ADT7481ARMZ1RL - ON SEMICONDUCTOR

October, 2014 − Rev. 2 1Publication Order Number:

7WBD383/D

7WBD383

Translating Bus Exchange

Switch

The 7WBD383 is an advanced high−speed low−power translating

bus exchange switch in ultra−small footprints.

Features

•High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V

•3 W Switch Connection Between 2 Ports

•Power Down Protection Provided on Inputs

•Zero Bounce

•TTL−Compatible Control Inputs

•Ultra−Small Pb−Free Packages

•These are Pb−Free Devices

This document contains information on some products that are still under development.

ON Semiconductor reserves the right to change or discontinue these products without

notice.

http://onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

UDFN8

MU SUFFIX

CASE 517AJ

8ALM

18AJ M*G

UQFN8

MU SUFFIX

CASE 523AN

US8

US SUFFIX

CASE 493

AG M*G

(Note: Microdot may be in either location)

A = Assembly Location

Y = Year

W = Work Week

M = Date Code

G= Pb−Free Package

*Date Code orientation may vary depending

upon manufacturing location.

UDFN8

1.95 x 1.0

CASE 517CA X M

D383

AYWG

Micro8]

DM SUFFIX

CASE 846A

7WBD383

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OE 1V

GND

Figure 1. UDFN8

(Top Thru−View)

Figure 2. UQFN8

(Top Thru−View)

123

765

CDEX

VCC GND

Figure 3. US8/Micro8

(Top View)

GND

VCC

Figure 4. Logic Diagram

FUNCTION TABLE

Input OE Input EX Function

L L A = C; B = D

L H A = D; B = C

H X Disconnect

7WBD383

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage −0.5 to +7.0 V

VIN Control Pin Input Voltage −0.5 to +7.0 V

VI/O Switch Input / Output Voltage −0.5 to +7.0 V

IIK Control Pin DC Input Diode Current VIN < GND −50 mA

IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA

IOON−State Switch Current $128 mA

Continuous Current Through VCC or GND $150 mA

ICC DC Supply Current Per Supply Pin $150 mA

IGND DC Ground Current per Ground Pin $150 mA

TSTG Storage Temperature Range −65 to +150 °C

TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C

TJJunction Temperature Under Bias 150 °C

qJA Thermal Resistance US8 (Note 1)

UDFN8

UQFN8

Micro8

251

111

208

392

°C/W

PDPower Dissipation in Still Air at 85°C US8

UDFN8

UQFN8

Micro8

498

1127

601

319

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

VESD ESD Withstand Voltage Human Body Mode (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

> 200

N/A

ILATCHUP Latchup Performance Above VCC and Below GND at 125 °C (Note 5) $200 mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.

2. Tested to EIA / JESD22−A114−A.

3. Tested to EIA / JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA / JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC Positive DC Supply Voltage 4.0 5.5 V

VIN Control Pin Input Voltage 0 5.5 V

VI/O Switch Input / Output Voltage 0 5.5 V

TAOperating Free−Air Temperature −55 +125 °C

Dt/DVInput Transition Rise or Fall Rate Control Input

Switch I/O 0

DC nS/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

7WBD383

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DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Conditions VCC

(V)

TA = 255CTA =

−555C to +1255C

Unit

Min Typ Max Min Max

VIK Clamp Diode Voltage II/O = −18 mA 4.5 −1.2 −1.2 V

VIH High−Level Input Voltage

(Control) 4.0 to

5.5 2.0 2.0 V

VIL Low−Level Input Voltage

(Control) 4.0 to

5.5 0.8 0.8 V

VOH Output Voltage High See Figure 5

IIN Input Leakage Current 0 v VIN v 5.5 V 5.5 ±0.1 ±1.0 mA

IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0±0.1 ±1.0 mA

ICC Quiescent Supply Current IO = 0,

VIN = VCC or 0 V

OE = GND

OE = VCC

5.5

±1.0

±0.1 ±1.0

±1.0 mA

DICC Increase in Supply Current

(Control Pin) One input at 3.4 V;

Other inputs at VCC

or GND

5.5 2.5 mA

RON Switch ON Resistance VI/O = 0,

II/O = 64 mA

II/O = 30 mA

4.5 3

VI/O = 2.4,

II/O = 15 mA 15 50 50

VI/O = 2.4,

II/O = 15 mA 4.0 50 70 70

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

AC ELECTRICAL CHARACTERISTICS

Symbol Parameter Test Condition VCC

(V)

