Precision Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
R
2
J
3
3
4
R
5
B
6
D
7
1
8
0
9
0
10
V
11
2
12
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type: inches
1R : 0201
2R : 0402
3R : 0603
6R : 0805
Power R.
0.05 W
0.063 W
0.063 W
0.1 W
T.C.R. Marking
T.C.R.Code
H
B
K
E
±5010–6/˚C(ppm/˚C)
(1R, 2R)
±5010–6/˚C(ppm/˚C)
(3R, 6R)
±10010–6/˚C(ppm/˚C)
(1R, 2R)
±10010–6/˚C(ppm/˚C)
(3R, 6R) Resistance Value ✽
Resistance Tolerance
Code
D
Tolerance
±0.5 %
Packaging Methods
Code
C
X
V
Pressed Carrier Taping
2mmpitch
Punched Carrier Taping
2mmpitch
Punched Carrier Taping
4mmpitch
ERJ1R
ERJ2R
ERJ3R
ERJ6R
Packaging Type
The first three digits are significant figures of resistance
and the last one denotes number of zeros following.
Example: 1002촞10 k
Precision Thick Film Chip Resistors
ERJ G : 01005, 0201
ERJ R : 0201, 0402, 0603, 0805
ERJ E : 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type: ERJ XG, 1G
ERJ 1R, 2R, 3R, 6R
ERJ 3E, 6E, 8E, 14, 12, 1T
■Features
● Small size and lightweight
● High reliability
Metal glaze thick fi lm resistive element and three
layers of electrodes
● Compatible with placement machines
Taping packaging available
● Suitable for both refl ow and fl ow soldering
■Explanation of Part Numbers
● Low Resistance Tolerance
ERJXG, 1G, 2R, 3E, 6E, 8E, 14, 12, 1T Series.....±1 %
ERJ1R, 2R, 3R, 6R Series .............................. ±0.5 %
● Reference Standards
IEC 60115-8, JIS C 5201-8
● ERJ1R, 2R, 3R, 6R Series, ±0.5 % type
✽ For existing customers, we continue to use the three-digit resistance code in the part numbers.
Mar. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Precision Thick Film Chip Resistors
E
1
R
2
J
3
8
4
E
5
N
6
F
7
1
8
0
9
0
10
2
11
V
12
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type: inches
2R : 0402
3E : 0603
6E : 0805
8E : 1206
14 : 1210
12 : 1812
12 : 2010
1T : 2512
Power R.
0.1 W
0.1 W
0.125 W
0.25 W
0.5 W
0.75 W
0.75 W
1W
Marking
MarkingCode
K
N
S
No marking
(2R, 3E)
4 digit marking
(6E, 8E, 14, 12, 1T)
4 digit marking
[12(2010 inches)]
The first three digits are significant figures of resistance
and the 4th one denotes number of zeros following.
Resistance Value ✽
Resistance Tolerance
Code
F
Tolerance
±1%
Packaging Methods
Code
X
V
U
Punched Carrier Taping
2mmpitch
Punched Carrier Taping
4mmpitch
Embossed Carrier Taping
4mmpitch
ERJ2R
ERJ3E
ERJ6E
ERJ8E
ERJ14
ERJ12
ERJ1T
Packaging Type
E
1
R
2
J
3
1
4
G
5
E
6 7
F
8
1
9
00
10
2
11 12
C
Thick Film
Chip Resistors
Product Code Size, Power Rating
XGN : 01005 0.031 W
1GE : 0201 0.050 W
Power R.
Resistance Tolerance
Code
F
Tolerance
±1%
Resistance Value Packaging Methods
Code
Y
C
Type
ERJXGN
Packaging
Pressed Carrier Taping
2mmpitch, 20000 pcs.
ERJ1GE
Pressed Carrier Taping
2mmpitch, 15000 pcs.
