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FEATURES
• LOW COST
• HIGH VOLTAGE - 100 VOLTS
• HIGH OUTPUT CURRENT- 50 AMP PULSE OUTPUT, 15
AMP CONTINUOUS
• 170 WATT DISSIPATION CAPABILITY
• 130 V/uS SLEW RATE
• 500kHz POWER BANDWIDTH
APPLICATIONS
• INKJET PRINTER HEAD DRIVE
• PIEZO TRANSDUCER DRIVE
• INDUSTRIAL INSTRUMENTATION
• REFLECTOMETERS
• ULTRA-SOUND TRANSDUCER DRIVE
DESCRIPTION
The MP111FD operational amplifier is a surface mount con-
structed component that provides a cost-effective solution in
many industrial applications. The MP111FD offers outstanding
performance that rivals much more expensive hybrid compo-
nents yet has a footprint of only 4 sq in. The MP111FD has
many optional features such as four-wire current limit sensing
and external compensation. The 500 kHz power bandwidth
and 15 amp continuous and 50A pulse output of the MP111FD
makes it a good choice for piezo transducer drive applications.
The MP111FD is built on a thermally conductive but electrically
insulating substrate that can be mounted to a heat sink.
EQUIVALENT CIRCUIT DIAGRAM
34-PIN DIP
PACKAGE STYLE FD
TYPICAL APPLICATION
INKJET NOZZLE DRIVE
The MP111FD's fast slew rate and wide power bandwith
make it an ideal nozzle driver for industrial inkjet printers. The
50 amp pulse output capability can drive hundreds of inkjet
nozzles simultaneously.
EXTERNAL CONNECTIONS
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
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ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
MP111FD
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
PARAMETER TEST CONDITIONS1 MIN TYP MAX UNITS
INPUT
OFFSET VOLTAGE 1 5 mV
OFFSET VOLTAGE vs. temperature Full temperature range 20 50 µV/°C
OFFSET VOLTAGE vs. supply 20 µV/V
BIAS CURRENT, initial3 100 pA
BIAS CURRENT vs. supply 0.1 pA/V
OFFSET CURRENT, initial 50 pA
INPUT RESISTANCE, DC 1011 Ω
INPUT CAPACITANCE 4 pF
COMMON MODE VOLTAGE RANGE +VB - 15 V
COMMON MODE VOLTAGE RANGE -VB + 15 V
COMMON MODE REJECTION, DC 92 dB
NOISE 1MHz bandwidth, 1kΩ RS 10 µV RMS
GAIN
OPEN LOOP @ 15Hz RL = 10KΩ, CC = 33pF 96 dB
GAIN BANDWIDTH PRODUCT @ 1MHz CC = 33pF 6 MHz
PHASE MARGIN Full temperature range 45 degrees
OUTPUT
VOLTAGE SWING IO = 15A +VS - 10 +VS - 8.4 V
VOLTAGE SWING IO = -15A -VS + 10 -VS + 5.8 V
VOLTAGE SWING IO = 15A, +VB = +VS +10V +VS - 0.8 V
VOLTAGE SWING IO = -15A, -VB = -VS -10V -VS + 1.0 V
CURRENT, continuous, DC 15 A
SLEW RATE, AV = -20 CC = 33pF 100 130 V/µS
SETTLING TIME, to 0.1% 2V Step 1 µS
RESISTANCE No load, DC 3 Ω
POWER BANDWIDTH 80VP-P CC = 33pF, +VS = 50V, -VS = -50V 500 kHz
POWER SUPPLY
VOLTAGE ±15 ±45 ±50 V
CURRENT, quiescent 142 157 mA
THERMAL
RESISTANCE, AC, junction to case5 Full temperature range, f ≥ 60Hz .65 °C/W
RESISTANCE, DC, junction to case Full temperature range, f < 60Hz .88 °C/W
RESISTANCE, junction to air Full temperature range 13 °C/W
TEMPERATURE RANGE, case -40 85 °C
SUPPLY VOLTAGE, +VS to -VS 100V
SUPPLY VOLTAGE, +VB +VS + 15V6
SUPPLY VOLTAGE, -VB -VS – 15V6
OUTPUT CURRENT, peak 50A, within SOA
POWER DISSIPATION, internal, DC 170W
INPUT VOLTAGE +VB to -VB
DIFFERENTIAL INPUT VOLTAGE ±25V
TEMPERATURE, pin solder, 10s 225°C.
TEMPERATURE, junction2 175°C.
TEMPERATURE RANGE, storage -40 to 105°C.
OPERATING TEMPERATURE, case -40 to 85°C.
NOTES: 1. Unless otherwise noted: TC=25°C, compensation CC=100pF, DC input specifications are value given, power supply voltage
is typical rating.
2. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to
achieve high MTBF.
3. Doubles for every 10°C of case temperature increase.
4. +VS and -VS denote the positive and negative supply voltages to the output stage. +VB and -VB denote the positive and negative
supply voltages to the input stages.