TA = 25 5CTA =

−555C to +1255C

Unit

Min Typ Max Min Max

tPD Propagation Delay, Bus to Bus See Figure 6 4.0 to

5.5 0.25 0.25 ns

tPD−EX Propagation Delay, EX to Bus See Figure 6 and

Figure 7 4.0 to

5.5 4.5 4.5 ns

tEN Output Enable Time See Figure 6 4.5 to

5.5 0.8 2.5 4.2 0.8 4.2 ns

4.0 0.8 3.0 4.6 0.8 4.6

tDIS Output Disable Time 4.5 to

5.5 0.8 3.0 4.8 0.8 4.8 ns

4.0 0.8 2.9 4.4 0.8 4.4

CIN Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF

CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF

CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF

7WBD383

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TYPICAL DC CHARACTERISTICS

Figure 5. Output Voltage High vs Supply Voltage

VCC, SUPPLY VOLTAGE (V)

VOH, HIGH LEVEL OUTPUT VOLT-

AGE (V)

3.75

3.50

3.25

3.00

2.75

2.50

2.25

2.004.50 4.75 5.00 5.25 5.50 5.75

IOH =

−0.1 mA

−6 mA

−12 mA

−24 mA

VCC, SUPPLY VOLTAGE (V)

VOH, HIGH LEVEL OUTPUT VOLT-

AGE (V)

3.75

3.50

3.25

3.00

2.75

2.50

2.25

2.004.50 4.75 5.00 5.25 5.50 5.75

IOH =

−0.1 mA

−6 mA

−12 mA

−24 mA

VCC, SUPPLY VOLTAGE (V)

VOH, HIGH LEVEL OUTPUT VOLT-

AGE (V)

3.75

3.50

3.25

3.00

2.75

2.50

2.25

2.004.50 4.75 5.00 5.25 5.50 5.75

IOH =

−0.1 mA

−6 mA

−12 mA

−24 mA

TA = +85°C

VIN = VCC

TA = +25°C

VIN = VCC

TA = −40°C

VIN = VCC

7WBD383

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AC LOADING AND WAVEFORMS

CL = 50 pF*

From Output

Under Test

GND

Open

7 V

500 WS1

*CL includes probes and jig capacitance.

500 W

Test S1

tPD Open

tPLZ/tPZL 7 V

tPHZ/tPZH Open

Voltage Waveforms

Propagation Delay Times Voltage Waveforms

Enable and Disable Times

3.5 V

Output

Control 3 V

0 V

1.5 V1.5 V

1.5 V

tPZH tPHZVOL

VOH

0 V

Output

Waveform 1

S1 at 7 V

(Note 6)

Waveform 2

S1 at Open

(Note 6)

VOL + 0.3 V

VOH − 0.3 V

6. Waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control

7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns.

8. The outputs are measured one at a time, with one transition per measurement.

9. tPLZ and tPHZ are the same as tDIS.

10.tPZL and tPZH are the same as tEN.

11. tPHL and tPLH are the same as tPD.

Figure 6. tPD, tEN, tDIS Loading and Waveforms

1.5 V 1.5 V

Input

Output

VOH

VOL

tPHL

tPLH

3 V

0 V tPZL tPLZ

Figure 7. tPD−EX Waveforms

Exchange

(EX)

3 V

Output

(A, B, C, D)

Output

(A, B, C, D)

GND

1.5 V

tPHL

tPLH

1.5 V

tPLH

tPHL

90%

1.5 V 10%

VOH

VOL

tr 2.5 ns tf 2.5 ns

7WBD383

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ORDERING INFORMATION

Device Package Shipping†

7WBD383USG US8

(Pb−Free) 3000 / Tape & Reel

7WBD383MUTAG UDFN8

(Pb−Free) 3000 / Tape & Reel

7WBD383AMUTCG UQFN8

(Pb−Free) 3000 / Tape & Reel

7WBD383DMR2G Micro8

(Pb−Free) 4000 / Tape & Reel

(In Development)

7WBD383DMUTCG UDFN8, 1.95 x 1.0, 0.5 mm Pitch

(Pb−Free) 3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

7WBD383

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PACKAGE DIMENSIONS

UDFN8 1.8 x 1.2, 0.4P

CASE 517AJ

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 mm FROM TERMINAL TIP.

4. MOLD FLASH ALLOWED ON TERMINALS

ALONG EDGE OF PACKAGE. FLASH MAY

NOT EXCEED 0.03 ONTO BOTTOM

SURFACE OF TERMINALS.

5. DETAIL A SHOWS OPTIONAL

CONSTRUCTION FOR TERMINALS.

