TEA5767HN3TM - ST-Ericsson Inc

34.807IRELESS

IMPORTANT NOTICE

Dear customer,

As from August 2nd 2008, the wireless operations of NXP have moved to a new company,

ST-NXP Wireless.

As a result, the following changes are applicable to the attached document.

●Company name - NXP B.V. is replaced with ST-NXP Wireless.

●Copyright - the copyright notice at the bottom of each page “© NXP B.V. 200x. All

●Web site - http://www.nxp.com is replaced with http://www.stnwireless.com

●Contact information - the list of sales offices previously obtained by sending

an email to salesaddresses@nxp.com , is now found at http://www.stnwireless.com

under Contacts.

If you have any questions related to the document, please contact our nearest sales office.

Thank you for your cooperation and understanding.

ST-NXP Wireless

34.807IRELESS

www.stnwireless.com

1. General description

The TEA5767HN is a single-chip electronically tuned FM stereo radio for low-voltage

applications with fully integrated Intermediate Frequency (IF) selectivity and

demodulation. The radio is completely adjustment-free and only requires a minimum of

small and low cost external components. The radio can be tuned to the European, US,

and Japanese FM bands.

2. Features

nHigh sensitivity due to integrated low-noise RF input ampliﬁer

nFM mixer for conversion to IF of the US/Europe (87.5 MHz to 108 MHz) and Japanese

(76 MHz to 91 MHz) FM band

nPreset tuning to receive Japanese TV audio up to 108 MHz

nRF Automatic Gain Control (AGC) circuit

nLC tuner oscillator operating with low cost ﬁxed chip inductors

nFM IF selectivity performed internally

nNo external discriminator needed due to fully integrated FM demodulator

nCrystal reference frequency oscillator; the oscillator operates with a 32.768 kHz clock

crystal or with a 13 MHz crystal and with an externally applied 6.5 MHz reference

frequency

nPhase-locked loop (PLL) synthesizer tuning system

nI2C-bus and 3-wire bus, selectable via pin BUSMODE

n7-bit IF counter output via the bus

n4-bit level information output via the bus

nSoft mute

nSignal dependent mono to stereo blend [Stereo Noise Cancelling (SNC)]

nSignal dependent High Cut Control (HCC)

nSoft mute, SNC and HCC can be switched off via the bus

nAdjustment-free stereo decoder

nAutonomous search tuning function

nStandby mode

nTwo software programmable ports

nBus enable line to switch the bus input and output lines into 3-state mode

TEA5767HN

Low-power FM stereo radio for handheld applications

Rev. 05 — 26 January 2007 Product data sheet

Product data sheet Rev. 05 — 26 January 2007 2 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

3. Quick reference data

Table 1. Quick reference data

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values are given in RMS;

for V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VCCA analog supply voltage [1] 2.5 3.0 5.0 V

VCC(VCO) Voltage-Controlled

Oscillator (VCO)

supply voltage

[1] 2.5 3.0 5.0 V

VCCD digital supply voltage [1] 2.5 3.0 5.0 V

ICCA analog supply current operating; VCCA = 3 V 6.0 8.4 10.5 mA

Standby mode; VCCA =3V - 3 6 µA

ICC(VCO) VCO supply current operating; VCC(VCO) = 3 V 560 750 940 µA

Standby mode; VCC(VCO) =3V - 1 2 µA

ICCD digital supply current operating; VCCD = 3 V 2.1 3.0 3.9 mA

Standby mode; VCCD =3V

bus enable line HIGH 30 56 80 µA

bus enable line LOW 11 19 26 µA

fFM(ant) FM input frequency 76 - 108 MHz

Tamb ambient temperature VCCA =V

CC(VCO) =V

CCD =

2.5 V to 5 V −10 - +75 °C

FM overall system parameters; see Figure 13

VRF RF sensitivity input

voltage fRF = 76 MHz to 108 MHz;

∆f = 22.5 kHz; fmod = 1 kHz;

(S+N)/N = 26 dB;

de-emphasis = 75 µs; L = R;

BAF = 300 Hz to 15 kHz

- 2 3.5 µV

S−200 low side 200 kHz

selectivity ∆f=−200 kHz;

ftune = 76 MHz to 108 MHz [2] 32 36 - dB

S+200 high side 200 kHz

selectivity ∆f = +200 kHz;

ftune = 76 MHz to 108 MHz [2] 39 43 - dB

VAFL left audio frequency

output voltage VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

60 75 90 mV

VAFR right audio frequency

output voltage VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

60 75 90 mV

Product data sheet Rev. 05 — 26 January 2007 3 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

[1] VCCA, VCC(VCO) and VCCD must not differ by more than 200 mV.

[2] Low side and high side selectivity can be switched by changing the mixer from high side to low side LO

injection.

4. Ordering information

(S+N)/N maximum signal plus

noise-to-noise ratio VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs;

BAF = 300 Hz to 15 kHz

54 60 - dB

αcs(stereo) stereo channel

separation VRF = 1 mV; R = L = 0 or R = 0

and L = 1 including 9 % pilot;

∆f = 75 kHz; fmod = 1 kHz;

data byte 3 bit 3 = 0;

data byte 4 bit 1 = 1

24 30 - dB

THD total harmonic

distortion VRF =1mV; L=R;

∆f = 75 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

- 0.4 1 %

Table 1. Quick reference data

…continued

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values are given in RMS;

for V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 2. Ordering information

Type number Package

Name Description Version

TEA5767HN HVQFN40 plastic thermal enhanced very thin quad ﬂat package;

no leads; 40 terminals; body 6 ×6×0.85 mm SOT618-1

xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx

xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx

xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x

Product data sheet Rev. 05 — 26 January 2007 4 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

5. Block diagram

The component list is given in Section 16.

(1) Ccomp and Cpull data depends on crystal speciﬁcation.

Fig 1. Block diagram

mhc283

I/Q-MIXER

1st FM

IF CENTRE

FREQUENCY

ADJUST

100 pF

22 nF

VCCA

29 28 27 26 25

27 pF

L1 47 pF

22 µF

RFI1

Igain

AGND

VCCA

RFGND

RFI2

TAGC

LOOPSW

VCOTANK1 45

CPOUT VCOTANK2 VCC(VCO)

6789

DATAVCCD

DGND CLOCK

AGC

FM antenna

programmable divider output

reference frequency divider output

TUNING SYSTEM

4.7 nF

47 nF 47 nF 33 nF

24 23 22

LIMDEC2 LIMDEC1 TIFC Vref MPXO TMUTE VAFR VAFL

13 BUSENABLE

WRITE/READ

SWPORT1

SWPORT2

XTAL1

XTAL2

PHASEFIL

PILFIL

SDS

33 nF

1 nF

22 nF

Ccomp(1)

Cpull(1) 32.768 kHz

13 MHz

33 kΩ

10 kΩ

47 nF

VCO

39 nF10 nF

4.7 Ω

100 kΩ

10 kΩ

47 Ω

VCC(VCO)

12 Ω

22 nF

LEVEL

ADC IF

COUNTER

LIMITER DEMODULATOR

Iref

RESONANCE

AMPLIFIER

SOFTWARE

PROGRAMMABLE

PORT

MUX

I2C-BUS

AND

3-WIRE BUS

VCCD

GAIN

STABILIZATION POWER

SUPPLY

SOFT

MUTE

MPX

DECODER

CRYSTAL

OSCILLATOR

TEA5767HN

VCCA

1, 10, 20, 21,

30, 31, 40

n.c.

