Data Sheet HLMP-AG74/75, HLMP-AM74/75, HLMPAB74/75 Red, Green, and Blue 5 mm Mini Oval LEDs Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval-shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains a UV inhibitor to reduce the effects of long-term exposure to direct sunlight. Well-defined spatial radiation pattern High-brightness material Available in red, green, and blue colors - Red - AlInGaP, 626 nm - Green - InGaN, 530 nm - Blue - InGaN, 470 nm Superior resistance to moisture Standoff and non-standoff package Tinted and diffused Typical viewing angle 30 x 70 Applications Full-color signs Gas price signs CAUTION! InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom AV02-2753EN December14, 2018 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Figure 1: Package Dimensions Package Drawing A 8.70 0.20 0.342 0.008 24.00 MIN. 0.945 0.70 MAX. 0.028 MEASURED AT BASE OF LENS CATHODE LEAD 1.0 MIN. 0.038 DIMENSION B 2.54 0.3 0.100 0.012 DIMENSION A 0.50 0.10 SQ TYP 0.020 0.004 0.8 MAX. EPOXY MENISCUS 0.016 Package Drawing B 24.00 MIN 0.945 11.70 0.50 0.4606 0.020 MEASURED AT BASE OF LENS 1.50 0.15 0.0591 0.006 8.70 0.20 0.342 0.008 DIMENSION B CATHODE LEAD 2.54 0.30 0.100 0.012 DIMENSION A 0.8 0.032 0.7 MAX. 0.028 MAX. Epoxy Meniscus 0.50 0.10 Sq Typ 0.020 0.004 Parameter Part Number Dimension A Dimension B HLMP-AG74/75 5.30 0.20 0.209 0.008 3.90 0.20 0.154 0.008 HLMP-AM74/75 HLMP-AB74/75 5.40 0.20 0.213 0.008 3.90 0.20 0.150 0.008 Broadcom AV02-2753EN 2 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Device Selection Guide Color and Dominant Wavelength d (nm) Typ.a Luminous Intensity Iv (mcd) at 20 mA b, c, d Min. Max. Typical Viewing Angle () e Standoff Package Drawing Red 626 2900 4200 30 x 70 No A HLMP-AG75-120DD Red 626 2900 4200 Yes B HLMP-AM74-56BDD Green 530 6050 8710 No A Part Number HLMP-AG74-120DD HLMP-AM74-56CDD Green 530 6050 8710 No A HLMP-AM75-56BDD Green 530 6050 8710 Yes B HLMP-AM75-56CDD Green 530 6050 8710 Yes B HLMP-AB74-WXBDD Blue 470 1380 1990 No A HLMP-AB74-WXCDD Blue 470 1380 1990 No A HLMP-AB75-WXBDD Blue 470 1380 1990 Yes B HLMP-AB75-WXCDD Blue 470 1380 1990 Yes B a. Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. c. The optical axis is closely aligned with the package mechanical axis. d. Tolerance for each bin limit is 15%. e. 1/2 is the off -axis angle where the luminous intensity is half the on-axis intensity. Absolute Maximum Ratings TJ = 25C Parameter Red Green/Blue Units DC Forward Currenta 50 30 mA Peak Forward Current 100b 100c mA Power Dissipation 120 114 mW 130 110 C -40 to +100 -40 to +85 C LED Junction Temperature Operating Temperature Range Storage Temperature Range -40 to +100 C a. Derate linearly as shown in Figure 5 and Figure 9. b. Duty factor 30%, frequency 1 kHz. c. Duty factor 10%, frequency 1 kHz. Broadcom AV02-2753EN 3 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Electrical/Optical Characteristics TJ = 25C Parameter Symbol Forward Voltage Red Green Blue VF Reverse Voltagea Red Green and Blue VR Dominant Wavelengthb Red Green Blue d Typ. Max. 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 Thermal Resistance c RJ-PIN Units V Test Conditions IF = 20 mA V 5 5 -- -- -- -- 618 523 464 626 530 470 630 535 476 PEAK Peak Wavelength Red Green Blue Luminous Efficacy Red Green Blue Min. -- -- -- 634 521 464 -- -- -- -- 240 -- -- -- -- 218 538 65 -- -- -- V IR = 100 A IR = 10 A nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA C/W LED Junction-to-Pin lm/W Emitted Luminous Power/ Emitted Radiant Power a. Indicates product final testing condition. Long-term reverse bias is not recommended. b. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp. c. