FFSB20120A-F085 Silicon Carbide Schottky Diode 1200 V, 20 A Description Silicon Carbide (SiC) Schottky Diodes use a completely new technology that provides superior switching performance and higher reliability compared to Silicon. No reverse recovery current, temperature independent switching characteristics, and excellent thermal performance sets Silicon Carbide as the next generation of power semiconductor. System benefits include highest efficiency, faster operating frequency, increased power density, reduced EMI, and reduced system size and cost. www.onsemi.com 1.,3. Cathode 2. Anode Schottky Diode Features * * * * * * * Max Junction Temperature 175C Avalanche Rated 200 mJ High Surge Current Capacity Positive Temperature Coefficient Ease of Paralleling No Reverse Recovery/No Forward Recovery AEC-Q101 qualified 3 1 2 D2PAK-3(TO-263, 3-LEAD) CASE 418AJ MARKING DIAGRAM Applications * Automotive HEV-EV Onboard Chargers * Automotive HEV-EV DC-DC Converters $Y&Z&3&K FFSB 20120A $Y &Z &3 &K FFSB20120A = ON Semiconductor Logo = Assembly Plant Code = Numeric Date Code = Lot Code = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. (c) Semiconductor Components Industries, LLC, 2013 July, 2018 - Rev. 0 1 Publication Order Number: FFSB20120A-F085/D FFSB20120A-F085 ABSOLUTE MAXIMUM RATINGS (TC = 25C unless otherwise noted) Parameter Symbol Ratings Unit 1200 V 200 mJ A VRRM Peak Repetitive Reverse Voltage EAS Single Pulse Avalanche Energy IF Continuous Rectified Forward Current @ TC < 157C 20 Continuous Rectified Forward Current @ TC < 135C 32 IF, Max (Note 1) Non-Repetitive Peak Forward Surge Current TC = 25C, 10 ms 1190 TC = 150C, 10 ms 990 A IF, SM Non-Repetitive Forward Surge Current Half-Sine Pulse, tp = 8.3 ms 135 A IF, RM Repetitive Forward Surge Current Half-Sine Pulse, tp = 8.3 ms 74 A Ptot Power Dissipation TC = 25C 333 W TC = 150C 55 W -55 to +175 C TJ, TSTG Operating and Storage Temperature Range Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Symbol RqJC Parameter Thermal Resistance, Junction to Case, Max Ratings Unit 0.45 C/W PACKAGE MARKING AND ORDERING INFORMATION Part Number Top Mark Package Shipping FFSB20120A-F085 FFSB20120A D2PAK 800 Units/ Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted) Symbol VF IR Parameter Forward Voltage Reverse Current Test Conditions Min Typ. Max. Unit IF = 20 A, TC = 25C - 1.45 1.75 V IF = 20 A, TC = 125C - 1.7 2 IF = 20 A, TC = 175C - 2 2.4 VR = 1200 V, TC = 25C - - 200 VR = 1200 V, TC = 125C - - 300 VR = 1200 V, TC = 175C - - 400 mA QC Total Capacitive Charge V = 800 V - 120 - nC C Total Capacitance VR = 1 V, f = 100 kHz - 1220 - pF VR = 400 V, f = 100 kHz - 111 - VR = 800 V, f = 100 kHz - 88 - Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. EAS of 200 mJ is based on starting TJ = 25C, L = 0.5 mH, IAS = 29 A, V = 50 V. www.onsemi.com 2 FFSB20120A-F085 TYPICAL CHARACTERISTICS (TC = 25C unless otherwise noted) 101 TJ = -55C TJ = 25C TJ = 75C 16 IR, REVERSE CURRENT (mA) IF, FORWARD CURRENT (A) 20 12 