© Semiconductor Components Industries, LLC, 2009
January, 2009 − Rev. 8
1Publication Order Number:
NCP699/D
NCP699
150 mA CMOS Low Iq LDO
with Enable in TSOP-5
The NCP699 series of fixed output LDO’s are designed for
handheld communication equipment and portable battery powered
applications which require low quiescent current. The NCP699 series
features a very low ground current of 40 A, independent of load
current. Each device contains a voltage reference unit, an error
amplifier, a PMOS power transistor, internal resistors for setting
output voltage, current limit, and temperature limit protection circuits.
The NCP699 has been designed to be used with low cost capacitors.
The device is housed in the micro−miniature TSOP−5 surface mount
package. Standard voltage versions are 1.3, 1.4, 1.5, 1.8, 2.5, 2.8, 2.9,
3.0, 3.1, 3.3, 3.4, 4.5 and 5.0 V. Other voltages are available in 100 mV
steps.
Features
•Enable Control (Active High, Supports Sub 1 V Logic)
•Very Low Ground Current of 40 A Typical
•Low Dropout Voltage of 340 mV at 150 mA, and 3.0 V Vout
•Multiple Fixed Output Voltage Option
•Output Voltage Accuracy of 2.0%
•Operating Temperature Range of −40°C to 85°C
•Stable with 1 F Ceramic or Tantalum Capacitors
•These are Pb−Free Devices
Typical Applications
•Cellular Phones
•Battery Powered Consumer Products
•Hand−Held Instruments
•Camcorders and Cameras
•Printers and Office Equipment
Figure 1. Typical Application Diagram
This device contains 86 active transistors
Vout
Battery or
Unregulated
Voltage Cin
1 FCout
1 F
OFF
ON
1
2
3
5
4
+
+
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
TSOP−5
(SOT23−5, SC59−5)
SN SUFFIX
CASE 483
PIN CONNECTIONS
1
3N/C
Vin
2Gnd
Enable 4
Vout
5
(Top View)
MARKING
DIAGRAM
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(Note: Microdot may be in either location)
1
5
1
5
xxx AYWG
G
xxx = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
NCP699
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2
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
PIN FUNCTION DESCRIPTION
ÁÁÁÁ
ÁÁÁÁ
Pin No.
ÁÁÁÁÁ
ÁÁÁÁÁ
Pin Name
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Description
ÁÁÁÁ
ÁÁÁÁ
1
ÁÁÁÁÁ
ÁÁÁÁÁ
Vin
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Positive power supply input voltage.
ÁÁÁÁ
ÁÁÁÁ
2
ÁÁÁÁÁ
ÁÁÁÁÁ
Gnd
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Power supply ground.
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
3
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
Enable
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
This input is used to place the device into low−power standby. When this input is pulled low, the device is
disabled. If this function is not used, Enable should be connected to Vin.
ÁÁÁÁ
ÁÁÁÁ
4
ÁÁÁÁÁ
ÁÁÁÁÁ
N/C
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
No internal connection.
ÁÁÁÁ
ÁÁÁÁ
5
ÁÁÁÁÁ
ÁÁÁÁÁ
Vout
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Regulated output voltage.
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage Vin 2.1 to 6.0 V
Enable Voltage Enable −0.3 to Vin +0.3 V
Output Voltage Vout −0.3 to Vin +0.3 V
Power Dissipation PDInternally Limited W
Operating Junction Temperature TJ+150 °C
Maximum Junction Temperature TJ(max) +150 °C
Operating Ambient Temperature TA−40 to +85 °C
Storage Temperature Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch−up capability (85°C) "200 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating Symbol Test Conditions Typical Value Unit
Junction−to−Ambient RJA 1 oz Copper Thickness, 100 mm2250 °C/W
PSIJ−Lead 2 JL2 1 oz Copper Thickness, 100 mm268 °C/W
NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following
boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.
