ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 1/33
Flash 3V Only 4 Mbit Serial Flash Memory
FEATURES
y Single supply voltage 2.7~3.6V
y Speed
- Read max frequency : 33MHz
- Fast Read max frequency : 50MHz; 75MHz; 100MHz
y Low power consumption
- Active current：40mA
- Standby current：75 μA
y Reliability
- 100,000 typical program/erase cycles
- 20 years Data Retention
y Program
- Byte program time 9 μs(typical)
y Erase
- Chip erase time 4s(typical)
- Block erase time 1sec (typical)
- Sector erase time 90ms(typical)
y Auto Address Increment (AAI) WORD Programming
- Decrease total chip programming time over
Byte-Program operations
y SPI Serial Interface
- SPI Compatible : Mode 0 and Mode3
y End of program or erase detection
y Write Protect ( WP )
y Hold Pin ( HOLD )
y All Pb-free products are RoHS-Compliant
ORDERING INFORMATION
Part No. Speed Package COMMENTS
F25L004A –50PIG 50MHz 8 lead
SOIC
150 mil Pb-free
F25L004A –100PIG 100MHz 8 lead
SOIC
150 mil Pb-free
F25L004A –50PAIG 50MHz 8 lead
SOIC
200 mil Pb-free
Part No. Speed Package COMMENTS
F25L004A –100PAIG 100MHz 8 lead
SOIC
200 mil Pb-free
F25L004A –50DIG 50MHz 8 lead
PDIP
300 mil Pb-free
F25L004A –100DIG 100MHz 8 lead
PDIP
300 mil Pb-free
GENERAL DESCRIPTION
The F25L004A is a 4Megabit, 3V only CMOS Serial Flash
memory device. ESMT’s memory devices reliably store memory
data even after 100,000 program and erase cycles.
The F25L004A features a sector erase architecture. The device
memory array is divided into 128 uniform sectors with 4K byte
each ; 8 uniform blocks with 64K byte each. Sectors can be
erased individually without affecting the data in other sectors.
Blocks can be erased individually without affecting the data in
other blocks. Whole chip erase capabilities provide the flexibility
to revise the data in the device.
The sector protect/unprotect feature disables both program and
erase operations in any combination of the sectors of the
memory.
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 2/33
PIN CONFIGURATIONS
8-PIN SOIC
8-PIN PDIP
1 8
2 7
3 6
4 5
VDD
HOLD
SCK
SI
CE
SO
WP
VSS
1 8
2 7
3 6
4 5
VDD
HOLD
SCK
SI
CE
SO
WP
VSS
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 3/33
PIN Description
Symbol Pin Name Functions
SCK Serial Clock
To provide the timing for serial input and
output operations
SI Serial Data Input
To transfer commands, addresses or data
serially into the device.
Data is latched on the rising edge of SCK.
SO Serial Data Output
To transfer data serially out of the device.
Data is shifted out on the falling edge of
SCK.
CE Chip Enable To activate the device when CE is low.
WP Write Protect
The Write Protect ( WP ) pin is used to
enable/disable BPL bit in the status
register.
HOLD Hold
To temporality stop serial communication
with SPI flash memory without resetting
the device.
VDD Power Supply To provide power.
VSS Ground
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 4/33
SECTOR STRUCTURE
Table1 : F25L004A Sector Address Table
Block Address Block Sector Sector Size
(Kbytes) Address range A18 A17 A16
127 4KB 07F000H – 07FFFFH
: : :
7
112 4KB 070000H – 070FFFH
1 1 1
111 4KB 06F000H – 06FFFFH
: : :
6
96 4KB 060000H – 060FFFH
1 1 0
95 4KB 05F000H – 05FFFFH
: : :
5
80 4KB 050000H – 050FFFH
1 0 1
79 4KB 04F000H – 04FFFFH
: : :
4
64 4KB 040000H – 040FFFH
1 0 0
63 4KB 03F000H – 03FFFFH
: : :
3
48 4KB 030000H – 030FFFH
0 1 1
47 4KB 02F000H – 02FFFFH
: : :
2
32 4KB 020000H – 020FFFH
0 1 0
31 4KB 01F000H – 01FFFFH
: : :
1
16 4KB 010000H – 010FFFH
0 0 1
15 4KB 00F000H – 00FFFFH
: : :
0
0 4KB 000000H – 000FFFH
0 0 0
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 5/33
Table2 : F25L004A Block Protection Table
Status Register Bit Protected Me mory Area Protection Level
BP2 BP1 BP0 Block Range Address Range
0 0 0 0 None None
Upper 1/8 0 0 1 Block 7 70000H – 7FFFFH
Upper 1/4 0 1 0 Block 6~7 60000H – 7FFFFH
Upper 1/2 0 1 1 Block 4~7 40000H – 7FFFFH
All Blocks 1 0 0 Block 0~7 00000H – 7FFFFH
All Blocks 1 0 1 Block 0~7 00000H – 7FFFFH
All Blocks 1 1 0 Block 0~7 00000H – 7FFFFH
All Blocks 1 1 1 Block 0~7 00000H – 7FFFFH
Block Protection (BP2, BP1, BP0)
The Block-Protection (BP2, BP1, BP0) bits define the size of the
memory area, as defined in Table2 to be software protected
against any memory Write (Program or Erase) operations. The
Write-Status-Register (WRSR) instruction is used to program the
BP2, BP1, BP0 bits as long as WP is high or the
Block-Protection-Look (BPL) bit is 0. Chip-Erase can only be
executed if Block-Protection bits are all 0. After power-up, BP2,
BP1 and BP0 are set to1.
