PZTA42T1 - Motorola / Freescale Semiconductor

Motorola Small–Signal Transistors, FETs and Diodes Device Data

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NPN Silicon

MAXIMUM RATINGS

Rating Symbol Value Unit

Collector-Emitter Voltage (Open Base) VCEO 300 Vdc

Collector-Base Voltage (Open Emitter) VCBO 300 Vdc

Emitter-Base Voltage (Open Collector) VEBO 6.0 Vdc

Collector Current (DC) IC500 mAdc

Total Power Dissipation @ TA = 25°C(1) PD1.5 Watts

Storage Temperature Range Tstg –65 to +150 °C

Junction Temperature TJ150 °C

DEVICE MARKING

P1D

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance,

Junction-to-Ambient(1) RθJA 83.3 °C/W

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristics Symbol Min Max Unit

OFF CHARACTERISTICS

Collector-Emitter Breakdown Voltage(2)

(IC = 1.0 mAdc, IB = 0) V(BR)CEO 300 — Vdc

Collector-Base Breakdown Voltage

(IC = 100 µAdc, IE = 0) V(BR)CBO 300 — Vdc

Emitter-Base Breakdown Voltage

(IE = 100 µAdc, IC = 0) V(BR)EBO 6.0 — Vdc

Collector-Base Cutoff Current

(VCB = 200 Vdc, IE = 0) ICBO — 0.1 µAdc

Emitter-Base Cutoff Current

(VBE = 6.0 Vdc, IC = 0) IEBO — 0.1 µAdc

1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min 0.93 in2.

2. Pulse Test Conditions, tp = 300 µs, δ = 0.02.

Thermal Clad is a trademark of the Bergquist Company

Preferred devices are Motorola recommended choices for future use and best overall value.

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SEMICONDUCTOR TECHNICAL DATA

 Motorola, Inc. 1996



SOT–223 PACKAGE

NPN SILICON

HIGH VOLTAGE

TRANSISTOR

SURFACE MOUNT

Motorola Preferred Device

CASE 318E-04, STYLE 1

TO-261AA

123

COLLECTOR 2,4

BASE

EMITTER 3

REV 2

PZTA42T1

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued)

ON CHARACTERISTICS

DC Current Gain

(IC = 1.0 mAdc, VCE = 10 Vdc)

(IC = 10 mAdc, VCE = 10 Vdc)

(IC = 30 mAdc, VCE = 10 Vdc)

hFE 25

—

DYNAMIC CHARACTERISTICS

Current-Gain — Bandwidth Product

(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) fT50 — MHz

Feedback Capacitance

(VCB = 20 Vdc, IE = 0, f = 1.0 MHz) Cre — 3.0 pF

Collector-Emitter Saturation Voltage

(IC = 20 mAdc, IB = 2.0 mAdc) VCE(sat) — 0.5 Vdc

Base-Emitter Saturation Voltage

(IC = 20 mAdc, IB = 2.0 mAdc) VBE(sat) — 0.9 Vdc

PZTA42T1

Motorola Small–Signal Transistors, FETs and Diodes Device Data

INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

SOT-223

0.079

2.0

0.15

3.8

0.248

6.3

0.079

2.0

0.059

1.5 0.059

1.5

0.091

2.3

0.091

2.3

inches

SOT-223 POWER DISSIPATION

The power dissipation of the SOT-223 is a function of the

pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power dissipation.

Power dissipation for a surface mount device is determined

by TJ(max), the maximum rated junction temperature of the

die, RθJA, the thermal resistance from the device junction to

ambient, and the operating temperature, TA. Using the

values provided on the data sheet for the SOT-223 package,

PD can be calculated as follows:

PD = TJ(max) – TA

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature T A of 25°C, one can

calculate the power dissipation of the device which in this

case is 1.5 watts.

PD = 150°C – 25°C= 1.5 watts

83.3°C/W

The 83.3°C/W for the SOT-223 package assumes the use

of the recommended footprint on a glass epoxy printed circuit

board to achieve a power dissipation of 1.5 watts. There are

other alternatives to achieving higher power dissipation from

the SOT-223 package. One is to increase the area of the

collector pad. By increasing the area of the collector pad, the

power dissipation can be increased. Although the power

dissipation can almost be doubled with this method, area is

taken up on the printed circuit board which can defeat the

purpose of using surface mount technology. A graph of RθJA

versus collector pad area is shown in Figure 1.

0.8 Watts

1.25 Watts* 1.5 Watts

R , Thermal Resistance, Junction

to Ambient ( C/W)

A, Area (square inches)

0.0 0.2 0.4 0.6 0.8 1.0

160

140

120

100

Figure 1. Thermal Resistance versus Collector

Pad Area for the SOT-223 Package (Typical)

Board Material = 0.0625

″

G-10/FR-4, 2 oz Copper TA = 25

*Mounted on the DPAK footprint

Another alternative would be to use a ceramic substrate or

an aluminum core board such as Thermal Clad. Using a

board material such as Thermal Clad, an aluminum core

board, the power dissipation can be doubled using the same

footprint.

PZTA42T1

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the SOT-223 package should be

the same as the pad size on the printed circuit board, i.e., a

1:1 registration.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference should be a maximum of 10°C.

•The soldering temperature and time should not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied during

cooling

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator

must set temperatures for several heating zones, and a

figure for belt speed. Taken together, these control settings

make up a heating “profile” for that particular circuit board.

On machines controlled by a computer, the computer

remembers these profiles from one operating session to the

next. Figure 2 shows a typical heating profile for use when

soldering a surface mount device to a printed circuit board.

This profile will vary among soldering systems but it is a good

starting point. Factors that can affect the profile include the

type of soldering system in use, density and types of

components on the board, type of solder used, and the type

of board or substrate material being used. This profile shows

temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface

of a test board at or near a central solder joint. The two

profiles are based on a high density and a low density board.

The Vitronics SMD310 convection/infrared reflow soldering

system was used to generate this profile. The type of solder

used was 62/36/2 Tin Lead Silver with a melting point

between 177–189°C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1

“RAMP”

STEP 2

VENT

“SOAK”

STEP 3

HEATING

ZONES 2 & 5

“RAMP”

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

STEP 6

VENT STEP 7

COOLING

200

150

100

TIME (3 TO 7 MINUTES TOTAL) TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205

219

PEAK AT

SOLDER

JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

100

150

C160

170

140

Figure 2. Typical Solder Heating Profile

PZTA42T1

Motorola Small–Signal Transistors, FETs and Diodes Device Data

PACKAGE DIMENSIONS

TO-261AA

STYLE 1:

PIN 1. BASE

2. COLLECTOR

3. EMITTER

4. COLLECTOR

1 2 3

0.08 (0003)

DIM

AMIN MAX MIN MAX

MILLIMETERS

0.249 0.263 6.30 6.70

INCHES

B0.130 0.145 3.30 3.70

C0.060 0.068 1.50 1.75

D0.024 0.035 0.60 0.89

F0.115 0.126 2.90 3.20

G0.087 0.094 2.20 2.40

H0.0008 0.0040 0.020 0.100

J0.009 0.014 0.24 0.35

K0.060 0.078 1.50 2.00

L0.033 0.041 0.85 1.05

M0 10 0 10

S0.264 0.287 6.70 7.30

_ _ _ _

CASE 318E–04

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

PZTA42T1

6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

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