Type : inches The first three digits are significant
figures of resistance and the last
one denotes number of zeros
a
b
t
W
L
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWa b t
ERJXG
(01005) 0.40±0.02 0.20±0.02 0.10±0.03 0.10±0.03 0.13±0.02 0.04
ERJ1G, 1R
(0201) 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15
ERJ2R첸
(0402) 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8
ERJ3R첸
(0603) 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2
ERJ6R첸
(0805) 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4
ERJ3EK
(0603) 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2
ERJ6EN
(0805) 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4
ERJ8EN
(1206) 3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10
ERJ14N
(1210) 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16
ERJ12N
(1812) 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27
ERJ12S
(2010) 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27
ERJ1TN
(2512) 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45
● ERJ2R, 3E, 6E, 8E, 14, 12, 1T Series, ±1 % type
● ERJXG, 1G Series, ±1 % type
■Construction ■Dimensions in mm (not to scale)
Protective coating
Alumina substrate
Electrode (Inner)
Electrode
(Between)
Thick film
resistive element Electrode (Outer)
–0.05
–0.05
–0.15–0.20
Oct. 2008
Precision Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
–40
–20 0 20 40 60 80 100 120 140 160
0180
–60
70 °C
–55 °C
Ambient Temperature (°C)
20
40
60
80
100
Rated Load (%)
125 °C155 °C
XG, 1G, 1R, 2RH,
2RK, 3R, 6R
2RK, 3E, 6E, 8E,
14, 12, 1T
Type
(inches)
Power Rating
at 70 °C (W)
Limiting Element
Voltage (Maximum
RCWV)(1) (V)
Maximum Overload
Voltage(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[10–6/°C
(ppm/°C)]
Category Temperature
Range (Operating
Temperature Range)
(°C)
ERJ1RH
(0201) 0.05 15 30 ±0.5 1 k to 100 k
(E24, E96) ±50 –55 to +125
ERJ1RK
(0201) 0.05 15 30 ±0.5 100 to 976
(E24, E96) ±100 –55 to +125
ERJ2RH
(0402) 0.063 50 100 ±0.5 100 to 100 k
(E24, E96) ±50 –55 to +125
ERJ2RK
(0402) 0.063 50 100 ±0.5 10 to 97.6
102 k to 1 M
(E24, E96) ±100 –55 to +125
ERJ3RB
(0603) 0.063 50 100 ±0.5 100 to 100 k
(E24, E96) ±50 –55 to +125
ERJ3RE
(0603) 0.063 50 100 ±0.5 10 to 97.6
102 k to 1 M
(E24, E96) ±100 –55 to +125
ERJ6RB
(0805) 0.1 150 200 ±0.5 100 to 100 k
(E24, E96) ±50 –55 to +125
ERJ6RE
(0805) 0.1 150 200 ±0.5 10 to 97.6
102 k to 1 M
(E24, E96) ±100 –55 to +125
(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating Re sis tance Values, or Limiting Element Voltage
(max. RCWV) list ed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 Power Rating or max. Over load Volt age list ed above
whichever less.
(3) Please contact us when you need a type with a resistance of less than 10 .
■Ratings
<±0.5 %>
Type
(inches)
Power Rating
at 70 °C (W)
Limiting Element
Voltage (Maximum
RCWV)(1) (V)
Maximum Overload
Voltage(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[10–6/°C
(ppm/°C)]
Category Temperature
Range (Operating
Temperature Range)
(°C)
ERJXG
(01005) 0.031 15 30 ±1 10 to 1 M
(E24, E96)
<100 : ±300
100 < : ±200 –55 to +125
ERJ1G
(0201) 0.05 25 50 ±1 10 to 1 M(3)
(E24, E96) ±200 –55 to +125
ERJ2RK
(0402) 0.1 50 100 ±1 10 to 1 M
(E24, E96) ±100 –55 to +155
ERJ3EK
(0603) 0.1 75 150 ±1 10 to 1 M
(E24, E96) ±100 –55 to +155
ERJ6EN
(0805) 0.125 150 200 ±1 10 to 2.2 M
(E24, E96) ±100 –55 to +155
ERJ8EN
(1206) 0.25 200 400 ±1 10 to 2.2 M
(E24, E96) ±100 –55 to +155
ERJ14N
(1210) 0.5 200 400 ±1 10 to 1 M
(E24, E96) ±100 –55 to +155
ERJ12N
(1812) 0.75 200 500 ±1 10 to 1 M
(E24, E96) ±100 –55 to +155
ERJ12S
(2010) 0.75 200 500 ±1 10 to 1 M
(E24, E96) ±100 –55 to +155
ERJ1TN
(2512) 1200500±1
10 to 1 M
(E24, E96) ±100 –55 to +155
<±1 %>
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in ac cor dance
with the fi gure on the right.