Block Protection Lock-Down (BPL)
WP pin driven low (VIL), enables the Block-Protection
-Lock-Down (BPL) bit. When BPL is set to 1, it prevents any
further alteration of the BPL, BP2, BP1, and BP0 bits. When the
WP pin is driven high (VIH), the BPL bit has no effect and its
value is “Don’t Care”. After power-up, the BPL bit is reset to 0.
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 6/33
FUNTIONAL BLOCK DIAGRAM
Address
Buffers
and
Latches
X-Decoder Flash
Y-Decoder
I/O Butters
and
Data Latches
Serial Interface
Control Logic
CE SCK SI WPSO HOLD
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 7/33
Hold Operation
HOLD pin is used to pause a serial sequence underway with the
SPI flash memory without resetting the clocking sequence. To
activate the HOLD mode, CE must be in active low state. The
HOLD mode begins when the SCK active low state coincides
with the falling edge of the HOLD signal. The HOLD mode ends
when the HOLD signal’s rising edge coincides with the SCK
active low state.
If the falling edge of the HOLD signal does not coincide with the
SCK active low state, then the device enters Hold mode when the
SCK next reaches the active low state.
Similarly, if the rising edge of the HOLD signal does not
coincide with the SCK active low state, then the device exits in
Hold mode when the SCK next reaches the active low state. See
Figure 1 for Hold Condition waveform.
Once the device enters Hold mode, SO will be in high impedance
state while SI and SCK can be VIL or VIH.
If CE is driven active high during a Hold condition, it resets the
internal logic of the device. As long as HOLD signal is low, the
memory remains in the Hold condition. To resume
communication with the device, HOLD must be driven active
high, and CE must be driven active low. See Figure 21 for Hold
timing.
Active Hold Active Hold Active
HOLD
SCK
Figure 1 : HOLD CONDITION WAVEFORM
Write Protection
F25L004A provides software Write protection.
The Write Protect pin ( WP ) enables or disables the lockdown
function of the status register. The Block-Protection bits (BP1,
BP0, and BPL) in the status register provide Write protection to
the memory array and the status register. See Table 2 for
Block-Protection description.
Write Protect Pin (WP )
The Write Protect ( WP ) pin enables the lock-down function of
the BPL bit (bit 7) in the status register. When WP is driven low,
the execution of the Write-Status-Register (WRSR) instruction is
determined by the value of the BPL bit (see Table 3). When WP
is high, the lock-down function of the BPL bit is disabled.
TABLE3: CONDITIONS TO EXECUTE
WRITE-STATUS- REGISTER (WRSR)
INSTRUCTION
WP BPL Execute WRSR Instruction
L 1 Not Allowed
L 0 Allowed
H X Allowed
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 8/33
Status Register
The software status register provides status on whether the flash
memory array is available for any Read or Write operation,
whether the device is Write enabled, and the state of the memory
Write protection. During an internal Erase or Program operation,
the status register may be read only to determine the completion
of an operation in progress.
Table 4 describes the function of each bit in the software status
register.
TABLE 4: SOFTWARE STATUS REGISTER
Bit Name Function Default at
Power-up Read/Write
0 BUSY
1 = Internal Write operation is in progress
0 = No internal Write operation is in progress 0 R
1 WEL
1 = Device is memory Write enabled
0 = Device is not memory Write enabled 0 R
2 BP0 Indicate current level of block write protection (See Table 2) 1 R/W
3 BP1 Indicate current level of block write protection (See Table 2) 1 R/W
4 BP2 Indicate current level of block write protection (See Table 2) 1 R/W
5 RESERVED Reserved for future use 0 N/A
6 AAI
Auto Address Increment Programming status
1 = AAI programming mode
0 = Byte-Program mode
0 R
7 BPL
1 = BP2,BP1,BP0 are read-only bits
0 = BP2,BP1,BP0 are read/writable 0 R/W
Note1 : Only BP0,BP1,BP2 and BPL are writable
Note2 : All register bits are volatility
Note3 : All area are protected at power-on (BP2=BP1=BP0=1)
Busy
The Busy bit determines whether there is an internal Erase or
Program operation in progress. A “1” for the Busy bit indicates
the device is busy with an operation in progress. A “0” indicates
the device is ready for the next valid operation.