12 BUSMODE

pilot

mono

Product data sheet Rev. 05 — 26 January 2007 5 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Pin conﬁguration

001aab363

TEA5767HN

n.c.

CLOCK

n.c.

VAFL

DATA VAFR

VCCD TMUTE

DGND MPXO

VCC(VCO) Vref

VCOTANK2 TIFC

VCOTANK1 LIMDEC1

CPOUT LIMDEC2

n.c. n..c.

WRITE/READ

BUSMODE

BUSENABLE

SWPORT1

SWPORT2

XTAL1

XTAL2

PHASEFIL

PILFIL

n.c.

LOOPSW

TAGC

RFI2

RFGND

RFI1

VCCA

AGND

Igain

n.c.

10 21

9 22

8 23

7 24

6 25

5 26

4 27

3 28

2 29

1 30

terminal 1

index area

Transparent top view

Table 3. Pin description

Symbol Pin Description

n.c. 1 not connected

CPOUT 2 charge pump output of synthesizer PLL

VCOTANK1 3 VCO tuned circuit output 1

VCOTANK2 4 VCO tuned circuit output 2

VCC(VCO) 5 VCO supply voltage

DGND 6 digital ground

VCCD 7 digital supply voltage

DATA 8 bus data line input/output

CLOCK 9 bus clock line input

n.c. 10 not connected

WRITE/READ 11 write/read control input for the 3-wire bus

BUSMODE 12 bus mode select input

BUSENABLE 13 bus enable input

SWPORT1 14 software programmable port 1

SWPORT2 15 software programmable port 2

XTAL1 16 crystal oscillator input 1

Product data sheet Rev. 05 — 26 January 2007 6 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

7. Functional description

7.1 Low-noise RF ampliﬁer

The Low Noise Ampliﬁer (LNA) input impedance together with the LC RF input circuit

deﬁnes an FM band ﬁlter. The gain of the LNA is controlled by the RF AGC circuit.

7.2 FM mixer

The FM quadrature mixer converts the FM RF (76 MHz to 108 MHz) to an IF of 225 kHz.

7.3 VCO

The varactor tuned LC VCO provides the Local Oscillator (LO) signal for the FM

quadrature mixer. The VCO frequency range is 150 MHz to 217 MHz.

XTAL2 17 crystal oscillator input 2

PHASEFIL 18 phase detector loop ﬁlter

PILFIL 19 pilot detector low-pass ﬁlter

n.c. 20 not connected

n.c. 21 not connected

VAFL 22 left audio frequency output voltage

VAFR 23 right audio frequency output voltage

TMUTE 24 time constant for soft mute

MPXO 25 FM demodulator MPX signal output

Vref 26 reference voltage

TIFC 27 time constant for IF center adjust

LIMDEC1 28 decoupling IF limiter 1

LIMDEC2 29 decoupling IF limiter 2

n.c. 30 not connected

n.c. 31 not connected

Igain 32 gain control current for IF ﬁlter

AGND 33 analog ground

VCCA 34 analog supply voltage

RFI1 35 RF input 1

RFGND 36 RF ground

RFI2 37 RF input 2

TAGC 38 time constant RF AGC

LOOPSW 39 switch output of synthesizer PLL loop ﬁlter

n.c. 40 not connected

Table 3. Pin description

…continued

Symbol Pin Description

Product data sheet Rev. 05 — 26 January 2007 7 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

7.4 Crystal oscillator

The crystal oscillator can operate with a 32.768 kHz clock crystal or a 13 MHz crystal. The

temperature drift of standard 32.768 kHz clock crystals limits the operational temperature

range from −10 °Cto+60°C.

The PLL synthesizer can be clocked externally with a 32.768 kHz, a 6.5 MHz or a 13 MHz

signal via pin XTAL2.

The crystal oscillator generates the reference frequency for:

•The reference frequency divider for the synthesizer PLL

•The timing for the IF counter

•The free-running frequency adjustment of the stereo decoder VCO

•The center frequency adjustment of the IF ﬁlters

7.5 PLL tuning system

The PLL synthesizer tuning system is suitable to operate with a 32.768 kHz or a 13 MHz

reference frequency generated by the crystal oscillator or applied to the IC from an

external source. The synthesizer can also be clocked via pin XTAL2 at 6.5 MHz. The PLL

tuning system can perform an autonomous search tuning function.

7.6 RF AGC

The RF AGC prevents overloading and limits the amount of intermodulation products

created by strong adjacent channels.

7.7 IF ﬁlter

Fully integrated IF ﬁlter.

7.8 FM demodulator

The FM quadrature demodulator has an integrated resonator to perform the phase shift of

the IF signal.

7.9 Level voltage generator and analog-to-digital converter

The FM IF analog level voltage is converted to 4 bits digital data and output via the bus.

7.10 IF counter

The IF counter outputs a 7-bit count result via the bus.

7.11 Soft mute

The low-pass ﬁltered level voltage drives the soft mute attenuator at low RF input levels.

The soft mute function can be switched off via the bus.

7.12 MPX decoder

The PLL stereo decoder is adjustment-free. The stereo decoder can be switched to mono

via the bus.

Product data sheet Rev. 05 — 26 January 2007 8 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

7.13 Signal dependent mono to stereo blend

With a decreasing RF input level the MPX decoder blends from stereo to mono to limit the

output noise. The continuous mono to stereo blend can also be programmed via the bus

to an RF level depending switched mono to stereo transition. Stereo Noise Cancelling

(SNC) can be switched off via the bus.

7.14 Signal dependent AF response

The audio bandwidth will be reduced with a decreasing RF input level. This function can

be switched off via the bus.

7.15 Software programmable ports

Two software programmable ports (open-collector) can be addressed via the bus.

The port 1 (pin SWPORT1) function can be changed with write data byte 4 bit 0

(see Table 13). Pin SWPORT1 is then output for the ready ﬂag of read byte 1.

7.16 I2C-bus and 3-wire bus

The 3-wire bus and the I2C-bus operate with a maximum clock frequency of 400 kHz.

Before any READ or WRITE operation the pin BUSENABLE has to be HIGH for at

least 10 µs.

The I2C-bus mode is selected when pin BUSMODE is LOW, when pin BUSMODE is HIGH

the 3-wire bus mode is selected.

Product data sheet Rev. 05 — 26 January 2007 9 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

Fig 3. Flowchart auto search or preset

001aae346

Power on:

Mute, stand-by activated

All other status is random

Complete initialization by

microprocessor is required

Reset bit counter:

Bits are clocked into the

receive register

Completed bytes are written to

the destinastion register

Use value of tuning memory:

Write result to the programmable

divider (also available at the bus)

Wait 10 ms. Have the signal level

available at the bus

Reset IF counter and enable counting

Wait for result

Have the result available for the bus

Set 'found' flagSubstract 100 kHz to the tuning memory

Add 100 kHz to the tuning memory

Set 'band limit' flag

yes

yesyes

no no

yes

no no

Lower

tuning limit

exceeded?

