QUALIFIED MANUFACTURERS LIST
OF
CUSTOM HYBRID MICROCIRCUITS
QUALIFIED UNDER MILITARY SPECIFICATION
MIL-PRF-38534
CUSTOM HYBRID MICROCIRCUITS
GENERAL REQUIREMENTS FOR
Qualifications
Validated Annually CUSTOM HYBRID
MICROCIRCUITS
SUPERSEDING
QML-38534-29
30-Jun-99
QML-38534-28
31-Mar-99
This list has been prepared for use by or for the Government in the acquisition of products covered by Specification MIL-PRF-38534. Listing of a product is
not intended to, and does not connote endorsement of the product by the Department of Defense. This list is subject to change without notice; revision or
amendment of this list will be issued as necessary. The listing of a product, process, or material does not, in any way, release the supplier from the
responsibility to comply with the individual item specification requirements.
THE DEFENSE SUPPLY CENTER COLUMBUS (DSCC-V) IS THE PREPARING ACTIVITY (PA) FOR MIL-PRF-38534, AND IS THEREFOR RESPONSIBLE FOR
QUALIFICATION. DSCC-VQ IS THE ORGANIZATIONAL ELEMENT, WITHIN THE PA, WHICH PERFORMS THE ADMINISTRATIVE AND TECHNICAL FUNCTIONS
NECESSARY FOR QUALIFICATION OF PRODUCTS, PROCESSES AND MATERIAL. Mailing Address: Defense Supply Center Columbus (DSCC-VQ), P.O.
Box 3990, Columbus, Ohio 43216-5000.
In order for a manufacturer to have test data considered for qualification, the manufacturer must perform all required qualification tests; produce the
qualification sample under a valid authorization to test with DSCC certified materials and manufacturing construction techniques; and comply with the
requirements specified in MIL-PRF-38534.
The listing of custom hybrid microcircuit materials and manufacturing construction techniques in QML-38534 applies only to products produced on the MIL-
PRF-38534 certified line(s) at the plant(s) specified on the QML.
Custom hybrid microcircuits manufactured, assembled, and tested in accordance with MIL-PRF-38534 shall bear the "certification mark" for SMD controlled
hybrid Microcircuits, or the "compliant hybrid" certification mark for non-SMD controlled hybrid microcircuits as follows:
SMD product, for all classes, shall have the certification mark "QML" or "Q" for small devices.
Non-SMD product dated after MIL-PRF-38534D, for Class K shall have the certification mark "CK."
Non-SMD product dated after MIL-PRF-38534D, for Class H shall have the certification mark "CH."
Non-SMD product dated after MIL-PRF-38534D, for Class G shall have the certification mark "CG."
Non-SMD product dated after MIL-PRF-38534D, for Class E shall have the certification mark "CE."
Non-SMD product dated after MIL-PRF-38534D, for Class D shall have the certification mark "CD."
Non-SMD dated prior to MIL-PRF-38534D, for all classes, shall have the certification mark "CH" or "C" for small devices.
These certification marks or the abbreviations "Q" or "C" shall not be used, on product that does not meet all requirements of MIL-PRF-38534 except as
allowed in 3.7.5 of MIL-PRF-38534.
Products manufactured, assembled, and tested for Class K, Class H, Class G, Class E, or Class D, with all the provisions of MIL-PRF-38534, and with
DSCC qualified materials and manufacturing construction techniques, can be represented as being compliant to the appropriate product assurance levels
as listed herein.
The information contained in this QML reflects the general material and manufacturing techniques of the particular test sample(s). In order to protect the
manufacturers' proprietary processes and materials, only the generic process and material are listed. The user must contact the manufacturer for any
detail information on specific materials (i.e., such as epoxy, getter, solder-type), or process details. Processes and materials, not listed, may be considered
qualified by similarity to those demonstrated for the qualification (e.g., different wire, package, or die sizes). See Appendix D of MIL-PRF-38534, Class l,
major changes paragraph, for a baseline of qualification limits.
Any product, represented as being compliant to MIL-PRF-38534, must be built using qualified processes and materials. The user shall be responsible for
determining if the qualification baseline for a given class level is adequate to demonstrate capability for the intended application.
To obtain MIL-PRF-38534 qualified hybrid microcircuits, the user should specify in the procurement document that the product be manufactured to MIL-PRF-
38534, and be comprised of materials and manufacturing construction techniques listed herein. Acquisition requirements are contained in paragraph 6.2 of
MIL-PRF-38534. Microcircuit devices represented as being built, tested and shipped under the QML provision of MIL-PRF-38534, must be built using
qualified manufacturing materials and construction listed in this QML.
Contractor acquiring activities, military program offices, and other government representatives can determine if hybrid microcircuits meet the requirements
of MIL-PRF-38534 by:
a. For SMD controlled product: Product listed in the product eligibility section herein and marked with "QML" or "Q".
-1-
AMSC N/A. DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited
QML-38534-29 FSC 5962
b. For non-SMD controlled Product: The part will not be listed on the QML. However, the part will be marked with "C" plus the Class Level designator".
Warning! If products were not purchased to, and identified as MIL-PRF-38534 QML, do not assume they have been manufactured on the DSCC certified
line, with qualified materials and processes, or that all other MIL-PRF-38534 requirements were performed.
To determine whether new SMD controlled products are in accordance with MIL-PRF-38534, or to verify any new process/material qualifications, you may
call the qualifying activity (DSCC-VQ).
Only DSCC-VQ ISO Registrations are listed herein. Therefore, QML listed manufacturers may have ISO registrations from other registrars.
This Qualified Manufacturers List (QML) is available from the DSCC-VQ World Wide Web pages. The web pages are accessed at the address
http://www.dscc.dla.mil/offices/sourcing_and_qualification/index.html or http://www.dscccols.com/offices/sourcing_and_qualification/index.html.
Notes:
1/ The QML listing can be expanded provided appropriate qualification testing is performed and passed. Therefore the manufacturer may accept an order
for complaint product not covered by his QML listing, but shall not ship the compliant product until the testing has been successfully completed.
2/ Package seal perimeter is listed by largest perimeter successfully tested in inches.
3/ Package lead counts are listed by maximum number of leads covered by qualification.
4/ Caution. Do not use this number for item acquisition. Item acquired to this number may not satisfy the performance requirements of the listed SMD.
5/ Inactive for new design, no longer available from manufacturer.
6/ Class E devices are devices, which meet all of the requirements of one of the other classes (K, H, or G), with some exceptions taken. Therefore any
manufacturer qualified to G, H or K is eligible to produce and mark product as compliant to class E.