Write Enable Latch (WEL)
The Write-Enable-Latch bit indicates the status of the internal
memory Write Enable Latch. If the Write-Enable-Latch bit is set to
“1”, it indicates the device is Write enabled. If the bit is set to “0”
(reset), it indicates the device is not Write enabled and does not
accept any memory Write (Program/ Erase) commands. The
Write-Enable-Latch bit is automatically reset under the following
conditions:
• Power-up
• Write-Disable (WRDI) instruction completion
• Byte-Program instruction completion
• Auto Address Increment (AAI) programming reached its
highest memory address
• Sector-Erase instruction completion
• Block-Erase instruction completion
• Chip-Erase instruction completion
• Write-Status-Register instructions
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 9/33
Instructions
Instructions are used to Read, Write (Erase and Program), and
configure the F25L004A. The instruction bus cycles are 8 bits
each for commands (Op Code), data, and addresses. Prior to
executing any Byte-Program, Auto Address Increment (AAI)
programming, Sector-Erase, Block-Erase, or Chip-Erase
instructions, the Write-Enable (WREN) instruction must be
executed first. The complete list of the instructions is provided in
Table 5. All instructions are synchronized off a high to low
transition of CE . Inputs will be accepted on the rising edge of
SCK starting with the most significant bit. CE must be driven
low before an instruction is entered and must be driven high after
the last bit of the instruction has been shifted in (except for Read,
Read-ID and Read-Status-Register instructions). Any low to high
transition on CE , before receiving the last bit of an instruction
bus cycle, will terminate the instruction in progress and return the
device to the standby mode.
Instruction commands (Op Code), addresses, and data are all
input from the most significant bit (MSB) first
TABLE 5: DEVICE OPERATION INSTRUCTIONS
Bus Cycle
1 2 3 4 5 6
Cycle Type/
Operation1,2
Max
Freq SIN S
OUT SIN SOUT SIN SOUT S
IN S
OUT S
IN S
OUT SIN SOUT
Read 33 MHz 03H Hi-Z A23-A16 Hi-Z A15-A8Hi-Z A7-A0 Hi-Z X DOUT
High-Speed-Read 0BH Hi-Z A23-A16 Hi-Z A15-A8Hi-Z A7-A0 Hi-Z X X X DOUT
Sector-Erase4,5 (4K Byte) 20H Hi-Z A23-A16 Hi-Z A15-A8Hi-Z A7-A0 Hi-Z - - - -
Block-Erase5 (64K Byte) D8H Hi-Z A23-A16 Hi-Z A15-A8Hi-Z A7-A0 Hi-Z - - - -
Chip-Erase5 60H
C7H Hi-Z - - - - - - - - - -
Byte-Program5 02H Hi-Z A23-A16 Hi-Z A15-A8Hi-Z A7-A0 Hi-Z DIN Hi-Z - -
Auto-Address-Increment-word
programming (AAI) 6 ADH Hi-Z A23-A16 Hi-Z A15-A8Hi-Z A7-A0 Hi-Z DIN0 Hi-Z DIN1 Hi-Z
Read-Status-Register
(RDSR) 05H Hi-Z X DOUT - Note7 - Note7 - Note7--
Enable-Write-Status-Register
(EWSR)8 50H Hi-Z - - - - - - - - - -
Write-Status-Register
(WRSR)8 01H Hi-Z Data Hi-Z - - -. - - - - -
Write-Enable (WREN) 11 06H Hi-Z - - - - - - - - - -
Write-Disable (WRDI) 04H Hi-Z - - - - - - - - - -
Read-Electronic-Signature9
(RES) ABH Hi-Z X 12H - - - - - - - -
Jedec-Read-ID (JEDEC-ID) 10 9FH Hi-Z X 8CH X 20H X 13H - - - -
90H (A0=0) 8CH 12H
Read-ID (RDID) 90H (A0=1)
Hi-Z A23-A16 Hi-Z A15-A8Hi-Z A7-A0 Hi-Z X 12H X8CH
Enable SO to output RY/BY#
Status during AAI (EBSY) 70H Hi-Z - - - - - - - -
Disable SO to output RY/BY#
Status during AAI (DBSY)
50MHz
100MHz
80H Hi-Z - - - - - - - -
1. Operation: SIN = Serial In, SOUT = Serial Out
2. X = Dummy Input Cycles (VIL or VIH); - = Non-Applicable Cycles (Cycles are not necessary)
3. One bus cycle is eight clock periods.
4. Sector addresses: use AMS-A12, remaining addresses can be VIL or VIH
5. Prior to any Byte-Program, Sector-Erase, Block-Erase,or Chip-Erase operation, the Write-Enable (WREN) instruction must be
executed.
6. To continue programming to the next sequential address location, enter the 8-bit command, ADH, followed by the data to be
programmed.
7. The Read-Status-Register is continuous with ongoing clock cycles until terminated by a low to high transition on CE .
8. The Enable-Write-Status-Register (EWSR) instruction and the Write-Status-Register (WRSR) instruction must work in conjunction
of each other. The WRSR instruction must be executed immediately (very next bus cycle) after the EWSR instruction to make both
instructions effective.
9. The Read-Electronic-Signature is continuous with on going clock cycles until terminated by a low to high transition on CE .
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 10/33
10. The Jedec-Read-ID is output first byte 8CH as manufacture ID; second byte 20H as top memory type; third byte 13H as memory
capacity.
11. The Write-Enable (WREN) instruction and the Write-Status-Register (WRSR) instruction must work in conjunction of each other.
The WRSR instruction must be executed immediately (very next bus cycle) after the WREN instruction to make both instructions
effective. Both EWSR and WREN can enable WRSR, user just need to execute one of it. A successful WRSR can reset WREN.
Read (33 MHz)
The Read instruction supports up to 33 MHz, it outputs the data
starting from the specified address location. The data output
stream is continuous through all addresses until terminated by a
low to high transition on CE . The internal address pointer will
automatically increment until the highest memory address is
reached. Once the highest memory address is reached, the
address pointer will automatically increment to the beginning
(wrap-around) of the address space, i.e. for 4Mbit density, once
the data from address location 7FFFFH had been read, the next
output will be from address location 00000H.