Upper

tuning limit

exceeded?

upwards?

Mode?

Signal

level OK?

Mode?

Write enable

activated?

IF frequency

OK?

Product data sheet Rev. 05 — 26 January 2007 10 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

8. I2C-bus, 3-wire bus and bus-controlled functions

8.1 I2C-bus speciﬁcation

Information about the I2C-bus can be found in the brochure

“The I

C-bus and how to use

it” (order number 9398 393 40011)

The standard I2C-bus speciﬁcation is expanded by the following deﬁnitions:

IC address: 110 0000b

Structure of the I2C-bus logic: slave transceiver

Subaddresses are not used

The maximum LOW-level input and the minimum HIGH-level input are speciﬁed to

0.2VCCD and 0.45VCCD respectively.

The pin BUSMODE must be connected to ground to operate the IC with the I2C-bus.

Remark: The I2C-bus operates at a maximum clock frequency of 400 kHz. It is not

allowed to connect the IC to an I2C-bus operating at a higher clock rate.

8.1.1 Data transfer

Data sequence: address, byte 1, byte 2, byte 3, byte 4 and byte 5 (the data transfer has to

be in this order). The Least Signiﬁcant Bit (LSB) = 0 of the address indicates a WRITE

operation to the TEA5767HN.

Bit 7 of each byte is considered as the Most Signiﬁcant Bit (MSB) and has to be

transferred as the ﬁrst bit of the byte.

The data becomes valid bitwise at the appropriate falling edge of the clock. A STOP

condition after any byte can shorten transmission times.

When writing to the transceiver by using the STOP condition before completion of the

whole transfer:

•The remaining bytes will contain the old information

•If the transfer of a byte is not completed, the new bits will be used, but a new tuning

cycle will not be started

The IC can be switched into a low current Standby mode with the standby bit; the bus is

then still active. The standby current can be reduced by deactivating the bus interface

(pin BUSENABLE LOW). If the bus interface is deactivated (pin BUSENABLE LOW)

without the Standby mode being programmed, the IC maintains normal operation, but is

isolated from the bus lines.

The software programmable output (SWPORT1) can be programmed to operate as a

tuning indicator output. As long as the IC has not completed a tuning action,

pin SWPORT1 remains LOW. The pin becomes HIGH, when a preset or search tuning is

completed or when a band limit is reached.

The reference frequency divider of the synthesizer PLL is changed when the MSB in

byte 5 is set to logic 1. The tuning system can then be clocked via pin XTAL2 at 6.5 MHz.

Product data sheet Rev. 05 — 26 January 2007 11 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

8.1.2 Power-on reset

At Power-on reset the mute is set, all other bits are set to LOW. To initialize the IC all bytes

have to be transferred.

8.2 I2C-bus protocol

[1] Read or write mode:

a) 0 = write operation to the TEA5767HN.

b) 1 = read operation from the TEA5767HN.

(1) S = START condition.

(2) A = acknowledge.

(3) P = STOP condition.

Fig 4. Write mode

(1) S = START condition.

(2) A = acknowledge.

Fig 5. Read mode

Table 4. IC address byte

IC address Mode

1100000R/

W[1]

001aae347

ADDRESS (WRITE) DATA BYTE(S)

S(1) A(2) P(3)

A(2)

001aae348

ADDRESS (READ) DATA BYTE 1

S(1) A(2)

Product data sheet Rev. 05 — 26 January 2007 12 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

8.3 3-wire bus speciﬁcation

The 3-wire bus controls the write/read, clock and data lines and operates at a maximum

clock frequency of 400 kHz.

Hint: By using the standby bit the IC can be switched into a low current Standby mode. In

Standby mode the IC must be in the WRITE mode. When the IC is switched to READ

mode, during standby, the IC will hold the data line down. The standby current can be

reduced by deactivating the bus interface (pin BUSENABLE LOW). If the bus interface is

deactivated (pin BUSENABLE LOW) without the Standby mode being programmed, the

IC maintains normal operation, but is isolated from the clock and data line.

8.3.1 Data transfer

Data sequence: byte 1, byte 2, byte 3, byte 4 and byte 5 (the data transfer has to be in this

order).

tf = fall time of both SDA and SCL signals: 20 + 0.1Cb < tf < 300 ns, where Cb = capacitive load on bus line in pF.

tr = rise time of both SDA and SCL signals: 20 + 0.1Cb < tf < 300 ns, where Cb = capacitive load on bus line in pF.

tHD;STA = hold time (repeated) START condition. After this period, the ﬁrst clock pulse is generated: > 600 ns.

tHIGH = HIGH period of the SCL clock: > 600 ns.

tLOW = LOW period of the SCL clock > 1300 ns.

tSU;STA = set-up time for a repeated START condition: > 600 ns.

tHD;DAT = data hold time: 300 ns < tHD;DAT < 900 ns.

Remark: 300 ns lower limit is added because the ASIC has no internal hold time for the SDA signal.

tSU;DAT = data set-up time: tSU;DAT > 100 ns. If ASIC is used in a standard mode I2C-bus system, tSU;DAT > 250 ns.

tSU;STO = set-up time for STOP condition: > 600 ns.

tBUF = bus free time between a STOP and a START condition: > 600 ns.

Cb = capacitive load of one bus line: < 400 pF.

tSU;BUSEN = bus enable set-up time: tSU;BUSEN > 10 µs.

tHO;BUSEN = bus enable hold time: tHO;BUSEN > 10 µs.

Remark: The terms SDA and SCL are the corresponding terms used by the I2C-bus for the DATA and CLOCK signals

respectively.

Fig 6. I2C-bus timing diagram

001aae349

tHD;STA tHD;DAT tSU;STA tSU;STO

tBUF

tSU;DAT

tHD;STA

tLOW tr

tHIGH

SDA

SCL

BUSENABLE

tSU;BUSEN tHO;BUSEN

Product data sheet Rev. 05 — 26 January 2007 13 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

A positive edge at pin WRITE/READ enables the data transfer into the IC. The data has to

be stable at the positive edge of the clock. Data may change while the clock is LOW and is

written into the IC on the positive edge of the clock. Data transfer can be stopped after the

transmission of new tuning information with the ﬁrst two bytes or after each following byte.

A negative edge at pin WRITE/READ enables the data transfer from the IC. The

WRITE/READ pin changes while the clock is LOW. With the negative edge at

pin WRITE/READ the MSB of the ﬁrst byte occurs at pin DATA.

The bits are shifted on the negative clock edge to pin DATA and can be read on the

positive edge.

To do two consecutive read or write actions, pin WRITE/READ has to be toggled for at

least one clock period. When a search tuning request is sent, the IC autonomously starts

searching the FM band; the search direction and search stop level can be selected. When

a station with a ﬁeld strength equal to or greater than the stop level is found, the tuning

system stops and the ready ﬂag bit is set to HIGH. When, during search, a band limit is

reached, the tuning system stops at the band limit and the band limit ﬂag bit is set to

HIGH. The ready ﬂag is also set to HIGH in this case.

The software programmable output (SWPORT1) can be programmed to operate as a

tuning indicator output. As long as the IC has not completed a tuning action,

pin SWPORT1 remains LOW. The pin becomes HIGH, when a preset or search tuning is

completed or when a band limit is reached.

