1
®HD-6409
CMOS Manchester Encoder-Decoder
The HD-6409 Manchester Encoder-Decoder (MED) is a high
speed, low power device ma nufactured using self-aligned
silicon gate technology. The device is intended for use in
serial data communication, and can be operated in either of
two modes. In the converter mode, the MED converts Non
return-to-Zero code (NRZ) into Manchester code and
decodes Manchester code into N onreturn-to-Zero code. For
serial data communication, Manchester code does not have
some of the deficiencies inherent in Nonreturn-to-Zero code.
For instance, use of the MED on a serial line eliminates DC
components, provides clock recovery, and gives a relatively
high degree of noise immunity. Because the MED converts
the most commonly used code (NRZ) to Ma nchester code,
the advantages of using Manchester code are easily realized
in a serial data link.
In the Repeater mode, the MED accepts Manchester code
input and reconstructs it with a recovered clock. This
minimizes the effects of noise on a serial data link. A digital
phase lock loop generates the recovered clock. A maximum
data rate of 1MHz requires only 50mW of power.
Manchester code is used in magnetic tape recording and in
fiber optic communication, and generally is used where data
accuracy is imperative. Because it frames blocks of data, the
HD-6409 easily interfaces to protocol controllers.
Features
Converter or Repeater Mode
Independent Manchester Encoder and Decoder
Operation
Static to One Megabit/sec Data Rate Guaranteed
Low Bit Error Rate
Digital PLL Clock Recovery
On Chip Oscillator
Low Operating Power: 50mW Typical at +5V
Pb-Free Available (RoHS Compliant)
Pinout
HD-6409
(20 LD PDIP, SOIC)
TOP VIEW
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
BZI
BOI
UDI
SD/CDS
SDO
SRST
DCLK
NVM
RST
GND
VCC
BZO
SS
ECLK
BOO
CTS
MS
OX
IX
CO
Ordering Information
PART NUMBER
(1 MEGABIT/SEC) PART MARKING TEMP. RANGE
(°C) PACKAGE PKG. DWG. #
HD3-6409-9 HD3-6409-9 -40 to +85 20 Ld PDIP E20.3
HD3-6409-9Z (Notes 2, 3) HD3-6409-9Z -40 to +85 20 Ld PDIP (Pb-free) E20.3
HD9P6409-9 HD9P6409-9 -40 to +85 20 Ld SOIC M20.3
HD9P6409-9Z (Notes 2, 3) HD9P6409-9Z -40 to +85 20 Ld SOIC (Pb-free) M20.3
HD9P6409-9Z96 (Notes 1, 2, 3) HD9P6409-9Z -40 to +85 20 Ld SOIC Tape & Reel
(Pb-free) M20.3
NOTES:
1. “96” suffix is for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets , molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
3. Pb-free PDIPs can be used for through hole wave solder processing only . They are not intended for use in Reflow solder processing applications.
FN2951.3Data Sheet October 15, 2008
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 1997, 2005, 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
2FN2951.3
October 15, 2008
Block Diagram
Logic Symbol
EDGE
DETECTOR
COMMAND
SYNC
GENERATOR
OUTPUT
SELECT
LOGIC
BOI
BZI
UDI
RST
SD/CDS
IX
OX
CO
SS
RESET
5-BIT SHIFT
REGISTER
AND DECODER
DATA
INPUT
LOGIC
INPUT/
OUTPUT
SELECT
OSCILLATOR COUNTER
CIRCUITS
MANCHESTER
ENCODER
SDO
NVM
BOO
BZO
CTS
SRST
MS
ECLK
DCLK
SD
CLOCK
GENERATOR
ENCODER
CONTROL
DECODER
SS
CO
SD/CDS
ECLK
MS
RST
SDO
DCLK
NVM
SRST
OX
IX
BOO
BZO
CTS
BOI
BZI
UDI
13
12
19
18
15
2
1
3
17
11
4
16
14
8
7
6
5
9
HD-6409HD-6409
3FN2951.3
October 15, 2008
Pin Descriptions
PIN
NUMBER TYPE SYMBOL NAME DESCRIPTION
1 I BZl Bipolar Zero Input Used in conjunction with pin 2, Bipolar One Input (BOl), to input Manchester II encoded
data to the decoder, BZI and BOl are logical complements. When using pin 3, Unipolar
Data Input (UDI) for data input, BZI must be held high.
