General Note
IRC reserves the right to make changes in product specifi cation without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
s3OUTH3TAPLES3TREETs#Orpus Christi TeXAS53!
Wire and Film Technologies Division
Telephone:sFacsimile:s Website: www.irctt.com
Metal Glaze™ General Purpose
Surface Mount Power Resistor
MM Series
s Up to 2 watts
sUp to 1000 volts
s 0.1 ohm to 2.2 megohm range
s 150°C maximum operating temperature
Electrical Data
Size
Code
Industry
Footprint
IRC
Type
Maximum
Power
Rating
Working
Voltage
Resistance
Range
(ohms)²
Tolerance
(+%)³
TCR
(ppm/°C)³
Product
Category
B1206 MMA0204 1/2 400
0.1 to 0.99 1, 2, 5 100 Low Range
1.0 to 1.0M 1, 2, 5 50, 100 Standard
20 to 348K 0.25, 0.5 50, 100 Tight Tolerance
F2512 MMB0207 1 700
0.1 to 0.99 1, 2, 5 100 Low Range
1.0 to 2.21M 1, 2, 5 50, 100 Standard
20 to 348K 0.25, 0.5 50, 100 Tight Tolerance
H3610 MMC0310 2 1000 0.1 to 0.99 1, 2, 5 100 Low Range
1.0 to 2.21M 1, 2, 5 50, 100 Standard
¹Not to exceed P x R ²Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
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Temperature Coeffi cient As specifi ed MIL-R-55342E Par 4.7.9 (-55°C +125°C)
Thermal Shock ±0.5% +0.01MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
Low Temperature Operation ±0.25% +0.01MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload ±0.5% +0.01
±1% for R>100K
MIL-R-55342E Par 4.7.5
2.5 x P x R for 5 seconds
High Temperature Exposure ±0.5% +0.01MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure ±0.25% +0.01MIL-R-55342E Par 4.7.7 (Refl ow soldered to board at 260°C for 10 seconds)
Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance ±0.5% +0.01MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test ±0.5% +0.01MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength ±1% +0.01
no mechanical damage
1200 gram push from underside of mounted chip for
60 seconds
Resistance to Board Bending ±0.5% +0.01
no mechanical damage
Chip mounted in center of 90mm long board, defl ected 5mm
so as to exert pull on chip contacts for 10 seconds
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
High
temperature
dielectric
coating
60/40 Solder
over nickel barrier
--3ErIES)SSUE-ARCH3HEETOF
Metal Glaze™ General Purpose
Surface Mount Power Resistor
MM Series
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
09.12
· Up to 2 watts
· Up to 1000 volts
· 0.1 ohm to 2.2 megohm range
· 150°C maximum operating temperature
General Note
IRC reserves the right to make changes in product specifi cation without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
s3OUTH3TAPLES3TREETs#Orpus Christi TeXAS53!
Wire and Film Technologies Division
Telephone:sFacsimile:s Website: www.irctt.com
Metal Glaze™ General Purpose
Surface Mount Power Resistor
MM Series
s Up to 2 watts
sUp to 1000 volts
s 0.1 ohm to 2.2 megohm range
s 150°C maximum operating temperature
Electrical Data
Size
Code
Industry
Footprint
IRC
Type
Maximum
Power
Rating
Working
Voltage
Resistance
Range
(ohms)²
Tolerance
(+%)³
TCR
(ppm/°C)³
Product
Category
B1206 MMA0204 1/2 400
0.1 to 0.99 1, 2, 5 100 Low Range
1.0 to 1.0M 1, 2, 5 50, 100 Standard
20 to 348K 0.25, 0.5 50, 100 Tight Tolerance
F2512 MMB0207 1 700
0.1 to 0.99 1, 2, 5 100 Low Range
1.0 to 2.21M 1, 2, 5 50, 100 Standard
20 to 348K 0.25, 0.5 50, 100 Tight Tolerance
H3610 MMC0310 2 1000 0.1 to 0.99 1, 2, 5 100 Low Range
1.0 to 2.21M 1, 2, 5 50, 100 Standard
¹Not to exceed P x R ²Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
dohteM tseTegnahC mumixaMscitsiretcarahC
Temperature Coeffi cient As specifi ed MIL-R-55342E Par 4.7.9 (-55°C +125°C)
Thermal Shock ±0.5% +0.01MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
Low Temperature Operation ±0.25% +0.01MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload ±0.5% +0.01
±1% for R>100K
MIL-R-55342E Par 4.7.5
2.5 x P x R for 5 seconds
High Temperature Exposure ±0.5% +0.01MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure ±0.25% +0.01MIL-R-55342E Par 4.7.7 (Refl ow soldered to board at 260°C for 10 seconds)
Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance ±0.5% +0.01MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test ±0.5% +0.01MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength ±1% +0.01
no mechanical damage
1200 gram push from underside of mounted chip for
60 seconds
Resistance to Board Bending ±0.5% +0.01
no mechanical damage
Chip mounted in center of 90mm long board, defl ected 5mm
so as to exert pull on chip contacts for 10 seconds
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
High
temperature
dielectric
coating
60/40 Solder
over nickel barrier
--3ErIES)SSUE-ARCH3HEETOF