LM4889
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LM4889 1 Watt Audio Power Amplifier
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1FEATURES DESCRIPTION
The LM4889 is an audio power amplifier primarily
23• Available in Space-Saving VSSOP, SOIC, designed for demanding applications in mobile
WSON, and DSBGA Packages phones and other portable communication device
• Ultra Low Current Shutdown Mode (3.3 to 2.6V applications. It is capable of delivering 1 watt of
- 0.01µA) continuous average power to an 8ΩBTL load with
less than 2% distortion (THD+N) from a 5VDC power
• Can Drive Capacitive Loads up to 500 pF supply.
• Improved Pop & Click Circuitry Eliminates
Noises During Turn-On and Turn-Off Boomer™ audio power amplifiers were designed
Transitions specifically to provide high quality output power with a
minimal amount of external components. The
• 2.2 - 5.5V Operation LM4889 does not require output coupling capacitors
• No Output Coupling Capacitors, Snubber or bootstrap capacitors, and therefore is ideally suited
Networks or Bootstrap Capacitors Required for mobile phone and other low voltage applications
where minimal power consumption is a primary
• Unity-Gain Stable requirement.
• External Gain Configuration Capability The LM4889 features a low-power consumption
APPLICATIONS shutdown mode, which is achieved by driving the
shutdown pin with a logic low. Additionally, the
• Mobile Phones LM4889 features an internal thermal shutdown
• PDAs protection mechanism.
• Portable Electronic Devices The LM4889 contains advanced pop & click circuitry
to eliminate noise which would otherwise occur during
KEY SPECIFICATIONS turn-on and turn-off transitions.
• Improved PSRR at 217Hz, 5 - 3.3V 75dB The LM4889 is unity-gain stable and can be
• Power Output at 5.0V & 2% THD 1.0W(typ.) configured by external gain-setting resistors.
• Power Output at 3.3V & 1% THD 400mW(typ.)
• Shutdown Current at 3.3 & 2.6V 0.01µA(typ.)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2Boomer is a trademark of Texas Instruments.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2002–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM4889
SNAS157H –APRIL 2002–REVISED MAY 2013
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Typical Application
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
Figure 2. Small Outline (SOIC) Package - Top View Figure 3. Mini Small Outline (VSSOP) Package –
Top View
See Package Number D See Package Number DGK
Figure 4. 8-Bump DSBGA - Top View Figure 5. WSON Package - Top View
See Package Number YZR0008 See Package Number NGZ
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)(2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD +0.3V
Power Dissipation(3) Internally Limited
ESD Susceptibility(4) 2000V
ESD Susceptibility(5) 200V
Junction Temperature 150°C
Thermal Resistance θJC (SOIC) 35°C/W
θJA (SOIC) 150°C/W
θJA (8 Bump DSBGA)(6) 210°C/W
θJC (VSSOP) 56°C/W
θJA (VSSOP) 190°C/W
θJA (WSON) 220°C/W
Soldering Information See the AN-1112 Application Report.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4889, see power derating currents for additional information.
(4) Human body model, 100 pF discharged through a 1.5 kΩresistor.
(5) Machine Model, 220 pF–240 pF discharged through all pins.
(6) All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4889ITL demo board
(views featured in the Application Information section) has two inner layers, one for VDD and one for GND. The planes each measure
600mils x 600mils (15.24mm x 15.24mm) and aid in spreading heat due to power dissipation within the IC.
Operating Ratings
Temperature Range TMIN ≤TA≤TMAX −40°C ≤TA≤85°C
Supply Voltage 2.2V ≤VDD ≤5.5V
Electrical Characteristics VDD = 5V(1)(2)
The following specifications apply for VDD = 5V, AV= 2, and 8Ωload unless otherwise specified. Limits apply for TA= 25°C.
LM4889 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)(5)
VIN = 0V, Io= 0A, no Load 4 8 mA (max)
IDD Quiescent Power Supply Current VIN = 0V, Io= 0A, with BTL Load 5 8 mA (max)
ISD Shutdown Current Vshutdown = GND(6) 0.1 2 µA (max)
VSDIH Shutdown Voltage Input High 1.2 V (min)
VSDIL Shutdown Voltage Input Low 0.4 V (max)
PoOutput Power THD = 2% (max); f = 1 kHz 1 W
THD+N Total Harmonic Distortion+Noise Po= 0.4 Wrms; f = 1kHz 0.1 %
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(5) Datasheet min/max specification limits are specified by design, test or statistical analysis.
(6) For DSBGA only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2µA.
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Electrical Characteristics VDD = 5V(1)(2) (continued)
The following specifications apply for VDD = 5V, AV= 2, and 8Ωload unless otherwise specified. Limits apply for TA= 25°C.