2 I BOl Bipolar One Input Used in conjunction with pin 1, Bipolar Zero Input (BZI), to input Manchester II encoded
data to the decoder, BOI and BZI are logical complements. When using pin 3, Unipolar
Data Input (UDI) for data input, BOl must be held low.
3 I UDI Unipolar Data Input An alternate to bipolar input (BZl, BOl), Unipolar Data Input (UDl) is used to input
Manchester II encoded data to the decoder. When using pin 1 (BZl) and pin 2 (BOl) for
data input, UDI must be held low.
4 I/O SD/CDS Serial Data/Command
Data Sync In the converter mode, SD/CDS is an input used to receive serial NRZ data. NRZ data is
accepted synchronously on the falling edge of encoder clock output (ECLK). In the
repeater mode, SD/CDS is an output indicating the status of last valid sync pattern
received. A high indicates a command sync and a low indicates a data sync pattern.
5 O SDO Serial Data Out The decoded serial NRZ data is transmitted out synchronously with the decoder clock
(DCLK). SDO is forced low when RST is low.
6 O SRST Serial Reset In the converter mode, SRST follows RST. In the repeater mode, when RST goes low,
SRST goes low and remains low after RST goes high. SRST goes high only when RST
is high, the reset bit is zero, and a valid synchronization sequence is received.
7ONVM
Nonvalid Manchester A low on NVM indicates that the decoder has received invalid Manchester data and
present data on Serial Data Out (SDO) is invalid. A high indicates that the sync pulse and
data were valid and SDO is valid. NVM is set low by a low on RST, and remains low after
RST goes high until valid sync pulse followed by two valid Manchester bits is received.
8 O DCLK Decoder Clock The decoder clock is a 1X clock recovered from BZl and BOl, or UDI to synchronously
output received NRZ data (SDO).
9IRST
Reset In the converter mode, a low on RST forces SDO, DCLK, NVM, and SRST low. A high on
RST enables SDO and DCLK, and forces SRST high. NVM remains low after RST goes
high until a valid sync pulse followed by two Manchester bits is received, after which it
goes high. In the repeater mode, RST has the same effect on SDO, DCLK and NVM as
in the converter mode. When RST goes low, SRST goes low and remains low after RST
goes high. SRST goes high only when RST is high, the reset bit is zero and a valid
synchronization sequence is received.
10 I GND Ground Ground
11 O COClock Output Buffered output of clock input IX. May be used as clock signal for other peripherals.
12 I IXClock Input IX is the input for an external clock or, if the internal oscillator is used, IX and OX are used
for the connection of the crystal.
13 O OXClock Drive If the internal oscillator is used, OX and IX are used for the connection of the crystal.
14 I MS Mode Select MS must be held low for operation in the converter mode, and high for operation in the
repeater mode.
15 I CTS Clear to Send In the converter mode, a high d isables the e ncoder, fo rcing out puts BOO, BZO high and
ECLK low . A high to low transition of CTS initiates transmission of a Command sync pulse.
A low on CTS enables BOO, BZO, an d E CLK. In the repea ter m ode , th e fu nction o f CTS
is identical to that of the converter mod e with the exception that a transition o f CTS do es
not initiate a synchronization sequence.
16 O ECLK Encoder Clock In the converter mode, ECLK is a 1X clock output used to receive serial NRZ data to
SD/CDS. In the repeater mode, ECLK is a 2X clock which is recovered from BZl and BOl
data by the digital phase locked loop.
17 I SS Speed Select A logic high on SS sets the data rate at 1/32 times the clock frequency while a low sets
the data rate at 1/16 times the clock frequency.
