ASIC TGC4000 Family SGYV048A November 1998 Highlights: As the complexity of designs continue to increase, it is important to choose an ASIC technology that will meet all the design goals, not just the gate count. TGC4000 was especially developed to be one of the fastest 0.35 m ASIC technologies, and still provide a very low power solution. Technology Features: * * * * * * * * * * * * * 0.35 m CMOS Process 3.3-V Supply Voltage 5.0-V tolerant and 3.6-V Failsafe I/O Interface Options Quad Level Metallization 15 Arrays With up to 954,000 Available Gates (636,000 Usable) Low Power Consumption (0.4 W/MHz/Gate) Design Support for SynopsysTM, CadenceTM, and MentorTM Tools Support for Synopsys Primetime Static Timing Analysis Memory Compiler for Custom Memory Configurations Single Port RAMs Dual Port RAMs Two Port RAMs Three Port RAMs ROMs Metallized or Embedded Memories Available Full IEEE 1149.1 (JTAG) Support Clock Distribution Macros Clock Tree Synthesis TGC4000 Military CMOS Gate Arrays Base Array TGC4950 TGC4830 TGC4720 TGC4580 TGC4530 TGC4430 TGC4340 TGC4260 TGC4200 TGC4170 TGC4140 TGC4110 TGC4080 TGC4050 TGC4030 Available Gates 954,200 831,500 723,000 581,800 527,300 427,700 345,400 268,300 189,700 171,400 167,000 109,700 82,600 51,000 31,400 QLM Usable Gates 636,500 562,900 497,400 406,100 368,100 302,800 248,300 195,600 149,100 128,500 104,200 84,600 64,500 39,800 24,600 Bond Pads 528 496 464 416 396 356 320 284 244 228 204 184 160 128 100 Packages: * * * * All Standard Packages have Power and Ground Planes Reduces Noise Created by Simultaneous Switching Outputs Reduces Number of Power and Ground Pins Necessary High Performance Ceramic PGA, QFP, BGA Packages All Standard CQFP Packages Utilize Non-Conductive-Tie-Bars Maintains Lead Coplanarity Throughout Manufacturing, Testing, and Shipping Eliminates Need for Carriers Bare Die Production Processing: * * * * * MIL-PRF-38535 (QML) DSCC SMD # 5962-96B04 Military Temperature (Packaged) Industrial Temperature (Packaged) Military Temperature (Die) Industrial Temperture (Die) Contacts: * * * TI Military Homepage : http://www.ti.com/sc/docs/military TI Military ASIC Homepage : http://www.ti.com/sc/docs/military/product/asic/asic.htm Product Information Center (PIC) 972-644-5580 Cadence is a trademark of Cadence Design Systems, Inc. Mentor is a trademark of Mentor Graphics Corporation. Synopsys is a trademark of Synopsys Inc.