NCP699
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ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, C out = 1.0 F, TA = 25°C,
unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Output Voltage (Iout = 10 mA, TA = −40°C to 85°C)
1.3 V
1.4 V
1.5 V
1.8 V
2.5 V
2.8 V
2.9 V
3.0 V
3.1 V
3.3 V
3.4 V
4.5 V
5.0 V
Vout
1.261
1.358
1.455
1.746
2.425
2.716
2.813
2.910
3.007
3.201
3.298
4.365
4.850
1.3
1.4
1.5
1.8
2.5
2.8
2.9
3.0
3.1
3.3
3.4
4.5
5.0
1.339
1.442
1.545
1.854
2.575
2.884
2.987
3.090
3.193
3.399
3.502
4.635
5.150
V
Line Regulation (Iout = 10 mA)
1.3 V−4.4 V (Vin = Vout(nom.) + 1.0 V to 6.0 V)
4.5 V−5.0 V (Vin = 5.5 V to 6.0 V)
Regline
−
−
1.0
1.0
3.0
3.0
mV/V
Load Regulation (Iout = 1.0 mA to 150 mA) Regload −0.3 0.8 mV/mA
Output Current Limit
1.3 V−3.9 V (Vin = Vout(nom.) + 2.0 V)
4.0 V−5.0 V (Vin = 6.0 V)
Io(nom.)
150
150
240
240
−
−
mA
Dropout Voltage (Iout = 150 mA,
Measured at Vout = Vout(nom) −3.0%)
1.3 V
1.4 V
1.5 V
1.8 V
2.5 V
2.8 V
2.9 V
3.0 V
3.1 V
3.3 V
3.4 V
4.5 V − 5.0 V
Vin−Vout
−
−
−
−
−
−
−
−
−
−
−
−
800
750
690
570
400
360
350
340
330
320
300
240
900
850
750
620
450
420
420
400
400
360
360
300
mV
Disable Current (TA = −40°C to 85°C)
(Enable Input = 0 V)
DIS
−0.03 1.0
A
Ground Current (TA = −40°C to 85°C)
(Enable Input = Vin, Iout = 1.0 mA to Io(nom.))
IGND
−40 90
A
Output Short Circuit Current (Vout = 0 V)
1.3 V−3.9 V (Vin = Vout(nom.) + 2.0 V)
4.0 V−5.0 V (Vin = 6.0 V)
Iout(max)
150
150
300
300
600
600
mA
Output Voltage Noise (f = 100 Hz to 100 kHz)
Iout = 30 mA, Cout = 1 F
Vn
−100 −
Vrms
Ripple Rejection
(f = 120 Hz, 15 mA)
(f = 1.0 kHz, 15 mA)
RR
−
−
55
50
−
−
dB
Enable Input Threshold Voltage (TA = −40°C to 85°C)
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Off, Logic Low)
Vth(en)
0.95
−
−
−
−
0.3
V
Output Voltage Temperature Coefficient TC−"100 −ppm/°C
3. Maximum package power dissipation limits must be observed.
PD +TJ(max) *TA
RJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
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TYPICAL CHARACTERISTICS
200
−60 −40 0 20 40 60 80
150
100
50
0
100
TA, AMBIENT TEMPERATURE (°C)
Figure 2. Dropout Voltage vs. Temperature
VDD, DROPOUT VOLTAGE (mV)
250
450
3.010
−60 −40 −20 0 20 40 60
3.005
3.000
2.990 100
TA, AMBIENT TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
Vout, OUTPUT VOLTAGE (V)
3.015
80
2.995
−60 −40 −20 0 20 40 60
43
39
37
100
TA, AMBIENT TEMPERATURE (°C)
Figure 4. Quiescent Current vs. Temperature
Iq, QUIESCENT CURRENT (A)
80
41
35
40
0 1.0 2.0 3.0 4.0 5.0 6.0
30
20
10
0
7.0
Vin, INPUT VOLTAGE (V)
Figure 5. Quiescent Current vs. Input Voltage
50
60
Iq, QUIESCENT CURRENT (A)
40
0 1.0 2.0 3.0 4.0 5.0 6.0
30
20
10
0
7.0
Vin, INPUT VOLTAGE (V)
Figure 6. Ground Pin Current vs. Input Voltage
50
60
Ignd, GROUND CURRENT (A)
40
100 1.0k 10k 100k 1.0M
30
20
10
0
f, FREQUENCY (Hz)
Figure 7. Ripple Rejection vs. Frequency
50
60
RIPPLE REJECTION (dB)
70
Vin = 6.0 V
Vin = 4.0 V
Vin = 4.0 V
Vout = 3.0 V
Iout = 0 mA
Vout = 3.0 V
Iout = 0 mA
TA = 25°C
Cin = 1.0 F
Cout = 1.0 F
Vout = 3.0 V
Iout = 30 mA
TA = 25°C
Cin = 1.0 F
Cout = 1.0 F
Vin = 4.0 V
Cout = 1.0 F
Iout = 30 mA
Vin = 4.0 V
Vout = 3.0 V
Iout = 150 mA
300
−20
Vout = 3.0 V
Iout = 1.0 mA
42
38
36
40
350
400
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TYPICAL CHARACTERISTICS
4
10 1.0k 10k 100k 1.0M
3
2
1
0
f, FREQUENCY (Hz)
Figure 8. Output Noise Density
5
6
OUTPUT VOLTAGE NOISE (V/ǰHz)
7
100
Figure 9. Line Transient Response
Vin = 4.0 V
Cout = 1.0 F
Iout = 30 mA
Figure 10. Load Transient Response Figure 11. Turn−on Response
2.5
0 1.0 2.0 3.0 4.0 5.0 6.0
2.0
1.5
0.5
0
Vin, INPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
3.0
3.5
1.0
Figure 12. Output Voltage vs. Input Voltage
Iout = 1.0 mA
150 mA
TA = 25°C
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DEFINITIONS
Load Regulation
The change in output voltage for a change in output
current at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3.0% below
its nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Maximum Power Dissipation
The maximum total dissipation for which the regulator
will operate within its specifications.
