Semiconductor Components Industries, LLC, 2001
November, 2001 – Rev. 4 1Publication Order Number:
MC74VHC1GT32/D
MC74VHC1GT32
2-Input OR Gate/CMOS
Logic Level Shifter
The MC74VHC1GT32 is an advanced high speed CMOS 2–input OR
gate fabricated with silicon gate CMOS technology. It achieves high speed
operation similar to equivalent Bipolar Schottky TTL while maintaining
CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output w hich provides high noise immunity and stable output.
The device i nput is c ompatible w ith T TL–type input t hresholds a nd th e
output has a full 5 V CMOS level output swing. The input protection
circuitry on this device allows overvoltage tolerance on the input,
allowing the device to be used as a logic–level translator from 3.0 V
CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V
CMOS Logic while operating at the high–voltage power supply.
The MC74VHC1GT32 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1GT32 to be used to interface 5 V circuits to 3 V
circuits. The output structures also provide protection when VCC = 0 V.
These input and output structures help prevent device destruction caused
by supply voltage – input/output voltage mismatch, battery backup, hot
insertion, etc.
•High Speed: tPD = 3.5 ns (Typ) at VCC = 5 V
•Low Power Dissipation: ICC = 2 µA (Max) at TA = 25°C
•TTL–Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V
•CMOS–Compatible Outputs: VOH > 0 . 8 VCC; VOL < 0.1 VCC @Load
•Power Down Protection Provided on Inputs and Outputs
•Balanced Propagation Delays
•Pin and Function Compatible with Other Standard Logic Families
•Chip Complexity: FETs = 65; Equivalent Gates = 15
Figure 1. Pinout (Top View)
VCC
IN B
IN A
OUT Y
GND
IN A
IN B OUT Y
≥ 1
Figure 2. Logic Symbol
1
2
34
5
PIN ASSIGNMENT
1
2
3 GND
IN B
IN A
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4
5V
CC
OUT Y
L
L
H
H
L
H
L
H
FUNCTION TABLE
Inputs Output
AB
L
H
H
H
Y
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
SC–88A / SOT–353/SC–70
DF SUFFIX
CASE 419A
Pin 1
d = Date Code
VNd
TSOP–5/SOT–23/SC–59
DT SUFFIX
CASE 483
Pin 1
d = Date Code
VNd
MARKING
DIAGRAMS
MC74VHC1GT32
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2
MAXIMUM RATINGS (Note 1)
Symbol Characteristics Value Unit
VCC DC Supply Voltage –0.5 to +7.0 V
VIN DC Input Voltage –0.5 to +7.0 V
VOUT DC Output Voltage VCC = 0
High or Low State –0.5 to 7.0
–0.5 to VCC + 0.5 V
IIK Input Diode Current –20 mA
IOK Output Diode Current VOUT < GND; VOUT > VCC +20 mA
IOUT DC Output Current, per Pin +25 mA
ICC DC Supply Current, VCC and GND +50 mA
PDPower dissipation in still air SC–88A, TSOP–5 200 mW
JA Thermal resistance SC–88A, TSOP–5 333 C/W
TLLead temperature, 1 mm from case for 10 s 260 °C
TJJunction temperature under bias +150 °C
Tstg Storage temperature –65 to +150 °C
VESD ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
ILatch–Up Latch–Up Performance Above VCC and Below GND at 125°C (Note 5) ±500 mA
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely af fect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22–A114–A
