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LOPL-E011C
Datasheet of 1W Cyan Power LED
(Preliminary)
SPEC NO:
CREATED: Jan 01, 2006
REV. NO: 0.3
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1. Description
The LOPL (LiteOn Power LED) Emitter I is a 1W power LED package which is a point light source with more
energy efficient than incandescent and halogen lamps. It gives you total design freedom and unmatched
brightness, creating a new opportunities for solid state lighting to displace conventional lighting technologies.
Features
z High power LED light source
z Long life, up to 100k hours
z Instant light (less than 100 ns)
z Low voltage DC operated
z 110° Lambertian radiation pattern.
z Low thermal resistance
Applications
z Portable lights
z Traffic signaling
z Backlighting
z Interior & exterior automotive lighting
z Decorative and landscape lighting
z Medical illumination
2. Outline Dimensions
14.5±0.2
2.3
0.1±0.05
1.8
9.6±0.2
1.1±0.05
8±0.05
Thermal PAD
Lead
Body Lens
Cothode
1.5
Cothode
3.15
7.4±0.03
3°±0.5°
Notes
1. All dimensions are in millimeters.
2. Tolerance is ±0.2 mm (.008") unless otherwise noted.
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3. Rating and Characteristics
3.1 Absolute Maximum Ratings at Ta=25°C
Parameter Symbol Rating Unit
Power Dissipation Po 1.5 W
Forward Current IF 350 mA
Forward Pulse Current IFP 500 mA
Reverse Voltage VR 5 V
Junction Temperature Tj 125 °C
Thermal Resistance, Junction-Case Rth, J-C 15 °C/W
Operating Temperature Range Topr -40 - 80 °C
Storage Temperature Range Tstg -40 - 120 °C
Soldering Condition 1, 2 T
sol 260°C For 5 Seconds
Notes
1. Proper current derating must be observed to maintain junction temperature below the maximum.
For more information, consult the LOPL Emitters application notes, available upon request.
2. Measured at leads, during lead soldering and heat pad attach, body temperature must not exceed
120°C. LOPL Emitters can’t be soldered by general IR or Vapor phase reflow, nor by wave
soldering. Lead soldering is limited to selective heating of the leads, such as by hot bar reflow or
hand soldering.
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3.2 Electro-Optical Characteristics at Ta=25°C
Parameter Symbol MIN. TYP. MAX. Test Condition Unit
Forward Voltage VF 3.03 3.80 4.23 IF= 350mA V
Reverse Current IR 100 VR = 5V μA
Luminous Flux 1, 4 ΦV 23.5 32.0 IF = 350mA lm
Viewing Angle 2 2θ1/2 110 IF = 350mA °
Dominant Wavelength λD 490 505 520 IF = 350mA nm
Temperature Coefficient of λD TCλ 0.04 IF = 350mA, Topr nm/°C
Temperature Coefficient of VF TCV -2.0 IF = 350mA, Topr mV/°C
Optical Efficiency ηopt 24.0 IF = 350mA lm/W
Notes
1. Luminous flux is the total luminous flux output as measured with an integrating sphere.
2. Viewing angle is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
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3.3 Typical Electrical / Optical Characteristics Curves
0%
20%
40%
60%
80%
100%
400 450 500 550 600 650 700 750
Wavelength (nm)
Relative Intensity (%)
Fig 1. Relative Spectrum of Emission
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
Relative Intensity (%)
90° 60 30° 50 100%
60°
30°
Fig 2. Radiation Characteristics
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0
100
200
300
400
2.0 2.5 3.0 3.5 4.0 4.5
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
Fig 3. Forward Current
0
100
200
300
400
0 40 80 120
Ambient Temperature (°C)
Forward Current I
F
(mA)
R
th, J-C
=60°C/W
R
th, J-C
=50°C/W
R
th, J-C
=40°C/W
R
th, J-C
=30°C/W
Fig 4. Forward Current Derating Curve
0%
20%
40%
60%
80%
100%
0 100 200 300 400
Forward Current I
F
(mA)
Relative Luminous Flux
Fig 5. Relative Luminous Flux
504.5
505.0
505.5
506.0
506.5
507.0
507.5
508.0
0 100 200 300 400
Forward Current I
F
(mA)
Dominant Wavelength (nm)
Fig 6. Wavelength Shift
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4. Category Code Table
Q L C3
Peak Wavelength Categories
Code Min Max
C1 490 495
C2 495 500
C3 500 505
C4 505 510
C5 510 515
C6 515 520
Forward Voltage Categories
Code Min Max
H 3.03 3.27
J 3.27 3.51
K 3.51 3.75
L 3.75 3.99
M 3.99 4.23
Luminous Flux Categories
Code Min Max
P 18.1 23.5
Q 23.5 30.6
R 30.6 39.8
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5. Package Dimensions of Tape and Reel
4
12±0.1
Progressive direction
24±0.2
21.5
1.75±0.1
2
11.5
14.8±0.1
3.15
3.65±0.1
1.5
Note:The tolerances unless mentioned is ±0.1mm, Unit=mm
13±0.5
2.2±0.5
178±1.0
60±0.5
30.4Max
24.4+0.2
0
+0.1
0
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6. Reliability Test
Item Description Stress Condition Test Duration
HTOL High Temperature Operation
Life 85°C, Max. IF 1000 hours
RTOL Room Temperature Operation
Life 25°C, Max. IF 1000 hours
LTOL Low Temperature Operation
Life -40°C, Max. IF 1000 hours
WHTOL Wet High Temperature
Operation Life 85°C/60%RH, Max. IF 1000 hours
TC Temperature Cycling 40/110°C,
30min dwell, <5min trans. 200 cycles
TS Thermal Shock -40/110°C
20min dwell, <20sec trans. 200 cycles
HTSL High Temperature Storage
Life 110°C 1000 hours
LTSL Low Temperature Storage Life -40°C 1000 hours
SHR Solder Heat Resistance 260±5°C, 10secs
SLD Solderability Steam age for 16 hrs, then solder dip
at 245°C for 5secs
SA Salt Atmosphere 35°C 48 hours
MS Mechanical Shock 1500G, 0.5msec pulse,
5 shocks each 6 axis
ND Natural Drop On concrete from 1.2m, 3xtimes
RV Random Vibration 6G RMS from 10 to 2KHz,
10mins/axis
VVF Variable Vibration Frequency 10-2000-10Hz, 20G,
1 min, 1.5mm, 3timesx/axis
LS Lead Strength 1lb, 30 secs
LF Lead Fatigue 1lb, 3X45° bend
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7. Cautions
7.1 Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
7.2 Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
7.3 Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
LED
LED
Circuit model A Circuit model B
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
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7.4 ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:
z Use a conductive wrist band or anti-electrostatic glove when handling these LEDs.
z All devices, equipment, and machinery must be properly grounded.
z Work tables, storage racks, etc. should be properly grounded.
z Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low
forward voltage, or “no light up” at low currents. To verify for ESD damage, check for “light up” and VF
of the suspect LEDs at low currents. The VF of “good” LEDs should be >2.0V@0.1mA for InGaN
product.
7.5 Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel
strap or conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all
DLs?
5. All wrist strap or heel strap checkers calibration up to date?
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Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?