ispLSI® 2064VE
3.3V In-System Programmable
High Density SuperFAST™ PLD
2064ve_09 1
Features
•SuperFAST HIGH DENSITY PROGRAMMABLE LOGIC
— 2000 PLD Gates
— 64 and 32 I/O Pin Versions, Four Dedicated Inputs
— 64 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
— 100% Functional, JEDEC and Pinout Compatible with
ispLSI 2064V Devices
•3.3V LOW VOLTAGE 2064 ARCHITECTURE
— Interfaces with Standard 5V TTL Devices
•HIGH-PERFORMANCE E2CMOS® TECHNOLOGY
— fmax = 280MHz Maximum Operating Frequency
— tpd = 3.5ns Propagation Delay
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
• IN-SYSTEM PROGRAMMABLE
— 3.3V In-System Programmability (ISP™) Using
Boundary Scan Test Access Port (TAP)
— Open-Drain Output Option for Flexible Bus Interface
Capability, Allowing Easy Implementation of Wired-OR
or Bus Arbitration Logic
—Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
—Reprogram Soldered Devices for Faster Prototyping
•100% IEEE 1149.1 BOUNDARY SCAN TESTABLE
•THE EASE OF USE AND FAST SYSTEM SPEED OF
PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAs
— Enhanced Pin Locking Capability
— Three Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Interconnectivity
•LEAD-FREE PACKAGE OPTIONS
Functional Block Diagram
Global Routing Pool
(GRP)
A0
A1
A3
Input Bus
Output Routing Pool (ORP)
B3
B2
B1
B0
Input Bus
Output Routing Pool (ORP)
A2
GLB Logic
Array
DQ
DQ
DQ
DQ
A4 A5 A6 A7
B7 B6 B5 B4
Input Bus
Output Routing Pool (ORP)
Input Bus
Output Routing Pool (ORP)
0139A/2064V
Description
The ispLSI 2064VE is a High Density Programmable
Logic Device available in 64 and 32 I/O-pin versions. The
device contains 64 Registers, four Dedicated Input pins,
three Dedicated Clock Input pins, two dedicated Global
OE input pins and a Global Routing Pool (GRP). The
GRP provides complete interconnectivity between all of
these elements. The ispLSI 2064VE features in-system
programmability through the Boundary Scan Test Ac-
cess Port (TAP) and is 100% IEEE 1149.1 Boundary
Scan Testable. The ispLSI 2064VE offers non-volatile
reprogrammability of the logic, as well as the intercon-
nect, to provide truly reconfigurable systems.
The basic unit of logic on the ispLSI 2064VE device is the
Generic Logic Block (GLB). The GLBs are labeled A0,
A1…B7 (see Figure 1). There are a total of 16 GLBs in the
ispLSI 2064VE device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
Copyright © 2004 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. August 2004
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
Lead-
Free
Package
Options
Available!
2
Specifications ispLSI 2064VE
Functional Block Diagram
Figure 1. ispLSI 2064VE Functional Block Diagram (64-I/O and 32-I/O Versions)
The 64-I/O 2064VE contains 64 I/O cells, while the 32-
I/O version contains 32 I/O cells. Each I/O cell is directly
connected to an I/O pin and can be individually pro-
grammed to be a combinatorial input, output or
bi-directional I/O pin with 3-state control. The signal
levels are TTL compatible voltages and the output drivers
can source 4 mA or sink 8 mA. Each output can be
programmed independently for fast or slow output slew
rate to minimize overall output switching noise. Device
pins can be safely driven to 5-Volt signal levels to support
mixed-voltage systems.
Eight GLBs, 32 or 16 I/O cells, two dedicated inputs and
two or one ORPs are connected together to make a
Megablock (see Figure 1). The outputs of the eight GLBs
are connected to a set of 32 or 16 universal I/O cells by
two or one ORPs. Each ispLSI 2064VE device contains
two Megablocks.
The GRP has as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI 2064VE device are selected using
the dedicated clock pins. Three dedicated clock pins (Y0,
TDO/IN 2
Global Routing Pool
(GRP)
A0
A1
A3
Input Bus
Output Routing Pool (ORP)
B3
B2
B1
B0
Input Bus
Output Routing Pool (ORP)
A2
CLK 0
CLK 1
CLK 2
GOE 0
I/O 0
I/O 1
I/O 2
I/O 3
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 47
I/O 46
I/O 45
I/O 44
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 38
I/O 37
I/O 36
I/O 35
I/O 34
I/O 33
I/O 32
TDI/IN 0
TMS/IN 1
I/O 4
I/O 5
BSCAN
RESET
0139B/2064VE
I/O 63
I/O 62
I/O 61
I/O 60
I/O 59
I/O 58
I/O 57
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
Input Bus
Output Routing Pool (ORP)
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
Y0
Y1
Y2
I/O 31
Output Routing Pool (ORP)
Megablock
Input Bus
A4 A5 A6 A7
B7 B6 B5 B4
GOE 1
TCK/IN 3
Generic Logic
Blocks (GLBs)
Y1, Y2) or an asynchronous clock can be selected on a
GLB basis. The asynchronous or Product Term clock
can be generated in any GLB for its own clock.