The reference frequency divider of the synthesizer PLL is changed when the MSB in

byte 5 is set to logic 1. The tuning system can then be clocked via pin XTAL2 at 6.5 MHz.

8.3.2 Power-on reset

At Power-on reset the mute is set, all other bits are random. To initialize the IC all bytes

have to be transferred.

8.4 Writing data

Fig 7. 3-wire bus write data

mhc250

50 %

tsu(clk)

tsu(write)

valid data

tW(write)

50 % 50 %

50 %

WRITE_READ

CLOCK

DATA

th(write)

Product data sheet Rev. 05 — 26 January 2007 14 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

Fig 8. Write mode

Table 5. Format of 1st data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

MUTE SM PLL13 PLL12 PLL11 PLL10 PLL9 PLL8

Table 6. Description of 1st data byte bits

Bit Symbol Description

7 MUTE if MUTE = 1 then L and R audio are muted; if MUTE = 0 then L and R

audio are not muted

6SM Search mode: if SM = 1 then in search mode; if SM = 0 then not in

search mode

5 to 0 PLL[13:8] setting of synthesizer programmable counter for search or preset

Table 7. Format of 2nd data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

PLL7 PLL6 PLL5 PLL4 PLL3 PLL2 PLL1 PLL0

Table 8. Description of 2nd data byte bits

Bit Symbol Description

7 to 0 PLL[7:0] setting of synthesizer programmable counter for search or preset

Table 9. Format of 3rd data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

SUD SSL1 SSL0 HLSI MS MR ML SWP1

Table 10. Description of 3rd data byte bits

Bit Symbol Description

7 SUD Search Up/Down: if SUD = 1 then search up; if SUD = 0 then search

down

6 and 5 SSL[1:0] Search Stop Level: see Table 11

4 HLSI High/Low Side Injection: if HLSI = 1 then high side LO injection; if

HLSI = 0 then low side LO injection

3MS Mono to Stereo: if MS = 1 then forced mono; if MS = 0 then stereo

2MR Mute Right: if MR = 1 then the right audio channel is muted and

forced mono; if MR = 0 then the right audio channel is not muted

1ML Mute Left: if ML = 1 then the left audio channel is muted and forced

mono; if ML = 0 then the left audio channel is not muted

0 SWP1 Software programmable port 1: if SWP1 = 1 then port 1 is HIGH; if

SWP1 = 0 then port 1 is LOW

001aae350

DATA BYTE 5DATA BYTE 4DATA BYTE 3DATA BYTE 2DATA BYTE 1

Product data sheet Rev. 05 — 26 January 2007 15 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

Table 11. Search stop level setting

SSL1 SSL0 Search stop level

0 0 not allowed in search mode

0 1 low; level ADC output = 5

1 0 mid; level ADC output = 7

1 1 high; level ADC output = 10

Table 12. Format of 4th data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

SWP2 STBY BL XTAL SMUTE HCC SNC SI

Table 13. Description of 4th data byte bits

Bit Symbol Description

7 SWP2 Software programmable port 2: if SWP2 = 1 then port 2 is HIGH; if

SWP2 = 0 then port 2 is LOW

6 STBY Standby: if STBY = 1 then in Standby mode; if STBY = 0 then not in

Standby mode

5BL Band Limits: if BL = 1 then Japanese FM band; if BL = 0 then

US/Europe FM band

4XTAL Clock frequency: see Table 16

3 SMUTE Soft Mute: if SMUTE = 1 then soft mute is ON; if SMUTE = 0 then soft

mute is OFF

2 HCC High Cut Control: if HCC = 1 then high cut control is ON; if HCC = 0

then high cut control is OFF

1 SNC Stereo Noise Cancelling: if SNC = 1 then stereo noise cancelling is

ON; if SNC = 0 then stereo noise cancelling is OFF

0SI Search Indicator: if SI = 1 then pin SWPORT1 is output for the ready

ﬂag; if SI = 0 then pin SWPORT1 is software programmable port 1

Table 14. Format of 5th data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

PLLREF DTC - - - - - -

Table 15. Description of 5th data byte bits

Bit Symbol Description

7 PLLREF if PLLREF = 1 then the 6.5 MHz reference frequency for the PLL is

enabled; if PLLREF = 0 then the 6.5 MHz reference frequency for the

PLL is disabled; see Table 16

6 DTC if DTC = 1 then the de-emphasis time constant is 75 µs; if DTC = 0

then the de-emphasis time constant is 50 µs

5 to 0 - not used; position is don’t care

Product data sheet Rev. 05 — 26 January 2007 16 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

8.5 Reading data

Table 16. Clock bits setting

PLLREF XTAL Clock frequency

0 0 13 MHz

0 1 32.768 kHz

1 0 6.5 MHz

1 1 not allowed

Fig 9. 3-wire bus read data

Fig 10. Read mode

Table 17. Format of 1st data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

RF BLF PLL13 PLL12 PLL11 PLL10 PLL9 PLL8

Table 18. Description of 1st data byte bits

Bit Symbol Description

7RF Ready Flag: if RF = 1 then a station has been found or the band limit

has been reached; if RF = 0 then no station has been found

6 BLF Band Limit Flag: if BLF = 1 then the band limit has been reached; if

BLF = 0 then the band limit has not been reached

5 to 0 PLL[13:8] setting of synthesizer programmable counter after search or preset

Table 19. Format of 2nd data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

PLL7 PLL6 PLL5 PLL4 PLL3 PLL2 PLL1 PLL0

mhc249

50 % 50 %

tsu(clk) tHIGH

tLOW td

tW(read)

50 % 50 %

50 %

WRITE_READ

CLOCK

DATA

001aae350

DATA BYTE 5DATA BYTE 4DATA BYTE 3DATA BYTE 2DATA BYTE 1

Product data sheet Rev. 05 — 26 January 2007 17 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

Table 20. Description of 2nd data byte bits

Bit Symbol Description

7 to 0 PLL[7:0] setting of synthesizer programmable counter after search or preset

Table 21. Format of 3rd data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

STEREO IF6 IF5 IF4 IF3 IF2 IF1 IF0

Table 22. Description of 3rd data byte bits

Bit Symbol Description

7 STEREO Stereo indication: if STEREO = 1 then stereo reception; if

STEREO = 0 then mono reception

6 to 0 PLL[13:8] IF counter result

Table 23. Format of 4th data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

LEV3 LEV2 LEV1 LEV0 CI3 CI2 CI1 0

Table 24. Description of 4th data byte bits

Bit Symbol Description

7 to 4 LEV[3:0] level ADC output

3 to 1 CI[3:1] Chip Identiﬁcation: these bits have to be set to logic 0

0 - this bit is internally set to logic 0

Table 25. Format of 5th data byte

7 (MSB) 6 5 4 3 2 1 0 (LSB)

00000000

Table 26. Description of 5th data byte bits

Bit Symbol Description

7 to 0 - reserved for future extensions; these bits are internally set to logic 0

Product data sheet Rev. 05 — 26 January 2007 18 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

9. Internal circuitry

Table 27. Internal circuitry

Pin Symbol Equivalent circuit

1 n.c.