The Read instruction is initiated by executing an 8-bit command,
03H, followed by address bits [A23-A0]. CE must remain active
low for the duration of the Read cycle. See Figure 2 for the Read
sequence.
Figure 2 : READ SEQUENCE
CE
SCK
SI
1 2 3 4 5 6 7 8 15 16 23 24 31 32 39 40 47 48 55 56 63 64 70
N+ 4
DOU T
N+3
DOUT
N+2
DOUT
N+1
DOUT
N
DOUT
MSB
MSB
MSB
HIGH IMPENANCE
SO
03
MODE3
MODE1
ADD. ADD. ADD.
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 11/33
Fast-Read (50 MHz ; 100 MHz)
The High-Speed-Read instruction supporting up to 100 MHz is
initiated by executing an 8-bit command, 0BH, followed by
address bits [A23-A0] and a dummy byte. CE must remain active
low for the duration of the High-Speed-Read cycle. See Figure 3
for the High-Speed-Read sequence.
Following a dummy byte (8 clocks input dummy cycle), the
High-Speed-Read instruction outputs the data starting from the
specified address location. The data output stream is continuous
through all addresses until terminated by a low to high transition
on CE . The internal address pointer will automatically increment
until the highest memory address is reached. Once the highest
memory address is reached, the address pointer will
automatically increment to the beginning (wrap-around) of the
address space, i.e. for 4Mbit density, once the data from address
location 7FFFFH has been read, the next output will be from
address location 000000H.
Figure 3 : HIGH-SPEED-READ SEQUENCE
CE
SCK
SI
0 1 2 3 4 5 6 7 8 1516 2324 3132 39 40 4748 55 56 63 64 80
N+ 4
DOU T
N+ 3
DOU T
N+2
DOUT
N+1
DOUT
N
DOU T
MSB
MSB
MSB
HIGH IMPENANCE
SO
0B ADD. ADD. A DD.
MOD E3
MODE0
71 72
X
Note : X = Dummy Byte : 8 Clocks Input Dummy (VIL or VIH)
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 12/33
Byte-Program
The Byte-Program instruction programs the bits in the selected
byte to the desired data. The selected byte must be in the erased
state (FFH) when initiating a Program operation. A Byte-Program
instruction applied to a protected memory area will be ignored.
Prior to any Write operation, the Write-Enable (WREN)
instruction must be executed. CE must remain active low for
the duration of the Byte-Program instruction. The Byte-Program
instruction is initiated by executing an 8-bit command, 02H,
followed by address bits [A23-A0]. Following the address, the data
is input in order from MSB (bit 7) to LSB (bit 0). CE must be
driven high before the instruction is executed. The user may poll
the Busy bit in the software status register or wait TBP for the
completion of the internal self-timed Byte-Program operation.
See Figure 4 for the Byte-Program sequence.
Figure 4 : BYTE-PROGRAM SEQUENCE
CE
SCK
SI
012345678 1516 2324 3132 39
LSB
MSB
MSB
HIGH IMPENANCE
S
O
02 A DD. ADD. A DD.
MODE3
MODE0
DIN
MSB
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 13/33
Auto Address Increment (AAI) WORD Program
The AAI program instruction allows multiple bytes of data to be programmed without re-issuing the next sequential address location.
This feature decreases total programming time when the multiple bytes or entire memory array is to be programmed. An AAI program
instruction pointing to a protected memory area will be ignored. The selected address range must be in the erased state (FFH) when
initiating an AAI program instruction. While within AAI WORD programming sequence, the only valid instructions are AAI WORD
program operation, RDSR, WRDI. Users have three options to determine the completion of each AAI WORD program cycle: hardware
detection by reading the SO; software detection by polling the BUSY in the software status register or wait TBP. Refer to End-of-Write
Detection section for details.
Prior to any write operation, the Write-Enable (WREN) instruction must be executed. The AAI WORD program instruction is initiated by
executing an 8-bit command, ADH, followed by address bits [A23-A0]. Following the addresses, two bytes of data is input sequentially.
The data is input sequentially from MSB (bit 7) to LSB (bit 0). The first byte of data(DO) will be programmed into the initial address
[A23-A1] with A0 =0; The second byte of data(D1) will be programmed into the initial address [A23-A1] with A0 =1. CE must be driven
high before the AAI WORD program instruction is executed. The user must check the BUSY status before entering the next valid
command. Once the device indicates it is no longer busy, data for next two sequential addresses may be programmed and so on. When
the last desired byte had been entered, check the busy status using the hardware method or the RDSR instruction and execute the
WRDI instruction, to terminate AAI. User must check busy status after WRDI to determine if the device is ready for any command.
Please refer to Figures 7 and Figures 8.
There is no wrap mode during AAI programming; once the highest unprotected memory address is reached, the device will exit AAI
operation and reset the Write-Enable-Latch bit (WEL = 0) and the AAI bit (AAI=0).
End of Write Detection
There are three methods to determine completion of a program cycle during AAI WORD programming: hardware detection by reading
the SO, software detection by polling the BUSY bit in the Software Status Register or wait TBP. The hardware end of write detection
method is described in the section below.