Programmable Open-Drain Outputs
In addition to the standard output configuration, the
outputs of the ispLSI 2064VE are individually program-
mable, either as a standard totem-pole output or an
open-drain output. The totem-pole output drives the
specified Voh and Vol levels, whereas the open-drain
output drives only the specified Vol. The Voh level on the
open-drain output depends on the external loading and
pull-up. This output configuration is controlled by a pro-
grammable fuse. The default configuration when the
device is in bulk erased state is totem-pole configuration.
The open-drain/totem-pole option is selectable through
the Lattice software tools.
TMS/IN 2
Global Routing Pool
(GRP)
A0
A1
A3
Input Bus
Output Routing Pool (ORP)
B3
B2
B1
B0
Output Routing Pool (ORP)
A2
CLK 0
CLK 1
CLK 2
I/O 0
I/O 1
I/O 2
I/O 3
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 23
I/O 22
I/O 21
I/O 20
I/O 19
I/O 18
I/O 17
I/O 16
TDI/IN 0
TDO/IN 1
I/O 4
I/O 5
BSCAN
0139B/2064VE.32IO
I/O 31
I/O 30
I/O 29
I/O 28
I/O 27
I/O 26
I/O 25
I/O 24
Input Bus
Output Routing Pool (ORP)
GOE1/Y0
RESET/Y1
TCK/Y2
Output Routing Pool (ORP)
Megablock
Input Bus
A4 A5 A6 A7
B7 B6 B5 B4
GOE0/IN 3
Generic Logic
Blocks (GLBs)
Input Bus
3
Specifications ispLSI 2064VE
CSYMBOL
Table 2-0006/2064VE
C
PARAMETER
I/O Capacitance 6
UNITSTYPICAL TEST CONDITIONS
1
2
8Dedicated Input Capacitance pf
pf V = 3.3V, V = 0.0V
V = 3.3V, V = 0.0V
CC
CC I/O
IN
CClock and Global Output Enable Capacitance 10
3
pf V = 3.3V, V = 0.0V
CC Y
Absolute Maximum Ratings 1
Supply Voltage Vcc................................................... -0.5 to +5.4V
Input Voltage Applied..................................... -0.5 to +5.6V
Off-State Output Voltage Applied .................. -0.5 to +5.6V
Storage Temperature.....................................-65 to 150°C
Case Temp. with Power Applied .................... -55 t o 1 2 5°C
Max. Junction Temp. (TJ) with Power Applied ............ 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
DC Recommended Operating Condition
Capacitance (TA=25°C, f=1.0 MHz)
Table 2-0008/2064VE
PARAMETER MINIMUM MAXIMUM UNITS
Erase/Reprogram Cycles 10000 – Cycles
Erase Reprogram Specifications
T
A
= 0°C to + 70°C
T
A
= -40°C to + 85°C
SYMBOL
Table 2-0005/2064V
VCC
VIH
VIL
PARAMETER
Supply Voltage
Input High Voltage
Input Low Voltage
MIN. MAX. UNITS
3.0
3.0
2.0
V – 0.5
3.6
3.6
5.25
0.8
V
V
V
V
SS
Commercial
Industrial
4
Specifications ispLSI 2064VE
Switching Test Conditions
+ 3.3V
R1
R2CL*
Device
Output Test
Point
*CL includes Test Fixture and Probe Capacitance.
0213A/2064V
Figure 2. Test Load
DC Electrical Characteristics
Over Recommended Operating Conditions
VOL
SYMBOL
1. One output at a time for a maximum duration of one second. V = 0.5V was selected to avoid test
problems by tester ground degradation. Characterized but not 100% tested.
2. Measured using four 16-bit counters.
3. Typical values are at V = 3.3V and T = 25°C.
4. Maximum I varies widely with specific device configuration and operating frequency. Refer to the Power Consumption
section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to
estimate maximum I .
Table 2-0007/2064VE
1
VOH
IIH
IIL
IIL-isp
PARAMETER
IIL-PU
IOS
2, 4
ICC
Output Low Voltage
Output High Voltage
Input or I/O High Leakage Current
Input or I/O Low Leakage Current
BSCAN Input Low Leakage Current
I/O Active Pull-Up Current
Output Short Circuit Current
Operating Power Supply Current
I = 8 mA
I = -4 mA
0V ≤ V ≤ V (Max.)