2 CPOUT

COTANK1

COTANK2

CC(VCO)

6 DGND

CCD

8 DATA

9 CLOCK

10 n.c.

mhc285

270 Ω

mhc286

120 Ω

mhc287

270 Ω

mhc288

Product data sheet Rev. 05 — 26 January 2007 19 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

11 WRITE/READ

12 BUSMODE

13 BUSENABLE

14 SWPORT1

15 SWPORT2

16 XTAL1

17 XTAL2

Table 27. Internal circuitry

Pin Symbol Equivalent circuit

270 Ω

mhc289

611

270 Ω

mhc290

612

150 Ω

mhc291

613

mhc292

150 Ω

mhc293

150 Ω

16 17

mhc294

Product data sheet Rev. 05 — 26 January 2007 20 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

18 PHASEFIL

19 PILFIL

20 n.c.

21 n.c.

22 VAFL

23 VAFR

24 TMUTE

Table 27. Internal circuitry

Pin Symbol Equivalent circuit

mhc295

270 Ω19

mhc296

10 Ω

mhc297

10 Ω

mhc298

1 kΩ

mhc299

Product data sheet Rev. 05 — 26 January 2007 21 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

25 MPXO

26 Vref

27 TIFC

28 LIMDEC1

29 LIMDEC2

30 n.c.

31 n.c.

Table 27. Internal circuitry

Pin Symbol Equivalent circuit

150 Ω

mhc300

mhc301

mhc302

40 kΩ

mhc303

270 Ω28

mhc304

270 Ω

Product data sheet Rev. 05 — 26 January 2007 22 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

10. Limiting values

32 Igain

33 AGND

34 VCCA

35 RFI1

36 RFGND

37 RFI2

38 TAGC

39 LOOPSW

40 n.c.

Table 27. Internal circuitry

Pin Symbol Equivalent circuit

mhc305

mhc306

35 37

mhc307

mhc308

Table 28. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VVCOTANK1 VCO tuned circuit output

voltage 1 −0.3 +8 V

VVCOTANK2 VCO tuned circuit output

voltage 2 −0.3 +8 V

VCCD digital supply voltage −0.3 +5 V

VCCA analog supply voltage −0.3 +8 V

Tstg storage temperature −55 +150 °C

Tamb ambient temperature −10 +75 °C

Product data sheet Rev. 05 — 26 January 2007 23 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

[1] Machine model (R = 0 Ω, C = 200 pF).

[2] Human body model (R = 1.5 kΩ, C = 100 pF).

11. Thermal characteristics

12. Static characteristics

Vesd electrostatic discharge

voltage all pins except

pin DATA [1] −200 +200 V

[2] −2000 +2000 V

pin DATA [1] −150 +200 V

[2] −2000 +2000 V

Table 28. Limiting values

…continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Table 29. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to

ambient in free air 29 K/W

Table 30. Static characteristics

CCA

CC(VCO)

CCD

= 2.7 V; T

amb

=25

C; All AC values are given in RMS unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Supply voltages[1]

VCCA analog supply voltage 2.5 3.0 5.0 V

VCC(VCO) VCO supply voltage 2.5 3.0 5.0 V

VCCD digital supply voltage 2.5 3.0 5.0 V

Supply currents

ICCA analog supply current operating

VCCA = 3 V 6.0 8.4 10.5 mA

VCCA = 5 V 6.2 8.6 10.7 mA

Standby mode

VCCA =3V - 3 6 µA

VCCA = 5 V - 3.2 6.2 µA

ICC(VCO) VCO supply current operating

VCC(VCO) = 3 V 560 750 940 µA

VCC(VCO) = 5 V 570 760 950 µA

Standby mode

VCC(VCO) =3V - 1 2 µA

VCC(VCO) = 5 V - 1.2 2.2 µA

Product data sheet Rev. 05 — 26 January 2007 24 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

[1] VCCA, VCC(VCO) and VCCD must not differ by more than 200 mV.

ICCD digital supply current operating

VCCD = 3 V 2.1 3.0 3.9 mA

VCCD = 5 V 2.25 3.15 4.05 mA

Standby mode; VCCD =3V

bus enable line HIGH 30 56 80 µA

bus enable line LOW 11 19 26 µA

Standby mode; VCCD =5V

bus enable line HIGH 50 78 105 µA

bus enable line LOW 20 33 45 µA

Table 30. Static characteristics

…continued

CCA

CC(VCO)

CCD

= 2.7 V; T

amb

=25

C; All AC values are given in RMS unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Table 31. DC operating points, unloaded DC voltage

CCA

CC(VCO)

CCD

= 2.7 V; T

amb

=25

C; unless otherwise speciﬁed.

Operating

point Conditions Min Typ Max Unit

VCPOUT 0.1 - VCC(VCO) −0.1 V

VXTAL2 data byte 4 bit 4 = 1 1.64 1.72 1.8 V

data byte 4 bit 4 = 0 1.68 1.75 1.82 V

VXTAL2 data byte 4 bit 4 = 1 1.64 1.72 1.8 V

data byte 4 bit 4 = 0 1.68 1.75 1.82 V

VPHASEFIL 0.4 1.2 VCCA −0.4 V

VPILFIL 0.65 0.9 1.3 V

VAFL fRF = 98 MHz; VRF = 1 mV 720 850 940 mV

VAFR fRF = 98 MHz; VRF = 1 mV 720 850 940 mV

VTMUTE VRF = 0 V 1.5 1.65 1.8 V

VMPXO fRF = 98 MHz; VRF = 1 mV 680 815 950 mV

Vref 1.45 1.55 1.65 V

VTIFC 1.34 1.44 1.54 V

VLIMDEC1 1.86 1.98 2.1 V

VLIMDEC2 1.86 1.98 2.1 V

VIgain 480 530 580 mV

VRFI1 0.93 1.03 1.13 V

VRFI2 0.93 1.03 1.13 V

VTAGC VRF = 0 V 1 1.57 2 V

Product data sheet Rev. 05 — 26 January 2007 25 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

13. Dynamic characteristics

Table 32. Dynamic characteristics

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values given in RMS;

For V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VCO

fosc oscillator frequency 150 - 217 MHz

Crystal oscillator

Circuit input: pin XTAL2

Vi(osc) oscillator input voltage oscillator externally clocked 140 - 350 mV

Riinput resistance oscillator externally clocked

data byte 4 bit 4 = 0 2 3 4 kΩ

data byte 4 bit 4 = 1 230 330 430 kΩ

Ciinput capacitance oscillator externally clocked

data byte 4 bit 4 = 0 3.9 5.6 7.3 pF

data byte 4 bit 4 = 1 5 6 7 pF

Crystal: 32.768 kHz

frseries resonance

frequency data byte 4 bit 4 = 1 - 32.768 - kHz

∆f/frfrequency deviation −20 ×10−6- +20 ×10−6

C0shunt capacitance - - 3.5 pF

RSseries resistance - - 80 kΩ

∆fr/fr(25 °C) temperature drift −10 °C<T

amb < +60 °C−50 ×10−6- +50 ×10−6

Crystal: 13 MHz

frseries resonance

frequency data byte 4 bit 4 = 0 - 13 - MHz

∆f/frfrequency deviation −30 ×10−6- +30 ×10−6

C0shunt capacitance - - 4.5 pF

Cmot motional capacitance 1.5 - 3.0 fF

RSseries resistance - - 100 kΩ

∆fr/fr(25 °C) temperature drift −40 °C<T

amb < +85 °C−30 ×10−6- +30 ×10−6

Synthesizer

Programmable divider[1]

