Datasheet Single-chip Type with Built-in FET Switching Regulator Series Step-up and inverted 2-channel DC/DC converter with Built-in Power MOSFET BD8317GWL Description The BD8317GWL is step-up and inverted 2-channel switching regulator with integrated internal high-side MOSFET. With wide input range from 2.5~5.5V ,it suitable for application of portable item. In addition,The small package design is ideal for miniaturizing the power supply. Features Wide input voltage range of 2.5V to 5.5 V High frequency operation 0.8MHz Incorporates Nch FET of 230m/22V and Pch Pow FET of 230m/15V Incorporates Soft Start (4.2msec(typ))and hight side switch of boost channel Independent ON/OFF signal(STB). Built-in discharge SW for step up channel Small package UCSP50L1( 1.8mmx1.5mm, 4x 3 grid, 11pin, WLCSP) Circuits protection OCP,SCP,UVLO,TSD STRUCTURE : Important Specifications Input voltage range 2.55.5 [V] Output boost voltage Input voltage(max)~18 [V] Output inverted voltage -9.0-1.0 [V] Maximum current 1.0A](max) Operating frequency 0.8 [MHz] (typ.) Nch FET ON resistance 230[m] Pch FET ON resistance 230[m] Standby current 1[A](max) Package UCSP50L1 (WLCSP) 1.8mmx1.5mmx0.5mm, 4x3glid,11pin, Application LCD battery CCD battery Portable items that are represented by mobile phone and DSC Silicon Monolithic Integrated Circuit Typical Application Input: 2.5 to 5.5V, ch1 output: -5.0 V /100mA(MAX), ch2 output:5.0 V /100mA(MAX) 0.1uF/10V 20k 100k Vout1: -5.0V/100mA 10uF/16V VREF Vin 2.55.5V 10uH NON1 LX1 VDD 10uF/10V DIS1 EN CH1 STB1 EN CH STB2 HS2L GND LX2 10uH INV2 Vout2: 5.0V/100mA 10uF/16V 160k 30k Figure 1. Application schematic www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 1/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Pin Description C B A 1 2 3 4 Figure 2. Pin assignment (Bottom view) Pin No. Pin Name Function A-1 VDD Power input voltage pin. Connect to input ceramic capacitor bigger than 0.47uF. A-2 HS2L Load SW output pin .Connect to inductor A-3 LX2 Boost channel drain Nch Power MOS. Connect to diode and inductor. A-4 GND Ground connection B-1 LX1 B-3 STB1 B-4 STB2 C-1 DIS1 C-2 VREF C-3 NON1 C-4 INV2 PchPowerMOS drain of boost channel. Connect to diode and inductor Enable pin of inverted channel. ON threshold set to 1.5V. Integrated pull down resistance (800k (typ)) Enable pin of boost channel. ON threshold set to 1.5V. Integrated pull down resistance (800k (typ)) Discharge SW of inverted channel. Connect to output of inverted channel. STB1 disable , Output pin voltage is discharged by 100 (typ) Reference voltage of inverted channel. 1.0V(typ) is included in error amp offset Feedback pin of inverted channel. Connect to feedback resistance and set output voltage. The method of output voltage setting is P16/20. When inverted cannel is disable , the pin is discharged by integrated resistance (150 (typ)) Feedback pin of boost channel. Connect to feedback resistance and set output voltage. The method of output voltage setting is P16/20. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 2/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Block Diagram UVLO VREF For Analog Voltage Reference SS1 Phase Compensation + NON1 PROTECT to Control TSD Vin = 2.55.5V 10uF OCP CH1 Inverting Timing Control (Current mode) SS1 SS2 VDD LX1 Vo1 DIS1 STB1 SS Vo1 OSC 0.8MHz Vo2 SS2 Phase Compensation INV2 SS2 High side switch CH2 Step up Timing Control (Current mode) + + + + - SCP Timer HS2L OCP LX2 Vo2 GND ON/OFF STB1 STB2 Figure 3. Block diagram www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 3/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Function blacks description 1.Voltage Reference This block generates ERROR AMP reference voltage. The reference voltage of CH1 is 1.0V, The reference voltage of CH2 is 0.8V. 2.UVLO Circuit for preventing malfunction at low voltage input. This circuit prevents malfunction at the start of DC/DC converter and low input voltage .The function monitors VCC pin voltage and if VCC voltage is lower than 2.2V, function turns off all output of FETs and DC/DC converter , and reset the timer latch of the internal SCP circuit and soft-start circuit. 3.SCP Short-circuit protection function based on timer latch system. When the voltage of NON1 pin is higher than 0V or INV2 pin voltage is lower than 0.8V, the internal SCP circuit starts counting. SCP circuit detects output of Error AMP. Since internal Error AMP has highly gain as high as 80dB or more, if input erroramp voltage cross reference voltage ,the output voltage of Error AMP goes high and detects SCP . The internal counter is in synch with OSC, the latch circuit activates after the counter counts oscillations to turn off DC/DC converter output (about 40.9 msec ). To reset the latch circuit, turn off the STB pin once. Then, turn it on again or turn on the power supply voltage again. 