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens/watt. Broadcom AV02-2753EN 4 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Part Numbering System H L M P - x1 x2 x3 x4 Number Description Option x1 Package type A x2 Color - x5 x6 x7 x8 x9 5-mm Mini Oval 30 x 70 B Blue G Red M Green 74 Without lead standoffs x3x4 Lead standoff x5 Minimum intensity bin Refer to the Device Selection Guide x6 Maximum intensity bin Refer to the Device Selection Guide x7 Color bin selection 75 x8x9 NOTE: Broadcom Packaging option With lead standoffs 0 Full range B Color bin 2 and bin 3 C Color bin 3 and bin 4 DD Ammopack Refer to AB 5337 for complete information about the part numbering system. AV02-2753EN 5 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Intensity (mcd) at 20 mA Bin ID Min. Max. W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 5 6050 7260 6 7260 8710 Red Color Range Min. Dom. Max. Dom 618.0 630.0 x 0.6872 0.3126 0.6890 0.2943 y 0.6690 0.3149 0.7080 0.2920 Blue Color Bin Table Bin Min. Max. Dom. Dom. 2 464 468 x 0.1374 y 0.0374 0.0966 0.1062 0.0495 3 468 472 x 0.1291 0.1699 0.1616 0.1187 y 0.0495 0.1062 0.1209 0.0671 x 0.1187 0.1616 0.1517 0.1063 y 0.0671 0.1209 0.1423 0.0945 4 472 476 Tolerance for each bin limit is 15% 0.1766 0.1699 0.1291 Tolerance for each bin limit is 0.5 nm. VF Bin Table (V at 20 mA) Green Color Bin Table Bin ID Min. Max. VD 1.8 2.0 VA 2.0 2.2 Bin VB 2.2 2.4 2 NOTE: Min. Max. Dom. Dom. 523 527 0.145 0.1711 0.1305 y 0.8316 0.7319 0.7218 0.8189 0.1711 0.1967 0.1625 3 527 531 x 0.1305 y 0.8189 0.7218 0.7077 0.8012 4 531 535 x 0.1625 0.1967 0.221 0.1929 y 0.8012 0.7077 0.692 0.7816 1. Tolerance for each bin limit is 0.05 V. 2. VF binning only applicable to the Red color. x 0.0979 Tolerance for each bin limit is 0.5 nm. NOTE: Broadcom All bin categories are established for the classification of products. Products may not be available in all bin categories. Contact your Broadcom(R) representative for further information. AV02-2753EN 6 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs AlInGaP Red Figure 3: Forward Current vs. Forward Voltage 1 100 0.8 80 FORWARD CURRENT - mA RELATIVE INTENSITY Figure 2: Relative Intensity vs. Wavelength 0.6 0.4 0.2 0 550 600 650 WAVELENGTH - nm Broadcom 0 20 40 60 DC FORWARD CURRENT-mA 80 20 0 1 2 FORWARD VOLTAGE - V 3 Figure 5: Maximum Forward Current vs. Ambient Temperature IF MAX - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 40 0 700 Figure 4: Relative Intensity vs. Forward Current 60 100 60 50 40 30 20 10 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 100 AV02-2753EN 7 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs InGaN Green and Blue 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Figure 7: Forward Current vs. Forward Voltage 100 BLUE FORWARD CURRENT - mA RELATIVE INTENSITY Figure 6: Relative Intensity vs. Wavelength GREEN 380 430 480 530 WAVELENGTH - nm 580 20 0 1 2 3 FORWARD VOLTAGE - V 4 5 Green 2.5 2.0 Blue 1.5 1.0 0.5 0 20 40 60 80 FORWARD CURRENT-mA 100 120 IF - MAXIMUM FORWARD CURRENT - mA 35 3.0 RELATIVE INTENSITY (NORMALIZED AT 20mA) 40 Figure 9: Maximum Forward Current vs. Ambient Temperature 3.5 0.0 60 0 630 Figure 8: Relative Intensity vs. Forward Current 80 30 25 20 15 10 5 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 100 RELATIVE DOMINANT WAVELENGTH-nm Figure 10: Relative Dominant Wavelength vs. Forward Current 6 4 2 0 Blue -2 -4 Green -6 -8 0 Broadcom 20 40 60 80 FORWARD CURRENT-mA 100 120 AV02-2753EN 8 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Figure 11: Radiation Pattern-Major Axis Figure 12: Radiation Pattern-Minor Axis 1.0 Red Green Blue 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT () 60 Figure 13: Relative Light Output vs. Junction Temperature 0.4 0.2 -90 -60 -30 0 30 ANGULAR DISPLACEMENT () 60 90 Figure 14: Forward Voltage Shift vs. Junction Temperature 0.5 10 Green Red Blue Green Red Blue 0.4 FORWARD VOLTAGE SHIFT-V RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25C) 0.6 0.0 90 Red Green Blue 0.8 1 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 0.1 -40 Broadcom -20 0 20 40 60 80 100 TJ -JUNCTION TEMPERATURE 120 140 -0.4 -40 -20 0 20 40 60 80 100 TJ -JUNCTION TEMPERATURE 120 140 AV02-2753EN 9 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Precautions Lead Forming The leads of an LED lamp may be preformed or cut to length prior to the insertion and soldering on the PC board. For better control, use the proper tool to precisely form and cut the leads to the applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Use this method for the hand soldering operation, because the excess lead length also acts as a small heat sink. Take care during the PCB assembly and soldering process to prevent damage to the LED component. The LED component may be effectively hand soldered to the PCB. However, it is only recommended under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (the soldering iron's tip) to