0V ≤ V ≤ V
0V ≤ V ≤ V
V = 3.3V, V = 0.5V
V = 0.0V, V = 3.0V
f = 1 MHz
OL
OH
IN IL
IN IL
IN IL
CC OUT
CLOCK
IL IH
CONDITION MIN. TYP. MAX. UNITS
3
–
2.4
–
–
–
–
–
–
–
–
90
–
–
–
–
–
–
–
0.4
–
10
10
-10
-150
-150
-100
–
V
V
µA
µA
µA
µA
µA
mA
mA
CC A
OUT
CC
CC
(V – 0.2)V ≤ V ≤ V
V ≤ V ≤ 5.25V
IN
CC CC
IN
CC
Input Pulse Levels
Table 2-0003/2064VE
Input Rise and Fall Time
Input Timing Reference Levels
Output Timing Reference Levels
Output Load
GND to 3.0V
1.5V
1.5V
See Figure 2
3-state levels are measured 0.5V from
steady-state active level.
≤ 1.5 ns 10% to 90%
TEST CONDITION R1 R2 CL
A316Ω348Ω35pF
B∞348Ω35pF
316Ω348Ω35pF
Active High
Active Low
C316Ω348Ω5pF
∞348Ω5pF
Active Low to Z
at V +0.5V
OL
Active High to Z
at V -0.5V
OH
Table 2-0004/2064V
Output Load Conditions (see Figure 2)
5
Specifications ispLSI 2064VE
External Timing Parameters
Over Recommended Operating Conditions
t
pd1
UNITS
TEST
COND.
1. Unless noted otherwise, all parameters use a GRP load of four, 20 PTXOR path, ORP and Y0 clock.
2. Standard 16-bit counter using GRP feedback.
3. Reference Switching Test Conditions section.
Table 2-0030A/2064VE v.0.0
1
3
2
1
tsu2 + tco1
( )
DESCRIPTION#PARAMETER
A1Data Propagation Delay, 4PT Bypass, ORP Bypass ns
t
pd2 A2Data Propagation Delay ns
f
max A3Clock Frequency with Internal Feedback MHz
f
max (Ext.) –4Clock Frequency with External Feedback MHz
f
max (Tog.) –5Clock Frequency, Max. Toggle MHz
t
su1 –6GLB Reg. Setup Time before Clock, 4 PT Bypass ns
t
co1 A7GLB Reg. Clock to Output Delay, ORP Bypass ns
t
h1 –8GLB Reg. Hold Time after Clock, 4 PT Bypass ns
t
su2 –9GLB Reg. Setup Time before Clock ns
t
co2 A10GLB Reg. Clock to Output Delay ns
t
h2 –11GLB Reg. Hold Time after Clock ns
t
r1 A12Ext. Reset Pin to Output Delay, ORP Bypass ns
t
rw1 –13Ext. Reset Pulse Duration ns
t
ptoeen B14Input to Output Enable ns
t
ptoedis C15Input to Output Disable ns
t
goeen B16Global OE Output Enable ns
t
goedis C17Global OE Output Disable ns
t
wh –18External Synchronous Clock Pulse Duration, High ns
t
wl –19External Synchronous Clock Pulse Duration, Low ns
-200
MIN. MAX.
–4.5
–
200 –
–
–
–
–
0.0
4.0
–
0.0
–
4.0
–
–
–
–
2.5 –
2.5 –
133
200
3.0 3.5
–
–
4.5
–
6.0
–
8.0
8.0
5.0
5.0
7.0
-280
MIN. MAX.
– 3.5
–
280 –
–
–
–
–
0.0
3.0
–
0.0
–
3.5
–
–
–
–
1.6 –
1.6 –
182
300
2.3 2.5
–
–
3.3
–
5.5
–
6.0
6.0
3.5
3.5
5.5
6
Specifications ispLSI 2064VE
External Timing Parameters
Over Recommended Operating Conditions
t
pd1
UNITS
-100
MIN.
TEST
COND.
1. Unless noted otherwise, all parameters use a GRP load of four, 20 PTXOR path, ORP and Y0 clock.
2. Standard 16-bit counter using GRP feedback.
3. Reference Switching Test Conditions section.
Table 2-0030B/2064VE v.0.0
1
3
2
1
tsu2 + tco1
( )
MAX.
DESCRIPTION#PARAMETER
A1Data Propagation Delay, 4PT Bypass, ORP Bypass – 10.0 ns
t
pd2 A2Data Propagation Delay – ns
f
max A3Clock Frequency with Internal Feedback 100 – MHz
f
max (Ext.) –4Clock Frequency with External Feedback – MHz
f
max (Tog.) –5Clock Frequency, Max. Toggle – MHz
t
su1 –6GLB Reg. Setup Time before Clock, 4 PT Bypass – ns
t
co1 A7GLB Reg. Clock to Output Delay, ORP Bypass – ns
t
h1 –8GLB Reg. Hold Time after Clock, 4 PT Bypass 0.0 ns
t
su2 –9GLB Reg. Setup Time before Clock 8.0 ns
t
co2 A10GLB Reg. Clock to Output Delay – ns
t
h2 –11GLB Reg. Hold Time after Clock 0.0 ns
t
r1 A12Ext. Reset Pin to Output Delay, ORP Bypass – ns
t
rw1 –13Ext. Reset Pulse Duration 6.5 ns
t
ptoeen B14Input to Output Enable – ns
t
ptoedis C15Input to Output Disable – ns
t
goeen B16Global OE Output Enable – ns
t
goedis C17Global OE Output Disable – ns
t
wh –18External Synchronous Clock Pulse Duration, High 5.0 – ns
t
wl –19External Synchronous Clock Pulse Duration, Low 5.0 – ns
77
100
6.5 5.0
–
–
6.0
–
12.5
–
15.0
15.0
9.0
9.0
13.0
-135
MIN. MAX.