Quiescent and Ground Current
The quiescent current is the current which flows through
the ground when the LDO operates without a load on its
output: internal IC operation, bias, etc. When the LDO
becomes loaded, this term is called the Ground current. It is
actually the difference between the input current (measured
through the LDO input pin) and the output current.
Line Regulation
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low
dissipation or by using pulse technique such that the average
chip temperature is not significantly affected.
Line Transient Response
Typical over and undershoot response when input voltage
is excited with a given slope.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 160°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Maximum Package Power Dissipation
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches
its maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
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APPLICATIONS INFORMATION
A typical application circuit for the NCP699 series is
shown in Figure 1, front page.
Input Decoupling (Cin)
A 1.0 F capacitor either ceramic or tantalum is
recommended and should be connected close to the NCP699
package. Higher values and lower ESR will improve the
overall line transient response.
TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K
Output Decoupling (Cout)
The NCP699 is a stable regulator and does not require any
specific Equivalent Series Resistance (ESR) or a minimum
output current. Capacitors exhibiting ESRs ranging from a
few m up to 5.0 can thus safely be used. The minimum
decoupling value is 1.0 F and can be augmented to fulfill
stringent load transient requirements. The regulator accepts
ceramic chip capacitors as well as tantalum capacitors.
Larger values improve noise rejection and load regulation
transient response.
TDK capacitor: C2012X5R1C105K, C1608X5R1A105K,
or C3216X7R1C105K
Enable Operation
The enable pin will turn on the regulator when pulled high
and turn off the regulator when pulled low. These limits of
threshold are covered in the electrical specification section
of this data sheet. If the enable is not used then the pin should
be connected to Vin.
Hints
Please be sure the Vin and Gnd lines are sufficiently wide.
When the impedance of these lines is high, there is a chance
to pick up noise or cause the regulator to malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
Thermal
As power across the NCP699 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material and also the ambient
temperature effect the rate of temperature rise for the part.
This is stating that when the NCP699 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
The maximum dissipation the package can handle is
given by:
PD +TJ(max) *TA
RJA
If junction temperature is not allowed above the
maximum 125°C, then the NCP699 can dissipate up to
400 mW @ 25°C.
The power dissipated by the NCP699 can be calculated
from the following equation:
Ptot +ƪVin *I
gnd (@Iout)ƫ)[Vin *Vout]*I
out
or
VinMAX +Ptot )Vout *Iout
Ignd(@Iout))Iout
If an 150 mA output current is needed then the ground
current from the data sheet is 40 A. For an NCP699 (3.0 V),
the maximum input voltage will then be 5.65 V.
ORDERING INFORMATION
Device
Nominal
Output Voltage* Marking Package Shipping†
NCP699SN13T1G 1.3 LJY
TSOP−5
(Pb−Free)
3000 Units/
7″ Tape & Reel
NCP699SN14T1G 1.4 AA4
NCP699SN15T1G 1.5 LJP
NCP699SN18T1G 1.8 LJS
NCP699SN25T1G 2.5 LJT
NCP699SN28T1G 2.8 LJU
NCP699SN29T1G 2.9 ACP
NCP699SN30T1G 3.0 LJV
NCP699SN31T1G 3.1 AAE
NCP699SN33T1G 3.3 LJW
NCP699SN34T1G 3.4 ACF
NCP699SN45T1G 4.5 ACQ
NCP699SN50T1G 5.0 LJX
*Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
NCP699
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PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
L1.25 1.55
M0 10
S2.50 3.00
123
54 S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
NCP699/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
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