TJ = 125C TJ = 175C 8 4 0 0.0 0.5 1.0 1.5 2.0 VF, FORWARD VOLTAGE (V) 2.5 100 TJ = 175C 10-1 TJ = 125C TJ = 75C 10-2 TJ = 25C 10-3 200 3.0 Figure 1. Forward Characteristics 200 D = 0.2 D = 0.3 150 D = 0.5 100 50 D=1 D = 0.7 50 75 125 100 150 300 250 200 150 100 50 0 25 175 TC, CASE TEMPERATURE (5C) 50 75 100 125 150 175 TC, CASE TEMPERATURE (5C) Figure 3. Current Derating Figure 4. Power Derating 150 5000 125 CAPACITIANCE (pF) QC, CAPACITIVE CHARGE (nC) 1200 350 D = 0.1 0 25 400 600 800 1000 VR, REVERSE VOLTAGE (V) Figure 2. Reverse Characteristics PTOT, POWER DISSIPATION (W) IP, PEAK FORWARD CURRENT (A) 250 TJ = -55C 100 75 50 25 0 1000 100 0 200 400 600 800 50 0.1 1000 VR, REVERSE VOLTAGE (V) Figure 5. Capacitive Charge vs. Reverse Voltage 1 10 100 VR, REVERSE VOLTAGE (V) 1000 Figure 6. Capacitive Charge vs. Reverse Voltage www.onsemi.com 3 FFSB20120A-F085 TYPICAL CHARACTERISTICS (TC = 25C unless otherwise noted) (continued) EC, CAPACITIVE ENERGY (mJ) 50 40 30 20 10 0 0 200 400 800 600 1000 VR, REVERSE VOLTAGE (V) r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE Figure 7. Capacitance Stored Energy 2 1 DUTY CYCLE - DESCENDING ORDER PDM 0.1 0.2 0.5 0.1 0.0 1 0.02 0.01 t1 t2 0.05 NOTES: ZqJC (t) = r(t) x RqJC RqJC = 0.45C/W PEAK TJ = PDM x ZqJC (t) + TC Duty cycle, D = t1/t2 0.001 SINGLE PULSE 0.0001 10-6 10-5 10-4 10-3 10-2 10-1 1 t, RECTANGULAR PULSE DURATION (sec) Figure 8. Junction-to-Case Transient Thermal Response Curve TEST CIRCUIT AND WAVEFORMS L = 0.5 mH R < 0.1 W VDD = 50 V EAVL = 1/2LI2 [VR(AVL) / (VR(AVL) - VDD)] Q1 = IGBT (BVCES > DUT VR(AVL)) L Q1 CURRENT SENSE DUT VAVL R + VDD IL IL I V VDD - t0 t1 Figure 9. Unclamped Inductive Switching Test Circuit & Waveform www.onsemi.com 4 t2 t FFSB20120A-F085 PACKAGE DIMESIONS D2PAK-3 (TO-263, 3-LEAD) CASE 418AJ B E2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. CHAMFER OPTIONAL 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.005 PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AT DATUM H. 5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN DIMENSIONS E, L1, D1 AND E1. 6. OPTIONAL MOLD FEATURE A A E SEATING PLANE L1 c2 NOTE 3 A D1 L1 D H DETAIL C E1 0.10 L2 e 2X TOP VIEW b 0.10 B A B SEATING PLANE M A c NOTE 6 M VIEW A-A SIDE VIEW M B A M H GAUGE PLANE L3 A1 L M DETAIL C VIEW A-A OPTIONAL CONSTRUCTIONS RECOMMENDED SOLDERING FOOTPRINT* 0.436 0.366 0.653 2X 0.169 2X 0.063 0.100 PITCH DIMENSIONS: INCHES *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 DIM A A1 b c c2 D D1 E E1 e H L L1 L2 L3 M INCHES MIN MAX 0.160 0.190 0.000 0.010 0.020 0.039 0.012 0.029 0.045 0.065 0.330 0.380 0.260 ---- 0.380 0.420 0.245 ---- 0.100 BSC 0.575 0.625 0.070 0.110 ---- 0.066 ---- 0.070 0.010 BSC 0 8 MILLIMETERS MIN MAX 4.06 4.83 0.00 0.25 0.51 0.99 0.30 0.74 1.14 1.65 8.38 9.65 6.60 ---- 9.65 10.67 6.22 ---- 2.54 BSC 14.60 15.88 1.78 2.79 ---- 1.68 ---- 1.78 0.25 BSC 0 8 FFSB20120A-F085 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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