Hardware End of Write Detection
The hardware end of write detection method eliminates the overhead of polling the BUSY bit in the software status register during an AAI
Word PROGRAM OPERATION. The 8bit command, 70H, configures the SO to indicate Flash Busy status during AAI WORD
programming (refer to figure5). The 8bit command, 70H, must be executed prior to executing an AAI WORD program instruction. Once
an internal programming operation begins, asserting CE will immediately drive the status of the internal flash status on the SO pin. A “0”
Indicates the device is busy ; a “1” Indicates the device is ready for the next instruction. De-asserting CE will return the SO pin to
tri-state. The 8bit command, 80H,disables the SO pin to output busy status during AAI WORD program operation and return SO pin to
output software register data during AAI WORD programming (refer to figure6).
FIGURE 5 : ENABLE SO AS HARDWARE BY
/
RY FIGURE 6 : DISABLE SO AS HARDWARE BY
/
RY
DURING AAI PROGRAMMING DURING AAI PROGRAMMING
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 14/33
FIGURE 7 : AUTO ADDRESS INCREMENT (AAI) WORD-PROGRAM SEQUENCE WITH HARDWARE END-OF-WRITE DETETION
FIGURE 8 : AUTO ADDRESS INCREMENT (AAI) WORD-PROGRAM SEQUENCE WITH SOFTWARE END-OF-WRITE DETETION
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 15/33
64K-Byte Block-Erase
The 64K Byte Block-Erase instruction clears all bits in the
selected block to FFH. A Block-Erase instruction applied to a
protected memory area will be ignored. Prior to any Write
operation, the Write-Enable (WREN) instruction must be
executed. CE must remain active low for the duration of the any
command sequence. The Block-Erase instruction is initiated by
executing an 8-bit command, D8H, followed by address bits
[A23-A0]. Address bits [AMS-A16] (AMS = Most Significant address)
are used to determine the block address (BAX), remaining
address bits can be VIL or VIH. CE must be driven high before
the instruction is executed. The user may poll the Busy bit in the
software status register or wait TBE for the completion of the
internal self-timed Block-Erase cycle. See Figure 9 for the
Block-Erase sequence.
FIGURE 9 : 64-KBYTE BLOCK-ERASE SEQUENCE
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 16/33
4K-Byte-Sector-Erase
The Sector-Erase instruction clears all bits in the selected sector
to FFH. A Sector-Erase instruction applied to a protected
memory area will be ignored. Prior to any Write operation, the
Write-Enable (WREN) instruction must be executed. CE must
remain active low for the duration of the any command sequence.
The Sector-Erase instruction is initiated by executing an 8-bit
command, 20H, followed by address bits [A23-A0]. Address bits
[AMS-A12] (AMS = Most Significant address) are used to determine
the sector address (SAX), remaining address bits can be VIL or
VIH. CE must be driven high before the instruction is executed.
The user may poll the Busy bit in the software status register or
wait TSE for the completion of the internal self-timed
Sector-Erase cycle. See Figure 10 for the Sector-Erase
sequence.
CE
SCK
SI
012345678 15 16 23 24 31
MSB
MSB
HIGH IMPENANCE
SO
20 ADD. ADD. ADD.
MODE3
MODE0
FIGURE 10 : SECTOR-ERASE SEQUENCE
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 17/33
Chip-Erase
The Chip-Erase instruction clears all bits in the device to FFH. A
Chip-Erase instruction will be ignored if any of the memory area
is protected. Prior to any Write operation, the Write-Enable
(WREN) instruction must be executed. CE must remain active
low for the duration of the Chip-Erase instruction sequence. The
Chip-Erase instruction is initiated by executing an 8-bit command,
60H or C7H. CE must be driven high before the instruction is
executed. The user may poll the Busy bit in the software status
register or wait TCE for the completion of the internal self-timed
Chip-Erase cycle.
See Figure 11 for the Chip-Erase sequence.
FIGURE 11 : CHIP-ERASE SEQUENCE
Read-Status-Register (RDSR)
The Read-Status-Register (RDSR) instruction allows reading of
the status register. The status register may be read at any time
even during a Write (Program/Erase) operation.
When a Write operation is in progress, the Busy bit may be
checked before sending any new commands to assure that the
new commands are properly received by the device.
CE must be driven low before the RDSR instruction is entered
and remain low until the status data is read.
Read-Status-Register is continuous with ongoing clock cycles
until it is terminated by a low to high transition of the CE
See Figure 12 for the RDSR instruction sequence.
Figure12 : READ-STATUS-REGIST ER (RDSR) SEQUENCE
CE
SCK
SI
0123456789
Bit7
MSB
MSB
HIGH IMPENANCE
SO
05
MODE3
MODE1
10 11 12 13 14
Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Status
Register Out
CE
SCK
SI
01234567
MSB
HI GH IM PENAN CE
SO
60 or C7
MOD E3
MODE0
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 18/33
Write-Enable (WREN)
The Write-Enable (WREN) instruction sets the Write-
Enable-Latch bit to 1 allowing Write operations to occur.
The WREN instruction must be executed prior to any Write
(Program/Erase) operation. CE must be driven high before the
WREN instruction is executed.