– 7.5
–
135 –
–
–
–
–
0.0
6.0
–
0.0
–
5.0
–
–
–
–
3.5 –
3.5 –
100
143
5.0 4.0
–
–
5.0
–
9.0
–
12.0
12.0
7.0
7.0
10.0
7
Specifications ispLSI 2064VE
Internal Timing Parameters1
Over Recommended Operating Conditions
tio
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
Table 2-0036A/2064VE v.0.0
Inputs
UNITS
-280 -200
MIN. MIN.MAX. MAX.
DESCRIPTION#
2
PARAMETER
20 Input Buffer Delay ns
tdin 21 Dedicated Input Delay ns
tgrp 22 GRP Delay ns
GLB
t1ptxor 25 1 Product Term/XOR Path Delay ns
t20ptxor 26 20 Product Term/XOR Path Delay ns
txoradj 27 XOR Adjacent Path Delay ns
tgbp 28 GLB Register Bypass Delay ns
tgsu 29 GLB Register Setup Time before Clock ns
tgh 30 GLB Register Hold Time after Clock ns
tgco 31 GLB Register Clock to Output Delay ns
3
tgro 32 GLB Register Reset to Output Delay ns
tptre 33 GLB Product Term Reset to Register Delay ns
tptoe 34 GLB Product Term Output Enable to I/O Cell Delay ns
tptck 35 GLB Product Term Clock Delay ns
ORP
tob 38 Output Buffer Delay ns
tsl 39 Output Slew Limited Delay Adder ns
GRP
t4ptbpc 23 4 Product Term Bypass Path Delay (Combinatorial) ns
t4ptbpr 24 4 Product Term Bypass Path Delay (Registered) ns
torp 36 ORP Delay ns
torpbp 37 ORP Bypass Delay ns
Outputs
toen 40 I/O Cell OE to Output Enabled ns
todis 41 I/O Cell OE to Output Disabled ns
tgoe 42 Global Output Enable ns
tgy0 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) ns
tgy1/2 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line ns
Clocks
tgr 45 Global Reset to GLB
0.4
0.8
0.4
2.3
2.3
2.3
0.0
–
–
0.2
0.4
4.1
2.9
2.9
1.2
1.8
1.1
1.6
1.2
0.4
2.3
2.3
1.2
0.7
0.9
3.5
–
–
–
–
–
–
–
0.6
1.7
–
–
–
–
0.8
–
–
–
–
–
–
–
–
–
0.7
0.9
–
0.5
1.1
0.6
2.9
2.9
2.9
0.0
–
–
0.3
0.4
4.3
3.9
4.0
1.5
2.0
1.4
1.9
1.5
0.5
3.0
3.0
2.0
1.2
1.4
3.6
–
–
–
–
–
–
–
1.2
1.8
–
–
–
–
1.0
–
–
–
–
–
–
–
–
–
1.2
1.4
–ns
Global Reset
8
Specifications ispLSI 2064VE
Internal Timing Parameters1
Over Recommended Operating Conditions
t
io
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
Table 2-0036B/2064VE v.0.0
Inputs
UNITS
-135
MIN.
-100
MIN.MAX. MAX.