-2-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Aeroflex Circuit Technology (CAGE Code: 88379)
35 South Service Road, Plainview, NJ 11803-4193, US
Company Contact: Mr. Joe Mazzotta, Phone: 516-694-6700, Fax: 516-694-6715, E-mail: jmazzotta@aeroflex.com
DSCC Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: jacqueline_cunningham@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Linear, Analog, Digital, Power
Class K, Class H, Class E
Qualification Letters: EQ(EQC-90-616), EQ(EQC-91-896), EQ(EQC-92-001), EQ(EQC-93-019), EQ(EQC-94-032), ELS(ELSH-94-0342), ELS(ELSH-95-
0042), ELS(ELSH-95-0395), ELS(ELSH-96-0130), ELS(ELSH-96-176), VQ(VQH-98-0001), VQ(VQH-99-0028)
Substrate Fabrication Flows: QAP21-240, QAP21-225
Substrate Fabrication:
Thick Film on Alumina, 6 Conductor Level(s), Resistors; Thick Film on Beryllia, 2 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: QAP21-241, QAP21-337
Substrate Attach: Solder, Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 7.94 Seal Perimeter, 90 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line, Seam
Weld, 3.72 Seal Perimeter, 24 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 7.01 Seal Perimeter, 88
Leads, Gold/Solder Lead Finish; Metal Package, TO can, Projection Weld, 2.6 Seal Perimeter, 2 Leads, Gold Lead Finish; Metal
Package, Platform, Projection Weld, 3.93 Seal Perimeter, 24 Leads, Gold Lead Finish; Ceramic Cofire Package, Axial Leads,
Seam Weld, 7.66 Seal Perimeter, 90 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-3-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Analog Devices Incorporated (CAGE Code: 24355)
Assembled Products Division, 7910 Triad Center Drive, Greensboro, NC 27409-9605, US
Company Contact: Ms. Elaine Trotter, Phone: 910-605-4234, Fax: 910-605-4347, E-mail: elaine.trotter@analog.com
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: AD/DA Converters, Buffer, Op-Amp, Track and Hold, Voltage Reference, Signal Processor, Data Acquisition Systems, DC/DC Converters
Class H, Class E
Qualification Letters: EQ(EQC-92-025), EQ(EQC-92-119), EQ(EQC-92-476), EQ(EQC-93-047), EQ(EQC-93-115), EQ(EQC-93-116), EQ(EQC-93-450),
EQ(EQC-93-633), EQ(EQC-93-678), ELS(ELSH-94-172), ELS(ELSH-94-222), VQ(VQH-98-0252)
Substrate Fabrication Flows: QAP 3060
Substrate Fabrication:
Thick Film on Alumina, 4 Conductor Level(s), Resistors; Thin Film on Alumina, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: QAP 3060
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Transformers, Inductors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, TO can, Projection Weld, 1.91 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads,
Seam Weld, 7.94 Seal Perimeter, 46 Leads, Gold/Solder Lead Finish; Ceramic Package, Dual-in-line, Seam Weld, 7.31 Seal
Perimeter, 88 Leads, Gold Lead Finish; Ceramic Package, Quad Flat Pack, Seam Weld, 7.31 Seal Perimeter, 88 Leads, Gold Lead
Finish; Metal Package, Peripheral Leads, Seam Weld, 4.4 Seal Perimeter, 17 Leads, Gold/Solder Lead Finish
Class Level Information: See Note 6/
-4-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Apex Microtechnology Corporation (CAGE Code: 60024)
5980 North Shannon Road, Tucson, AZ 85741-5247, US
Company Contact: Mr. Rick Reed, Phone: 520-690-8695, Fax: 520-888-3329, E-mail: rreed@apexmicrotech.com
DSCC Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Power Op-Amp
Class H, Class E
Qualification Letters: EQ(EQC-91-347), EQ(EQC-92-410), EQ(EQC-92-416), EQ(EQC-93-028), EQ(EQC-93-595), ELS(ELSH-94-0354), ELS(ELSH-95-
0070)
Substrate Fabrication Flows: Flow 01
Substrate Fabrication:
Thick Film on Beryllia, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: Flow 10, Flow 99
Substrate Attach: Solder
Element Attach: Conductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors
Wire Bonding: Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information:
Metal Package, TO can, Projection Weld, 2.67 Seal Perimeter, 8 Leads, Gold/Solder Lead Finish
Class Level Information: See Note 6/
-5-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Austin Semiconductor, Inc. (CAGE Code: 0EU86)
8701 Cross Park Drive, Austin, TX 78754-4566, US
Company Contact: Mr. Clem Murdzak, Phone: 512-339-1188, Fax: 512-339-6641, E-mail: clemm@austinsemiconductor.com
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Option 1
Technologies: Memory
Class H, Class E
Qualification Letters: VQ(VQH-99-0144)
Substrate Fabrication Flows: N/A
Substrate Fabrication: N/A
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 2/ASI-H/512K32F1/A
Substrate Attach: N/A
Element Attach: Ag Cyanyte Ester
Add-on Elements: Unpackaged die, Chip Capacitors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Co-fire Package, Quad Flat Pack, Solder Seal, 1.76 Seal Perimeter, 68 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-6-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
BI Technology (CAGE Code: 73138)
4200 Bonita Place, Fullerton, CA 92635-1080, US
Company Contact: Ms. Chris Deleon, Phone: 714-447-2647, Fax: 714-447-2315, E-mail: bi-usacdeleon@bitech.attmail.com
DSCC Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
Technologies: Voltage Regulator, Data Converters, Analog
Class H, Class E
Qualification Letters: EQ(EQC-89-071), EQ(EQC-91-718), EQ(EQC-92-382), EQ(EQC-92-383), VQH-97-0081
Substrate Fabrication Flows: 800-403-2
Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 800-403-03
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 5.86 Seal Perimeter, 61 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line,
Seam Weld, 6.87 Seal Perimeter, 44 Leads, Gold Lead Finish; Ceramic Co-fire Package, Flatpack, Seam Weld, 1.04 Seal
Perimeter, 10 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-7-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Boeing Defense and Space Group (CAGE Code: 81205)
P.O. Box 3999, Seattle, WA 98124-2499, US
Company Contact: Mr. Ronald St. Pierre, Phone: 253-773-1414, Fax: 253-773-9498, E-mail: ronald.l.stpierre@boeing.com
DSCC Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Option 1
Technologies: Custom
Class H, Class E
Qualification Letters: EQ(EQM-87-2947), EQ(EQC-91-046), EQ(EQC-92-079), EQ(EQC-91-228), EQ(EQC-91-630), EQ(EQC-91-672), EQ(EQC-91-624),
EQ(EQC-91-438)
Substrate Fabrication Flows: D900-10476-1-2
Substrate Fabrication:
Thick Film on Alumina, 10 Conductor Level(s), Resistors; Thick Film on Beryllia, 5 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: D900-10476-1-2
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs
Wire Bonding: Gold, Ribbon
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 5.86 Seal Perimeter, 30 Leads, Gold Lead Finish, Getter Qualified; Metal Package,
Peripheral Leads, Seam Weld, 9.16 Seal Perimeter, 94 Leads, Gold Lead Finish, Getter Qualified
Class Level Information: See Note 6/
-8-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
C-MAC Microcircuits Limited (CAGE Code: U4388)
South Denes, Great Yarmouth, Norfolk NR30 3PX, England
Company Contact: Mr. David Lawn, Phone: 0493-856122, Fax: 0493-858536, E-mail: dlawn@yarmouth.cmac.co.uk
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
Technologies: 1553 Transceiver, High Voltage Drivers
Class H, Class E
Qualification Letters: EQ(EQC-91-835), EQ(EQC-92-084), EQ(EQC-93-139), ELS(ELSH-96-0054), ELS(ELSH-96-0161), VQ(VQH-98-0227), VQ(VQH-99-
0192), VQ(VQH-99-0196)
Substrate Fabrication Flows: FCES 6301:15
Substrate Fabrication:
Thick Film on Alumina, 2 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: FCES 6301:15
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 5.3 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Peripheral
Leads, Seam Weld, 5.3 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads, Projection Weld, 4.37
Seal Perimeter, 24 Leads, Gold/Solder Lead Finish; Ceramic Package, Pin Grid Array, Seam Weld, 5 Seal Perimeter, 101 Leads,
Gold Lead Finish; Metal Package, TO can, Projection Weld, 1.13 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish
Class Level Information: See Note 6/
-9-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Canadian Marconi Company (CAGE Code: 90073)
600 Dr. Frederik Philips Boulevard, Ville Saint Laurent, Quebec, Canada H3P 1Y9
Company Contact: Mr. Gino Pisano, Phone: 514-748-3000, Fax: 514-748-3100
DSCC Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: jacqueline_cunningham@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
Technologies: Voltage Regulator
Class H, Class E
Qualification Letters: EQ(EQC-91-720), EQ(EQC-92-427), VQ(VQH-98-0133)
Substrate Fabrication Flows: 411-146425-000
Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 411-146425-000
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 3.61 Seal Perimeter, 16 Leads, Gold Lead Finish; Metal Package, Bathtub, Seam Weld,
4.3 Seal Perimeter, 24 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-10-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Cincinnati Electronics Corporation (CAGE Code: 80045)
7500 Innovation Way, Mason, OH 45040-9699, US
Company Contact: Mr. Emil Paquette, Phone: 973-573-6243, Fax: 973-573-6290, E-mail: bpaquette@cinele.com
DSCC Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: jacqueline_cunningham@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Custom, Analog, Amplifier, Linear
Class D
Qualification Letters: VQ(VQH-98-0195)
Substrate Fabrication Flows: 637140
Substrate Fabrication: Thick Film on Alumina, 7 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 637143
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Radial Leads, Laser Seal, 8 Seal Perimeter, 69 Leads, Gold Lead Finish
Class Level Information: See Note 6/
Class H, Class E
Qualification Letters: EQ(EQC-93-113), EQC-93-197, ELS(ELSH-94-417)
Substrate Fabrication Flows: 637140
Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 637143
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 3.48 Seal Perimeter, 18 Leads, Gold Lead Finish; Metal Package, Peripheral Leads,
Seam Weld, 3.58 Seal Perimeter, 20 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-11-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
CTS Microelectronics (CAGE Code: 23223)
1201 Cumberland Avenue, West Lafayette, IN 47906-1388, US
Company Contact: Mr. Duane Ringeisen, Phone: 765-463-2565, Fax: 765-497-5399, E-mail: dmr@ctsmicro.com
DSCC Contact: Mr. Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: kevin_rudd@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
Technologies: Analog Converter
Class H, Class E
Qualification Letters: EQ(EQC-92-787), EQ(EQC-93-015), ELS(ELSH-94-0054), VQ(VQH-97-0223)
Substrate Fabrication Flows: STD-THINFLM-BD1, STD-RC-HIREL
Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Alumina Nitride, 2 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: STD-C&W-1772
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, TO can, Projection Weld, 2.75 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish; Metal Package, Platform,
Projection Weld, 2.35 Seal Perimeter, 4 Leads, Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4.4 Seal
Perimeter, 30 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-12-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Datel Incorporated (CAGE Code: 50721)
11 Cabot Boulevard, Mansfield, MA 02048-1194, US
Company Contact: Mr. Tim Brown, Phone: 508-339-3000, Fax: 508-339-6356, E-mail: tmbrown@datel.com
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Digital
Class H, Class E
Qualification Letters: EQ(EQC-90-626), EQ(EQC-90-677), EQ(EQC-91-029), EQ(EQC-92-446), ELS(ELSH-95-0356), VQ(VQH-97-0084), VQ(VQH-98-
0261)
Substrate Fabrication Flows: D-4552
Substrate Fabrication:
Thick Film on Alumina, 4 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: D-4552
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information:
Ceramic Package, Dual-in-line, Seam Weld, 7.24 Seal Perimeter, 62 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-13-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
DDC Ireland LTD. (CAGE Code: S7631)
Cork Business and Technology Park, Model Farm Road, Cork, Ireland
Company Contact: Ms. Caroline Dynan, Phone: 353-21-341065, Fax: 353-21-341568, E-mail: cdynan@ilcddc.com
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
Technologies: 1553 Bus, Data Converters
Class H, Class E
Qualification Letters: EQ(EQM-94-0109), ELS(ELSH-94-0163), ELS(ELSH-94-0463), ELS(ELSH-95-0019), ELS(ELSH-95-0116), ELS(ELSH-95-0148),
ELS(ELSH-95-0361), ELS(ELSH-96-0038), ELS(ELSH-96-0053), ELS(ELSH-96-0071), VQ(VQH-97-0112), VQ(VQH-98-0182),
VQ(VQH-99-0149), VQ(VQH-99-0133)
Substrate Fabrication Flows: ILC DDC (Bohemia, NY): 41637, ILC DDC (Bohemia, NY): 41638
Substrate Fabrication:
Thick Film on Alumina, 5 Conductor Level(s), Resistors; Thin Film on Alumina, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 60005
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Daughter Board
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Co-fire Package, Axial Leads, Seam Weld, 5.8 Seal Perimeter, 70 Leads, Gold/Solder Lead Finish, Getter Qualified;
Ceramic Co-fire Package, Axial Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-
fire Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package,
Axial Leads, Seam Weld, 7.34 Seal Perimeter, 78 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Axial Leads,
Seam Weld, 5.34 Seal Perimeter, 36 Leads, Gold/Solder Lead Finish, Getter Qualified
Class Level Information: See Note 6/
-14-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
EMS Technologies Incorporated (CAGE Code: 31395)
P.O. Box 7700, Norcross, GA 30091-7700, US
Company Contact: Mr. Kevin Lane, Phone: 770-263-9200, Fax: 770-441-3757, E-mail: lane_kp@elmg.com
DSCC Contact: Ms. Jacqueline Cunningham, Phone: 614-692-0584, Fax: 614-692-6942, E-mail: jacqueline_cunningham@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
Technologies: Analog, Digital
Class K, Class H, Class E
Qualification Letters: ELS(ELSH-94-109), ELS(ELSH-95-171), ELS(ELSH-95-172), ELS(ELSH-95-0212), ELS(ELSH-96-0019)
Substrate Fabrication Flows: 171771
Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s); Purchased Thin Film
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 171773
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 34 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-
fire Package, Flatpack, Seam Weld, 3.94 Seal Perimeter, 40 Leads, Gold Lead Finish, Getter Qualified
Class Level Information: See Note 6/
-15-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Film Microelectronics Incorporated (CAGE Code: 27851)
530 Turnpike Street, North Andover, MA 01845, US
Company Contact: Mr. Gregory Madden, Phone: 508-975-3385, Fax: 508-975-3506
DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
Technologies: Low Power
Class H, Class E
Qualification Letters: ELS(ELSH-95-0183), VQ(VQH-98-0177), VQ(VQH-98-0232), VQ(VQH-99-0176), VQ(VQH-99-0204)
Substrate Fabrication Flows: 52-0069
Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 52-0015
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Resistors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 3.58 Seal Perimeter, 16 Leads, Gold Lead Finish; Metal Package, TO can,
Projection Weld, 1.65 Seal Perimeter, 12 Leads, Gold Lead Finish; Metal Package, TO can, Projection Weld, 6 Seal Perimeter, 12
Leads, Nickel Lead Finish
Class Level Information: See Note 6/
-16-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
General Microcircuits Corporation (CAGE Code: 67294)
780 Boston Road, Billerica, MA 08121-5925, US
Company Contact: Mr. John Gerrior, Phone: 978-663-9101, Fax: 978-63-9132, E-mail: jgerrior@general-microcircuits.com
DSCC Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
Technologies: Custom
Class H, Class E
Qualification Letters: EQ(EQC-89-235), EQ(EQC-93-587), VQH-97-0082
Substrate Fabrication Flows: 10000
Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 10000
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy
Element Attach: Conductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 2.45 Seal Perimeter, 22 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-17-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Hewlett-Packard Company (CAGE Code: 50434)
Optical Communications Division, 370 West Trimble Road, San Jose, CA 95131-1008, US
Company Contact: Ms. Ann Harding, Phone: (408) 435-6707, Fax: (408) 435-6547, E-mail: ann_harding@hp.com
DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
Technologies: Optocoupler
Class K, Class H, Class E
Qualification Letters: EQ(EQM-87-2594), EQ(EQM-88-1265), EQ(EQC-90-0754), EQ(EQC-93-271), EQ(EQC-93-591), ELS(ELSH-95-271), VQ(VQH-97-
047)
Substrate Fabrication Flows: N/A
Substrate Fabrication:
Purchased Thick Film
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: ICPI-9001-3
Substrate Attach: Eutectic, Solder, Silver Glass
Element Attach: Eutectic, Silver Glass
Add-on Elements: Unpackaged Die
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Package, Dual-in-line, Solder Seal, 1.28 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless
Chip Carrier, Solder Seal, 0.92 Seal Perimeter, 20 Leads, Solder Lead Finish; Ceramic Package, Peripheral Leads, Solder Seal,