18 O BZO Bipolar Zero Output BZO and its logical complement BOO are the Manchester data outputs of the encoder.
The inactive state for these outputs is in the high state.
19 O BOO Bipolar One Out See pin 18.
20 I VCC VCC VCC is the +5V power supply pin. A 0.1µF decoupling capacitor from VCC (pin 20) to GND
(pin 10) is recommended.
NOTE: (I) Input (O) Output
HD-6409HD-6409
4FN2951.3
October 15, 2008
Encoder Operation
The encoder uses free running clocks at 1X and 2X the data
rate derived from the system clock lX for internal timing. CTS
is used to control the encoder outputs, ECLK, BOO and
BZO. A free running 1X ECLK is transmitted out of the
encoder to drive the external circuits which supply the NRZ
data to the MED at pin SD/CDS.
A low on CTS enables encoder outputs ECLK, BOO and
BZO, while a high on CTS forces BZO, BOO high and holds
ECLK low. When CTS goes from high to low , a
synchronization sequence is transmitted out on BOO and
BZO. A synchronization sequence consists of eight
Manchester “0” bits followed by a command sync pulse.
A command sync pulse is a 3-bit wide pulse with the first 1
1/2 bits high followed by 1 1/2 bits low . Serial NRZ data is
clocked into the encoder at SD/CDS on the high to low
transition of ECLK during the command sync pulse. The
NRZ data received is encoded into Manchester II data and
transmitte d ou t on BOO and BZO following the command
sync pulse. Following the synchronization sequence,
input data is encoded and transmitted out continuously
without parity check or word framing. The length of the data
block encoded is defined by CTS. Manchester data out is
inverted.
Decoder Operation
The decoder requires a single clock with a frequency 16X or
32X the desired data rate. The rate is selected on the speed
select with SS low producing a 16X clock and high a 32 X
clock. For long data links the 32X mode should be used as
this permits a wider timing jitter margin. The internal
operation of the decoder utilizes a free running clock
synchronized with incoming data for its clocking.
The Manchester II encoded data can be presented to the
decoder in either of two ways. The Bipolar One and Bipolar
Zero inputs will accept data from differential inputs such as a
comparator sensed transformer coupled bus. The Unipolar
Data input can only accept noninverted Manchester II
encoded data i.e. Bipolar One Out through an inverter to
Unipolar Data Input. The decoder continuously monitors this
data input for valid sync pattern. Note that while the MED
encoder section can generate only a command sync pattern,
the decoder can recognize either a command or data sync
pattern. A data sync is a logically inverted command sync.
There is a three bit delay between UDI, BOl, or BZI input and
the decoded NRZ data transmitted out of SDO.
Control of the decoder outputs is provided by the RST pin.
When RST is low, SDO, DCLK and NVM are forced low.
When RST is high, SDO is transmitted out synchronously
with the recovered clock DCLK. The NVM output remains
low after a low to high transition on RST until a valid sync
pattern is received.
The decoded data at SDO is in NRZ format. DCLK is
provided so that the decoded bits can be shifted into an
external register on every high to low transition of this clock.
Three bit periods after an invalid Manchester bit is received
on UDI, or BOl, NVM goes low synchronously with the
questionable data output on SDO. FURTHER, THE
DECODER DOES NOT RE-ESTABLISH PROPER DATA
DECODING UNTIL ANOTHER SYNC PATTERN IS
RECOGNIZED.
1
234
CTS
ECLK
SD/CDS
BZO
BOO
tCE6
0000 0000
tCE5
SYNCHRONIZATION SEQUENCE
EIGHT “0’s” COMMAND
SYNC
DON’T CARE
‘1’ ‘0 ‘1’
‘1’ ‘0’ ‘1’
FIGURE 1. ENCODER OPERATION
1
2
3
4
HD-6409HD-6409
5FN2951.3
October 15, 2008
Repeater Operation
Manchester Il data can be presented to the repeater in either
of two ways. The inputs Bipolar One In and Bipolar Zero In
will accept data from differential inputs such as a comparator
or sensed transformer coupled bus. The input Unipolar Data
In accepts only noninverted Manchester II coded data. The
decoder requires a single clock with a frequency 16X or 32X
the desired data rate. This clock is selected to 16X w ith
Speed Select low and 32X with Speed Select high. For long
data links the 32X mode should be used as this permits a
wider timing ji tt er margin.