DESCRIPTION#
2
PARAMETER
20 Input Buffer Delay ns
t
din 21 Dedicated Input Delay ns
t
grp 22 GRP Delay ns
GLB
t
1ptxor 25 1 Product Term/XOR Path Delay ns
t
20ptxor 26 20 Product Term/XOR Path Delay ns
t
xoradj 27 XOR Adjacent Path Delay ns
t
gbp 28 GLB Register Bypass Delay ns
t
gsu 29 GLB Register Setup Time before Clock ns
t
gh 30 GLB Register Hold Time after Clock ns
t
gco 31 GLB Register Clock to Output Delay ns
3
t
gro 32 GLB Register Reset to Output Delay ns
t
ptre 33 GLB Product Term Reset to Register Delay ns
t
ptoe 34 GLB Product Term Output Enable to I/O Cell Delay ns
t
ptck 35 GLB Product Term Clock Delay ns
ORP
t
ob 38 Output Buffer Delay ns
t
sl 39 Output Slew Limited Delay Adder ns
GRP
t
4ptbpc 23 4 Product Term Bypass Path Delay (Combinatorial) ns
t
4ptbpr 24 4 Product Term Bypass Path Delay (Registered) ns
t
orp 36 ORP Delay ns
t
orpbp 37 ORP Bypass Delay ns
Outputs
t
oen 40 I/O Cell OE to Output Enabled ns
t
odis 41 I/O Cell OE to Output Disabled ns
t
goe 42 Global Output Enable ns
t
gy0 43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) ns
t
gy1/2 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line ns
Clocks
t
gr 45 Global Reset to GLB
0.5
1.7
1.2
4.7
4.7
4.7
0.5
–
–
0.3
1.1
6.1
6.9
5.0
1.6
2.0
3.7
3.7
1.5
0.5
3.4
3.4
3.6
1.6
1.8
5.8
–
–
–
–
–
–
–
1.2
3.8
–
–
–
–
1.6
–
–
–
–
–
–
–
–
–
1.6
1.8
–
0.7
2.5
1.8
6.2
6.2
6.2
1.0
–
–
0.3
3.1
7.1
9.1
5.6
1.6
2.0
5.2
4.7
1.7
0.7
3.4
3.4
5.6
2.4
2.6
7.1
–
–
–
–
–
–
–
1.7
4.8
–
–
–
–
2.6
–
–
–
–
–
–
–
–
–
2.4
2.6
–ns
Global Reset
9
Specifications ispLSI 2064VE
ispLSI 2064VE Timing Model
GLB Reg
Delay
I/O Pin
(Output)
ORP
Delay
Feedback
Reg 4 PT Bypass
20 PT
XOR Delays
Control
PTs
I/O Pin
(Input)
Y0,1,2
GRP GLB Reg Bypass ORP Bypass
DQ
RST
RE
OE
CK
I/O Delay
I/O CellORPGLBGRPI/O Cell
#24
#25, 26, 27
#33, 34,
35
#43, 44
#36
Reset
Ded. In #21
#20 #28
#29, 30,
31, 32
#38,
39
GOE 0,1 #42
#40, 41
0491/2064
#22
Comb 4 PT Bypass #23
#37
#45
Derivations of
t
su,
t
h and
t
co from the Product Term Clock
=
=
=
=
t
su Logic + Reg su - Clock (min)
(
t
io +
t
grp +
t
20ptxor) + (
t
gsu) - (
t
io +
t
grp +
t
ptck(min))
(#20 + #22 + #26) + (#29) - (#20 + #22 + #35)
(0.4 + 0.4 + 2.3) + (0.6) - (0.4 + 0.4 + 0.8)
=
=
=
=
t
h Clock (max) + Reg h - Logic
(
t
io +
t
grp +
t
ptck(max)) + (
t
gh) - (
t
io +
t
grp +
t
20ptxor)
(#20 + #22 + #35) + (#30) - (#20 + #22 + #26)
(0.4 + 0.4 + 2.9) + (1.7) - (0.4 + 0.4 + 2.3)
=
=
=
=
t
co Clock (max) + Reg co + Output
(
t
io +
t
grp +
t
ptck(max)) + (
t
gco) + (
t
orp +
t
ob)
(#20 + #22 + #35) + (#31) + (#36 + #38)
(0.4 + 0.4 + 2.9) + (0.2) + (1.2 + 1.2)
Table 2-0042/2064VE
Note: Calculations are based on timing specifications for the ispLSI 2064VE-280L.
2.1ns
2.3ns
6.3ns
10
Specifications ispLSI 2064VE
Power Consumption
Power consumption in the ispLSI 2064VE device de-
pends on two primary factors: the speed at which the
device is operating and the number of Product Terms
used. Figure 3 shows the relationship between power
and operating speed.
Figure 3. Typical Device Power Consumption vs fmax
0127/2064VE
ICC can be estimated for the ispLSI 2064VE using the following equation:
ICC(mA) = 8 + (# of PTs * 0.67) + (# of Nets * Fmax * 0.0045)
Where:
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max freq = Highest Clock Frequency to the device (in MHz)
The ICC estimate is based on typical conditions (VCC = 3.3V, room temperature) and an assumption of two GLB
loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating
conditions and the program in the device, the actual ICC should be verified.
Notes: Configuration of four 16-bit counters
Typical current at 3.3V, 25° C
100
140
050100 150 200 250 300
fmax (MHz)
ispLSI 2064VE
160
180
120
80
ICC (mA)
11
Specifications ispLSI 2064VE
32-I/O Signal Descriptions
GOE 0/IN 3 This pin performs one of two functions. It can be programmed to function as a Global Output Enable
pin or a Dedicated Input pin.
GOE 1/Y0 This pin performs one of two functions. (1) It can be programmed to function as a GLobal Output Enable
or a Dedicated Clock input. (2) This clock input is connected to one of the clock inputs of all GLBs on
the device.
RESET/Y1 This pin performs two functions: (1) Active Low (0) Reset pin which resets all of the registers in the
device. (2) When active low (0), it functions as a dedicated clock input.
BSCAN Input – Dedicated in-system programming Boundary Scan Enable input pin. This pin is brought low to
enable the programming mode. The TMS, TDI, TDO and TCK controls become active.