LM4889 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)(5)
Vripple = 200mV sine p-p
fripple = 217Hz 62 dB
fripple = 1kHz 66 dB
PSRR Power Supply Rejection Ratio Vripple = 200mV sine p-p
Input Floating 75 68 dB
Electrical Characteristics VDD = 3.3V(1)(2)
The following specifications apply for VDD = 3.3V, AV= 2, and 8Ωload unless otherwise specified. Limits apply for TA= 25°C.
LM4889 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)(5)
VIN = 0V, Io= 0A, no Load 3.5 7 mA (max)
IDD Quiescent Power Supply Current VIN = 0V, Io= 0A, with BTL Load 4.5 7 mA (max)
ISD Shutdown Current Vshutdown = GND(6) 0.01 2 µA (max)
VSDIH Shutdown Voltage Input High 1.2 V (min)
VSDIL Shutdown Voltage Input Low 0.4 V (max)
PoOutput Power THD = 1% (max); f = 1kHz 0.4 W
THD+N Total Harmonic Distortion+Noise Po= 0.25Wrms; f = 1kHz 0.1 %
Vripple = 200mV sine p-p
PSRR Power Supply Rejection Ratio fripple = 217Hz 60 dB
fripple =1kHz 62 dB
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(5) Datasheet min/max specification limits are specified by design, test or statistical analysis.
(6) For DSBGA only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2µA.
Electrical Characteristics VDD = 2.6V(1)(2)
The following specifications apply for VDD = 2.6V, AV= 2, and 8Ωload unless otherwise specified. Limits apply for TA= 25°C.
LM4889 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)(5)
IDD Quiescent Power Supply Current VIN = 0V, Io= 0A, no Load 2.6 6 mA (max)
VIN = 0V, Io= 0A, with BTL Load 3.0 6 mA (max)
ISD Shutdown Current Vshutdown = GND(6) 0.01 2 µA (max)
Output Power ( 8Ω) THD = 1% (max); f = 1 kHz 0.2 W
P0Output Power ( 4Ω) THD = 1% (max); f = 1 kHz 0.22 W
THD+N Total Harmonic Distortion+Noise Po= 0.1Wrms; f = 1kHz 0.08 %
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).
(5) Datasheet min/max specification limits are specified by design, test or statistical analysis.
(6) For DSBGA only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2µA.
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Electrical Characteristics VDD = 2.6V(1)(2) (continued)
The following specifications apply for VDD = 2.6V, AV= 2, and 8Ωload unless otherwise specified. Limits apply for TA= 25°C.
LM4889 Units
Symbol Parameter Conditions (Limits)
Typical(3) Limit(4)(5)
Vripple = 200mV sine p-p
PSRR Power Supply Rejection Ratio fripple = 217Hz 44 dB
fripple = 1kHz 44 dB
External Components Description
(Figure 1)
Components Functional Description
1. RiInverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass
filter with Ciat fC= 1/(2πRiCi).
2. CiInput coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a highpass filter with
Riat fc= 1/(2πRiCi). Refer to the section, PROPER SELECTION OF EXTERNAL COMPONENTS, for an explanation
of how to determine the value of Ci.
3. RfFeedback resistance which sets the closed-loop gain in conjunction with Ri. AVD = 2*(Rf/Ri).
4. CSSupply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING section for
information concerning proper placement and selection of the supply bypass capacitor.
5. CBBypass pin capacitor which provides half-supply filtering. Refer to the section, PROPER SELECTION OF EXTERNAL
COMPONENTS, for information concerning proper placement and selection of CB.
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Typical Performance Characteristics
THD+N vs Frequency THD+N vs Frequency
at VDD = 5V, 8ΩRL, and PWR = 250mW at VDD = 3.3V, 8ΩRL, and PWR = 150mW
Figure 6. Figure 7.
THD+N vs Frequency THD+N vs Frequency
at VDD = 2.6V, 8ΩRL, and PWR = 100mW at VDD = 2.6V, 4ΩRL, and PWR = 100mW
Figure 8. Figure 9.
THD+N vs Power Out THD+N vs Power Out
at VDD = 5V, 8ΩRL, 1kHz at VDD = 3.3V, 8ΩRL, 1kHz
Figure 10. Figure 11.
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Typical Performance Characteristics (continued)
THD+N vs Power Out THD+N vs Power Out
at VDD = 2.6V, 8ΩRL, 1kHz at VDD = 2.6V, 4ΩRL, 1kHz
Figure 12. Figure 13.
Power Supply Rejection Ratio (PSRR) at VDD = 5V Power Supply Rejection Ratio (PSRR) at VDD = 5V
Figure 14. Input terminated with 10ΩR Figure 15. Input Floating
Power Supply Rejection Ratio (PSRR) at VDD = 2.6V Power Supply Rejection Ratio (PSRR) at VDD = 3.3V
Figure 16. Input terminated with 10ΩR Figure 17. Input terminated with 10ΩR
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Typical Performance Characteristics (continued)
Power Dissipation vs Power Dissipation vs
Output Power Output Power
VDD = 3.3V VDD = 5V
Figure 18. Figure 19.