The inputs UDl, or BOl, BZl are delayed approximately 1/2
bit period and repeated as outputs BOO and BZO. The 2X
ECLK is transmitted out of the repeater synchronously with
BOO and BZO.
A low on CTS enables ECLK, BOO, and BZO. In contrast to
the converter mode, a transition on CTS does not initiate a
synchronization sequence of eight 0’s and a command sync.
The repeater mode does recognize a command or data sync
pulse. SD/CDS is an output which reflects the state of the
most recent sync pulse received, with high indicating a
command sync and low indicating a data sync.
When RST is low, the outputs SDO, DCLK, and NVM are
low , and SRST is set low . SRST remains low af ter RST goes
high and is not reset until a sync pulse and two valid
manchester bits are received with the reset bit low . The reset
bit is the first data bit after the sync pulse. With RST high,
NRZ Data is transmitted out of Serial Data Out
synchronously with the 1X DCLK.
FIGURE 2. DECODER OPERATION
DCLK
UDI
SDO
RST
NVM
COMMAND
SYNC 1001010101010
FIGURE 3. REPEATER OPERATION
INPUT
COUNT
ECLK
UDI
BZO
BOO
RST
SRST
SYNC PUL SE
1234567
HD-6409HD-6409
6FN2951.3
October 15, 2008
Manchester Code
Nonreturn-to-Zero (NRZ) code represents the binary values
logic-O and Iogic-1 with a static level maintained throughout
the data cell. In contrast, Manchester code represents data
with a level transition in the middle of the data cell.
Manchester has bandwidth, error detection, an d
synchronization advantages over NRZ code.
The Manchester II code Bipolar One and Bipolar Zero shown
below are logical complements. The direction of the
transition indicates the binary value of data. A logic-0 in
Bipolar One is defined as a Low to high transition in the
middle of the data cell, and a logic-1 as a high to low mid bit
transition, Manchester Il is also known as Biphase-L code.
The bandwid th of NRZ is from DC to the clock frequency fc/2,
while that of Manchester is from fc/2 to Thus, Manchester
can be AC or transformer coupled, which has considerable
advantages over D C couplin g. Also, the ratio of maximum to
minimum frequency of Manchester exten ds one oct ave, while
the ratio for NRZ is the range of 5 to 10 octave s. It is much
easier to design a narro w band than a wi deban d amp.
Secondly, the mid bit transition in each data cell provides the
code with an effective error detection scheme. If noise
produces a logic inversion in the data cell such that there is
no transition, an error indiction is given, and synchronization
must be re-established. This places relatively stringent
requirements on the incoming data.
The synchronization advantages of using the HD-6409 and
Manchester code are several fold. One is that Manchester is
a self clocking code. The clock in serial data communication
defines the position of each data cell. Non self clocking
codes, as NRZ, often require an extra clock wire or clock
track (in magnetic recording). Further, there can be a phase
variation between the clock and data track. Crosstalk
between the two may be a problem. In Manchester, the
serial data stream contains both the clock and the data, with
the position of the mid bit transition representing the clock,
and the direction of the transition representing data. There is
no phase variation between the clock and the data.
A second synchronization advantage is a result of the
number of transitions in the data. The decoder
resynchronizes on each transition, or at leas t once every
data cell. In contrast, receivers using NRZ, which does not
necessarily have transitions, must resynchronize on frame
bit transitions, which occur far less often, usually on a
character basis. This more frequent resynchronization
eliminates the cumulative effect of errors over successive
data cells. A final synchronization advantage concerns the
HD-6409’s sync pulse used to initiate synchronization. This
three bit wide pattern is sufficiently distinct from Manchester
data that a false start by the receiver is unlikely.