FIGURE 13 : WRITE ENABLE (WREN) SEQUENCE
Write-Disable (WRDI)
The Write-Disable (WRDI) instruction resets the Write-Enable-Latch
bit and AAI bit to 0 disabling any new Write operations from occurring.
CE must be driven high before the WRDI instruction is executed.
Figure 14 : WRITE DISABLE (WRDI) SEQUENCE
CE
SCK
SI
01234567
MSB
HI GH IM PENAN CE
SO
06
MOD E3
MODE0
CE
SCK
SI
01234567
MSB
HI GH IM PENAN CE
SO
04
MOD E3
MODE0
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 19/33
Enable-Write-Status-Register (EWSR)
The Enable-Write-Status-Register (EWSR) instruction arms the
Write-Status-Register (WRSR) instruction and opens the status
register for alteration. The Enable-Write-Status-Register
instruction does not have any effect and will be wasted, if it is not
followed immediately by the Write-Status-Register (WRSR)
instruction. CE must be driven low before the EWSR instruction
is entered and must be driven high before the EWSR instruction
is executed.
Write-Status-Register (WRSR)
The Write-Status-Register instruction writes new values to the
BP2, BP1, BP0, and BPL bits of the status register. CE must be
driven low before the command sequence of the WRSR
instruction is entered and driven high before the WRSR
instruction is executed. See Figure 15 for EWSR or WREN and
WRSR instruction sequences.
Executing the Write-Status-Register instruction will be ignored
when WP is low and BPL bit is set to “1”. When the WP is
low, the BPL bit can only be set from “0” to “1” to lockdown the
status register, but cannot be reset from “1” to “0”.
When WP is high, the lock-down function of the BPL bit is
disabled and the BPL, BP0, BP1,and BP2 bits in the status
register can all be changed. As long as BPL bit is set to 0 or WP
pin is driven high (VIH) prior to the low-to-high transition of the
CE pin at the end of the WRSR instruction, the bits in the status
register can all be altered by the WRSR instruction. In this case,
a single WRSR instruction can set the BPL bit to “1” to lock down
the status register as well as altering the BP0 ;BP1 and BP2 bits
at the same time. See Table 3 for a summary description of WP
and BPL functions.
Figure 15 : ENABLE-WRITE-STATUS-REGISTER (EWSR) or WRITE-ENABLE(WREN) and WRITE-STATUS-REGISTER (WRSR)
CE
SCK
SI
01234567
MSB
MSB
HIGH IMPENANCE
SO
50 or 06
MOD E 3
MODE0
01234567891011 12 13 1415
STATUS
REGISTER IN
01 76 5 4 3 2 1 0
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 20/33
Read-Electronic-Signature (RES)
The RES instruction can be used to read the 8-bit Electronic Signature of the device on the SO pin. The RES instruction can provide
access to the Electronic Signature of the device (except while an Erase, Program or WRSR cycle is in progress), Any ERS instruction
executed while an Erase, Program or WRSR cycle is in progress is no decoded, and has no effect on the cycle in progress.
Figure 16 : Read-Electronic-Signature (RES)
CE
SCK
SI
0123456789
Bit7
MSB
MSB
HIGH IMPENANCE
SO
AB
MODE3
MODE1
10 11 12 13 14
Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Status
Register Out
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 21/33
JEDEC Read-ID
The JEDEC Read-ID instruction identifies the device as F25L004A and the manufacturer as ESMT. The device information can be read
from executing the 8-bit command,.9FH. Following the JEDEC Read-ID instruction, the 8-bit manufacturer’s ID, 8CH, is output from the
device. After that, a 16-bit device ID is shifted out on the SO pin. Byte1, 8CH, identifies the manufacturer as ESMT. Byte2, 20H,
identifies the memory type as SPI Flash. Byte3, 13H, identifies the device as F25L004A. The instruction sequence is shown in Figure17.
The JEDEC Read ID instruction is terminated by a low to high transition on CE at any time during data output. If no other command is
issued after executing the JEDEC Read-ID instruction, issue a 00H (NOP) command before going into Standby Mode ( CE =VIH).
Figure 17 : Jedec Read ID Seq uence
Table 9 : JEDEC READ-ID DATA
Device ID
Manufacturer’s ID Memory Type Memory Capacity
Byte1 Byte 2 Byte 3
8CH 20H 13H
CE
SCK
SI
0123456789
HIGH IMPENANCE
SO
9F
MOD E3
MODE0
10 11 12 13 14 15 16 17 18 19 20 2122 2324 2526 27 28 29 30 31 32 33 34
8C 20 13
MSB MSB
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 22/33
Read-ID (RDID)
The Read-ID instruction (RDID) identifies the devices as F25L004A and manufacturer as ESMT. This command is backward compatible
to all ESMT SPI devices and should be used as default device identification when multiple versions of ESMT SPI devices are used in
one design. The device information can be read from executing an 8-bit command, 90H or ABH, followed by address bits [A23-A0].
Following the Read-ID instruction, the manufacturer’s ID is located in address 00000H and the device ID is located in address 00001H.
Once the device is in Read-ID mode, the manufacturer’s and device ID output data toggles between address 00000H and 00001H until
terminated by a low to high transition on CE .