1.32 Seal Perimeter, 16 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-18-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Honeywell Incorporated (CAGE Code: 58960)
21111 North Nineteenth Avenue, Phoenix, AZ 85027-2700, US
Company Contact: Mr. Mark Glancy, Phone: 602-436-3135, Fax: 602-436-1310, E-mail: mark.h.glancy@cas.honeywell.com
DSCC Contact: Mr. Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: kevin_rudd@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Analog, Digital, Drive Controller
Class H, Class E
Qualification Letters: EQ(EQM-87-1933), EQ(EQC-90-0768)
Substrate Fabrication Flows: 51549
Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 51550
Substrate Attach: Eutectic
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 3.5 Seal Perimeter, 36 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-19-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Hycomp Incorporated (CAGE Code: 34707)
165 Cedar Hill Street, Marlborough, MA 01752-3035, US
Company Contact: Mr. Gregory Madden, Phone: 508-975-3385, Fax: 508-975-3506
DSCC Contact: Mr. Edward Raybould, Phone: 614-692-0582, Fax: 614-692-6942, E-mail: edward_raybould@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
Technologies: Analog, Voltage Reference
Class H, Class E
Qualification Letters: EQ(EQC-89-421), ELS(ELSH-94-0252), ELS(ELSH-94-0253), ELS(ELSH-94-0254)
Substrate Fabrication Flows: EMA-75
Substrate Fabrication: Thin Film on Alumina, 1 Conductor Level(s); Thin Film on Alumina, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: EMA-75
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Package, Single-in-line, Seam Weld, 2.9 Seal Perimeter, 10 Leads, Gold Lead Finish; Ceramic Package, Dual-in-line,
Seam Weld, 2.57 Seal Perimeter, 14 Leads, Gold Lead Finish; Ceramic Package, Leadless Chip Carrier, Seam Weld, 1.62 Seal
Perimeter, 28 Leads, Solder Lead Finish
Class Level Information: See Note 6/
-20-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Hytek Microelectronics Incorporated (CAGE Code: OANM4)
400 Hot Springs Road, Carson City, NV 89706-1609, US
Company Contact: Mrs. Kathy Cano, Phone: 702-883-0820, Fax: 702-883-0827, E-mail: kathy@hytek.com
DSCC Contact: Mr. Bradley Deslich, Phone: 614-692-0593, Fax: 614-692-6942, E-mail: bradley_deslich@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Active Delay Line
Class H, Class E
Qualification Letters: EQ(EQC-91-859), EQ(EQM-94-0023)
Substrate Fabrication Flows: RN1005-002
Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: RN1005-002
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Inductors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Platform, Projection Weld, 2.94 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads,
Seam Weld, 2.94 Seal Perimeter, 30 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-21-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
ILC Data Device Corporation (CAGE Code: 19645)
105 Wilbur Place, Bohemia, NY 11716-2482, US
Company Contact: Mr. Michael Green, Phone: 516-567-5600, Fax: 516-567-7358, E-mail: greenm@ilcddc.com
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Options 1 and 2
Technologies: 1553 Bus, Data Converters, Power
Class H, Class E
Qualification Letters:
EQ(EQC-90-657), EQ(EQC-91-606), EQ(EQC-93-625)
Substrate Fabrication Flows: 41639, 41638
Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s), Resistors; Thin Film on
Alumina, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 41634, 45552
Substrate Attach: Nonconductive Epoxy, Conductive Epoxy, Solder
Element Attach: Nonconductive Epoxy, Conductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, Transformers
Wire Bonding: Gold, Aluminum, Copper/Tin Solder
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 4.1 Seal Perimeter, 24 Leads, Gold Lead Finish, Getter Qualified; Metal Package,
Peripheral Leads, Seam Weld, 8.8 Seal Perimeter, 16 Leads, Gold Lead Finish, Getter Qualified
Engineering Line
Class Level Information: See Note 6/
Class H, Class E
Qualification Letters: EQ(EQC-90-220), EQ(EQC-91-104), EQ(EQC-91-306), EQ(EQC-91-308), EQ(EQC-91-386), EQ(EQC-91-667), EQ(EQC-93-055),
EQ(EQC-93-199), EQ(EQC-93-599), ELS(ELSH-94-0327), ELS(ELSH-94-0392), ELS(ELSH-94-0399), ELS(ELSH-95-0140),
ELS(ELSH-95-0266), VQ(VQH-96-0203), VQ(VQH-98-0101), VQ(VQH-99-0033)
Substrate Fabrication Flows: 41637, 41638
Substrate Fabrication: Thick Film on Alumina, 5 Conductor Level(s), Resistors; Thin Film on Alumina, 1 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 36070, 36071
Substrate Attach: Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Transformers
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 10.26 Seal Perimeter, 94 Leads, Gold Lead Finish, Getter Qualified; Metal Package,
Platform, Projection Weld, 5.38 Seal Perimeter, 32 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads,
Seam Weld, 7.58 Seal Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Axial Leads, Seam Weld, 7.34
Seal Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Peripheral Leads, Seam Weld, 7.34 Seal
Perimeter, 78 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 5.8 Seal Perimeter,
70 Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 5.8 Seal Perimeter, 70
Leads, Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 81 Leads,
Gold Lead Finish, Getter Qualified; Ceramic Co-fire Package, Axial Leads, Seam Weld, 4 Seal Perimeter, 81 Leads, Gold Lead
Finish, Getter Qualified
Manufacturing Line
Class Level Information: See Note 6/
-22-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Interpoint Corporation (CAGE Code: 50821)
10301 Willows Road, P.O. Box 97005, Redmond, WA 98073-9705, US
Company Contact: Mr. Gordon Kankelfritz, Phone: 425-882-3100, Fax: 425-882-1990, E-mail: gordon.kankelfritz@intp.com
DSCC Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Linear Amplifier, Signal Processor, Data Converters, DC/DC Converters, Analog, Digital, EMI Filters
Class K, Class H, Class E
Qualification Letters: EQ(EQM-87-2838), EQ(EQM-89-0439), EQ(EQC-92-174), EQ(EQC-92-300), EQ(EQC-93-056), EQ(EQC-93-031), EQ(EQC-93-196),
EQ(EQC-93-221), EQ(EQC-93-280), EQ(EQC-93-550), EQC-93-624, EQ(EQM-94-043), EQ(EQM-94-0111), ELS(ELSH-94-0297),
ELS(ELSH-94-0336), ELS(ELSH-94-0364), ELS(ELSH-95-0036), ELS(ELSH-95-0375), ELS(ELSH-96-0139), ELS(ELSH-96-0095),
VQ(VQH-96-0214), VQ(VQH-98-0253), VQ(VQH-99-0013), VQ(VQH-99-0070)
Substrate Fabrication Flows: QA-039
Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 3 Conductor Level(s), Resistors; Thick Film on
Beryllia, 1 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: QA-039
Substrate Attach: Solder, Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, Toroids
Wire Bonding: Gold, Aluminum, Copper
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 8 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads,
Seam Weld, 6.4 Seal Perimeter, 5 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 6 Seal Perimeter, 38 Leads,
Gold/Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 32 Leads, Gold/Solder Lead Finish;
Metal Package, Axial Leads, Projection Weld, 4.26 Seal Perimeter, 8 Leads, Gold/Solder Lead Finish
Class Level Information: See Note 6/
-23-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Interpoint Taiwan Corporation (CAGE Code: 50821)
2-1 West First Street, KEPZ, Kaohsiung, Taiwan, R.O.C
Company Contact: Mr. Gordon Kankelfritz, Phone: 425-882-3100, Fax: 425-882-1990, E-mail: gordon.kankelfritz@intp.com
DSCC Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
Technologies: DC-DC Converter
Class H, Class E
Qualification Letters: VQ(VQH-97-0266), VQ(VQH-99-0134), VQ(VQH-99-0200)
Substrate Fabrication Flows: QA-039
Substrate Fabrication: Thick Film on Alumina, 3 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: QA-039
Substrate Attach: Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Inductors, Toroids
Wire Bonding: Gold, Aluminum, Copper
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Projection Weld, 5.14 Seal Perimeter, 8 Leads, Gold Lead Finish; Metal Package, Peripheral Leads,
Seam Weld, 8 Seal Perimeter, 20 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-24-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Lambda Advanced Analog Incorporated (CAGE Code: 52467)
2270 Martin Avenue, Santa Clara, CA 95050-2781, US
Company Contact: Mr. James Mazzuco, Phone: 408-998-4930, Fax: 408-988-2702, E-mail: jim_mazzuco@lambdaaa.com
DSCC Contact: Mr. Ray Crothers, Phone: 614-692-0583, Fax: 614-692-6942, E-mail: ray_crothers@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: AD/DA Converters, Sample and Hold, Amplifier, DC/DC Converters
