

VCC VMINPUT

VItr=t

1.65 to 1.95 V 0.5 ×VCC VCC ≤2.0 ns

2.3 to 2.7 V 0.5 ×VCC VCC ≤2.0 ns

2.7 V 1.5 V 2.7 V ≤2.5 ns

3.0 to 3.6 V 1.5 V 2.7 V ≤2.5 ns VOL and VOH are typical output voltage drop that occur with the output load.

VX=V

OL + 0.3 V at VCC ≥2.7 V;

VX=V

OL + 0.15 V at VCC < 2.7 V;

VY=V

OH −0.3 V at VCC ≥2.7 V;

VY=V

OH −0.15 V at VCC < 2.7 V.

2001 Oct 30 9

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

handbook, full pagewidth

VEXT

VCC

VIVO

MNA616

D.U.T.

PULSE

GENERATOR

Fig.7 Load circuitry for switching times.

RL= Load resistor.

CL= Load capacitance including jig and probe capacitance.

RT= Termination resistance should be equal to the output impedance Zo of the pulse generator.

VCC VICLRLVEXT

tPLH/tPHL tPZH/tPHZ tPZL/tPLZ

1.65 to 1.95 V VCC 30 pF 1 kΩopen GND 2 ×VCC

2.3 to 2.7 V VCC 30 pF 500 Ωopen GND 2 ×VCC

2.7 V 2.7 V 50 pF 500 Ωopen GND 6 V

3.0 to 3.6 V 2.7 V 50 pF 500 Ωopen GND 6 V

2001 Oct 30 10

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 13.0

12.6 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

detail X

0.25

075E04 MS-013

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.51

0.49 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

vMA

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

97-05-22

99-12-27

2001 Oct 30 11

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 6.6

6.4 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.5

0.2 8

0.13 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1 MO-153 95-02-04

99-12-27

0.25

110

20 11

pin 1 index

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1

max.

1.10

2001 Oct 30 12

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

SOLDERING

Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplextechnology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certainsurfacemountICs,butitis notsuitableforfinepitch

SMDs. In these situations reflow soldering is

recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuit board by screen printing,stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 220 °C for

thick/large packages, and below 235 °C for small/thin

packages.

Wave soldering

Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswithleadsonfoursides, thefootprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2001 Oct 30 13

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, LFBGA, SQFP, TFBGA not suitable suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

2001 Oct 30 14

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS(1) PRODUCT

STATUS(2) DEFINITIONS

Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data Qualiﬁcation This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Changes will be

communicated according to the Customer Product/Process Change

Notiﬁcation (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

attheseoratanyotherconditionsabovethosegiveninthe

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarranty thatsuchapplicationswillbe

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingor sellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuseofanyofthese products, conveysnolicenceortitle

under any patent, copyright, or mask work right to these

products,andmakesnorepresentationsor warranties that

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

2001 Oct 30 15

Philips Semiconductors Preliminary speciﬁcation

Octal buffer/line driver; 3-state 74ALVC244

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

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Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands 613508/01/pp16 Date of release: 2001 Oct 30 Document order number: 9397 750 08976