4.OSC This function determine oscillation frequency . Oscillation frequency of DC/DC converter set at 0.8MHz. 5.ERROR AMP Error amplifier watch output voltage and output PWM control signals. The internal reference voltage for Error AMP of ch1 is set at 0V. The internal reference voltage for Error AMP of ch2 is set at 0.8V. 6.Timing Control Voltage-pulse width converter for controlling output voltage corresponding to input voltage. Comparing the internal SLOPE waveform with the ERROR AMP output voltage, PWM COMP controls the pulse width and outputs to the driver. Max Duties of ch1 and ch2 are set at 86%. 7.SOFT START Circuit for preventing in-rush current at the start of DC/DC converter by bringing the output voltage. Soft-start time is in synch with the internal OSC, and the output voltage of the DC/DC converter reaches the set voltage after about 4.2m sec. 8.OCP Circuit for preventing malfunction at over current. Under input current over electrical characteristics , it supply minimum duty to DC/DC converter and IC stop safety by SCP detected. 9.TSD Circuit for preventing malfunction at high Temperature . When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150), it turns OFF all Output FET, and turns OFF DC/DC Comparator Output. 10. ON/OFF Voltage applied on STB pin to control ON/OFF channel of each channel. Turned ON when a voltage of 1.5 V or higher is applied and turned OFF when the terminal is open or 0 V is applied. Incorporates approximately 800 k pull-down resistance. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 4/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Absolute maximum ratings(T=25) Parameter Symbol Rating Unit VDD 0.37 V Maximum power supply voltage STB1,STB2 0.37 V IHS2L 1.0 A Maximum input current ILX1 1.0 A ILX2 1.0 A VDD-LX1 15 V LX2 22 V Maximum input voltage NON1 -0.37 V INV2 -0.37 V DIS1 -90.3 V Power dissipation Pd 730 mW Operating temperature range Topr 35+85 Storage temperature range Tstg 55+150 Junction temperature Tjmax +150 ((*1) When mounted on 74.2x74.2x1.6mm and operated over 25 Pd reduces by 4.96mW/. Recommended operating conditions Parameter Symbol Power supply voltage Inverted output voltage Step up output voltage VDD VO1 VO2 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 MIN 2.5 -9.0 VCC 5/20 Standard value TYP MAX 5.5 -1.0 18 Units V V V TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Electrical characteristicsTa=25, VDD=3.6V Parameter MIN Standard value TYP MAX 50 2.2 100 2.35 150 V mV 0.72 82 82 0.8 86 86 0.88 90 90 MHz % % VO1 -5.06 -5.00 -4.94 V DVLi VINV INON1 IINV2 TSS1 TSS2 0.792 -50 -50 3.7 3.7 4.0 0.800 0 0 4.2 4.2 12.5 0.808 50 50 4.7 4.7 mV V nA nA ms ms RON1p RDIS1 RNON1 RON2p RON2n Iocp1 Iocp2 IleakH1 I leak1 I leak2 1.2 1.2 -1 -1 -1 230 100 150 130 230 2.4 2.4 0 0 0 480 160 240 220 480 1 1 1 m m m A A uA uA uA VSTBH VSTBL RSTB1 1.5 -0.3 500 800 5.5 0.3 1400 V V k ISTB - - 1 uA Symbol Low voltage input malfunction preventing circuit Detect threshold voltage VUV Hysteresis voltage VUVhy Oscillator Oscillating frequency Fosc LX1 Max Duty Dmax1 LX2 Max Duty Dmax2 Error AMP, VREF CH1output voltage VREF line regulation INV threshold voltage NON1 input bias current INV2 input bias current CH1 Soft start time CH2 Soft start time Internal FET LX1 PMOS ON resistance DIS1discharge resistance NON1 discharge resistance LX2HighsideSW ON resistance LX2 NMOS ON resistance LX1 OCP threshold LX2 OCP threshold HS2L leak current LX1 leak current LX2 leak current STB Active STB pin Control voltage Non-active STB pin pull down resistance Circuit current Standby current Unit Conditions VDD sweep down NON1 feedback resistance 20k , 100k VDD=2.55.5V STB1=3.6V, NON1=-0.2V INV2=1.2V VSTB1=0V, IDIS1=-1mA VSTB1=0V, INON1=1mA STB1=STB2=3.6V NON1=-0.2V, INV2=1.2V This product is not designed for normal operation within a radioactive environment. Circuit current of operation VDD IDD www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 - 500 6/20 650 uA TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Reference data (unless otherwise specified Ta=25, VCC=3.6V) VCC=2.5V VCC=3.6V VCC=4.2V VCC=2.5V Figure 4. VREF vs temp VCC=3.6V VCC=4.2V Figure 5. INV2 threshold vs temp Reset threshold VCC=2.5V VCC=3.6V VCC=4.2V Detect threshold Figure 7. UVLO detect threshold Vs temp Figure 6. Oscillation frequency vs temp www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 7/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL VCC=2.5V VCC=3.6V VCC=2.5V VCC=4.2V 500 