Class H, Class E
Qualification Letters: EQ(EQC-93-553), EQ(EQC-93-658), ELS(ELSH-94-0173), ELS(ELSH-94-0211), ELS(ELSH-94-0212), ELS(ELSH-94-0272),
ELS(ELSH-94-0482), ELS(ELSH-94-0483), VQ(VQH-98-0100), VQ(VQH-98-0231), EQ(EQC-89-065), EQ(EQC-90-652), EQ(EQC-92-
103), EQ(EQC-93-204), EQ(EQC-93-403)
Substrate Fabrication Flows: 8002-0044
Substrate Fabrication: Thick Film on Alumina, 4 Conductor Level(s), Resistors; Thick Film on Beryllia, 6 Conductor Level(s), Resistors; Purchased Direct
Bonded Copper
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 8002-0044
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Tabs, Chip Resistors, Transformer
Wire Bonding: Gold, Aluminum, Copper
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Package, Dual-in-line, Seam Weld, 3.69 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal
Package, Axial Leads, Seam Weld, 6.58 Seal Perimeter, 10 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package,
Peripheral Leads, Seam Weld, 10.1 Seal Perimeter, 58 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, TO Can,
Projection Weld, 1.64 Seal Perimeter, 7 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam
Weld, 8 Seal Perimeter, 12 Leads, Gold/Solder Lead Finish, Getter Qualified
Class Level Information: See Note 6/
-25-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Lockheed Martin Electronics and Missiles (CAGE Code: 04939)
5600 Sand Lake Road, Orlando, FL 32819-8907, US
Company Contact: Mr. Joe Agosta, Phone: 407-356-3434, Fax: 407-356-6808
DSCC Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Option 2
Technologies: Analog, Digital
Class H, Class E
Qualification Letters: EQ(EQC-91-402), EQ(EQC-91-764), EQ(EQC-92-112), EQ(EQC-92-312), EQ(EQC-92-412), VQ(VQH-99-0164)
Substrate Fabrication Flows: 72301772
Substrate Fabrication: Thick Film on Alumina, 6 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 72301772
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors, Inductors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Package, Leadless Chip Carrier, Solder Seal, 3.8 Seal Perimeter, 68 Leads, Gold Lead Finish; Ceramic Package, Dual-in-
line, Solder Seal, 2.88 Seal Perimeter, 18 Leads, Gold/Solder Lead Finish; Metal Package, Platform, Projection Weld, 5.76 Seal
Perimeter, 44 Leads, Gold Lead Finish; Metal Package, Axial Leads, Seam Weld, 11.8 Seal Perimeter, 140 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-26-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
M.S. Kennedy Corporation (CAGE Code: 51651)
8170 Thompson Road, Cicero, NY 13039-9393, US
Company Contact: Mr. Daniel Miller, Phone: 315-699-9201, Fax: 315-699-8023, E-mail: msk02@aol.com
DSCC Contact: Ms. Binh Tonnu, Phone: 614-692-0586, Fax: 614-692-6942, E-mail: binh_tonnu@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: High Power, DC Amplifier, PWB H-Bridge, Custom
Class K, Class H, Class E
Qualification Letters: EQ(EQC-90-451), EQ(EQC-90-507), EQ(EQC-92-417), EQ(EQC-93-141), EQ(EQC-93-242), EQ(EQC-93-346), EQ(EQC-93-488),
EQ(EQC-93-554), EQ(EQC-93-682), EQ(EQC-93-687), EQ(EQM-94-084), EQ(EQM-94-093), ELS(ELSH-94-0400), ELS(ELSH-94-
0401), ELS(ELSH-94-0402), ELS(ELSH-94-0470), ELS(ELSH-95-0020), ELS(ELSH-95-0216), ELS(ELSH-95-0304), ELS(ELSH-96-
0073), ELS(ELSH-96-0086), VQ(VQH-96-0206), VQ(VQH-97-0046), VQ(VQH-97-0073), VQ(VQH-97-0089), VQ(VQH-97-0223),
VQ(VQH-97-0228), VQ(VQH-97-0238), VQ(VQH-97-0243), VQ(VQH-98-0246), VQ(VQH-99-0145)
Substrate Fabrication Flows: 2422-1563
Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Alumina, 4 Conductor Level(s); Purchased
Alumina/Copper; Thick Film on Beryllia, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 2422-1518
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors, Inductors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, TO Can, Projection Weld, 3.14 Seal Perimeter, 12 Leads, Gold Lead Finish, Getter Qualified; Metal Package,
Platform, Projection Weld, 2.6 Seal Perimeter, 14 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Axial Leads, Seam
Weld, 5 Seal Perimeter, 44 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6.95 Seal
Perimeter, 82 Leads, Gold Lead Finish, Getter Qualified; Metal Package, Peripheral Leads, Seam Weld, 6 Seal Perimeter, 12
Leads, Gold Lead Finish, Getter Qualified; Ceramic Package, Brazed Leads, Solder Seal, 2.06 Seal Perimeter, 28 Leads, Gold
Lead Finish, Getter Qualified; Metal Package, Brazed Leads, Solder Seal, 2.1 Seal Perimeter, 16 Leads, Gold Lead Finish, Getter
Qualified; Ceramic Package, Leadless Chip Carrier, Solder Seal, 1.4 Seal Perimeter, 20 Leads, Gold Lead Finish, Getter Qualified
Class Level Information: See Note 6/
-27-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Micro Networks Company (CAGE Code: 50507)
324 Clark Street, Worchester, MA 01606-1298, US
Company Contact: Ms. Abbie Hartmaier, Phone: 508-852-5400, Fax: 508-853-8296, E-mail: abbie.h@mnc.com
DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
Technologies: Data Converters, Track and Hold Amp
Class H, Class E
Qualification Letters: EQ(EQM-88-0709), EQ(EQC-91-235), EQ(EQC-91-894), EQ(EQC-92-062), EQ(EQC-93-162), EQ(EQC-94-008), ELS(ELSH-95-
0269)
Substrate Fabrication Flows: FC-23
Substrate Fabrication:
Thin Film on Alumina, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: FC-25
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless
Chip Carrier, Solder Seal, 1.13 Seal Perimeter, 22 Leads, Solder Lead Finish
Class Level Information: See Note 6/
-28-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Micropac Industries, Incorporated (CAGE Code: 31757)
905 East Walnut Street, Garland, TX 75040-6696, US
Company Contact: Ms. Shirley Large, Phone: 972-272-3571, Fax: 972-494-2281
DSCC Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Custom, Power, Optocouplers
Class K, Class H, Class E
Qualification Letters:
EQ(EQC-91-178), EQ(EQC-91-647), EQ(EQC-92-183), EQ(EQC-92-258)
Substrate Fabrication Flows: 90138
Substrate Fabrication:
Thick Film on Alumina, 5 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 90138
Substrate Attach: Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 5 Seal Perimeter, 28 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal Package,
Peripheral Leads, Seam Weld, 5 Seal Perimeter, 46 Leads, Gold/Solder Lead Finish, Getter Qualified
Custom Line
Class Level Information: See Note 6/
Class K, Class H, Class E
Qualification Letters:
EQ(EQC-90-624), EQ(EQC-91-188), EQ(EQC-91-466), EQ(EQC-92-120), ELS(ELSH-95-0057), ELS(ELSH-95-0444)
Substrate Fabrication Flows: 90138
Substrate Fabrication:
Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Alumina, 1 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 90138
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy
Element Attach: Conductive Epoxy
Add-on Elements: Unpackaged Die
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Package, Dual-in-line, Solder Seal, 1.89 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic
Package, Leadless Chip Carrier, Solder Seal, 1.6 Seal Perimeter, 24 Leads, Solder Lead Finish, Getter Qualified; Metal Package,
TO Can (dual base), Projection Weld, 0.54 Seal Perimeter, 7 Leads, Gold/Solder Lead Finish, Getter Qualified
Opto Line
Class Level Information: See Note 6/
-29-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Micropac Industries, Incorporated (CAGE Code: 31757)
905 East Walnut Street, Garland, TX 75040-6696, US
Class K, Class H, Class E
Qualification Letters:
EQ(EQC-90-625), EQ(EQC-91-328), EQ(EQC-91-338), EQ(EQC-92-183), EQ(EQC-92-258), ELS(ELSH-94-0496)
Substrate Fabrication Flows: 90138
Substrate Fabrication:
Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Beryllia, 2 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 90138
Substrate Attach: Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information:
Metal Package, TO Can, Projection Weld, 2.27 Seal Perimeter, 8 Leads, Gold/Solder Lead Finish, Getter Qualified
Power Line
Class Level Information: See Note 6/
-30-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
MPC Products Corporation (CAGE Code: 19170)
7426 North Linder Avenue, Skokie, IL 60077-3219, US
Company Contact: Mr. Keith Stoddard, Phone: (847) 673-8300, Fax: (847) 673-9789, E-mail: kstoddard@mpcproducts.com
DSCC Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
Technologies: Motor Drive, Analog Power, Custom
Class H, Class E
Qualification Letters: VQ(VQH-97-0067)
Substrate Fabrication Flows: 6H95903044A, Sheet 27