Nprog programmable divider

ratio data byte 1 = XX11 1111;

data byte 2 = 1111 1110 - - 8191 -

data byte 1 = XX01 0000;

data byte 2 = 0000 0000 2048 - - -

∆Nstep programmable divider

step size -1--

Reference frequency divider

Nref crystal oscillator divider

ratio data byte 4 bit 4 = 0 - 260 - -

data byte 5 bit 7 = 1;

data byte 4 bit 4 = 0 - 130 - -

data byte 4 bit 4 = 1 - 1 - -

Product data sheet Rev. 05 — 26 January 2007 26 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

Charge pump: pin CPOUT

Isink charge pump peak sink

current 0.2 V < VCPOUT <

VVCOTANK2 −0.2 V;

fVCO >f

ref ×Nprog

- 0.5 - µA

Isource chargepumppeaksource

current 0.2 V < VCPOUT <

VVCOTANK2 −0.2 V;

fVCO <f

ref ×Nprog

-−0.5 - µA

IF counter

VRF RF input voltage for

correct IF count -1218µV

NIF IF counter length - 7 - bit

Nprecount IF counter prescaler ratio - 64 - -

Tcount(IF) IF counter period fxtal = 32.768 kHz - 15.625 - ms

fxtal = 13 MHz - 15.754 - ms

REScount(IF) IF counter resolution fxtal = 32.768 kHz - 4.096 - kHz

fxtal = 13 MHz - 4.0625 - kHz

IFcount IF counter result for

search tuning stop fxtal = 32.768 kHz 29h - 3Dh -

fxtal = 13 MHz 30h - 3Dh -

Pins DATA, CLOCK, WRITE/READ, BUSMODE and BUSENABLE

Riinput resistance 10 - - MΩ

Table 32. Dynamic characteristics

…continued

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values given in RMS;

For V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 05 — 26 January 2007 27 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

Software programmable ports

Pin SWPORT1

Isink(max) maximum sink current data byte 3 bit 0 = 0;

data byte 4 bit 0 = 0;

VSWPORT1 < 0.5 V

500 - - µA

Ileak(max) maximum leakage current data byte 3 bit 0 = 1;

VSWPORT1 <5V −1- +1µA

Pin SWPORT2

Isink(max) maximum sink current data byte 4 bit 7 = 0;

VSWPORT1 < 0.5 V 500 - - µA

Ileak(max) maximum leakage current data byte 4 bit 7 = 1;

VSWPORT1 <5V −1- +1µA

FM signal channel

FM RF input

fFM(ant) FM input frequency 76 - 108 MHz

Riinput resistance at pins

RFI1 and RFI2 to RFGND 75 100 125 Ω

Ciinput capacitance at pins

RFI1 and RFI2 to RFGND 2.5 4 6 pF

VRF RF sensitivity input

voltage fRF = 76 MHz to 108 MHz;

∆f = 22.5 kHz; fmod = 1 kHz;

(S+N)/N = 26 dB; L = R;

de-emphasis = 75 µs;

BAF = 300 Hz to 15 kHz

- 2 3.5 µV

IP3in in-band 3rd-order

intercept point related to

VRFI1-RFI2 (peak value)

∆f1= 200 kHz; ∆f2= 400 kHz;

ftune = 76 MHz to 108 MHz 81 84 - dBµV

IP3out out-band 3rd-order

intercept point related to

VRFI1-RFI2 (peak value)

∆f1= 4 MHz; ∆f2= 8 Hz;

ftune = 76 MHz to 108 MHz 82 85 - dBµV

RF AGC

VRF1 RF input voltage for start

of AGC fRF1 = 93 MHz; fRF2 = 98 MHz;

VRF2 =50dBµV;

[2] 66 72 78 dBµV

IF ﬁlter

fIF IF ﬁlter center frequency 215 225 235 kHz

BIF IF ﬁlter bandwidth 85 94 102 kHz

S+200 high side 200 kHz

selectivity ∆f = +200 kHz;

ftune = 76 MHz to 108 MHz [3] 39 43 - dB

S−200 low side 200 kHz

selectivity ∆f=−200 kHz;

ftune = 76 MHz to 108 MHz [3] 32 36 - dB

S+100 high side 100 kHz

selectivity ∆f = +100 kHz;

ftune = 76 MHz to 108 MHz [3] 812- dB

Table 32. Dynamic characteristics

…continued

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values given in RMS;

For V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VTMUTE

∆VRF1

------------------------ 14 mV

3 dBµV

-------------------

Product data sheet Rev. 05 — 26 January 2007 28 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

S-100 low side 100 kHz

selectivity ∆f=−100 kHz;

ftune = 76 MHz to 108 MHz [3] 812- dB

IR image rejection ftune = 76 MHz to 108 MHz;

VRF =50dBµV24 30 - dB

FM IF level detector and mute voltage

VRF RF input voltage for start

of level ADC read mode data byte 4 bit 4 = 1 2 3 5 µV

∆Vstep level ADC step size 2 3 5 dB

Pin TMUTE

Vlevel level output DC voltage VRF =0µV 1.55 1.65 1.80 V

VRF =3µV 1.60 1.70 1.85 V

Vlevel(slope) slope of level voltage VRF =10µV to 500 µV 150 165 180

Rooutput resistance 280 400 520 kΩ

FM demodulator: pin MPXO

VMPXO demodulator output

voltage VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs;

BAF = 300 Hz to 15 kHz

60 75 90 mV

(S+N)/N maximum signal plus

noise-to-noise ratio VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs;

BAF = 300 Hz to 15 kHz

54 60 - dB

THD total harmonic distortion VRF =1mV; L=R;

∆f = 75 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

- 0.5 1.5 %

αAM AM suppression VRF = 300 µV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

m = 0.3; de-emphasis = 75 µs;

BAF = 300 Hz to 15 kHz

40 - - dB

Rodemodulator output

resistance - - 500 Ω

Isink demodulator output sink

current --30µA

Soft mute

VRF RF input voltage for soft

mute start αmute = 3 dB; data byte 4

bit 3 = 1 3510µV

αmute mute attenuation VRF =1µV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs;

BAF = 300 Hz to 15 kHz;

data byte 4 bit 3 = 1

4 7 15 dB

Table 32. Dynamic characteristics

…continued

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values given in RMS;

For V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

20 dB

--------------

Product data sheet Rev. 05 — 26 January 2007 29 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

MPX decoder

VAFL left audio frequency

output voltage VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

60 75 90 mV

VAFR right audio frequency

output voltage VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

60 75 90 mV

RAFL left audio frequency

output resistance --50Ω

RAFR right audio frequency

output resistance --50Ω

Isink(AFL) left audio frequency

output sink current 170 - - µA

Isink(AFR) right audio frequency

output sink current 170 - - µA

VMPXIN(max) input overdrive margin THD < 3 % 4 - - dB

VAFL left audio frequency

output voltage difference VRF =1mV; L=R;