TDI/IN 0 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a serial data input
pin to load programming data into the device. (2) When BSCAN is high, it functions as a dedicated input
pin.
TMS/IN 2 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a mode control pin
for the Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated input pin.
TDO/IN 1 Output/Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as an output
pin to read serial shift register data. (2) When BSCAN is high, it functions as a dedicated input pin.
TCK/Y2 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a clock pin for the
Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated clock input.
GND Ground (GND)
VCC Vcc
NC1No Connect
I/O Input/Output pins – These are the general purpose I/O pins used by the logic array.
64-I/O Signal Descriptions
RESET Active Low (0) Reset pin resets all the registers in the device.
GOE 0, GOE1 Global Output Enable input pins.
Y0, Y1, Y2 Dedicated Clock Input – These clock inputs are connected to one of the clock inputs of all the GLBs in
the device.
BSCAN Input – Dedicated in-system programming Boundary Scan enable input pin. This pin is brought low to
enable the programming mode. The TMS, TDI, TDO and TCK controls become active.
TDI/IN 0 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a serial data input
pin to load programming data into the device. When BSCAN is high, it functions as a dedicated input pin.
TCK/IN 3 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a clock pin for the
Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated input pin.
TMS/IN 1 Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as a mode control pin
for the Boundary Scan state machine. (2) When BSCAN is high, it functions as a dedicated input pin.
TDO/IN 2 Output/Input – This pin performs two functions. (1) When BSCAN is logic low, it functions as an output
pin to read serial shift register data. (2) When BSCAN is high, it functions as a dedicated input pin.
GND Ground (GND)
VCC Vcc
NC1No Connect
I/O Input/Output Pins – These are the general purpose I/O pins used by the logic array.
Signal Name Description
1. NC pins are not to be connected to any active signals, VCC or GND.
Signal Name Description
1. NC pins are not to be connected to any active signals, VCC or GND.
12
Specifications ispLSI 2064VE
64-I/O Signal Locations
32-I/O Signal Locations
langiSAGBacllaB-001PFQTniP-001
TESER 2D11
1EOG,0EOG1E,9F31,26
2Y,1Y,0Y8F,6F,3E06,56,01
NACSB 5E51
0NI/IDT2F61
3NI/KCT01G95
1NI/SMT5J73
2NI/ODT6B78
DNG6K,9G,1F,7B68,16,93,41
CCV4J,01F,2E,5A98,36,63,21
CN
1
,4C,3C,8A,6A ,7E,8D,6D,1D ,4F,01E,9E ,8H,7H,5G,3G 5K,3K
,52,12,9,4 ,05,44,83,13 ,17,66,46,45 ,49,88,18,57 001
,slangisevitcaynaotdetcennocebottonerasnipCN.1 .DNGroCCV
langiSPFQTniP-44CCLPniP-44
3NI/0EOG042
0Y/1EOG5 11
TESER 1Y/ 9253
NACSB 731
0NI/IDT8 41
2NI/SMT0363
1NI/ODT8142
2Y/KCT7233
DNG93,7132,1
CCV82,643,21
CN
1
——
,slangisevitcaynaotdetcennocebottonerasnipCN.1 .DNGroCCV
I/O Locations
I/O 0 G1 17 9 15
I/O 1 F3 18 10 16
I/O 2 E4 19 11 17
I/O 3 H1 20 12 18
I/O 4 G2 22 13 19
I/O 5 J1 23 14 20
I/O 6 H2 24 15 21
I/O 7 K1 26 16 22
I/O 8 J2 27 19 25
I/O 9 K2 28 20 26
I/O 10 H3 29 21 27
