POLYSWITCH(R) Resettable PTCs Surface Mount > LoRho Series LoRho SMD PTC for Charging Cable Protection Description The Littelfuse LoRho SMD PTC for Charging Cables provides protection from heat generated due to faults within the connector such as USB-C, microUSB, and many others. As connectors get smaller, their pin-to-pin spacings are shrinking which increases the opportunity for debris such as dust, dirt, or water to collect causing a fault. These faults can generate a tremendous amount of heat which will damage charging cables, the devices they charge, or people using them. Agency Approvals AGENCY AGENCY FILE NUMBER AMPERE RANGE E74889 4.5A Pending Pending Applications * Over temperature (OT) protection for USB connectors and cables including: * Fast charging standards and protocols including: Features * SMD compatible with reflow soldering process * Ultra low internal resistance * Available in small 1206 and 1210 sizes * Reset automatically * Halogen-free, lead-free and RoHS compliant * Up to 12Vdc and 4.5A Ihold - USB Power Delivery (PD) - USB Type-C - Qualcomm Quick Charge (QC) - USB Micro-B - USB-A - Mediatek Pump Express (PE) - Samsung Adaptive Fast Charging (AFC) - Huawei/HiSilicon Fast Charging Protocol (FCP) These charging protocols are the property of their respective owners. Electrical Characteristics Part Number nanoSMD350LR-C nanoSMD400LR-C microSMD450LR-C Marking P S S Ihold 1 (A) Vmax 2 (Vdc) 3.50 4.00 4.50 12 12 12 Thermal Cut Off (TCO) - C @ 2A Min Max Min Max 65 70 90 85 100 110 50 65 80 75 90 100 Notes: 1. Ihold = Hold current: maximum current device will pass without tripping in 20C still air 2. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 3. Pd = Power dissipated from device when in the tripped state at 20C still air 4. Rmin = Minimum resistance of device in initial (un-soldered) state 5. R1max = Maximum resistance of device at 20C measured one hour after tripping or reflow Soldering of 260C for 20 seconds (Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces) Caution: Operation beyond the specified rating may result in damage and possible arcing and flame (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/16/17 Thermal Cut Off (TCO) - C @ 3A Pd3 typ. (W) 1.0 1.0 1.0 Resistance Rmin 4 () R1max 5 () 0.004 0.004 0.002 0.018 0.010 0.0085 Agency Approvals --X --X TCO and Pd Testing Method: Thermal Cut-Off Test- 1. Put the device into the thermostatic chamber controlled at room temperature or 25C. 2. Apply the specified current to the device, and increase the chamber temperature at the rate of 2C per minute. 3. Measure the device ambient temperature when the applied current has reduced to less than 20% of initial value. Power Dissipation- 1. Conduct thermal cut-off test at rated current/voltage. 2. After device trip, decrease the chamber temperature with keeping trip state. 3. Measure the tripped-state power dissipation when the device ambient temperature has reduced to 30C or less. POLYSWITCH(R) Resettable PTCs Surface Mount > LoRho Series Temperature Rerating Ambient Operating Temperature -20C 0C Part Number 20C 60C 85C 1.30 Hold Current (A) nanoSMD350LR-C 4.80 4.00 3.50 1.90 nanoSMD400LR-C 5.20 4.60 4.00 2.82 2.10 microSMD450LR-C 6.20 5.50 4.50 3.30 2.30 Note: The temperature rerating data is for reference only. Please contact Littelfuse technical support for detail temperature rerating information. Temperature Derating Curve Environmental Specifications Operating Temperature -20C to +85C Maximum Device Surface Temperature in Tripped State 125C Passive Aging +85C, 1000 hours -/+10% typical resistance change Humidity Aging +85C, 85% R.H.,100 hours -/+15% typical resistance change MIL-STD-202, Method 215 No change Thermal Shock Vibration MIL-STD-883, Method 2007, Condition A No change Moisture Sensitivity Level Level 2a, J-STD-020 Physical Specifications Terminal Materials Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/JSTD-002, Category 3 (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/16/17 