∆f = 75 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

-1-+1dB

VAFR right audio frequency

output voltage difference VRF =1mV; L=R;

∆f = 75 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

-1-+1dB

αcs(stereo) stereo channel separation VRF =1mV;R=L=0orR=0

and L = 1 including 9 % pilot;

∆f = 75 kHz; fmod = 1 kHz;

data byte 3 bit 3 = 0;

data byte 4 bit 1 = 1

24 30 - dB

(S+N)/N maximum signal plus

noise-to-noise ratio VRF =1mV; L=R;

∆f = 22.5 kHz; fmod = 1 kHz;

de-emphasis = 75 µs;

BAF = 300 Hz to 15 kHz

54 60 - dB

THD total harmonic distortion VRF =1mV; L=R;

∆f = 75 kHz; fmod = 1 kHz;

de-emphasis = 75 µs

- 0.4 1 %

αpilot pilot suppression

measured at pins VAFL

and VAFR

related to ∆f = 75 kHz;

fmod = 1 kHz;

de-emphasis = 75 µs

40 50 - dB

∆fpilot stereo pilot frequency

deviation VRF = 1 mV; read mode

data byte 3 bit 7 = 1 - 3.6 5.8 kHz

data byte 3 bit 7 = 0 1 3 - kHz

pilot switch hysteresis VRF = 1 mV 2 - - dB

Table 32. Dynamic characteristics

…continued

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values given in RMS;

For V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

fpilot1

∆fpilot2

∆

-----------------

Product data sheet Rev. 05 — 26 January 2007 30 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

[1] Calculation of this 14-bit word can be done as follows:

formula for high side injection: ; formula for low side injection:

where:

N = decimal value of PLL word;

fRF = the wanted tuning frequency [Hz];

fIF = the intermediate frequency [Hz] = 225 kHz;

fref = the reference frequency [Hz] = 32.768 kHz for the 32.768 kHz crystal; fref = 50 kHz for the 13 MHz crystal or when externally

clocked with 6.5 MHz.

Example for receiving a channel at 100 MHz with high side injection:

The PLL word becomes 2FCAh.

[2] VRF in Figure 13 is replaced by VRF1 +V

RF2. The radio is tuned to 98 MHz (high side injection).

[3] Low side and high side selectivity can be switched by changing the mixer from high side to low side LO injection.

High cut control

TCde-em de-emphasis time

constant VRF =1mV

data byte 5 bit 6 = 0 38 50 62 µs

data byte 5 bit 6 = 1 57 75 93 µs

VRF =1µV

data byte 5 bit 6 = 0 114 150 186 µs

data byte 5 bit 6 = 1 171 225 279 µs

Mono to stereo blend control

αcs(stereo) stereo channel separation VRF =45µV; R = L = 0 or

R = 0 and L = 1 including 9 %

pilot; ∆f = 75 kHz; fmod = 1 kHz;

data byte 3 bit 3 = 0;

data byte 4 bit 1 = 1

41016dB

Mono to stereo switched

αcs(stereo) stereochannel separation

switching from mono to

stereo with increasing RF

input level

R = L = 0 or R = 0 and L = 1

including 9 % pilot;

∆f = 75 kHz; fmod = 1 kHz;

data byte 3 bit 3 = 0;

data byte 4 bit 1 = 0

VRF = 1 mV 24 - - dB

VRF =20µV--1dB

Bus-driven mute functions

Tuning mute

αmute VAFL and VAFR muting

depth data byte 1 bit 7 = 1 - - −60 dB

αmute(L) VAFL muting depth data byte 3 bit 1 = 1;

fAF = 1 kHz; Rload(L) <30kΩ--−80 dB

αmute(R) VAFR muting depth data byte 3 bit 2 = 1;

fAF = 1 kHz; Rload(R) <30kΩ--−80 dB

Table 32. Dynamic characteristics

…continued

CCA

CCD

CC(VCO)

= 2.7 V; T

amb

=25

C; AC values given in RMS;

For V

the emf value is given; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

N4f

RF fIF

+()×fref

---------------------------------------

=N4f

RF fIF

–()×fref

---------------------------------------

N4 100 106

×225 10×3

+()×32768

--------------------------------------------------------------------12234==

Product data sheet Rev. 05 — 26 January 2007 31 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

14. FM characteristics

(1) Mono signal, no soft mute, ∆f = 22,5 kHz.

(2) Noise in mono mode, no soft mute.

(3) Total Harmonic Distortion (THD), ∆f = 75 kHz.

Fig 11. FM mono characteristics

(1) Right channel with modulation right, SNC on, ∆f = 67,5 kHz + 6,75 kHz pilot.

(2) Left channel with modulation left, SNC on, ∆f = 67,5 kHz + 6,75 kHz pilot.

(3) Noise in stereo mode, SNC on, ∆f = 0 kHz + 6,75 kHz pilot.

(4) Total Harmonic Distortion (THD), ∆f = 67,5 kHz + 6,75 kHz pilot.

Fig 12. FM stereo characteristics

001aae351

VRF (µV)

10−1105106

104

103

110

−40

−60

−20

VAFL,

VAFR

(dB)

−80

THD+N

(%)

(1)

(2)

(3)

001aae352

VRF (µV)

10−1105106

104

103

110

−40

−60

−20

VAFL,

VAFR

(dB)

−80

THD+N

(%)

(1)

(2)

(3)

(4)

Product data sheet Rev. 05 — 26 January 2007 32 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

15. I2C-bus characteristics

16. Test information

[1] Value of the Cpull must be as close as possible to the value of Cload of the crystal.

Table 33. Digital levels and timing

Symbol Parameter Conditions Min Max Unit

Digital inputs

VIH HIGH-level input voltage 0.45VCCD -V

VIL LOW-level input voltage - 0.2VCCD V

Digital outputs

Isink(L) LOW-level sink current 500 - µA

VOL LOW-level output voltage IOL = 500 µA - 450 mV

Timing

fclk clock input frequency I2C-bus enabled - 400 kHz

3-wire bus enabled - 400 kHz

tHIGH clock HIGH time I2C-bus enabled 1 - µs

3-wire bus enabled 1 - µs

tLOW clock LOW time I2C-bus enabled 1 - µs

3-wire bus enabled 1 - µs

tW(write) pulse width for write enable 3-wire bus enabled 1 - µs

tW(read) pulse width for read enable 3-wire bus enabled 1 - µs

tsu(clk) clock set-up time 3-wire bus enabled 300 - ns

th(out) read mode data output hold time 3-wire bus enabled 10 - ns

td(out) read mode output delay time 3-wire bus enabled - 400 ns

tsu(write) write mode set-up time 3-wire bus enabled 100 - ns

th(write) write mode hold time 3-wire bus enabled 100 - ns

Table 34. Component list for Figure 1 and Figure 13

Component Parameter Value Tolerance Type Manufacturer

R1 resistor with low

temperature coefﬁcient 18 kΩ±1 % RC12G Philips

D1 and D2 varicap for VCO tuning - - BB202 Philips

L1 RF band ﬁlter coil 120 nH ±2% Q

min =40

L2 and L3 VCO coil 33 nH ±2% Q

min =40

XTAL13MHz 13 MHz crystal - - NX4025GA

Cpull pulling capacitor for

NX4025GA 10 pF -

XTAL32768Hz 32,768 kHz crystal - -

Cpull pulling capacitor for

XTAL32768Hz Cload[1] -

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Product data sheet Rev. 05 — 26 January 2007 33 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

Value of Cpull must be as close as possible to the value of Cload of the crystal.