3. Tested to EIA/JESD22–A115–A
4. Tested to JESD22–C101–A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
VCC DC Supply Voltage 3.0 5.5 V
VIN DC Input Voltage 0.0 5.5 V
VOUT DC Output Voltage VCC = 0
High or Low State 0.0
0.0 5.5
VCC V
TAOperating Temperature Range –55 +125 °C
tr , tfInput Rise and Fall Time VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V 0
0100
20 ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °CTime, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100 1000
TIME, YEARS
NORMALIZED FAILURE RATE
TJ= 80 C°
TJ= 90 C°
TJ= 100 C°
TJ= 110 C°
TJ= 130 C°
TJ= 120 C°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction
Temperature
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3
DC ELECTRICAL CHARACTERISTICS
VCC TA = 25°C TA ≤ 85°C–55 ≤ TA ≤ 125°C
Symbol Parameter Test Conditions (V) Min Typ Max Min Max Min Max Unit
VIH Minimum High–Level
Input Voltage 3.0
4.5
5.5
1.4
2.0
2.0
1.4
2.0
2.0
1.4
2.0
2.0
V
VIL Maximum Low–Level
Input Voltage 3.0
4.5
5.5
0.53
0.8
0.8
0.53
0.8
0.8
0.53
0.8
0.8
V
VOH Minimum High–Level
Output Voltage
VV V
VIN = VIH or VIL
IOH = –50 µA3.0
4.5 2.9
4.4 3.0
4.5 2.9
4.4 2.9
4.4 V
g
VIN = VIH or VIL VIN = VIH or VIL
IOH = –4 mA
IOH = –8 mA 3.0
4.5 2.58
3.94 2.48
3.80 2.34
3.66
V
VOL Maximum Low–Level
Output Voltage
VV V
VIN = VIH or VIL
IOL = 50 µA3.0
4.5 0.0
0.0 0.1
0.1 0.1
0.1 0.1
0.1 V
g
VIN = VIH or VIL VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA 3.0
4.5 0.36
0.36 0.44
0.44 0.52
0.52
V
IIN Maximum Input
Leakage Current VIN = 5.5 V or GND 0 to
5.5 ±0.1 ±1.0 ±1.0 µA
ICC Maximum Quiescent
Supply Current VIN = VCC or GND 5.5 2.0 20 40 µA
ICCT Quiescent Supply
Current Input: VIN = 3.4 V 5.5 1.35 1.50 1.65 mA
IOPD Output Leakage
Current VOUT = 5.5 V 0.0 0.5 5.0 10 µA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS (Cload = 50 pF, Input tr = tf = 3.0ns)
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
TA = 25°C
ÎÎÎÎÎ
ÎÎÎÎÎ
TA ≤ 85°C
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
–55 ≤ TA ≤ 125°C
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
Parameter
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
Test Conditions
Min
Typ
Max
Min
Max
ÎÎÎ
ÎÎÎ
Min
ÎÎÎÎ
ÎÎÎÎ
Max
Unit
ÎÎÎÎ
ÎÎÎÎ
tPLH,
tPHL
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
Maximum
Propogation Delay,
ItABtY
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
VCC = 3.3 ± 0.3 V CL = 15 pF
CL = 50 pF
4.8
6.1
7.9
11.4
9.5
13.0
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
11.5
15.5
ns
ÎÎÎÎ
Î
ÎÎ
Î
ÎÎÎÎ
ÎÎÎÎÎÎ
Î
ÎÎÎÎ
Î
ÎÎÎÎÎÎ
gy
Input A or B to Y
ÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎ
VCC = 5.0 ± 0.5 V CL = 15 pF
CL = 50 pF
Î
3.7
4.4
Î
5.5
7.5
Î
Î
6.5
8.5
ÎÎÎ
Î
Î
Î
ÎÎÎ
ÎÎÎÎ
Î
ÎÎ
Î
ÎÎÎÎ
8.0
10.0
ÎÎÎÎ
Î
ÎÎ
Î
ÎÎÎÎ
CIN
ÎÎÎÎÎÎ
Î
ÎÎÎÎ
Î
ÎÎÎÎÎÎ
Maximum Input
Capacitance
ÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎ
Î
5.5
Î
10
Î
Î
10
ÎÎÎ
Î
Î
Î
ÎÎÎ
ÎÎÎÎ
Î
ÎÎ
Î
ÎÎÎÎ
10
pF
Typical @ 25°C, VCC = 5.0 V
