Parallel NOR Flash Embedded Memory
M29W256GH, M29W256GL
Features
• Supply voltage
– VCC = 2.7–3.6V (program, erase, read)
– VCCQ = 1.65–3.6V (I/O buffers)
– VPPH = 12V for fast program (optional)
• Asynchronous random/page read
– Page size: 8 words or 16 bytes
– Page access: 25ns, 30ns
– Random access: 60ns1, 70ns, 80ns
• Fast program commands: 32-word (64-byte) write
buffer
• Enhanced buffered program commands: 256-word
• Program time
– 16µs per byte/word (TYP)
– Chip program time: 10s with VPPH and 16s with-
out VPPH
• Memory organization
– Uniform blocks: 256 main blocks, 128KB, or 64-
Kwords each
• Program/erase controller
– Embedded byte/word program algorithms
• Program/erase suspend and resume capability
– Read from any block during a PROGRAM SUS-
PEND operation
– Read or program another block during an ERASE
SUSPEND operation
• Unlock bypass, block erase, chip erase, write to buf-
fer and program
– Fast buffered/batch programming
– Fast block/chip erase
• VPP/WP# pin protection
– Protects first or last block regardless of block
-protection settings
• Software protection
– Volatile protection
– Nonvolatile protection
– Password protection
• Extended memory block
– 128-word (256-byte) memory block for perma-
nent, secure identification
– Programmed or locked at the factory or by the
customer
• Common Flash interface
– 64-bit security code
• Low power consumption: Standby and automatic
mode
• JESD47H-compliant
– 100,000 minimum PROGRAM/ERASE cycles per
block
– Data retention: 20 years (TYP)
• 65nm single-level cell (SLC) process technology
• Fortified BGA, TBGA, and TSOP packages
• "Green" packages available
– RoHS-compliant
– Halogen-free
• Automotive device grade (6) temperature:
–40°C to +85°C (automotive grade-certified)
• Automotive device grade (3) temperature:
–40°C to +125°C (automotive grade-certified)
Note: 1. The 60ns device is available upon customer
request.
256Mb: 3V Embedded Parallel NOR Flash
Features
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Products and specifications discussed herein are subject to change by Micron without notice.
Part Numbering Information
Available with extended memory block prelocked by Micron. Devices are shipped from the factory with memory
content bits erased to 1. For available options, such as packages or high/low protection, or for further information,
contact your Micron sales representative. Part numbers can be verified at www.micron.com. Feature and specifica-
tion comparison by device type is available at www.micron.com/products. Contact the factory for devices not
found.
Table 1: Part Number Information
Part Number
Category Category Details Notes
Device type M29W
Operating voltage W = VCC = 2.7 to 3.6V
Device function 256GH = 256Mb (x8/x16) page, uniform block Flash memory, highest block protected by
VPP/WP#
256GL = 256Mb (x8/x16) page, uniform block Flash memory, lowest block protected by
VPP/WP#
Speed 70 = 70ns 1
60 = 60ns 1, 2
7A = 70ns 1, 3
Package N = 56-pin TSOP, 14mm x 20mm, lead-free, halogen-free, RoHS-compliant
ZA = 64-ball TBGA, 10mm x 13mm, lead-free, halogen-free, RoHS-compliant
ZS = 64-ball fortified BGA, 11mm x 13mm
Temperature range 1 = 0 to 70°C
6 = –40°C to +85°C
3 = –40°C to +125°C
Shipping options E = RoHS-compliant package, standard packing
F = RoHS-compliant package, tape and reel packing
Notes: 1. 80ns if VCCQ = 1.65V to VCC.
2. The 60ns device is available upon customer request.
3. Automotive-qualified, available only with option 6. Qualified and characterized according to AEC Q100 and
Q003 or equivalent; advanced screening according to AEC Q001 and Q002 or equivalent.
256Mb: 3V Embedded Parallel NOR Flash
Features
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Contents
General Description ......................................................................................................................................... 7
Signal Assignments ........................................................................................................................................... 8
Signal Descriptions ......................................................................................................................................... 10
Memory Organization .................................................................................................................................... 11
Memory Configuration ............................................................................................................................... 11
Memory Map – 256Mb Density ................................................................................................................... 11
Bus Operations ............................................................................................................................................... 12
Read .......................................................................................................................................................... 12
Write .......................................................................................................................................................... 12
Standby and Automatic Standby ................................................................................................................. 12
Output Disable ........................................................................................................................................... 13
Reset .......................................................................................................................................................... 13
Registers ........................................................................................................................................................ 14
Status Register ............................................................................................................................................ 14
Lock Register .............................................................................................................................................. 18
Standard Command Definitions – Address/Data Cycles ................................................................................... 21
READ Operations ........................................................................................................................................... 23
READ/RESET Command ............................................................................................................................ 23
READ CFI Command .................................................................................................................................. 23
AUTO SELECT Operations .............................................................................................................................. 24
AUTO SELECT Command ........................................................................................................................... 24
Bypass Operations .......................................................................................................................................... 27
UNLOCK BYPASS Command ...................................................................................................................... 27
UNLOCK BYPASS RESET Command ............................................................................................................ 27
Program Operations ....................................................................................................................................... 28
PROGRAM Command ................................................................................................................................ 28
UNLOCK BYPASS PROGRAM Command ..................................................................................................... 28
WRITE TO BUFFER PROGRAM Command .................................................................................................. 28
UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command ....................................................................... 31
WRITE TO BUFFER PROGRAM CONFIRM Command .................................................................................. 31
BUFFERED PROGRAM ABORT AND RESET Command ................................................................................ 31
PROGRAM SUSPEND Command ................................................................................................................ 31
PROGRAM RESUME Command .................................................................................................................. 32
ENTER and EXIT ENHANCED BUFFERED PROGRAM Command ................................................................ 32
ENHANCED BUFFERED PROGRAM Command ........................................................................................... 32
ENHANCED BUFFERED PROGRAM ABORT AND RESET Command ............................................................ 35
Erase Operations ............................................................................................................................................ 36
CHIP ERASE Command .............................................................................................................................. 36
UNLOCK BYPASS CHIP ERASE Command ................................................................................................... 36
BLOCK ERASE Command ........................................................................................................................... 36
UNLOCK BYPASS BLOCK ERASE Command ................................................................................................ 37
ERASE SUSPEND Command ....................................................................................................................... 37
ERASE RESUME Command ........................................................................................................................ 38
Block Protection Command Definitions – Address/Data Cycles ........................................................................ 39
Protection Operations .................................................................................................................................... 42
LOCK REGISTER Commands ...................................................................................................................... 42
PASSWORD PROTECTION Commands ....................................................................................................... 42
NONVOLATILE PROTECTION Commands .................................................................................................. 42
NONVOLATILE PROTECTION BIT LOCK BIT Commands ............................................................................ 44
VOLATILE PROTECTION Commands .......................................................................................................... 44
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Features
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EXTENDED MEMORY BLOCK Commands .................................................................................................. 44
EXIT PROTECTION Command .................................................................................................................... 45
Device Protection ........................................................................................................................................... 46
Hardware Protection .................................................................................................................................. 46
Software Protection .................................................................................................................................... 46
Volatile Protection Mode ............................................................................................................................. 47
Nonvolatile Protection Mode ...................................................................................................................... 47
Password Protection Mode .......................................................................................................................... 48
Common Flash Interface ................................................................................................................................ 49
Power-Up and Reset Characteristics ................................................................................................................ 53
Absolute Ratings and Operating Conditions ..................................................................................................... 56
DC Characteristics .......................................................................................................................................... 58
Read AC Characteristics .................................................................................................................................. 60
Write AC Characteristics ................................................................................................................................. 63
Accelerated Program, Data Polling/Toggle AC Characteristics ........................................................................... 70
Program/Erase Characteristics ........................................................................................................................ 72
Package Dimensions ....................................................................................................................................... 73
Revision History ............................................................................................................................................. 76
Rev. E – 7/16 ............................................................................................................................................... 76
Rev. D – 5/15 .............................................................................................................................................. 76
Rev. C – 7/13 ............................................................................................................................................... 76
Rev. B – 5/13 ............................................................................................................................................... 76
Rev. A – 5/12 ............................................................................................................................................... 76
256Mb: 3V Embedded Parallel NOR Flash
Features
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List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 7
Figure 2: 56-Pin TSOP (Top View) .................................................................................................................... 8
Figure 3: 64-Ball Fortified BGA and 64-Ball TBGA ............................................................................................. 9
Figure 4: Data Polling Flowchart .................................................................................................................... 16
Figure 5: Toggle Bit Flowchart ........................................................................................................................ 17
Figure 6: Status Register Polling Flowchart ..................................................................................................... 18
Figure 7: Lock Register Program Flowchart ..................................................................................................... 20
Figure 8: WRITE TO BUFFER PROGRAM Flowchart ........................................................................................ 30
Figure 9: ENHANCED BUFFERED PROGRAM Flowchart ................................................................................ 34
Figure 10: Program/Erase Nonvolatile Protection Bit Algorithm ...................................................................... 43
Figure 11: Software Protection Scheme .......................................................................................................... 48
Figure 12: Power-Up Timing .......................................................................................................................... 53
Figure 13: Reset AC Timing – No PROGRAM/ERASE Operation in Progress ...................................................... 54
Figure 14: Reset AC Timing During PROGRAM/ERASE Operation .................................................................... 55
Figure 15: AC Measurement Load Circuit ....................................................................................................... 57
Figure 16: AC Measurement I/O Waveform ..................................................................................................... 57
Figure 17: Random Read AC Timing (8-Bit Mode) ........................................................................................... 61
Figure 18: Random Read AC Timing (16-Bit Mode) ......................................................................................... 61
Figure 19: Page Read AC Timing (16-Bit Mode) ............................................................................................... 62
Figure 20: WE#-Controlled Program AC Timing (8-Bit Mode) .......................................................................... 64
Figure 21: WE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 65
Figure 22: CE#-Controlled Program AC Timing (8-Bit Mode) ........................................................................... 67
Figure 23: CE#-Controlled Program AC Timing (16-Bit Mode) ......................................................................... 68
Figure 24: Chip/Block Erase AC Timing (8-Bit Mode) ...................................................................................... 69
Figure 25: Accelerated Program AC Timing ..................................................................................................... 70
Figure 26: Data Polling AC Timing .................................................................................................................. 71
Figure 27: Toggle/Alternative Toggle Bit Polling AC Timing (8-Bit Mode) .......................................................... 71
Figure 28: 56-Pin TSOP – 14mm x 20mm ........................................................................................................ 73
Figure 29: 64-Ball TBGA – 10mm x 13mm ....................................................................................................... 74
Figure 30: 64-Ball Fortified BGA – 11mm x 13mm ........................................................................................... 75
256Mb: 3V Embedded Parallel NOR Flash
Features
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List of Tables
Table 1: Part Number Information ................................................................................................................... 2
Table 2: Signal Descriptions ........................................................................................................................... 10
Table 3: 256Mb, Blocks[255:0] ........................................................................................................................ 11
Table 4: Bus Operations ................................................................................................................................. 12
Table 5: Status Register Bit Definitions ........................................................................................................... 14
Table 6: Operations and Corresponding Bit Settings ........................................................................................ 15
Table 7: Lock Register Bit Definitions ............................................................................................................. 19
Table 8: Block Protection Status ..................................................................................................................... 19
Table 9: Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit ............................................ 21
Table 10: Read Electronic Signature ............................................................................................................... 24
Table 11: Block Protection ............................................................................................................................. 26
Table 12: Block Protection Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit ............................... 39
Table 13: Extended Memory Block Address and Data ...................................................................................... 44
Table 14: VPP/WP# Functions ......................................................................................................................... 46
Table 15: Query Structure Overview ............................................................................................................... 49
Table 16: CFI Query Identification String ........................................................................................................ 49
Table 17: CFI Query System Interface Information .......................................................................................... 50
Table 18: Device Geometry Definition ............................................................................................................ 50
Table 19: Primary Algorithm-Specific Extended Query Table ........................................................................... 51
Table 20: Security Code Area .......................................................................................................................... 52
Table 21: Power-Up Wait Timing Specifications .............................................................................................. 53
Table 22: Reset AC Specifications ................................................................................................................... 54
Table 23: Absolute Maximum/Minimum Ratings ............................................................................................ 56
Table 24: Operating Conditions ...................................................................................................................... 56
Table 25: I/O Capacitance1 ............................................................................................................................ 57
Table 26: DC Current Characteristics .............................................................................................................. 58
Table 27: DC Voltage Characteristics .............................................................................................................. 59
Table 28: Read AC Characteristics .................................................................................................................. 60
Table 29: WE#-Controlled Write AC Characteristics ......................................................................................... 63
Table 30: CE#-Controlled Write AC Characteristics ......................................................................................... 66
Table 31: Accelerated Program and Data Polling/Data Toggle AC Characteristics .............................................. 70
Table 32: Program/Erase Characteristics ........................................................................................................ 72
256Mb: 3V Embedded Parallel NOR Flash
Features
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General Description
The M29W is an asynchronous, uniform block, parallel NOR Flash memory device man-
ufactured on 65nm single-level cell (SLC) technology. READ, ERASE, and PROGRAM op-
erations are performed using a single low-voltage supply. Upon power-up, the device
defaults to read array mode.
