RF Power Detector
with Shutdown Control
MAX2209A
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VCC to GND .............................................................-0.3V to +6V
RFIN to GND ......................................... -0.3V to + (VCC + 0.3V)
OUT to GND .......................................... -0.3V to + (VCC + 0.3V)
RFIN Input Power .......................................................... +10dBm
Continuous Power Dissipation (TA = +70NC)
4-Bump WLP (derate 3mW/NC above +70NC) .............238mW
Junction-to-Ambient Thermal
Resistance (BJA) (Note 1) ..........................................335NC/W
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +160NC
Junction Temperature ....................................................+150NC
Bump Temperature (soldering, Note 2)
Infrared (15s) ...............................................................+260NC
Soldering Temperature (reflow) ......................................+240NC
DC ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 5.0V, no RF signal applied, TA = -40NC to +85NC. Typical values are at VCC = 2.8V, TA = +25NC, unless otherwise
noted.) (Note 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications.
CAUTION! ESD SENSITIVE DEVICE
PARAMETER CONDITIONS MIN TYP MAX UNITS
Supply Voltage 2.7 5.0 V
Supply Current 3.9 6 mA
Idle Output Voltage 35 mV
Output Current Source Capability PIN = -5dBm, VOUT forced 100mV lower than open-
circuit output voltage 1000 2300 FA
Output Current Sink Capability PIN = -25dBm, VOUT forced 10mV higher than open-
circuit output voltage 75 150 FA
Shutdown Current VSHDN = 0V 25 50 FA
SHDN Logic-High VIH, including 2kI resistor 1.2 V
SHDN Logic-Low VIL, including 2kI resistor 0.45 V
Turn-On Time SHDN transitions to VIH, VOUT is within 90% of final
value (Note 4) 1.5 2 Fs
RF Step-Response Time RF transitions from < -25dBm to -5dBm, VOUT is
within 90% of final value, 1kW + 10pF load (Note 4) 140 200 ns