CPD Power Dissipation Capacitance (Note 6) 11 pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I CC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no–load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
MC74VHC1GT32
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4
*Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 4. Switching Waveforms Figure 5. Test Circuit
GND
50%
50% VCC
Input A or B
Output Y
tPHL
tPLH
50% VCC
VOL
VOH
DEVICE ORDERING INFORMATION
Device Nomenclature
Device Order Number Circuit
Indicator
Temp
Range
Identifier Technology Device
Function Package
Suffix
Tape &
Reel
Suffix Package
Type Tape and Reel
Size
MC74VHC1GT32DFT1 MC 74 VHC1G T32 DF T1
SC–88A /
SOT–353
/ SC–70 178 mm (7”)
3000 Unit
MC74VHC1GT32DFT2 MC 74 VHC1G T32 DF T2
SC–88A /
SOT–353
/ SC–70 178 mm (7”)
3000 Unit
MC74VHC1GT32DTT1 MC 74 VHC1G T32 DT T1
TSOPS /
SOT–23
/ SC–59 178 mm (7”)
3000 Unit
MC74VHC1GT32
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5
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
TAPE LEADER
NO COMPONENTS
400 mm MIN
COMPONENTS
DIRECTION OF FEED
CAVITY
TAPE TOP TAPE
Figure 6. Tape Ends for Finished Goods
1
4.00
2.00
1.75
1.00 MIN
4.00
Figure 7. SC–70–5/SC–88A/SOT–353 DFT1 Reel Configuration/Orientation
DIRECTION OF FEED
TAPE DIMENSIONS mm
1.50 TYP
8.00 0.30 3.50 0.50
1
4.00
2.00
1.75
1.00 MIN
4.00
Figure 8. SC–70/SC–88A/SOT–353 DFT2 and SOT23–5/TSOP–5/SC59–5 DTT1 Reel Configuration/Orientation
DIRECTION OF FEED
TAPE DIMENSIONS mm
1.50 TYP
8.00 0.30 3.50 0.50
MC74VHC1GT32
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6
Figure 9. Reel Dimensions
13.0 mm 0.2 mm
(0.512 in 0.008 in)
1.5 mm MIN
(0.06 in)
50 mm MIN
(1.969 in)
20.2 mm MIN
(0.795 in)
FULL RADIUS
t MAX
G
A
REEL DIMENSIONS
Tape Size
8 mm
T and R Suffix
T1, T2
A Max
178 mm
(7 in)
G
8.4 mm, + 1.5 mm, –0.0
(0.33 in + 0.059 in, –0.00)
t Max
14.4 mm
(0.56 in)
Figure 10. Reel Winding Direction
DIRECTION OF FEED
BARCODE LABEL
HOLEPOCKET
MC74VHC1GT32
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7
PACKAGE DIMENSIONS
SC–88A/SOT–353/SC–70
DF SUFFIX
5–LEAD PACKAGE
CASE 419A–01
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
V0.30 0.400.012 0.016
B0.2 (0.008) MM
123
45
A
G
V
S
D 5 PL
H
C
N
J
K
–B–
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.5 mm (min)
0.4 mm (min)
0.65 mm 0.65 mm
1.9 mm
MC74VHC1GT32
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8
PACKAGE DIMENSIONS
TSOP–5/SOT–23/SC–59
DT SUFFIX
5–LEAD PACKAGE
CASE 483–01
ISSUE A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.1142 0.1220
B1.30 1.70 0.0512 0.0669
C0.90 1.10 0.0354 0.0433
D0.25 0.50 0.0098 0.0197
G0.85 1.00 0.0335 0.0413
H0.013 0.100 0.0005 0.0040
J0.10 0.26 0.0040 0.0102
K0.20 0.60 0.0079 0.0236
L1.25 1.55 0.0493 0.0610
M0 10 0 10
S2.50 3.00 0.0985 0.1181
0.05 (0.002)
123
54
S
AG
L
B
D
H
C
KM
J

mm
inches
1.9
0.039
1.0
0.094
0.7
0.074
2.4
0.028
0.95
0.037
0.95
0.037
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
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MC74VHC1GT32/D
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