I/O 11 J3 30 22 28
I/O 12 G4 32 23 29
I/O 13 H4 33 24 30
I/O 14 K4 34 25 31
I/O 15 H5 35 26 32
I/O 16 F5 40 31 37
I/O 17 J6 41 32 38
I/O 18 K7 42 33 39
I/O 19 H6 43 34 40
I/O 20 K8 45 35 41
I/O 21 G6 46 36 42
I/O 22 J7 47 37 43
I/O 23 K9 48 38 44
I/O 24 J8 49 41 3
I/O 25 K10 51 42 4
I/O 26 J9 52 43 5
I/O 27 J10 53 44 6
I/O 28 H9 55 1 7
I/O 29 H10 56 2 8
I/O 30 G7 57 3 9
I/O 31 G8 58 4 10
I/O 32 D10 67 — —
I/O 33 E8 68 — —
I/O 34 F7 69 — —
I/O 35 C10 70 — —
I/O 36 D9 72 — —
I/O 37 B10 73 — —
I/O 38 C9 74 — —
I/O 39 A10 76 — —
I/O 40 B9 77 — —
I/O 41 A9 78 — —
I/O 42 C8 79 — —
I/O 43 B8 80 — —
I/O 44 D7 82 — —
I/O 45 C7 83 — —
I/O 46 A7 84 — —
I/O 47 C6 85 — —
I/O 48 E6 90 — —
I/O 49 B5 91 — —
I/O 50 A4 92 — —
I/O 51 C5 93 — —
I/O 52 A3 95 — —
I/O 53 D5 96 — —
I/O 54 B4 97 — —
I/O 55 A2 98 — —
I/O 56 B3 99 — —
I/O 57 A1 1 — —
I/O 58 B2 2 — —
I/O 59 B1 3 — —
I/O 60 C2 5 — —
I/O 61 C1 6 — —
I/O 62 D4 7 — —
I/O 63 D3 8 — —
100 100 44 44
Signal caBGA TQFP TQFP PLCC
13
Specifications ispLSI 2064VE
Signal Configuration
ispLSI 2064VE 100-Ball caBGA Signal Diagram (0.8mm Ball Pitch/10.0 x 10.0mm Body Size)
10 987654321
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
10 987654321
I/O
39 I/O
41 I/O
46 I/O
50 I/O
52 I/O
55 I/O
57
NC
1
NC
1
VCC
I/O
35 I/O
38 I/O
42 I/O
45 I/O
47 I/O
51 I/O
60 I/O
61
NC
1
NC
1
TCK/
IN 3 I/O
31 I/O
30 I/O
21 I/O
12 I/O
4I/O
0
NC
1
GND NC
1
I/O
29 I/O
28 I/O
19 I/O
13 I/O
10
I/O
15 I/O
6I/O
3
NC
1
NC
1
I/O
27 I/O
26 I/O
24 I/O
22 I/O
17 I/O
11
TMS/
IN 1 I/O
8I/O
5
VCC
I/O
25
1NCs are not to be connected to any active signals, VCC or GND.
Note: Ball A1 indicator dot on top side of package.
I/O
23 I/O
20 I/O
18 I/O
14 I/O
9I/O
7
GND NC
1
NC
1
GOE
0I/O
34 I/O
16 I/O
1TDI/
IN 0
NC
1
GND
100-BGA/2064VE
VCC Y2 Y1
I/O
32 I/O
36 I/O
44 I/O
53 I/O
62 I/O
63
NC
1
NC
1
NC
1
RESET
I/O
33 I/O
48 I/O
2GOE
1
NC
1
VCCY0NC
1
NC
1BSCAN
I/O
37 I/O
40 I/O
43 I/O
54
I/O
49
TDO/
IN 2 I/O
56 I/O
58 I/O
59
GND
ispLSI 2064VE
Bottom View
14
Specifications ispLSI 2064VE
Pin Configuration
ispLSI 2064VE 100-Pin TQFP Pinout Diagram (0.5mm Lead Pitch/14.0 x 14.0mm Body Size)
I/O 57
I/O 58
I/O 59
1NC
I/O 60
I/O 61
I/O 62
I/O 63
1NC
Y0
RESET
VCC
GOE 1
GND
BSCAN
TDI/IN 0
I/O 0
I/O 1
I/O 2
I/O 3
1NC
I/O 4
I/O 5
I/O 6
1NC
NC1
I/O 38
I/O 37
I/O 36
NC1
I/O 35
I/O 34
I/O 33
I/O 32
NC1
Y1
NC1
VCC
GOE 0
GND
Y2
TCK/IN 3
I/O 31
I/O 30
I/O 29
I/O 28
NC1
I/O 27
I/O 26
I/O 25
NC1
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
NC1
I/O 51
I/O 50
I/O 49
I/O 48
VCC
NC1
TDO/IN 2
GND
I/O 47
I/O 46
I/O 45
I/O 44
NC1
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
1NC
I/O 12
I/O 13
I/O 14
I/O 15
VCC
TMS/IN 1
1NC
GND
I/O 16
I/O 17
I/O 18
I/O 19
1NC
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
1NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
57
56
55
54
53
52
51
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
58
ispLSI 2064VE
Top View
1. NC pins are not to be connected to any active signals, VCC or GND. 100 TQFP/2064VE
15
Specifications ispLSI 2064VE
Pin Configuration
ispLSI 2064VE 44-Pin PLCC Pinout Diagram (0.05in Lead Pitch/0.65 x 0.65in Body Size)
I/O 18
I/O 17
I/O 16
TMS/IN 2
RESET/Y1
VCC
TCK/Y2
I/O 15
I/O 14
I/O 13
I/O 12
I/O 28