Power Dissipation vs
Output Power vs Output Power
Load Resistance VDD = 2.6V
Figure 20. Figure 21.
Supply Current vs Clipping (Dropout) Voltage vs
Shutdown Voltage Supply Voltage
Figure 22. Figure 23.
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Typical Performance Characteristics (continued)
Frequency Response vs
Open Loop Frequency Response Input Capacitor Size
Figure 24. Figure 25.
Power Derating Curves
Noise Floor (PDMAX = 670mW)
Figure 26. Figure 27.
Power Derating Curves - 8 bump µSMD Power Derating Curves - 10 Pin LD pkg
(PDMAX = 670mW) (PDMAX = 670mW)
Figure 28. Figure 29.
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Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4889 has two operational amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in
a unity-gain, inverting configuration. The closed-loop gain of the first amplifier is set by selecting the ratio of Rfto
Riwhile the second amplifier's gain is fixed by the two internal 20kΩresistors. Figure 1 shows that the output of
amplifier one serves as the input to amplifier two which results in both amplifiers producing signals identical in
magnitude, but out of phase by 180°. Consequently, the differential gain for the IC is
AVD= 2 *(Rf/Ri) (1)
By driving the load differentially through outputs Vo1 and Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier
configuration where one side of the load is connected to ground.
A bridge amplifier design has an advantage over the single-ended configuration, as it provides differential drive to
the load, thus doubling output swing for a specified supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same conditions. This increase in attainable output power
assumes that the amplifier is not current limited or clipped. In order to choose an amplifier's closed-loop gain
without causing excessive clipping, please refer to the AUDIO POWER AMPLIFIER DESIGN section.
A bridge configuration, such as the one used in LM4889, also creates a second advantage over single-ended
amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists across
the load. This eliminates the need for an output coupling capacitor which is required in a single supply, single-
ended amplifier configuration. Without an output coupling capacitor, the half-supply bias across the load would
result in both increased internal IC power dissipation and also possible loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an
increase in internal power dissipation. Since the LM4889 has two operational amplifiers in one package, the
maximum internal power dissipation is 4 times that of a single-ended amplifier. The maximum power dissipation
for a given application can be derived from the power dissipation graphs or from Equation 2.
PDMAX = 4*(VDD)2/(2π2RL) (2)
It is critical that the maximum junction temperature TJMAX of 150°C is not exceeded. TJMAX can be determined
from the power derating curves by using PDMAX and the PC board foil area. By adding additional copper foil, the
thermal resistance of the application can be reduced from a free air value of 150°C/W, resulting in higher PDMAX.
Additional copper foil can be added to any of the leads connected to the LM4889. It is especially effective when
connected to VDD, GND, and the output pins. Refer to the application information on the LM4889 reference design
board for an example of good heat sinking. If TJMAX still exceeds 150°C, then additional changes must be made.
These changes can include reduced supply voltage, higher load impedance, or reduced ambient temperature.
Internal power dissipation is a function of output power. Refer to the Typical Performance Characteristics curves
for power dissipation information for different output powers and output loading.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. Typical applications employ a 5V regulator with 10 µF tantalum or electrolytic capacitor and a ceramic
bypass capacitor which aid in supply stability. This does not eliminate the need for bypassing the supply nodes of
the LM4889. The selection of a bypass capacitor, especially CB, is dependent upon PSRR requirements, click
and pop performance (as explained in the section, PROPER SELECTION OF EXTERNAL COMPONENTS),
system cost, and size constraints.
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SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4889 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. This shutdown feature turns the amplifier off when a logic low is placed on the
shutdown pin. By switching the shutdown pin to ground, the LM4889 supply current draw will be minimized in idle
mode. While the device will be disabled with shutdown pin voltages less than 0.5VDC, the idle current may be
greater than the typical value of 0.1µA. (Idle current is measured with the shutdown pin grounded).
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry to
provide a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in
conjunction with an external pull-up resistor. When the switch is closed, the shutdown pin is connected to ground
and disables the amplifier. If the switch is open, then the external pull-up resistor will enable the LM4889. This
scheme ensures that the shutdown pin will not float thus preventing unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize
device and system performance. While the LM4889 is tolerant of external component combinations,
consideration to component values must be used to maximize overall system quality.
The LM4889 is unity-gain stable which gives the designer maximum system flexibility. The LM4889 should be
used in low gain configurations to minimize THD+N values, and maximize the signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs. Please refer to the section, AUDIO POWER AMPLIFIER
DESIGN, for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closed-loop bandwidth of the amplifier. To a large extent, the
bandwidth is dictated by the choice of external components shown in Figure 1. The input coupling capacitor, Ci,
forms a first order high pass filter which limits low frequency response. This value should be chosen based on
needed frequency response for a few reasons.