FIGURE 4. MANCHESTER CODE
BIT PERIOD
BINARY CODE
NONRETURN
TO ZERO
BIPOLAR ONE
BIPOLAR ZERO
123 45
011 00
Crystal Oscillator Mode
FIGURE 5. CRYSTAL OSCILLATOR MODE
LC Oscillator Mode
FIGURE 6. LC OSCILLATOR MODE
IX
OX
X1R1C0 16MHz
C1
C1
CO
C1 = 32pF
C0 = CRYSTAL + STRAY
X1 = AT CUT PARALLEL
RESONANCE
FUNDAMENTAL
MODE
RS (TYP) = 30Ω
R1 = 15MΩ
C1
C1
LCE
C1 2C0
2
--------------------------
fO
1
2πLCe
-----------------------
C1 = 20pF
C0 = 5pF
IX
OX
HD-6409HD-6409
7FN2951.3
October 15, 2008
Using the 6409 as a Manchester Encoded UART
VCC
BOO
BZO
SS
ECLK
CTS
MS
OX
IX
CO
BZI
BOI
UDI
SD/CDS
SDO
SRST
NVM
DCLK
RST
GND
BIPOLAR OUT
BIPOLAR OUT
CTS
LOAD
LOAD QHCKSI
‘165
LOAD QHCK
‘165
BQHA
‘164
BCKA
‘164
CK
DATA IN
‘273
DATA IN
‘273
CP
RESET
BIPOLAR IN
BIPOLAR IN
FIGURE 7. MANCHESTER ENCODER UART
PARALLEL DATA OUT
PARALLEL DATA IN
HD-6409HD-6409
8FN2951.3
October 15, 2008
Common Electrical Specifications Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified.
Temperature limits established by characterization and are not production tested.
Absolute Maximum Ratings Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input, Output or I/O Voltage. . . . . . . . . . . .GND -0.5V to VCC +0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Class 1
Operating Conditions
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Operating Voltage Range. . . . . . . . . . . . . . . . . . . . . .+4.5V to +5.5V
Input Rise and Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . 50ns Max
Sync. Transition Span (t2) . . . . . . . . . .1.5 DBP Typical, (Notes 1, 2)
Short Data Transition Span (t4) . . . . . . 0.5DBP Typical, (Notes 1, 2)
Long Data Transition Span (t5) . . . . . . 1.0DBP Typical, (Notes 1, 2)
Zero Crossing Tolerance (tCD5) . . . . . . . . . . . . . . . . . . . . . (Note 3)
Thermal Resistance (Typical, Note 4) θJA (°C/W) θJC (°C/W)
PDIP Package . . . . . . . . . . . . . . . . . . . 75 N/A
SOIC Package . . . . . . . . . . . . . . . . . . . 100 N/A
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Maximum Junction Temperature
Ceramic Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+175°C
Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .250 Gates
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. D BP-Data Bit Period, Clock Rate = 16X, one DBP = 16 Clock Cycles; Clock Rate = 32X, one DBP = 32 Clock Cycles.
2. The input conditions specified are nominal values, the actual input waveforms transition spans may vary by ±2 IX clock cycles (16X mode) or ±6
IX clock cycles (32X mode).
3. The maximum zero crossing tolerance is ±2 IX clock cycles (16X mode) or ±6 IX clock cycles (32 mode ) from the nominal.
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Electrical Specifications VCC = 5.0V ± 10%, TA = -40°C to +85°C (HD-6409-9).