Figure 18 : Read-Electroni c-Signature
Table 10 : JEDEC READ-ID DATA
Address Byte1 Byte2
Manufacturer’s ID 00000H 8CH 12H
Device ID
ESMT F25L004A 00001H 12H 8CH
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 23/33
ELECTRICAL SPECIFICATIONS
Absolute Maximum Stress Ratings
(Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the
operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device
reliability.)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . -2.0V to VDD+2.0V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current (Note1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Note：
1. Output shorted for no more than one second. No more than one output shorted at a time.
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . <5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . . . . CL = 15 pF for ≧75MHz
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .CL = 30 pF for ≦50MHz
See Figures 23 and 24
OPERATING RANGE
Parameter Symbol Value Unit
VDD (for FCLK ≦ 75MHz) 2.7~3.6
Operating Supply Voltage VDD (for FCLK = 100MHz) 3.0~3.6 V
Ambient Operating Temperature TA -40~85 °C
TABLE 6: DC OPERATING CHARACTERISTICS Limits
Symbol Parameter Min Max Units Test Conditions
IDDR Read Current 15 mA
CE =0.1 VDD/0.9 VDD@33 MHz, SO=open
IDDW Program and Erase Current 40 mA
CE =VDD
ISB Standby Current 75 µA
CE =VDD, VIN=VDD or VSS
ILI Input Leakage Current 1 µA VIN=GND to VDD, VDD=VDD Max
ILO Output Leakage Current 1 µA VOUT=GND to VDD, VDD=VDD Max
VIL Input Low Voltage 0.8 V VDD=VDD Min
VIH Input High Voltage 0.7 VDD V VDD=VDD Max
VOL Output Low Voltage 0.2 V IOL=100 µA, VDD=VDD Min
VOH Output High Voltage VDD-0.2 V IOH=-100 µA, VDD=VDD Min
TABLE 7 : RECOMMENDED SYSTEM POWER-UP TIMINGS
Symbol Parameter Minimum Units
TPU-READ1 V
DD Min to Read Operation 10 µs
TPU-WRITE1 V
DD Min to Write Operation 10 µs
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 8: CAPACITANCE (TA = 25°C, f=1 Mhz, other pins open)
Parameter Description Test Condition Maximum
COUT1 Output Pin Capacitance VOUT = 0V 12 pF
CIN1 Input Capacitance VIN = 0V 6 pF
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 24/33
TABLE 11: RELIABILITY CHARACTERISTICS
Symbol Parameter Minimum Specification Units Test Method
NEND1 Endurance 100,000 Cycles JEDEC Standard A117
TDR1 Data Retention 10 Years JEDEC Standard A103
ILTH1 Latch Up 100 + IDD mA JEDEC Standard 78
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
TABLE 12 : AC OPERATING CHARACTERISTICS
Normal 33MHz Fast 50 MHz Fast 100 MHz
Symbol Parameter
Min Max Min Max Min Max
Units
FCLK Serial Clock Frequency 33 50 100 MHz
TSCKH Serial Clock High Time 13 9 5 ns
TSCKL Serial Clock Low Time 13 9 5 ns
TCES1 CE Active Setup Time 5 5 5 ns
TCEH1 CE Active Hold Time 5 5 5 ns
TCHS1 CE Not Active Setup Time 5 5 5 ns
TCHH1 CE Not Active Hold Time 5 5 5 ns
TCPH CE High Time 100 100 100 ns
TCHZ CE High to High-Z Output 9 9 9 ns
TCLZ SCK Low to Low-Z Output 0 0 0 ns
TDS Data In Setup Time 3 3 3 ns
TDH Data In Hold Time 3 3 3 ns
THLS HOLD Low Setup Time 5 5 5 ns
THHS HOLD High Setup Time 5 5 5 ns
THLH HOLD Low Hold Time 5 5 5 ns
THHH HOLD High Hold Time 5 5 5 ns
THZ HOLD Low to High-Z Output 9 9 9 ns
TLZ HOLD High to Low-Z Output 9 9 9 ns
TOH Output Hold from SCK Change 0 0 0 ns
TV Output Valid from SCK 12 8 7 ns
1. Relative to SCK.
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 25/33
ERASE AND PROGRAMMING PERFORMANCE
Limits
Parameter Symbol
Typ.(2) Max.(3) Unit
Sector Erase Time TSE 90 200 ms
Block Erase Time TBE 1 2 s
Chip Erase Time TCE 4 30 s
Byte Programming Time TBP 9 300 us
Chip Programming Time 12 100 s
Erase/Program Cycles (1) 100,000 - Cycles
Data Retention 20 - Years
Notes:
1.Not 100% Tested, Excludes external system level over head.
2.Typical values measured at 25°C, 3V.
