SN54HC04, SN74HC04 www.ti.com SCLS078F - DECEMBER 1982 - REVISED AUGUST 2013 HEX INVERTERS Check for Samples: SN54HC04, SN74HC04 FEATURES DESCRIPTION * * * * * * The 'HC04 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic. 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y 2A NC 2Y NC 3A 3 2 4 20 19 18 5 17 1 6A VCC 13 6 16 7 15 14 8 6Y NC 5A NC 5Y 9 10 11 12 13 4Y 14 2 4A 1 3Y 1A 1Y 2A 2Y 3A 3Y GND 1Y SN54HC04...FK PACKAGE (TOP VIEW) SN54HC04...J OR W PACKAGE SN74HC04...D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1A NC Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-A Max ICC Typical tpd = 8 ns 4-mA Output Drive at 5 V Low Input Current of 1 A Max GND NC 1 NC - No internal connection FUNCTION TABLE (EACH INVERTER) INPUT A OUTPUT Y H L L H LOGIC DIAGRAM (POSITIVE LOGIC) A Y 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1982-2013, Texas Instruments Incorporated SN54HC04, SN74HC04 SCLS078F - DECEMBER 1982 - REVISED AUGUST 2013 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX -0.5 UNIT VCC Supply voltage range IIK Input clamp current (2) VI < 0 or VI > VCC 20 7 mA IOK Output clamp current (2) VO < 0 20 mA IO Continuous output current VO = 0 to VCC 25 mA 50 mA Continuous current through VCCor GND JA Package thermal impedance (3) Tstg Storage temperature range D package 86 N package 80 NS package 76 PW package (1) (2) (3) V C/W 113 -60 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) SN54HC04 VCC Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V VCC = 6 V SN74HC04 MIN NOM MAX 2 5 6 Low-level input voltage NOM MAX 2 5 6 1.5 1.5 3.15 3.15 4.2 4.2 VCC = 2 V VIL MIN VCC = 4.5 V VCC = 6 V UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 V VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V VCC = 2 V t/v Input transition rise or fall rate TA (1) 2 Operating free-air temperature 1000 1000 VCC = 4.5 V 500 500 VCC = 6 V 400 400 -55 125 -40 85 ns C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright (c) 1982-2013, Texas Instruments Incorporated Product Folder Links: SN54HC04, SN74HC04 SN54HC04, SN74HC04 www.ti.com SCLS078F - DECEMBER 1982 - REVISED AUGUST 2013 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -20 A VI = VIH or VIL VOH IOH = -4 mA IOH = -5.2 mA IOL = 20 A VI = VIH or VIL VOL IOL = 4 mA IOL = 5.2 mA II ICC TA = 25C MIN TYP SN54HC04 MAX MIN SN74HC04 MAX MIN 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 UNIT MAX V 5.34 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 V 6V 0.15 0.26 0.4 0.33 VI = VCC or 0 6V 0.1 100 1000 1000 nA VI = VCC or 0, IO = 0 6V 2 40 20 A 10 10 10 pF Ci 2 V to 6 V 3 Switching Characteristics over operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC tpd A Y tt Y TA = 25C MIN SN54HC04 MIN SN74HC04 TYP MAX MAX MIN 2V 45 95 125 120 4.5 V 9 19 29 24 6V 8 16 25 20 UNIT MAX 2V 38 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 ns ns Operating Characteristics TA = 25C Cpd PARAMETER TEST CONDITIONS Power dissipation capacitance per inverter No load Copyright (c) 1982-2013, Texas Instruments Incorporated Product Folder Links: SN54HC04, SN74HC04 TYP 20 UNIT pF Submit Documentation Feedback 3 SN54HC04, SN74HC04 SCLS078F - DECEMBER 1982 - REVISED AUGUST 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Input 0V CL = 50 pF (see Note A) 50% 10% 90% In-Phase Output 90% tr tPHL tPLH LOAD CIRCUIT Input VCC 50% 50% 0V 90% tPHL VOH 50% 10% Out-of-Phase Output VOL tf tPLH 90% 50% 10% tf VOLTAGE WAVEFORMS INPUT RISE AND FALL TIMES 90% tr VCC 50% 10% 50% 10% 50% 10% 90% tf VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback Copyright (c) 1982-2013, Texas Instruments Incorporated Product Folder Links: SN54HC04, SN74HC04 SN54HC04, SN74HC04 www.ti.com SCLS078F - DECEMBER 1982 - REVISED AUGUST 2013 REVISION HISTORY Changes from Revision E (October 2010) to Revision F * Page Removed Ordering Information table. ................................................................................................................................... 1 Copyright (c) 1982-2013, Texas Instruments Incorporated Product Folder Links: SN54HC04, SN74HC04 Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) 5962-8409801VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409801VC A SNV54HC04J 5962-8409801VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409801VD A SNV54HC04W 84098012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84098012A SNJ54HC 04FK 8409801CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409801CA SNJ54HC04J 8409801DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409801DA SNJ54HC04W JM38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65701B2A JM38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BCA JM38510/65701BDA NRND CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BDA M38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65701B2A M38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BCA M38510/65701BDA NRND CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BDA SN54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC04J SN74HC04D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74HC04DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DRG3 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC04N SN74HC04N3 OBSOLETE PDIP N 14 TBD Call TI Call TI -40 to 85 SN74HC04NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC04N SN74HC04NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 85 SN74HC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 Addendum-Page 2 HC04 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74HC04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SNJ54HC04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84098012A SNJ54HC 04FK SNJ54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409801CA SNJ54HC04J SNJ54HC04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409801DA SNJ54HC04W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 : * Catalog: SN74HC04, SN54HC04 * Automotive: SN74HC04-Q1, SN74HC04-Q1 * Military: SN54HC04 * Space: SN54HC04-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC04DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HC04DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04DRG3 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 SN74HC04DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC04PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC04DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HC04DR SOIC D 14 2500 364.0 364.0 27.0 SN74HC04DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC04DRG3 SOIC D 14 2500 364.0 364.0 27.0 SN74HC04DRG4 SOIC D 14 2500 367.0 367.0 38.0 SN74HC04DRG4 SOIC D 14 2500 333.2 345.9 28.6 SN74HC04DT SOIC D 14 250 367.0 367.0 38.0 SN74HC04PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC04PWT TSSOP PW 14 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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