(1) Ccomp and Cpull data depends on crystal speciﬁcation.

Fig 13. Application and test diagram

mhc284

I/Q-MIXER

1st FM

IF CENTRE

FREQUENCY

ADJUST

100 pF

22 nF

VRF

VCCA

29 28 27 26 25

27 pF

L1 47 pF

22 µF

RFI1

Igain

AGND

VCCA

RFGND

RFI2

TAGC

LOOPSW

VCOTANK1 45

CPOUT VCOTANK2 VCC(VCO)

6789

DATAVCCD

DGND CLOCK

AGC

programmable divider output

reference frequency divider output

TUNING SYSTEM

4.7 nF

47 nF 47 nF 33 nF

24 23 22

LIMDEC2 LIMDEC1 TIFC Vref MPXO TMUTE VAFR VAFL

14 SWPORT1

SWPORT2

XTAL1

XTAL2

PHASEFIL

PILFIL

SDS

33 nF

1 nF

22 nF

Ccomp(1)

Cpull(1) 32.768 kHz

13 MHz

33 kΩ

10 kΩ

47 nF

VCO

39 nF10 nF

4.7 Ω

100 kΩ

10 kΩ

40 Ω

47 Ω

VCC(VCO)

12 Ω

22 nF

LEVEL

ADC IF

COUNTER

LIMITER DEMODULATOR

Iref

RESONANCE

AMPLIFIER

SOFTWARE

PROGRAMMABLE

PORT

MUX

VCCD

GAIN

STABILIZATION POWER

SUPPLY

SOFT

MUTE

MPX

DECODER

CRYSTAL

OSCILLATOR

TEA5767HN

VCCA

pilot

mono 13 BUSENABLE

WRITE/READ

I2C-BUS

AND

3-WIRE BUS 1, 10, 20, 21,

30, 31, 40

n.c.

12 BUSMODE

Product data sheet Rev. 05 — 26 January 2007 34 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

17. Package outline

Fig 14. Package outline SOT618-1 (HVQFN40)

terminal 1

index area

0.51

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 6.1

5.9

4.25

3.95

6.1

5.9 4.25

3.95

4.5

0.30

0.18

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT618-1 MO-220- - - - - -

0.5

0.3

0.1

0.05

0 2.5 5 mm

scale

SOT618-1

HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;

40 terminals; body 6 x 6 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

11 20

40 31

01-08-08

02-10-22

terminal 1

index area

1/2 e

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1) E(1)

Product data sheet Rev. 05 — 26 January 2007 35 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

18. Soldering

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note

AN10365 “Surface mount reﬂow

soldering description”

18.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

18.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

•Board speciﬁcations, including the board ﬁnish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus PbSn soldering

18.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath speciﬁcations, including temperature and impurities

Product data sheet Rev. 05 — 26 January 2007 36 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

18.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

•Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 15) than a PbSn process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 35 and 36

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 15.

Table 35. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 36. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 05 — 26 January 2007 37 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”

MSL: Moisture Sensitivity Level

Fig 15. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 05 — 26 January 2007 38 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

19. Revision history

Table 37. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TEA5767HN_5 20070126 Product data sheet - TEA5767HN_4

Modiﬁcations: •Modiﬁed: Section 13 “Dynamic characteristics” values of Soft mute, mute attenuation are

changed

TEA5767HN_4 20060220 Product data sheet - TEA5767HN_3

(9397 750 13531)

TEA5767HN_3

(9397 750 13531) 20040920 Product speciﬁcation - TEA5767HN_2

(9397 750 12071)

TEA5767HN_2

(9397 750 12071) 20031112 Preliminary speciﬁcation - TEA5767HN_1

(9397 750 09626)

TEA5767HN_1

(9397 750 09626) 20020913 Preliminary speciﬁcation - -

Product data sheet Rev. 05 — 26 January 2007 39 of 40

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

20. Legal information

20.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

20.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

20.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of a NXP Semiconductors product can reasonably be expected to

result in personal injury, death or severe property or environmental damage.

NXP Semiconductors accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or applications and therefore

such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

20.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

I2C-bus — logo is a trademark of NXP B.V.

21. Contact information

For additional information, please visit: http://www.nxp.com

For sales ofﬁce addresses, send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors TEA5767HN

Low-power FM stereo radio for handheld applications

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 26 January 2007

Document identifier: TEA5767HN_5

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

22. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Functional description . . . . . . . . . . . . . . . . . . . 6

7.1 Low-noise RF ampliﬁer. . . . . . . . . . . . . . . . . . . 6

7.2 FM mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.3 VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.4 Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . . . 7

7.5 PLL tuning system . . . . . . . . . . . . . . . . . . . . . . 7

7.6 RF AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.7 IF ﬁlter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.8 FM demodulator . . . . . . . . . . . . . . . . . . . . . . . . 7

7.9 Level voltage generator and

analog-to-digital converter . . . . . . . . . . . . . . . . 7

7.10 IF counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.11 Soft mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.12 MPX decoder . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.13 Signal dependent mono to stereo blend. . . . . . 8

7.14 Signal dependent AF response . . . . . . . . . . . . 8

7.15 Software programmable ports . . . . . . . . . . . . . 8

7.16 I2C-bus and 3-wire bus. . . . . . . . . . . . . . . . . . . 8

2C-bus, 3-wire bus and bus-controlled

functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

8.1 I2C-bus speciﬁcation. . . . . . . . . . . . . . . . . . . . 10

8.1.1 Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 10

8.1.2 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 11

8.2 I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 11

8.3 3-wire bus speciﬁcation . . . . . . . . . . . . . . . . . 12

8.3.1 Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 12

8.3.2 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 13

8.4 Writing data . . . . . . . . . . . . . . . . . . . . . . . . . . 13

8.5 Reading data . . . . . . . . . . . . . . . . . . . . . . . . . 16

9 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 18

10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 22

11 Thermal characteristics. . . . . . . . . . . . . . . . . . 23

12 Static characteristics. . . . . . . . . . . . . . . . . . . . 23

13 Dynamic characteristics . . . . . . . . . . . . . . . . . 25

14 FM characteristics . . . . . . . . . . . . . . . . . . . . . . 31

15 I2C-bus characteristics . . . . . . . . . . . . . . . . . . 32

16 Test information. . . . . . . . . . . . . . . . . . . . . . . . 32

17 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 34

18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

18.1 Introduction to soldering. . . . . . . . . . . . . . . . . 35

18.2 Wave and reﬂow soldering. . . . . . . . . . . . . . . 35

18.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 35

18.4 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 36

19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 38

20 Legal information . . . . . . . . . . . . . . . . . . . . . . 39

20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 39

20.2 Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

20.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 39

20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 39

21 Contact information . . . . . . . . . . . . . . . . . . . . 39

22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40