ÉÉ

A B

BOTTOM VIEW

BAC

CNOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

(A3)

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

A3 0.127 REF

b0.15 0.25

D1.80 BSC

E1.20 BSC

e0.40 BSC

L0.45 0.55

e/2

b2 0.30 REF

L1 0.00 0.03

L2 0.40 REF

DET AIL A

(L2)

(b2)

NOTE 5

DETAIL A

0.10

0.05

0.22

0.32

1.50

0.40 PITCH

0.66

DIMENSIONS: MILLIMETERS

MOUNTING FOOTPRINT*

SOLDERMASK DEFINED

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

7WBD383

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PACKAGE DIMENSIONS

UDFN8 1.95x1.0, 0.5P

CASE 517CA

ISSUE O

ÉÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

A3 0.13 REF

b0.15 0.25

D1.95 BSC

E1.00 BSC

e0.50 BSC

L0.25 0.35

L1 0.30 0.40

A B

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

CSEATING

PLANE

SIDE VIEW

BOTTOM VIEW

L7X

e/2

DIMENSIONS: MILLIMETERS

0.30

0.49 8X

1.24

0.54 PITCH

0.50

PKG

OUTLINE

0.10 B

0.05

CNOTE 3

7WBD383

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PACKAGE DIMENSIONS

ÉÉ

UQFN8, 1.6x1.6, 0.5P

CASE 523AN

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

BOTTOM VIEW

0.10 B

0.05

CNOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

(A3)

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.45 0.60

A1 0.00 0.05

A3 0.13 REF

b0.15 0.25

D1.60 BSC

L1 −−− 0.15

E1.60 BSC

e0.50 BSC

L0.35 0.45

DETAIL A

ÇÇ

ÉÉ

DETAIL B

OPTIONAL

MOLD CMPD

EXPOSED Cu

CONSTRUCTION

OPTIONAL

CONSTRUCTION

DETAIL B

DET AIL A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

PITCH

0.35

DIMENSIONS: MILLIMETERS

0.25

1.70

0.50

L3 0.25 0.35

(0.10) (0.15)

0.53

7WBD383

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PACKAGE DIMENSIONS

US8

CASE 493

ISSUE B

DIM

AMIN MAX MIN MAX

INCHES

1.90 2.10 0.075 0.083

MILLIMETERS

B2.20 2.40 0.087 0.094

C0.60 0.90 0.024 0.035

D0.17 0.25 0.007 0.010

F0.20 0.35 0.008 0.014

G0.50 BSC 0.020 BSC

H0.40 REF 0.016 REF

J0.10 0.18 0.004 0.007

K0.00 0.10 0.000 0.004

L3.00 3.20 0.118 0.126

M0 6 0 6

N5 10 5 10

P0.23 0.34 0.010 0.013

R0.23 0.33 0.009 0.013

S0.37 0.47 0.015 0.019

U0.60 0.80 0.024 0.031

V0.12 BSC 0.005 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR.

MOLD FLASH. PROTRUSION AND GATE

BURR SHALL NOT EXCEED 0.140 MM

(0.0055”) PER SIDE.

4. DIMENSION “B” DOES NOT INCLUDE

INTER−LEAD FLASH OR PROTRUSION.

INTER−LEAD FLASH AND PROTRUSION

SHALL NOT E3XCEED 0.140 (0.0055”) PER

SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203 MM.

(300−800 “).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED ±0.0508 (0.0002 “).

SEATING

DETAIL E

NR 0.10 TYP

−Y−

−X−

−T−

DETAIL E

0.10 (0.004) XY

T0.10 (0.004)

____

PLANE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

ǒmm

inchesǓ

SCALE 8:1

3.8

0.15

0.50

0.0197

1.0

0.0394

0.30

0.012

1.8

0.07

7WBD383

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PACKAGE DIMENSIONS

Micro8t

CASE 846A

ISSUE H

0.08 (0.003) A S

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED

0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.

PIN 1 ID

8 PL

0.038 (0.0015)

−T− SEATING

PLANE

A1 cL

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8X 8X

6X ǒmm

inchesǓ

SCALE 8:1

1.04

0.041 0.38

0.015

5.28

0.208

4.24

0.167

3.20

0.126

0.65

0.0256

DIM

AMIN NOM MAX MIN

MILLIMETERS

−− −− 1.10 −−

INCHES

A1 0.05 0.08 0.15 0.002

b0.25 0.33 0.40 0.010

c0.13 0.18 0.23 0.005

D2.90 3.00 3.10 0.114

E2.90 3.00 3.10 0.114

e0.65 BSC

L0.40 0.55 0.70 0.016

−− 0.043

0.003 0.006

0.013 0.016

0.007 0.009

0.118 0.122

0.026 BSC

0.021 0.028

NOM MAX

4.75 4.90 5.05 0.187 0.193 0.199

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, af filiates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

7WBD383/D

Micro8 is a trademark of International Rectifier.

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative