Gap Filler 2000 (Two-Part) Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 2000 PROPERTY Color / Part A * Thermal conductivity: 2.0 W/m-K * Ultra-conforming, designed for fragile and low-stress applications * Ambient and accelerated cure schedules * 100% solids - no cure by-products * Excellent low and high temperature mechanical and chemical stability IMPERIAL VALUE Pink Color / Part B White White -- 300,000 ASTM D2196 Density (g/cc) 2.9 2.9 ASTM D792 Mix Ratio 1:1 1:1 -- 6 6 -- Pink Pink Visual 70 70 ASTM D2240 Shelf Life @ 25C (months) PROPERTY AS CURED Color Hardness (Shore 00)(2) Heat Capacity (J/g-K) 1.0 1.0 ASTM D1269 -76 to 392 -60 to 200 -- 500 500 ASTM D149 7 7 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 Continuous Use Temp (F) / (C) ELECTRICAL AS CURED Dielectric Strength (V/ml) Dielectric Constant (1000 Hz) Resultant Thickness (mils) Cure @ 100C 2.0 ASTM D5470 SCHEDULE 2 60 min SCHEDULE 3 600 min (10 hr) 1-2 hours 3-4 hours 3 days 5 min 15 min 1 hour (4) 1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25C. 2) Thirty second delay value Shore 00 hardness scale. 3) Time for viscosity to double. 4) Cure schedule (rheometer - time to read 90% cure) Typical Applications Include: * Automotive electronics * Telecommunications * Computer and peripherals * Thermally conductive vibration dampening * Between any heat-generating semiconductor and a heat sink Configurations Available: * Supplied in cartridge or kit form Building a Part Number - 00 - 60 - 10G - 300 250 Standard Options NA Section E GF2000 Section D Thickness vs. Thermal Resistance Gap Filler 2000 2.0 SCHEDULE 1 15 min Cure @ 25C (4) Section A the final gap thickness of the application. CURE SCHEDULE Pot Life @ 25C (3) Section C Gap Filler 2000 is intended for use in thermal interface applications when a strong structural bond is not required. As cured, Gap Filler 2000 is formulated to have pliable low-modulus, properties. Note: Resultant thickness is defined as THERMAL AS CURED Thermal Conductivity (W/m-K) Section B Unlike cured Gap Filling materials, the liquid approach offers infinite thickness with little or no stress during displacement and assembly. It also eliminates the need for specific pad thickness and die-cut shapes for individual applications. TEST METHOD Visual 300,000 Viscosity as Mixed (cps)(1) Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch. METRIC VALUE Pink NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon Pot Life: 15 = 15 minutes, 60 = 60 minutes 600 = 600 minutes 00 = No spacer beads 07 = 0.007" spacer beads 200 150 50 GF2000 = Gap Filler 2000 Material Note: To build a part number, visit our website at www.bergquistcompany.com. 0 0 1 2 3 4 5 Thermal Resistance (C-in2/W) 6 Gap Pad (R): U.S. Patent 5,679,457 and others. www.bergquistcompany.com The Bergquist Company North American Headquarters 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-0430 The Bergquist Company European Headquarters Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company Asia Headquarters Hong Kong Phone: 852-2690-9296 Fax: 852-2690-3408 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers' and manufacturers' only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer. PDS_GF_2000_0913 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Bergquist Company: GF2000-00-60-50cc