MEC1–130–02–F–D
MEC1–120–02–F–D–A
MEC1–140–02–L–D
Mates with
(1,60mm)
.062" card
(1,00mm)
.03937" pitch
WWW.SAMTEC.COM
(No. of Positions + 2) x
(1,00) .03937 + (2,54) .100
(No. of Positions + 2)
x (1,00) .03937
(0,36)
.014
(1,00)
.03937
(8,89)
.350
(6,99)
.275
01
02
139
140
(9,04)
.356
(0,15)
.006
(8,51)
.335
(1,40)
.055
(1,83)
.072
(0,89)
.035
DIA
MEC1 POSITIONS
PER ROW
OTHER
OPTION
PLATING
OPTION D
–S
= 30µ" (0,76µm) Gold on contact,
Matte Tin on tail
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
–F
= Gold fl ash on contact,
Matte tin on tail
1mm MINI EDGE CARD SOCKET MEC1
SERIES
F-209
–A
= Alignment
Pin Metal or
plastic at
Samtec
discretion.
–K
= (7,87mm)
.310" DIA
Polyimide fi lm
Pick &
Place Pad
–TR
= Tape & Reel
–A
OPTION
1
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
2A @ 80°C ambient
Voltage Rating: 300 VAC
Insertion Depth:
(5,84mm) .230" to
(8,13mm) .320"
RoHS Compliant:
Ye s
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (05-20)
(0,15mm) .006" max (30-70) 02
05, 08, 20, 30,
40, 50, 60, 70
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Mates with:
(1,60mm) .062" card
APPLICATION
SPECIFIC
OPTION
• Locking Clip
• Non-polarized
Call Samtec.
1mm MEC1 Rated @ -3dB Insertion Loss
9,04mm Stack Height
Single-Ended Signaling 5.5 GHz / 11 Gbps
Differential Pair Signaling 6.5 GHz / 13 Gbps
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
POLARIZED
POSITIONS
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
APPLICATION
SPECIFICATIONS