SYMBOL PARAMETER TEST CONDITIONS
(Note 5) MIN MAX UNITS
VIH Logical “1” Input Voltage VCC = 4.5V 70% VCC -V
VIL Logical “0” Input Voltage VCC = 4.5V - 20% VCC V
VIHR Logic “1” Input Voltage (Reset)V
CC = 5.5V VCC -0.5 - V
VILR Logic “0” Input Voltage (Reset)V
CC = 4.5V - GND +0.5 V
VIHC Logical “1” Input Voltage (Clock) VCC = 5.5V VCC -0.5 - V
VILC Logical “0” Input Voltage (Clock) VCC = 4.5V - GND +0.5 V
IIInput Leakage Current (Except IX)V
IN = VCC or GND, VCC = 5.5V -1.0 +1.0 μA
IIInput Leakage Current (IX)V
IN = VCC or GND, VCC = 5.5V -20 +20 μA
IOI/O Leakage Current VOUT = VCC or GND, VCC = 5.5V -10 +10 μA
VOH Output HIGH Voltage (All Except OX)I
OH = -2.0mA, VCC = 4.5V (Note 6) VCC -0.4 - V
VOL Output LOW Voltage (All Except OX)I
OL = +2.0mA, VCC = 4.5V (Note 6) - 0.4 V
ICCSB Standby Power Supply Current VIN = VCC or GND, VCC = 5.5V,
Outputs Open - 100 μA
ICCOP Operating Power Supply Current f = 16.0MHz, VIN = VCC or GND
VCC = 5.5V, CL = 50pF - 18.0 mA
FTFunctional Test (Note 5) - - -
NOTES:
5. Tested as follows: f = 16MHz, VIH = 70% VCC, VIL = 20% VCC, VOH VCC/2, and VOL VCC/2, VCC = 4.5V and 5.5V.
6. Interchanging of force and sense conditions is permitted
HD-6409HD-6409
9FN2951.3
October 15, 2008
Capacitance TA = +25°C, Frequency = 1MHz.
SYMBOL PARAMETER TEST CONDITIONS TYP UNITS
CIN Input Capacitance All measurements are referenced to device GND 10 pF
COUT Output Capacitance 12 pF
AC Electrical Specifications V
CC = 5.0V ±10%, TA = -40°C to +85°C (HD-6409-9).
SYMBOL PARAMETER TEST CONDITIONS
(Note 7) MIN MAX UNITS
fCClock Frequency - - 16 MHz
tCClock Period - 1/fC-sec
t1Bipolar Pulse Width - tC+10 - ns
t3One-Zero Overlap - - tC-10 ns
tCH Clock High Time f = 16.0MHz 20 - ns
tCL Clock Low Time f = 16.0MHz 20 - ns
tCE1 Serial Data Setup Time - 120 - ns
tCE2 Serial Data Hold Time - 0 - ns
tCD2 DCLK to SDO, NVM - - 40 ns
tR2 ECLK to BZO - - 40 ns
trOutput Rise Time ( All except Clock) From 1.0V to 3.5V, CL = 50pF, Note 8 - 50 ns
tfOutput Fall Time (All except Clock) From 3.5V to 1.0V, CL = 50pF, Note 8 - 50 ns
trClock Output Rise Time From 1.0V to 3.5V, CL = 20pF, Note 8 - 11 ns
tfClock Output Fall Time From 3.5V to 1.0V, CL = 20pF, Note 8 - 11 ns
tCE3 ECLK to BZO, BOO Notes 8, 9 0.5 1.0 DBP
tCE4 CTS Low to BZO, BOO Enabled Notes 8, 9 0.5 1.5 DBP
tCE5 CTS Low to ECLK Enabled Notes 8, 9 10.5 11.5 DBP
tCE6 CTS High to ECLK Disabled Notes 8, 9 - 1.0 DBP
tCE7 CTS High to BZO, BOO Disabled Notes 8, 9 1.5 2.5 DBP
tCD1 UDI to SDO, NVM N o tes 8, 9 2.5 3.0 DBP
tCD3 RST Low to CDLK, SDO, NVM Low Notes 8, 9 0.5 1.5 DBP
tCD4 RST High to DCLK, Enabled Notes 8, 9 0.5 1.5 DBP
tR1 UDI to BZO, BOO Notes 8, 9 0.5 1.0 DBP
tR3 UDI to SDO, NVM Notes 8, 9 2.5 3.0 DBP
NOTES:
7. AC testing as follows: f = 4.0MHz, VIH = 70% VCC, VIL = 20% VCC, S peed Select = 16X, VOH VCC/2, VOL VCC/2, VCC = 4.5V and 5.5V.