Jul. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Precision Thick Film Chip Resistors
φB
W
T
φA
φC
TT TA
P0
P2
P1
P1
φD0
φD1(Only Emboss)
B
F
W
E
(2 mm pitch)
● Taping Reel
■Packaging Methods (Taping)
● Standard Quantity
● Carrier Tape
Type Kind of Taping Pitch (P1)Quantity
ERJXG Pressed Carrier Taping 2 mm
20000 pcs./reel
ERJ1G, ERJ1R 15000 pcs./reel
ERJ2RH, ERJ2RK
Punched Carrier Taping
10000 pcs./reel
ERJ3R첸, ERJ3EK
4 mm 5000 pcs./reel
ERJ6R첸, ERJ6EN
ERJ8EN
ERJ14N
Embossed Carrier Taping
ERJ12N
ERJ12S
ERJ1TN 4000 pcs./reel
(Unit : mm)
Type φAφBφCWT
ERJXG
180.0+0
60 min. 13.0±1.0
9.0±1.0 11.4±1.0
ERJ1G, ERJ1R
ERJ2RH, ERJ2RK
ERJ3R첸, ERJ3EK
ERJ6R첸, ERJ6EN
ERJ8EN
ERJ14N
ERJ12N
13.0±1.0 15.4±2.0
ERJ12S
ERJ1TN
(Unit : mm)
–3.0
Type A B W F E P1P2P0φD0TφD1
ERJXG 0.24±0.03 0.45±0.03
8.00±0.20
3.50±0.05
1.75±0.10
2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.31±0.05 –
ERJ1G, ERJ1R 0.38±0.05 0.68±0.05 0.42±0.05 –
ERJ2RH, ERJ2RK 0.67±0.05 1.17±0.05 0.52±0.05 –
ERJ3R첸, ERJ3EK 1.10±0.10 1.90±0.10
4.00±0.10
0.70±0.05 –
ERJ6R첸, ERJ6EN 1.65±0.15 2.50±0.20
0.84±0.05 –
ERJ8EN 2.00±0.15 3.60±0.20 –
ERJ14N 2.80±0.20 3.50±0.20 8.00±0.30
1.00±0.10
1.0+0.10
ERJ12N 3.50±0.20 4.80±0.20
12.00±0.30
5.50±0.20 1.5 min.
ERJ12S 2.80±0.20 5.30±0.20
ERJ1TN 3.60±0.20 6.90±0.20
−0
−0
Pressed Carrier Punched Carrier Embossed Carrier
Feb. 2006
Precision Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Preheating
Peak
Heating
Temperature
Time
Chip Resistor
c
a
b
Type (inches) Dimensions (mm)
abc
ERJXG (01005) 0.15 to 0.2 0.5 to 0.7 0.20 to 0.25
ERJ1G, 1R (0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
ERJ2R (0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJ3R, 3EK (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1
ERJ6R, 6EN (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJ8EN (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8
ERJ14N (1210) 2 to 2.4 4.4 to 5 1.8 to 2.8
ERJ12N (1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
ERJ12S (2010) 3.6 to 4 6.2 to 7 1.8 to 2.8
ERJ1TN (2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering For lead-free soldering
Temperature TimeTemperatureTime
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
■Recommended Land Pattern
In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
●Recommended soldering conditions for fl ow
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip Resistors (here af ter
called the resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive be nding of printed circuit boards in order to protect the resistors from abnormal stress.
Feb. 2006
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. S ea lin g o r c oating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non -cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