I/O 29
I/O 30
I/O 31
GOE1/Y0
VCC
BSCAN
TDI/IN 0
I/O 0
I/O 1
I/O 2
I/O 27
I/O 26
I/O 25
I/O 24
GOE 0/IN 3
GND
I/O 23
I/O 22
I/O 21
I/O 20
I/O 19
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
GND
TDO/IN 1
I/O 8
I/O 9
I/O 10
I/O 11
ispLSI 2064VE
Top View
1
2
3
4
6
5
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
44
12
43
13
42
14
41
15
40
16
39
17
38
18
37
19
36
20
35
21
34
22
44 TQFP/2064VE
I/O 18
I/O 17
I/O 16
TMS/IN 2
RESET/Y1
VCC
TCK/Y2
I/O 15
I/O 14
I/O 13
I/O 12
I/O 28
I/O 29
I/O 30
I/O 31
GOE1/Y0
VCC
BSCAN
TDI/IN 0
I/O 0
I/O 1
I/O 2
I/O 27
I/O 26
I/O 25
I/O 24
GOE 0/IN 3
GND
I/O 23
I/O 22
I/O 21
I/O 20
I/O 19
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
GND
TDO/IN 1
I/O 8
I/O 9
I/O 10
I/O 11
ispLSI 2064VE
Top View
7
8
9
10
12
11
13
14
15
16
17
39
38
37
36
35
34
33
32
31
30
29
6
18
5
19
4
20
3
21
2
22
1
23
44
24
43
25
42
26
41
27
40
28
44 PLCC/2064VE
Pin Configuration
ispLSI 2064VE 44-Pin TQFP Pinout Diagram (0.8mm Lead Pitch/10.0 x 10.0mm Body Size)
16
Specifications ispLSI 2064VE
Part Number Description
ispLSI 2064VE Ordering Information
135 7.5 100-Pin TQFPispLSI 2064VE-135LT100
Table 2-0041A/2064VE
135 100-Ball caBGA7.5 ispLSI 2064VE-135LB100
FAMILY fmax (MHz)
200
ORDERING NUMBER PACKAGE
100-Pin TQFP
tpd (ns)
4.5
ispLSI
ispLSI 2064VE-200LT100
64
64
135 7.5 44-Pin PLCCispLSI 2064VE-135LJ44
135 44-Pin TQFP7.5 ispLSI 2064VE-135LT44
32
32
I/Os
64
200 100-Ball caBGA4.5 ispLSI 2064VE-200LB10064
280 100-Pin TQFP3.5 ispLSI 2064VE-280LT10064
280 100-Ball caBGA3.5 ispLSI 2064VE-280LB10064
200 44-Pin PLCC4.5 ispLSI 2064VE-200LJ4432
200 44-Pin TQFP4.5 ispLSI 2064VE-200LT4432
280 44-Pin TQFP3.5 ispLSI 2064VE-280LT44
32
100
100 100-Pin TQFP10
10 ispLSI 2064VE-100LT100 100-Ball caBGAispLSI 2064VE-100LB100
64
64
100
100 44-Pin PLCC10
10 ispLSI 2064VE-100LJ44 44-Pin TQFPispLSI 2064VE-100LT44
32
32
COMMERCIAL
Table 2-0041B/2064VE
ispLSI 135 7.5 100-Pin TQFPispLSI 2064VE-135LT100I64
135 7.5 44-Pin TQFPispLSI 2064VE-135LT44I32
INDUSTRIAL
FAMILY fmax (MHz) ORDERING NUMBER PACKAGEtpd (ns) I/Os
Device Number
ispLSI 2064VE XXX X XXXXX
Grade
Blank = Commercial
I = Industrial
X
Speed
280 = 280 MHz fmax
200 = 200 MHz fmax
135 = 135 MHz fmax
100 = 100 MHz fmax
Power
L = Low
Package
T100 = 100-Pin TQFP
TN100 = Lead-Free 100-Pin TQFP
B100 = 100-Ball caBGA
T44 = 44-Pin TQFP
TN44 = Lead-Free 44-Pin TQFP
J44 = 44-Pin PLCC
–
Device Family
Conventional Packaging
17
Specifications ispLSI 2064VE
ispLSI 2064VE Ordering Information (Cont.)
Lead-Free Packaging
100 10 Lead-Free 44-Pin TQFPispLSI 2064VE-100LTN44
FAMILY fmax (MHz)
200
ORDERING NUMBER PACKAGE
Lead-Free 44-Pin TQFP
tpd (ns)
4.5
ispLSI ispLSI 2064VE-200LTN44
32
I/Os
32
135 Lead-Free 100-Pin TQFP7.5 ispLSI 2064VE-135LTN10064
280 Lead-Free 100-Pin TQFP3.5 ispLSI 2064VE-280LTN10064
280 Lead-Free 44-Pin TQFP3.5 ispLSI 2064VE-280LTN4432
135 Lead-Free 44-Pin TQFP7.5 ispLSI 2064VE-135LTN4432
100 Lead-Free 100-Pin TQFP10 ispLSI 2064VE-100LTN10064
200 Lead-Free 100-Pin TQFP4.5 ispLSI 2064VE-200LTN100
64
COMMERCIAL
FAMILY fmax (MHz) ORDERING NUMBER PACKAGEtpd (ns)
ispLSI
I/Os
135 Lead-Free 100-Pin TQFP7.5 ispLSI 2064VE-135LTN100I64
135 Lead-Free 44-Pin TQFP7.5 ispLSI 2064VE-135LTN44I
32
INDUSTRIAL