Input rise and fall times driven at 1ns/V, Output load = 50pF.
8. Limits established by characterization and are not production tested.
9. DBP-Data Bit Period, Clock Rate = 16X, one DBP = 16 Clock Cycles; Clock Rate = 32X, one DBP = 32 Clock Cycles.
HD-6409HD-6409
10 FN2951.3
October 15, 2008
Timing Waveforms
FIGURE 8.
FIGURE 9. CLOCK TIMING FIGURE 10. OUTPUT WAVEFORM
DATA SYNC
BIT PERIOD BIT PERIOD BIT PERIOD
t2
COMMAND SYNC t2
t3t3
t2
t2
t4
ONEONE ZERO
T1
t1
t1
t3t3
t1
t1
t1
t3t3t3t3
t1
t4t5
t5
t2
t2
COMMAND SYNC
t2t2
t4t5t5t4t4
ZERO ONE ONEONE
DATA SYNC
BOI
BZI
BOI
BZI
BOI
BZI
UDI
UDI
UDI
t3
NOTE: UDI = 0, FOR NEXT DIAGRAMS
NOTE: BOI = 0, BZI = 1 FOR NEXT DIAGRAMS
tC
tCH
trtCL
tf
10% 90%
trtf
1.0V 3.5V
HD-6409HD-6409
11 FN2951.3
October 15, 2008
FIGURE 11. ENCODER TIMING
FIGURE 12. ENCODER TIMING FIGURE 13. ENCODER TIMING
NOTE: Manchester Data-In is not synchronous with Decoder Clock.
Decoder Clock is synchronous with decoded NRZ out of SDO.
FIGURE 14. DECODER TIMING
FIGURE 15. DECODER TIMING FIGURE 16. DECODER TIMING
Timing Waveforms (Continued)
ECLK
SD/CDS
BZO
BOO
tCE1
tCE2
tCE3
tCE5
tCE4
CTS
BZO
BOO
ECLK
tCE6
CTS
BZO
BOO
ECLK
tCE7
DCLK
UDI
SDO
NVM
MANCHESTER
LOGIC-1 MANCHESTER
LOGIC-0 MANCHESTER
LOGIC-0 MANCHESTER
LOGIC-1
tCD2
tCD5
tCD2
tCD1
NRZ
LOGIC-1
RST
DCLK, SDO,
NVM
50%
50%
tCD3
RST
DCLK
50%
tCD4
HD-6409HD-6409
12 FN2951.3
October 15, 2008
Test Load Circuit
FIGURE 17. REPEATER TIMING
Timing Waveforms (Continued)
UDI
ECLK
BZO
SDO
NVM
MANCHESTER ‘1’
tR2
tR3
tR3
tR2
tR1
MANCHESTER ‘0’ MANCHESTER ‘0’ MANCHESTER ‘1’
MANCHESTER ‘1’ MANCHESTER ‘0’ MANCHESTER ‘0’
FIGURE 18. TEST LOAD CIRCUIT
DUT
CL
(NOTE)
NOTE: INCLUDES STRAY AND JIG
CAPACITANCE
HD-6409HD-6409
13 FN2951.3
October 15, 2008
HD-6409
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpen-
dicular to datum .
7. eB and eC are measured at the lead tips with the leads uncon-
strained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dam-
bar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
E20.3 (JEDEC MS-001-AD ISSUE D)
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.55 1.77 8
C 0.008 0.014 0.204 0.355 -
D 0.980 1.060 24.89 26.9 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N20 209
Rev. 0 12/93
14
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result
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For information regarding Intersil Corporation and its products, see www.intersil.com
FN2951.3
October 15, 2008
HD-6409
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. T e rminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C A
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H0.25(0.010) B
MM
α
M20.3 (JEDEC MS-013-AC ISSUE C)
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.014 0.019 0.35 0.49 9
C 0.0091 0.0125 0.23 0.32 -
D 0.4961 0.5118 12.60 13.00 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N20 207
α -
Rev. 2 6/05