the body is 1.59 mm. Soldering the LED using a soldering iron tip closer than 1.59 mm might damage the LED. Manual Solder Dipping Wave Solderinga, b Preheat temperature 105C max. -- Preheat time -- 60s max. Peak temperature 260C max. 260C max. Dwell time 5s max. 5s max. a. The preceding conditions refer to measurements with a thermocouple mounted at the bottom of the PCB. b. Use only the bottom preheaters to reduce thermal stress experienced by the LED. Soldering and Handling Recommended soldering conditions follow. Set and maintain wave soldering parameters according to the recommended temperature and dwell time. The customer is advised to perform a daily check on the soldering profile to ensure that it conforms to he recommended soldering conditions. Broadcom LED Configuration Figure 15: LED Configuration 1.59mm CATHODE Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component, which is ESD sensitive.Refer to Broadcom application note AN-1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. InGaN Device Broadcom ANODE AlInGaP Device Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not have weight or force applied on the LED. Use non-metal material because it absorbs less heat during the wave soldering process. At elevated temperatures, the LED is more susceptible to mechanical stress. Therefore, the PCB must allowed to cool down to room temperature prior to handling, which includes removal of the alignment fixture or pallet. AV02-2753EN 10 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet If the PCB board contains both through-hole (TH) LEDs and other surface-mount components, solder the surface mount components on the top side of the PCB. If surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED. The recommended PC board plated through-holes (PTH) sizes for the LED component leads follows. LED Component Lead Size Diagonal Red, Green, and Blue 5 mm Mini Oval LEDs Oversizing the PTH can lead to a twisted LED after clinching. Under sizing the PTH can cause difficulty with inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high-brightness TH LED lamps. Plated Through-Hole Diameter 0.45 x 0.45 mm (0.018 x 0.018 in.) 0.636 mm (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) 0.50 x 0.50 mm (0.020 x 0.020 in.) 0.707 mm (0.028 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.) Figure 16: Example of Wave Soldering Temperature Profile for TH LED 260C Max TEMPERATURE (C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255C 5C (maximum peak temperature = 260C) 105C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Broadcom AV02-2753EN 11 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Figure 17: Ammo Packs Drawing 6.35 1.30 0.250 0.051 12.70 1.00 0.500 0.039 CATHODE 20.5 1.00 0.8070 0.0394 18.00 0.50 0.7085 0.0195 9.125 0.625 0.3595 0.0245 12.70 0.30 0.500 0.012 4.00 0.20 TYP. 0.1575 0.0075 0.70 0.20 0.276 0.0075 VIEW A - A NOTE: Broadcom All dimensions are in millimeters (inches). AV02-2753EN 12 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Figure 18: Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. NOTE: Broadcom For InGaN devices, the ammo pack packaging box contains an ESD logo. AV02-2753EN 13 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Packaging Label Figure 19: Mother Label (Available on the packaging box of ammo pack and shipping box.) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Figure 20: Baby Label (Only available on bulk packaging.) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Broadcom AV02-2753EN 14 HLMP-AG74/75, HLMP-AM74/75, HLMP-AB74/75 Data Sheet Red, Green, and Blue 5 mm Mini Oval LEDs Acronyms and Definitions BIN The color bin only or VF bin only (applicable for part numbers with color bins but without VF bin or part numbers with VF bins and no color bin) or The color bin is incorporated with the VF bin (applicable for the part number that has both color bins and VF bins). Example Color bin only or VF bin only BIN: 2 (represents color bin 2 only) BIN: VB (represents VF bin "VB" only) Color bin incorporate with VF bin BIN: 2 VB where: - 2: Color bin 2 only - VB: VF bin "VB" Broadcom AV02-2753EN 15 Disclaimer Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright (c) 2011-2018 Broadcom. All Rights Reserved. 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