5. Rating applies if the output current alternates between both output transistors at a rate faster than 60Hz.
6. Power supply voltages +VB and -VB must not be less than +VS and -VS respectively.
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
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TYPICAL PERFORMANCE
GRAPHS MP111FD
Φ
Φ
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
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OPERATING
CONSIDERATIONS
MP111FD
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
MP111 REV B NOVEMBER 2004 © 2004 Apex Microtechnology Corp.
GENERAL
Please read Application Note 1 "General Operating Consid-
erations" which covers stability, power supplies, heat sinking,
mounting, current limit, SOA interpretation, and specification
interpretation. Visit www.apexmicrotech.com for design tools
that help automate tasks such as calculations for stability,
internal power dissipation, current limit, heat sink selection,
Apex's complete Application Notes library, Technical Seminar
Workbook and Evaluation Kits.
GROUND PINS
The MP111FD has two ground pins (pins 3, 32). These pins
provide a return for the internal capacitive bypassing of the small
signal portions of the MP111FD. The two ground pins are not
connected together on the substrate. Both of these pins are
required to be connected to the system signal ground.
SAFE OPERATING AREA
The MOSFET output stage of the MP111FD is not limited by
second breakdown considerations as in bipolar output stages.
Only thermal considerations and current handling capabilities
limit the SOA (see Safe Operating Area graph on previous page).
The output stage is protected against transient flyback by the
parasitic body diodes of the output stage MOSFET structure.
However, for protection against sustained high energy flyback
external fast-recovery diodes must be used.
COMPENSATION
The external compensation capacitor CC is connected
between pins 5 and 6. Unity gain stability can be achieved with
any capacitor value larger than 100pF for a minimum phase
margin of 45 degrees. At higher gains more phase shift can
usually be tolerated in most designs and the compensation
capacitor value can be reduced resulting in higher bandwidth
and slew rate. Use the typical operating curves as a guide to
select CC for the application. An NPO (COG) type capacitor
is required rated for the full supply voltage (100V).
OVERVOLTAGE PROTECTION
Although the MP111FD can withstand differential input
voltages up to ±25V, additional external protection is recom-
mended. In most applications 1N4148 signal diodes con-
nected anti-parallel across the input pins is sufficient. In more
demanding applications where bias current is important diode
connected JFETs such as 2N4416 will be required. See Q1
and Q2 in Figure 1. In either case the differential input voltage
will be clamped to ±0.7V. This is usually sufficient overdrive
to produce the maximum power bandwidth. Some applications
will also need over voltage protection devices connected to
the power supply rails. Unidirectional zener diode transient
suppressors are recommended. The zeners clamp transients
to voltages within the power supply rating and also clamp
power supply reversals to ground. Whether the zeners are
used or not the system power supply should be evaluated
for transient performance including power-on overshoot and
power-off polarity reversals as well as line regulation. See Z1
and Z2 in Figure 1.
POWER SUPPLY BYPASSING
Bypass capacitors to power supply terminals +VS and -VS
must be connected physically close to the pins to prevent local
parasitic oscillation in the output stage of the MP111FD. Use
electrolytic capacitors at least 10µF per output amp required.
Bypass the electrolytic capacitors with high quality ceramic
capacitors (X7R) 0.1µF or greater. In most applications power
supply terminals +Vb and -Vb will be connected to +VS and
-VS respectively. Supply voltages +Vb and -Vb are bypassed
internally but both ground pins 3 and 32 must be connected
to the system signal ground to be effective. In all cases power
to the buffer amplifier stage of the MP111FD at pins 8 and 25
must be connected to +Vb and
-Vb at pins 4 and 30 respectively. Provide local bypass
capacitors at pins 8 and 25. See the external connections
diagram on page 1.
CURRENT LIMIT
The two current limit sense lines are to be connected directly
across the current limit sense resistor. For the current limit to
work correctly pin 28 must be connected to the amplifier output
side and pin 27 connected to the load side of the current limit
resistor RLIM as shown in Figure 2. This connection will bypass
any parasitic resistances RP, formed by socket and solder joints
as well as internal amplifier losses. The current limiting resistor
may not be placed anywhere in the output circuit except where
shown in Figure 2. The value of the current limit resistor can
be calculated as follows: RLIM = .65/ILIMIT
BOOST OPERATION
With the boost feature the small signal stages of the amplifier
are operated at a higher supply voltages than the amplifier's
high current output stage. +Vb (pins 4,8) and -Vb (pins 25,30)
are connected to the small signal stages and +VS (pins 14-16)
and -VS (pins 17-19) are connected to the high current output
stage. An additional 10V on the +Vb and -Vb pins is sufficient
to allow the small signal stages to drive the output stage into
the triode region and improve the output voltage swing for extra
efficient operation when required. When the boost feature is
not needed +VS and -VS are connected to the +Vb and -Vb
pins respectively. The +Vb and -Vb pins must not be operated
at supply voltages less than +VS and -VS respectively.
BACKPLATE GROUNDING
The substrate of the MP111FD is an insulated metal sub-
strate. It is required that it be connected to signal ground.
Connect pin 2 (back plate) to signal ground. The back plate
will then be AC grounded to signal ground through a 1µF
capacitor.
FIGURE 1
OVERVOLTAGE PROTECTION
FIGURE 2
4 WIRE CURRENT LIMIT