POLYSWITCH(R) Resettable PTCs Surface Mount > LoRho Series Soldering Parameters Pb - Free assembly Pre Heat - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 120 seconds Ramp-up TL Average ramp up rate (Liquidus Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow tP TP - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds tL TS(max) Temperature Profile Feature Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 260C Time within 5C of actual peak Temperature (tp) 30 seconds max Ramp-down Rate 2C/second max Time 25C to peak Temperature (TP) 8 minutes max time to peak temperature Time Notes: * All temperature refer to topside of the package, measured on the package body surface. * If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements. * Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead. * Recommended maximum paste thickness is 0.25 mm (0.010 inch). * Devices can be cleaned using standard industry methods and solvents. * Devices can be reworked using the standard industry practices. Dimensions nanoSMD350LR-C nanoSMD400LR-C C B Solder Pad Layout E P B S A microSMD450LR-C A C G F D D H F Marking code varies by device. See Electrical Characteristics table. Device Dimension Part Number A inch B mm inch Solder Pad C mm inch D mm inch E mm F inch mm Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max G H inch mm inch mm inch mm nanoSMD350LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.60 0.80 0.05 0.07 1.37 1.85 0.01 0.03 0.25 0.75 -- -- -- -- 0.04 1.10 0.08 2.00 0.07 1.75 nanoSMD400LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.60 0.80 0.05 0.07 1.37 1.85 0.01 0.03 0.25 0.75 -- -- -- -- 0.04 1.10 0.08 2.00 0.07 1.75 microSMD450LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.60 0.80 0.09 0.11 2.35 2.80 0.01 0.03 0.25 0.75 0.003 -- 0.076 -- 0.04 1.00 0.08 2.00 0.10 2.65 (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/16/17 POLYSWITCH(R) Resettable PTCs Surface Mount > LoRho Series Packaging Part Number Ordering IHOLD (A) IHOLD Code RF4610-000 3.50 350 nanoSMD400LR-C RF4611-000 4.00 400 microSMD450LR-C RF2515-000 4.50 450 nanoSMD350LR-C Packaging Option Quantity 15,000 Tape and Reel 15,000 15,000 Part Numbering System nano SMD 350 LR -C -2 SIZE SURFACE MOUNT DEVICE IHOLD CURRENT CODE LoRho FOR CHARGING CABLE APPLICATION TAPE/REEL Installation and Handling Guidelines * Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire. * These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such conditions are expected to be repetitive or prolonged in duration. * Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices. * These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses. * Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device. * Hand-soldering of PTC devices on boards is generally not recommended. Users shall define and verify this process if needed. * Consult Littelfuse when the device is to be applied with thermal processes other than reflow process on the circuit board, such as molding, encapsulation. User should evaluate molding materials used in the charging cable applications to ensure there are no adverse effect on the PTC devices. (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/16/17 POLYSWITCH(R) Resettable PTCs Surface Mount > LoRho Series Tape and Reel Specifications P0 T Embossment P2 D0 E1 Cover Tape A0 B1 F W E2 K0 B0 T1 P1 Center lines of Cavity W2 (Measured at Hub) Cover Tape A N (hub dia.) W1 (Measured at Hub) Carrier Tape Embossed Cavity Standard Pack Quantity: 3,000 pcs Minimum Order Quantity: 15,000 pcs (c) 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/16/17 nanoSMD350LR-C nanoSMD400LR-C microSMD450LR-C W 8.0 0.30 8.0 0.30 P0 4.0 0.10 4.0 0.10 P1 4.0 0.10 4.0 0.10 P2 2.0 0.05 2.0 0.05 A0 1.95 0.10 2.9 0.10 B0 3.50 + 0.1/-0.08 3.55 0.10 B1 max. 4.35 4.35 D0 1.55 0.05 1.55 0.05 F 3.50 0.05 3.50 0.05 E1 1.75 0.10 1.75 0.10 E2 min. 6.25 6.25 T max. 0.3 0.3 T1 max. 0.1 0.1 K0 0.89 0.10 1.27 0.10 A max. 179 179 N min. 53.5 53.5 W1 9.5 0.5 9.5 0.5 W2 max. 15 15