500 450 450 400 400 350 300 250 200 T=150 150 T=25 T=-60 100 350 300 200 T=25 150 T=-60 100 50 0 0 2 4 6 8 0 VCC[V] 2 4 6 8 VCC[V] Figure 10. LX1 high side FET ON registance vs VCC www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 T=150 250 50 0 VCC=4.2V Figure 9. STB OFF threshold voltage vs temp ON RESISTANCE[m] ON RESISTANCE[m] Figure 8. STB ON threshold voltage vs temp VCC=3.6V Figure 11. LX2 high side FET ON registance vs VCC 8/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL 300 500 450 250 ON RESISTANCE[] ON RESISTANCE[m] 400 350 300 250 T=150 200 T=25 150 T=-60 100 200 150 100 T=150 T=25 50 50 0 T=-60 0 0 2 4 6 8 0 VCC[V] 2 4 6 8 VCC[V] Figure 12. HS2L high side FET ON registance vs VCC Figure 13. DIS1 discharge SW ON registance vs VCC 300 VCC CURRENT [uA] ON RESISTANCE[] 250 200 150 100 T=150 T=25 50 T=-60 0 0 2 4 6 8 VCC[V] VCC[V] Figure 15. VCC input current vs VCC (STB ON) Figure 14. NON1 discharge SW ON registance vs VCC www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 9/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL VCC=4.2V VCC=3.6V VCC=2.5V Figure 16. VCC input current vs Temp (STB OFF) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 10/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Example of Application1 Input: 2.5 to 5.5 V, ch1 output: -5.0 V / 100m A(MAX), ch2 output:5.0V/100mA(MAX) 10F/16V 0.1F/10V 100k 160k 20k 30k 30V/200mA (RB521-S30) 10H (DFE252012C) 10H BD8317GWL CSP-SMT 10F/10V (DFE252012C) 30V/200mA (RB521-S30) 10F/16V Figure 17. Example of Application1 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 11/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Example of Board Layout ROHM SMD Evaluation Board Figure 18. Assembly Layer Figure 19. Bottom Layer www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 12/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Typical Performance Characteristic (Unless otherwise specified, Ta = 25C, VCC = 3.6V) (Example of application 1) Figure 20. CH1 Power conversion efficiency vs output current Figure 21. CH2 Power conversion efficiency vs output current Figure 22. CH1 Output voltage vs Output Current www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 Figure 23. CH2 Output voltage vs Output Current 13/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Figure 24. CH1 Output voltage vs Input voltage Figure 25. CH2 Output voltage vs Input voltage 5msec/div 5msec/div Vo1=100mV/div Vo2=100mV/div Io=100mA/div Io=100mA/div Figure 26. CH1 Output current response (output current : 10mA 100mA) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 Figure 27. CH2 Output current response (output current : 10mA 100mA) 14/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Figure 29. CH2 Soft start waveform Figure 28. CH1 Soft start waveform Figure 30. CH1 Discharge waveform [500usec/div] (STB1:High Low) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 15/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Selection of Parts for Applications (1)Output inductor A shielded inductor that satisfies the current rating (current value, Ipeak as shown in the drawing below) and has a low DCR (direct current resistance component) is recommended. Inductor values affect output ripple current greatly. Ripple current can be reduced as the inductor L value becomes larger and the switching frequency becomes higher as the equations shown below. IL I peak I peak Vin Vout V f Vin I out Vin (Vout V f ) 1 2 L f (Vin Vout V f ) I Vout 1 Vin (Vout Vin ) out Vin 2 L f Vout (Inverted channel) Fig.ure 31. Ripple current (Boost channel) : Efficiency(<0.92), f: Switching frequency(1.6MHz), L: inductance, The second terms of equations above are ripple current of the inductor(IL of Fig.32) which should be set at about 20 to 50% of the maximum output current. Current over the inductor rating flowing in the inductor brings the inductor into magnetic saturation, which may lead to lower efficiency or output bad oscillation. Select an inductor with an adequate margin so that the peak current does not exceed the rated current of the inductor. (2) Output capacitor CH1 The reference voltage of CH1 is 1.0V and the internal reference voltage of the ERROR AMP is 0 V. Output voltage should be obtained by referring to Equation (3) of Fig.33. VREF 1.0 V R1B ERROR AMP Vout NON1 R1A R1B (3) R1A VOUT Figure 32. CH1output setting CH2 The internal reference voltage of the ERROR AMP is 0.8 V. Output voltage should be obtained by referring to Equation (4) of Fig.34. VOUT R2A INV2 Vout R2B ( R 2 A R 2 B) 0.8 R2B (4) Inside reference voltage 0.8V Figure 33 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 CH2 output setting 16/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL (3) Output capacitor A ceramic capacitor with low ESR is recommended for output in order to reduce output ripple. There must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the DC bias property into consideration. Output ripple voltage when ceramic capacitor is used is obtained by the following equation. 