Substrate Fabrication: Thick Film on Beryllia, 2 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 6H95903044A, Sheet 27
Substrate Attach: Conductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral, Seam Weld, 5.5 Seal Perimeter, 12 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-31-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Natel Engineering Company, Inc. (CAGE Code: 09059)
4550 Runway Street, Simi Valley, CA 93063-3493, US
Company Contact: Ms. Betty May, Phone: 818-734-6500, Fax: 818-734-6540, E-mail: natelqamgr@aol.com
DSCC Contact: Mr. Kevin Rudd, Phone: 614-692-0594, Fax: 614-692-6942, E-mail: kevin_rudd@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Synchro/Digital Converters
Class H, Class E
Qualification Letters: EQ(EQC-91-714), EQ(EQC-92-048), EQ(EQC-92-039), EQ(EQC-92-202), EQ(EQC-93-261), ELS(ELSH-95-0154), ELS(ELSH-95-
0314)
Substrate Fabrication Flows: NHPS-01.001
Substrate Fabrication:
Thick Film on Alumina, 3 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: NHPS-01.001
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Ceramic Posts, Daughter Board
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 6.56 Seal Perimeter, 40 Leads, Gold Lead Finish; Metal Package, Peripheral Leads,
Seam Weld, 5.34 Seal Perimeter, 36 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-32-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
National Hybrid, Incorporated (CAGE Code: 57363)
2200 Smithtown Avenue, Ronkonkama, NY 11779-7359, US
Company Contact: Mr. Don Sartorius, Phone: 516-981-2400, Fax: 516-981-2445
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Linear, Data Converters, Digital, Sample and Hold, Data Bus, Amplifier, Custom
Class H, Class E
Qualification Letters: EQ(EQC-90-557), EQ(EQC-92-035), EQ(EQC-92-291), EQ(EQM-94-0127), ELS(ELSH-94-255), ELS(ELSH-94-274), ELS(ELSH-94-
359), ELS(ELSH-94-475), VQ(VQH-97-0093), VQ(VQH-97-0098)
Substrate Fabrication Flows: FL1772A7THK
Substrate Fabrication:
Thick Film on Alumina, 3 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: FL883500834
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Inductors, Daughter Board, Chip Thermistor, Inductors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 6.32 Seal Perimeter, 66 Leads, Gold Lead Finish; Metal (2 piece) Package, Peripheral
Leads, Seam Weld, 7.1 Seal Perimeter, 78 Leads, Gold Lead Finish; Metal (1 piece) Package, Peripheral Leads, Seam Weld, 5.74
Seal Perimeter, 112 Leads, Gold/Solder Lead Finish; Ceramic Package, Side Brazed Leads, Seam Weld, 2.42 Seal Perimeter, 20
Leads, Gold/Solder Lead Finish; Ceramic Co-fire Package, Pin Grid Array, Seam Weld, 4.4 Seal Perimeter, 66 Leads, Gold/Solder
Lead Finish; Ceramic Package, Side Brazed Leads, Solder Seal, 2.26 Seal Perimeter, 24 Leads, Gold/Solder Lead Finish
Class Level Information: See Note 6/
-33-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Northrop Grumman Corporation (CAGE Code: 26916)
Electronic Sensors and Systems Sector, Defensive Systems Division, 600 Hicks Road, Rolling Meadows, IL 60008-1098, US
Company Contact: Mr. Joseph Sowka, Phone: 847-259-9600, Fax: 847-870-5746
DSCC Contact: Mr. Joseph Buben II, Phone: 614-692-0592, Fax: 614-692-6942, E-mail: joseph_buben@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Option 1
Technologies: Digital, Linear
Class D
Qualification Letters: ELS(ELSH-94-452)
Substrate Fabrication Flows: Custom(BVM)-Process(182) 058-006501-001
Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: Custom(BVM)-Process(182) 058-006501-001
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 3.5 Seal Perimeter, 32 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-34-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Omnirel Corporation (CAGE Code: 69210)
205 Crawford Street, Leominster, MA 01453-2353, US
Company Contact: Mr. Martin Enright, Phone: 978-534-5776, Fax: 978-537-4246, E-mail: menright@omnirel.com
DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
Technologies: Voltage Regulator, Power
Class H, Class E
Qualification Letters: EQ(EQC-91-408), EQ(EQC-91-807), EQ(EQC-91-838), EQ(EQM-94-0029), ELS(ELSH-94-0388), VQ(VQH-98-0014)
Substrate Fabrication Flows: D070002G
Substrate Fabrication: Thick Film on Alumina, 2 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: D050015G
Substrate Attach: Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 2.47 Seal Perimeter, 8 Leads, Solder Lead Finish; Metal Package, Peripheral
Leads, Seam Weld, 8.8 Seal Perimeter, 20 Leads, Gold Lead Finish; Metal Package, TO Can, Projection Weld, 2.64 Seal
Perimeter, 8 Leads, Nickel Lead Finish
Class Level Information: See Note 6/
-35-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Q-Bit Corporation (CAGE Code: 55027)
2575 Pacific Avenue N.E., Palm Bay, FL 32905-2699, US
Company Contact: Mr. Robert Novak, Phone: 407-727-1838, Fax: 407-727-3729, E-mail: rnovak@q-bit.com
DSCC Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: RF Amplifier
Class K, Class H, Class E
Qualification Letters: EQ(EQC-93-252), EQ(EQC-93-529), ELS(ELSH-94-278), ELS(ELSH-94-325), ELS(ELSH-95-0025), ELS(ELSH-96-0074)
Substrate Fabrication Flows: QB 500011
Substrate Fabrication: Thin Film on Beryllia, 1 Conductor Level(s); Thin Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Alumina, 1
Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: QB 801805
Substrate Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Transformers
Wire Bonding: Gold, Copper
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, TO Can, Projection Weld, 1.57 Seal Perimeter, 4 Leads, Gold Lead Finish; Metal Package, Peripheral Leads,
Seam Weld, 4 Seal Perimeter, 16 Leads, Gold Lead Finish; Metal Package, Brazed Leads, Seam Weld, 1.18 Seal Perimeter, 4
Leads, Gold Lead Finish
Class Level Information: See Note 6/
-36-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Raytheon Company (CAGE Code: 94144)
Missile Systems Division, 465 Centre Street, Quincy, MA 02169-7530, US
Company Contact: Mr. Joseph Gennari, Phone: 617-984-4109, Fax: 617-984-4195
DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 2
Technologies: Amplifier
Class H, Class E
Qualification Letters: EQ(EQM-87-1031), EQ(EQC-91-668), EQ(EQC-91-669), EQ(EQC-92-327), EQ(EQC-92-372)
Substrate Fabrication Flows: 38756
Substrate Fabrication: Thick Film on Alumina, 8 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 42771
Substrate Attach: Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Tantalum Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 2.76 Seal Perimeter, 13 Leads, Gold Lead Finish; Metal Package, Peripheral Leads,
Seam Weld, 6.36 Seal Perimeter, 76 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-37-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Raytheon TI Systems, Inc. (CAGE Code: 96214)
P.O. Box 655012, Dallas, TX 75265-5012, US
Company Contact: Ms. Linda Muniz, Phone: 972-995-1096, Fax: 972-995-6206, E-mail: l-muniz1@ti.com
DSCC Contact: Mr. Bruce Dickerson, Phone: 614-692-0595, Fax: 614-692-6942, E-mail: bruce_dickerson@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Option 2
Technologies: Linear, A/D Converter, Amplifier, Squib Driver, Digital, Regulator
Class H, Class E
Qualification Letters: EQ(EQC-91-031), EQ(EQC-92-392), ELS(ELSH-94-0140), ELS(ELSH-95-0092), ELS(ELSH-95-421), ELS(ELSH-95-422),
ELS(ELSH-95-423), ELS(ELSH-95-424), ELS(ELSH-95-425), ELS(ELSH-95-426), ELS(ELSH-95-427), ELS(ELSH-95-428),
ELS(ELSH-95-434), ELS(ELSH-95-435), ELS(ELSH-96-0085), ELS(ELSH-96-0113), ELS(ELSH-96-0116), ELS(ELSH-96-0117),
ELS(ELSH-96-0149), VQ(VQH-97-0111), VQ(VQH-97-0151)
Substrate Fabrication Flows: All-HYB-005
Substrate Fabrication: Purchased Thick Film
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: All-HYB-005
Substrate Attach: Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs, Chip Resistors
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Axial Leads, Seam Weld, 7.88 Seal Perimeter, 64 Leads, Gold Lead Finish; Metal Package, Single-in-line, Seam
Weld, 4.62 Seal Perimeter, 6 Leads, Gold Lead Finish; Metal Package, Axial Leads, Projection Weld, 2.43 Seal Perimeter, 8 Leads,
Gold Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 4.78 Seal Perimeter, 10 Leads, Gold Lead Finish; Ceramic
Package, Dual-in-line, Seam Weld, 3.3 Seal Perimeter, 32 Leads, Gold Lead Finish; Ceramic Package, Leadless Chip Carrier,
Seam Weld, 2.76 Seal Perimeter, 18 Leads, Gold Lead Finish; Ceramic Package, Side Brazed Leads, Solder Seal, 2.06 Seal
Perimeter, 28 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-38-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