3.Maximum values measured at 85°C, VDD(min)
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 26/33
FIGURE 19: SERIAL INPUT TIMING DIAGRAM
FIGURE 20: SERIAL OUTPUT TIMING DIAGRAM
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 27/33
CE#
SCK
SI
HOLD#
SO
FIGURE 21: HOLD TIMING DIAGRAM
FIGURE 22: POWER-UP TIMING DIAGRAM
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 28/33
FIGURE 23 : AC INPUT/OUTPUT REFERENCE WAVEFORMS
FIGUR E 24: A TEST LOAD EXAMPLE
Input timing re
f
erence le
v
el Output timing reference level
0.8VCC
0.2VCC
0.7VCC
0.3VCC 0.5VCC
AC
Measurement
Level
Note : In
p
ut
p
ulse rise an
d
f
all time are <5ns
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 29/33
PACKAGING DIAGRAMS
8-LEAD SOIC ( 150 mil )
b e
0
L
DETAIL "X"
A
A1
SEATING PLANE
D
A2
L1
"X"
C
1 4
E
H
85
0.25
GAUGE PLANE
Dimension in mm Dimension in inch Dimension in mm Dimension in inch
Symbol Min Norm Max Min Norm Max Symbol Min Norm Max Min Norm Max
A 1.35 1.60 1.75 0.053 0.063 0.069 D 4.80 4.90 5.00 0.189 0.193 0.197
A1 0.10 0.15 0.25 0.004 0.006 0.010 E 3.80 3.90 4.00 0.150 0.154 0.157
A2 1.25 1.45 1.55 0.049 0.057 0.061 L 0.40 0.66 0.86 0.016 0.026 0.034
b 0.33 0.406 0.51 0.013 0.016 0.020 e 1.27 BSC 0.050 BSC
c 0.19 0.203 0.25 0.0075 0.008 0.010 L1 1.00 1.05 1.10 0.039 0.041 0.043
H 5.80 6.00 6.20 0.228 0.236 0.244
θ
°0 --- °8 °0 --- °8
Controlling dimension : millimenter
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 30/33
PACKING DIMENSIONS
8-LEAD SOIC 200 mil (official name – 209 mil)
A1
A2
SEATING PLANE
D
b
e
E
14
85
DETAIL "X"
θ
L1
L
AE1
Dimension in mm Dimension in inch Dimension in mm Dimension in inch
Symbol Min Norm Max Min Norm Max Symbol Min Norm Max Min Norm Max
A --- --- 2.16 --- --- 0.085 E 7.70 7.90 8.10 0.303 0.311 0.319
A1 0.05 0.15 0.25 0.002 0.006 0.010 E1 5.18 5.28 5.38 0.204 0.208 0.212
A2 1.70 1.80 1.91 0.067 0.071 0.075 L 0.50 0.65 0.80 0.020 0.026 0.032
b 0.36 0.41 0.51 0.014 0.016 0.020 e 1.27 BSC 0.050 BS C
c 0.19 0.20 0.25 0.007 0.008 0.010 L1 1.27 1.37 1.47 0.050 0.054 0.058
D 5.13 5.23 5.33 0.202 0.206 0.210
θ
°0 --- °8 °0 --- °8
Controlling dimension : millimenter
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 31/33
PACKING DIMENSIONS
8-Leads P-DIP ( 300 MIL )
14
85
D
E1
E
eB
AA 12
A
Seating Plane
e
b
b1
L
0
Dimension in mm Dimension in inch
Symbol Min Norm Max Min Norm Max
A
5.00
0.21
A1 0.38
0.015
A2 3.18 3.30 3.43 0.125 0.130 0.135
D 9.02 9.27 10.16 0.355 0.365 0.400
E 7.62 BSC. 0.300 BSC.
E1 6.22 6.35 6.48 0.245 0.250 0.255
L 9.02 9.27 10.16 0.115 0.130 0.150
e 2.54 TYP. 0.100 TYP.
eB 8.51 9.02 9.53 0.335 0.355 0.375
b 0.46 TYP. 0.018 TYP.
b1 1.52 TYP. 0.060 TYP.
θO 0O 7
O 15O 0
O 7
O 15O
Controlling dimension : Inch.
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 32/33
Revision History
Revision Date Description
1.0 2007.04.04 Original
1.1 2007.10.02 1. Modify part No. for I grade.
2. Delete bottom block protection table.
1.2 2008.07.17
1. Add “All Pb-free products are RoHS-Compliant” in the
description of features
2. Modify tSE timing
3. Add Revision History
1.3 2009.01.12
1. Correct the size of "L" in the packaging diagram of
SOIC 150 mil
2.Add operating range table
3.Delete the rating of Temperature Under Bias
4.Add the symbol for erase and byte programming time
5.Correct typo error
6.Modify headline
ESMT
F25L004A
Operation Temperature Condition -40 C° ~85 C°
Elite Semiconductor Memory Technology Inc. Publication Date: Jan. 2009
Revision: 1.3 33/33
Important Notice
All rights reserved.
No part of this document may be reproduced or duplicated in any form or
by any means without the prior permission of ESMT.
The contents contained in this document are believed to be accurate at
the time of publication. ESMT assumes no responsibility for any error in
this document, and reserves the right to change the products or
specification in this document without notice.
The information contained herein is presented only as a guide or
examples for the application of our products. No responsibility is
assumed by ESMT for any infringement of patents, copyrights, or other
intellectual property rights of third parties which may result from its use.
No license, either express , implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of ESMT or
others.
Any semiconductor devices may have inherently a certain rate of failure.
To minimize risks associated with customer's application, adequate
design and operating safeguards against injury, damage, or loss from
such failure, should be provided by the customer when making
application designs.
ESMT 's products are not authorized for use in critical applications such
as, but not limited to, life support devices or system, where failure or
abnormal operation may directly affect human lives or cause physical
injury or property damage. If products described here are to be used for
such kinds of application, purchaser must do its own quality assurance
testing appropriate to such applications.