1 Vpp=ILx ILxRESR [V] 2xfxCo Co is set within the range of 120uF. Setting must be performed so that output ripple is within the allowable ripple voltage. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 17/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL I/O Equivalence Circuit VREF NON1,INV2 VCC VCC VCC VREF VCC NON1,INV2 STB1,STB2 VCC,LX1,DIS1,GND VCC VCC LX1 STB1,STB2 GND DIS1 HS2L LX2 VCC VCC LX2 HS2L Figure 34. I/O Equivalence Circuit www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 18/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Operation Notes .) Absolute maximum ratings This product is produced with strict quality control. However, the IC may be destroyed if operated beyond its absolute maximum ratings. If the device is destroyed by exceeding the recommended maximum ratings, the failure mode will be difficult to determine. (E.g. short mode, open mode) Therefore, physical protection counter-measures (like fuse) should be implemented when operating conditions beyond the absolute maximum ratings anticipated. .) GND potential Make sure GND is connected at lowest potential. .) Setting of heat Make sure that power dissipation does not exceed maximum ratings. .) Pin short and mistake fitting Avoid placing the IC near hot part of the PCB. This may cause damage to IC. Also make sure that the output-to-output and output to GND condition will not happen because this may damage the IC. .) Actions in strong magnetic field Exposing the IC within a strong magnetic field area may cause malfunction. .) Mutual impedance Use short and wide wiring tracks for the main supply and ground to keep the mutual impedance as small as possible. Use induct or and capacitor network to keep the ripple voltage minimum. .) Thermal shutdown circuit (TSD circuit) The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. .)Rush current at the time of power supply injection. An IC which has plural power supplies, or CMOS IC could have momentaly rush current at the time of power supply injection. Because there exists inside logic uncertainty state. Please take care about power supply coupling capacity and width of power Supply and GND pattern wiring. .)IC Terminal Input This IC is a monolithic IC that has a P- board and P+ isolation for the purpose of keeping distance between elements. A P-N junction is formed between the P-layer and the N-layer of each element, and various types of parasitic elements are then formed. For example, an application where a resistor and a transistor are connected to a terminal (shown in Fig.36): When GND > (terminal A) at the resistor and GND > (terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. When GND > (terminal B) at the transistor (NPN), a parasitic NPN transistor operates as a result of the NHayers of other elements in the proximity of the aforementioned parasitic diode. Parasitic elements are structurally inevitable in the IC due to electric potential relationships. The operation of parasitic elements Induces the interference of circuit operations, causing malfunctions and possibly the destruction of the IC. Please be carefu l not to use the IC in a way that would cause parasitic elements to operate. For example, by applying a voltage that is lower than the GND (P-board) to the input terminal. E GND N P P N N P-board P P P N N Parasitic element P Parasitic element N P-board Parasitic element Terminal A C Transistor (NPN) B Resistor Terminal A Terminal B GND GND Figure 35. Simplified structure of a Bipolar IC www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 19/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 BD8317GWL Ordering part number B D 8 Part No. 3 1 7 G Part No. W L Package GWL: UCSP50L1 - E2 Packaging and forming specification E2: Embossed tape and reel External information 1 PIN MARK Lot No . 5 0 . 0 5 . 1 8317 1.8 0. 05 (BD8316GWL) (BD8317GWL) 5 0 .0 1 .0 X A M 5 5 .0 S 0.06 S 5 0 .0 5 3 .0 11- 0. 20 0. 05 0.05 A B A ( 0.15 )INDEX POST C B B A 1 0.3 0. 05 2 3 P= 0 . 4 x 3 4 2 x 4 . 0 = P (BD8317GWL) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TS2211114001 20/20 TSZ02201-0Q2Q0AJ00010-1-2 2012.09.5 Rev. 001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd8317gwl - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd8317gwl UCSP50L1 3000 3000 Taping inquiry Yes