RDL Corporation (CAGE Code: 16478)
West Seventh Avenue and Freedley Street, Conshohocken, PA 19428-1699, US
Company Contact: Mr. Daniel Mieczkowski, Phone: 610-825-3750, Fax: 610-825-3530
DSCC Contact: Ms. Jonnie Schneider, Phone: 614-692-0585, Fax: 614-692-6942, E-mail: jonnie_schneider@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Microwave, Amplifier
Class H, Class E
Qualification Letters: VQ(VQH-96-0224)
Substrate Fabrication Flows: N/A
Substrate Fabrication: Purchased Thick Film
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 476038, 376189
Substrate Attach: Conductive Epoxy
Element Attach: Conductive Epoxy, Eutectic, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, TO Can, Projection Weld, 0.5 Seal Perimeter, 20 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-39-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
REMEC Incorporated (CAGE Code: 65628)
9404 Chesapeake Drive, San Diego, CA 92123, US
Company Contact: Mr. Bradford Born, Phone: 619-505-3294, Fax: 619-569-7364, E-mail: bborn@remec.com
DSCC Contact: Mr. Richard Barker, Phone: 614-692-0596, Fax: 614-692-6942, E-mail: richard_barker@dscc.dla.mil
Quality Management (QM) Program: TRB
Periodic Inspection System: Option 1
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Microwave Amplifier, Microwave Filter, Microwave Custom (IMAs)
Class H, Class E
Qualification Letters: ELS(ELSH-94-199), VQ(VQH-96-226), VQ(VQH-96-227), VQ(VQH-97-0180), VQ(VQH-97-0181)
Substrate Fabrication Flows: N/A
Substrate Fabrication: Purchased Thin Film; Purchased Duriod; Purchased Polyimide/PWB Copper
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 001775
Substrate Attach: Conductive Epoxy, Eutectic, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors, Toroids, Coils, Thermcon, Inductors
Wire Bonding: Gold, Copper, Ribbon
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 4 Seal Perimeter, 16 Leads, Gold Lead Finish; Aluminum/Stainless Steel Package,
DC/Microwave Leads, Laser Weld, 12.5 Seal Perimeter, 6 Leads; Aluminum/Stainless Steel Package, DC/Microwave Leads (Dual-
Sided, Multi-Cavity), Laser Weld, 24 Seal Perimeter, 4 Leads
Class Level Information: See Note 6/
-40-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Sipex Corporation (CAGE Code: 33256)
Hybrid Systems Division, 22 Linnell Circle, Billerica, MA 01821-3985, US
Company Contact: Mr. Herb Shifres, Phone: 978-667-8700, Fax: 978-667-8310, E-mail: hshifres@sipex.com
DSCC Contact: Mr. Edward Raybould, Phone: 614-692-0582, Fax: 614-692-6942, E-mail: edward_raybould@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
Technologies: A/D Converter, D/A Converter, Data Acquisition Systems, Sample and Hold, Voltage Reference
Class H, Class E
Qualification Letters: EQ(EQC-90-506), EQ(EQC-91-781), EQ(EQC-91-813), EQ(EQC-92-052), EQ(EQC-92-438), EQ(EQC-93-524), ELS(ELSH-94-0329),
ELS(ELSH-94-477), ELS(ELSH-95-0075), ELS(ELSH-95-0215), VQ(VQH-99-0177)
Substrate Fabrication Flows: 239-0232
Substrate Fabrication:
Thin Film on Alumina, 1 Conductor Level(s); Purchased Thick Film
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 239-0458
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Ceramic Package, Dual-in-line, Seam Weld, 7.48 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Metal Package, Axial Leads,
Seam Weld, 5.78 Seal Perimeter, 62 Leads, Gold/Solder Lead Finish; Ceramic Package, Leadless Dual-in-line, Seam Weld, 4.17
Seal Perimeter, 24 Leads, Solder Lead Finish; Metal Package, Peripheral Leads, Seam Weld, 5.53 Seal Perimeter, 64 Leads,
Gold/Solder Lead Finish; Ceramic Package, Axial Leads, Seam Weld, 2.88 Seal Perimeter, 68 Leads, Gold/Solder Lead Finish
Class Level Information: See Note 6/
-41-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Solitron Devices, Incorporated (CAGE Code: 21845)
3301 Electronics Way, West Palm Beach, FL 33407-4697, US
Company Contact: Mr. Ed Roman, Phone: 407-848-4311, Fax: 407-863-5946, E-mail: eroman@solitrondevices.com
DSCC Contact: Mr. Bradley Deslich, Phone: 614-692-0593, Fax: 614-692-6942, E-mail: bradley_deslich@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
Technologies: Linear, Power, Voltage Regulator
Class H, Class E
Qualification Letters: ELS(ELSH-94-0316), ELS(ELSH-94-0433), ELS(ELSH-95-0079), ELS(ELSH-95-0210), VQ(VQH-99-0180), VQ(VQH-99-0195)
Substrate Fabrication Flows: H1043
Substrate Fabrication: Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Beryllia, 1 Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: H1040
Substrate Attach: Eutectic, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors, Tabs
Wire Bonding: Gold, Aluminum
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 4.64 Seal Perimeter, 6 Leads, Gold/Solder Lead Finish, Getter Qualified; Metal
Package, TO Can, Projection Weld, 2.86 Seal Perimeter, 3 Leads, Gold/Solder Lead Finish, Getter Qualified
Class Level Information: See Note 6/
-42-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
Teledyne Electronic Technologies (CAGE Code: 16170)
12964 Panama Street, Los Angeles, CA 90066-6534, US
Company Contact: Mr. Steve Thompson, Phone: 310-574-2047, Fax: 310-574-2093, E-mail: steven_e_thompson@teledyne.com
DSCC Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Option 1
Technologies: Data Converters, Linear, Microwave
Class H, Class E
Qualification Letters: EQ(EQM-87-1898), EQ(EQC-91-897), EQ(EQM-94-0085), EQ(EQM-94-0098), EQ(EQM-94-138), ELS(ELSH-94-313)
Substrate Fabrication Flows: 7700530 Exhibit 2.5, 7700530 Exhibit 2.4
Substrate Fabrication: Thick Film on Alumina, 7 Conductor Level(s); Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thin Film on Alumina, 1
Conductor Level(s), Resistors
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 7700530 Exhibit 2.6
Substrate Attach: Nonconductive Epoxy, Solder
Element Attach: Conductive Epoxy, Nonconductive Epoxy, Solder, Eutectic
Add-on Elements: Unpackaged Die, Chip Capacitors
Wire Bonding: Gold, Aluminum, Ribbon
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Peripheral Leads, Seam Weld, 8.75 Seal Perimeter, 94 Leads, Gold Lead Finish; Metal Package, Axial Leads,
Seam Weld, 5 Seal Perimeter, 24 Leads, Gold Lead Finish
Class Level Information: See Note 6/
-43-QML-38534-29
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
MIL-PRF-38534 QML Program Status
White Electronic Design Corporation (CAGE Code: 54230)
3601 East University Drive, Phoenix, AZ 85043-7217, US
Company Contact: Ms. Marlene Maat, Phone: 602-437-1520, Fax: 602-437-9120, E-mail: maat@whitemicro.com
DSCC Contact: Mr. James Eschmeyer, Phone: 614-692-0591, Fax: 614-692-6942, E-mail: james_eschmeyer@dscc.dla.mil
Quality Management (QM) Program: Non-TRB
Periodic Inspection System: Options 1 and 2
ISO 9000 System:
ISO 9001 approved by DSCC-VQH
Technologies: Linear (Oscillator), Digital Memory
Class H, Class E
Qualification Letters: EQ(EQC-92-070), EQ(EQC-92-138), EQC-93-457, EQ(EQC-93-508), ELS(ELSH-94-0256), ELS(ELSH-95-0107), ELS(ELSH-95-
0365), ELS(ELSH-95-0014), ELS(ELSH-96-0184), ELS(ELSH-96-0186), VQ(VQH-96-0210), VQ(VQH-96-0211), VQ(VQH-97-0016),
VQ(VQH-97-0170), VQ(VQH-98-0172)
Substrate Fabrication Flows: 106A00006
Substrate Fabrication:
Thick Film on Alumina, 1 Conductor Level(s), Resistors; Thick Film on Alumina, 6 Conductor Level(s)
Substrate Fabrication Information: See Note 1/
Assembly Information: See Note 1/
Assembly Flows: 106A00006
Substrate Attach: Nonconductive Epoxy
Element Attach: Conductive Epoxy, Nonconductive Epoxy
Add-on Elements: Unpackaged Die, Chip Capacitors, Chip Resistors
Wire Bonding: Gold
Package Information: See Notes 1/ 2/ 3/
Package Information: Metal Package, Platform, Projection Weld, 3.53 Seal Perimeter, 16 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-
fire Package, Brazed Leads, Seam Weld, 5.36 Seal Perimeter, 68 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic Co-
fire Package, Axial Leads, Seam Weld, 4.58 Seal Perimeter, 66 Leads, Gold/Solder Lead Finish, Getter Qualified; Ceramic
Package, Pin Grid Array, Seam Weld, 4.1 Seal Perimeter, 66 Leads, Gold Lead Finish, Getter Qualified
Class Level Information: See Note 6/
-44-QML-38534-29
Standardized Microcircuit Drawing (SMD) Approved Source Master Product Listing: Table 1, Table 2, Table 3, and Table 4
PRODUCT ELIGIBILITY: The manufacturers listed in tables 1, 2, 3 and 4 have certified that the Hybrid Microcircuits are built,
tested, and shipped using MIL-PRF-38534 CERTIFIED FLOW/QUALIFIED MATERIALS and MANUFACTURING TECHNIQUES and are in
FULL COMPLIANCE with MIL-PRF-38534 requirements.