SELECTION OF INPUT CAPACITOR SIZE
Large input capacitors are both expensive and space hungry for portable designs. Clearly, a certain sized
capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the speakers
used in portable systems, whether internal or external, have little ability to reproduce signals below 100 Hz to
150 Hz. Thus, using a large input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally
1/2 VDD). This charge comes from the output via the feedback and is apt to create pops upon device enable.
Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be
minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value.
Bypass capacitor, CB, is the most critical component to minimize turn-on pops since it determines how fast the
LM4889 turns on. The slower the LM4889's outputs ramp to their quiescent DC voltage (nominally 1/2 VDD), the
smaller the turn-on pop. Choosing CBequal to 1.0 µF along with a small value of Ci(in the range of 0.1 µF to
0.39 µF), should produce a virtually clickless and popless shutdown function. While the device will function
properly, (no oscillations or motorboating), with CBequal to 0.1 µF, the device will be much more susceptible to
turn-on clicks and pops. Thus, a value of CBequal to 1.0 µF is recommended in all but the most cost sensitive
designs.
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AUDIO POWER AMPLIFIER DESIGN
A 1W/8ΩAudio Amplifier
• Given:
– Power Output: 1 Wrms
– Load Impedance: 8Ω
– Input Level: 1 Vrms
– Input Impedance: 20 kΩ
– Bandwidth: 100 Hz–20 kHz ± 0.25 dB
A designer must first determine the minimum supply rail to obtain the specified output power. By extrapolating
from the Output Power vs Supply Voltage graphs in the Typical Performance Characteristics section, the supply
rail can be easily found. A second way to determine the minimum supply rail is to calculate the required Vopeak
using Equation 3 and add the output voltage. Using this method, the minimum supply voltage would be (Vopeak +
(VODTOP + VODBOT)), where VODBOT and VODTOP are extrapolated from the Dropout Voltage vs Supply Voltage curve in
the Typical Performance Characteristics section.
(3)
5V is a standard voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates
headroom that allows the LM4889 to reproduce peaks in excess of 1W without producing audible distortion. At
this time, the designer must make sure that the power supply choice along with the output impedance does not
violate the conditions explained in the POWER DISSIPATION section.
Once the power dissipation equations have been addressed, the required differential gain can be determined
from Equation 4.
(4)
Rf/Ri= AVD/2 (5)
From Equation 3, the minimum AVD is 2.83; use AVD = 3.
Since the desired input impedance was 20 kΩ, and with a AVD impedance of 2, a ratio of 1.5:1 of Rfto Riresults
in an allocation of Ri= 20 kΩand Rf= 30 kΩ. The final design step is to address the bandwidth requirements
which must be stated as a pair of −3 dB frequency points. Five times away from a −3 dB point is 0.17 dB down
from passband response which is better than the required ±0.25 dB specified.
fL= 100 Hz/5 = 20 Hz (6)
fH= 20 kHz * 5 = 100 kHz (7)
As stated in the External Components Description section, Riin conjunction with Cicreate a highpass filter.
Ci≥1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF (8)
The high frequency pole is determined by the product of the desired frequency pole, fH, and the differential gain,
AVD. With a AVD = 3 and fH= 100 kHz, the resulting GBWP = 300kHz which is much smaller than the LM4889
GBWP of 2.5MHz. This calculation shows that if a designer has a need to design an amplifier with a higher
differential gain, the LM4889 can still be used without running into bandwidth limitations.
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Figure 30. Higher Gain Audio Amplifier
The LM4889 is unity-gain stable and requires no external components besides gain-setting resistors, an input
coupling capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential
gain of greater than 10 is required, a feedback capacitor (C4) may be needed as shown in Figure 30 to
bandwidth limit the amplifier. This feedback capacitor creates a low pass filter that eliminates possible high
frequency oscillations. Care should be taken when calculating the -3dB frequency in that an incorrect
combination of R3and C4will cause rolloff before 20kHz. A typical combination of feedback resistor and
capacitor that will not produce audio band high frequency rolloff is R3= 20kΩand C4= 25pf. These components
result in a -3dB point of approximately 320kHz.
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REFERENCE DESIGN BOARD AND PCB LAYOUT GUIDELINES - VSSOP & SOIC BOARDS
Figure 33. Reference Design Board
LM4889 SOIC DEMO BOARD ARTWORK
Figure 34. Silk Screen
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REVISION HISTORY
Changes from Revision G (May 2013) to Revision H Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 18
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PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4889MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM48
89MA
LM4889MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 LM48
89MA
LM4889MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 GA2
LM4889MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 GA2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4889MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM4889MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM4889MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4889MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM4889MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM4889MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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