Approved Source Master Product Listing
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
Standard
Microcircuit
Drawing
Manufacturer
Similar Part
Number /4 ESDS
Class Product
Type/Description CAGE
Code
Sorted by Standard Microcircuit Drawing
Approved
Source
Table 1
51651MSKCURRENT AMPLIFIER1MSK0002H7801301XC 27851FMICURRENT AMPLIFIER1FLH0002H/8837801301XA No SourceCURRENT AMPLIFIERLH00027801301GA 51651MSKCURRENT AMPLIFIER1MSK0002H7801301XA 27851FMIOP AMP1FLH0032G/8838001301ZA 51651MSKOP AMP1MSK0032B8001301ZC 51651MSKOP AMP1MSK0032B8001301ZA 51651MSKVOLT. FOLLOWER/BUFFER1MSK0033B8001401ZC 51651MSKVOLT. FOLLOWER/BUFFER1MSK0033B8001401ZA 27851FMIVOLT. FOLLOWER/BUFFER1FLH0033G/8838001401ZA 50434HPOPTOCOUPLER, DUAL36N134/883B#1008102801UA 31757MicropacOPTOCOUPLER, DUAL166013-0018102801EC 50434HPOPTOCOUPLER, DUAL36N134/883B#1008102801UC 31757MicropacOPTOCOUPLER, DUAL166013-0018102801EA 50434HPOPTOCOUPLER, DUAL36N134/883B#3008102801TA 50434HPOPTOCOUPLER, DUAL36N134/883B#2008102801EA 31757MicropacOPTOCOUPLER, DUAL166072-001/883B8102801XA 31757MicropacOPTOCOUPLER, DUAL166072-001/883B8102801XC 50434HPOPTOCOUPLER, DUAL36N134/883B8102801EC 50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3HCPL-5631#3008102802ZA
50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3HCPL-56318102802PC
50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3HCPL-5631#1008102802YA
31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
166056-1038102802PA
50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3HCPL-5631#2008102802PA
31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
166056-1038102802PC
50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3HCPL-5631#1008102802YC
50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE
SUPPLY VOLTAGE AND GROUND CONNECTIONS
3HCPL-663181028032A
31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE
SUPPLY VOLTAGE AND GROUND CONNECTIONS
166123-00181028032A
31757MicropacOPTOCOUPLER, DUAL-CHANNEL, WITH SEPARATE
SUPPLY VOLTAGE AND GROUND CONNECTIONS
166123-00181028032C
50434HPOPTOCOUPLER, QUAD-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3(4)HCPL-66518102804FC
50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3(4)HCPL-56518102805PC
50434HPOPTOCOUPLER, DUAL-CHANNEL, WITH COMMON SUPPLY
VOLTAGE AND GROUND CONNECTIONS
3(4)HCPL-5651#2008102805PA
24355AnalogD/A CONVERTER, 12-BIT, RANGE-PROGRAMMABLE
VOLTAGE OUTPUT
1DAC87CBI8300201JC
24355AnalogD/A CONVERTER, 12-BIT, RANGE-PROGRAMMABLE
VOLTAGE OUTPUT
1DAC87CBI8300201JA
No SourceD/A CONVERTER, 12-BIT, RANGE-PROGRAMMABLE
VOLTAGE OUTPUT
DAC878300201XA
31757MicropacOPTOCOUPLER, 4-CHANNEL16N140A/883B8302401EC 31757MicropacOPTOCOUPLER, 4-CHANNEL16N140A/883B8302401EA 31757MicropacOPTOCOUPLER, 4-CHANNEL16N140A8302401XA
-45-QML-38534-29
Approved Source Master Product Listing
Defense Supply Center, Columbus
Sourcing and Qualification Unit, Hybrid Devices Team, DSCC-VQH
Standard
Microcircuit
Drawing
Manufacturer
Similar Part
Number /4 ESDS
Class Product
Type/Description CAGE
Code
Sorted by Standard Microcircuit Drawing
Approved
Source
Table 1
50434HPOPTOCOUPLER, 4-CHANNEL3(>4)HCPL-67518302401FC 50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B8302401EC 50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#6008302401ZC 50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#6008302401ZA 50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#2008302401EA 50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#1008302401YA 50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#1008302401YC 50434HPOPTOCOUPLER, 4-CHANNEL36N140A/883B#3008302401XA No SourceVOLT. REFERENCE, +10.000V, PRECISION27008503001XA 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD/883B8503001CA 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503001YC 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503001YA 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD/883B8503001CC 34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700SLCC/883B85030013A 34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700SD/883B8503001YA 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503002YC 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700SD8503002YA 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700UD/883B8503002CA No SourceVOLT. REFERENCE, +10.000V, PRECISION2700U8503002XA 33256SipexVOLT. REFERENCE, +10.000V, PRECISION1HS2700UD/883B8503002CC 34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700ULCC/883B85030023A 34707HycompVOLT. REFERENCE, +10.000V, PRECISION1HC2700UD/883B8503002YA 34707HycompVOLT. REFERENCE, ±10.000V, PRECISION1HC2702SD/883B8503003YA 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702SD/883B8503003CC 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702SD/883B8503003CA 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702SD8503003YC 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702SD8503003YA 34707HycompVOLT. REFERENCE, ±10.000V, PRECISION1HC2702SLCC/883B85030033A No SourceVOLT. REFERENCE, ±10.000V, PRECISION2702S8503003XA 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702UD/883B8503004CA 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702UD/883B8503004CC 34707HycompVOLT. REFERENCE, ±10.000V, PRECISION1HC2702ULCC/883B85030043A 34707HycompVOLT. REFERENCE, ±10.000V, PRECISION1HC2702UD/883B8503004YA 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702SD8503004YA 33256SipexVOLT. REFERENCE, ±10.000V, PRECISION1HS2702SD8503004YC No SourceVOLT. REFERENCE, ±10.000V, PRECISION2702U8503004XA 33256SipexVOLT. REFERENCE, -10.000V, PRECISION1HS2701SD8503005YA 33256SipexVOLT. REFERENCE, -10.000V, PRECISION1HS2701SD/883B8503005CC 34707HycompVOLT. REFERENCE, -10.000V, PRECISION1HC2701SD/883B8503005YA 34707HycompVOLT. REFERENCE, -10.000V, PRECISION1HC2701SLCC/883B85030053A 33256SipexVOLT. REFERENCE, -10.000V, PRECISION1HS2701SD/883B8503005CA 33256SipexVOLT. REFERENCE, -10.000V, PRECISION1HS2701SD8503005YC 24355AnalogVOLT. REFERENCE, -10.000V, PRECISION12701SD/883B8503005YC 24355