The main memory array is divided into uniform blocks that can be erased independent-
ly so that valid data can be preserved while old data is purged. PROGRAM and ERASE
commands are written to the command interface of the memory. An on-chip program/
erase controller simplifies the process of programming or erasing the memory by taking
care of all special operations required to update the memory contents. The end of a
PROGRAM or ERASE operation can be detected, and any error condition can be identi-
fied. The command set required to control the device is consistent with JEDEC stand-
ards.
CE#, OE#, and WE# control the bus operation of the device and enable a simple con-
nection to most microprocessors, often without additional logic.
The M29W supports asynchronous random read and page read from all blocks of the
array. It features a write to buffer program capability that improves throughput by pro-
gramming a buffer of 32 words in one command sequence. Also, in x16 mode, the en-
hanced buffered program capability improves throughput by programming 256 words
in one command sequence. The device VPP/WP# signal enables faster programming.
The device contains a 128-word (x16) and 256-byte (x8) extended memory block. The
user can program this additional space and then protect it to permanently secure the
contents. The device also features different levels of hardware and software protection
to secure blocks from unwanted modification.
Figure 1: Logic Diagram
VCC VCCQ
A[23:0]
WE#
VPP/WP#
DQ[14:0]
DQ15/A-1
VSS
15
CE#
OE#
RST#
BYTE#
RY/BY#
256Mb: 3V Embedded Parallel NOR Flash
General Description
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Signal Assignments
Figure 2: 56-Pin TSOP (Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
A23
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RST#
A21
VPP/WP#
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
RFU
RFU
RFU
RFU
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
RFU
VCCQ
Notes: 1. A23 = A[MAX].
2. A-1 is the least significant address bit in x8 mode.
256Mb: 3V Embedded Parallel NOR Flash
Signal Assignments
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Figure 3: 64-Ball Fortified BGA and 64-Ball TBGA
A
B
C
D
E
F
G
H
A
B
C
D
E
F
G
H
1
RFU
RFU
RFU
RFU
RFU
VCCQ
RFU
RFU
1
RFU
RFU
RFU
RFU
RFU
VCCQ
RFU
RFU
2
A3
A4
A2
A1
A0
CE#
OE#
VSS
2
A3
A4
A2
A1
A0
CE#
OE#
VSS
3
A7
A17
A6
A5
D0
D8
D9
D1
3
A7
A17
A6
A5
D0
D8
D9
D1
4
RY/BY#
VPP/WP#
A18
A20
D2
D10
D11
D3
4
RY/BY#
VPP/WP#
A18
A20
D2
D10
D11
D3
5
WE#
RST#
A21
A19
D5
D12
VCC
D4
5
WE#
RST#
A21
A19
D5
D12
VCC
D4
6
A9
A8
A10
A11
D7
D14
D13
D6
6
A9
A8
A10
A11
D7
D14
D13
D6
7
A13
A12
A14
A15
A16
BYTE#
D15/A-1
VSS
7
A13
A12
A14
A15
A16
BYTE#
D15/A-1
VSS
8
RFU
A22
A23
VCCQ
VSS
RFU
RFU
RFU
8
RFU
A22
A23
VCCQ
VSS
RFU
RFU
RFU
Top view – ball side down Bottom view – ball side up
Notes: 1. A[23] = A[MAX].
2. A-1 is the least significant address bit in x8 mode.
256Mb: 3V Embedded Parallel NOR Flash
Signal Assignments
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Signal Descriptions
The signal description table below is a comprehensive list of signals for this device fami-
ly. All signals listed may not be supported on this device. See Signal Assignments for in-
formation specific to this device.
Table 2: Signal Descriptions
Name Type Description
A[MAX:0] Input Address: Selects the cells in the array to access during READ operations. During WRITE oper-
ations, they control the commands sent to the command interface of the program/erase con-
troller.
CE# Input Chip enable: Activates the device, enabling READ and WRITE operations to be performed.
When CE# is HIGH, the device goes to standby, and data outputs are at High-Z.
OE# Input Output enable: Controls the bus READ operation.
WE# Input Write enable: Controls the bus WRITE operation of the command interface.
VPP/WP# Input VPP/write protect: Provides WRITE PROTECT function and VPPH function. These functions
protect the lowest or highest block and enable the device to enter unlock bypass mode, re-
spectively. (Refer to Hardware Protection and Bypass Operations for details.)
BYTE# Input Byte/word organization select: Switches between x8 and x16 bus modes. When BYTE# is
LOW, the device is in x8 mode; when HIGH, the device is in x16 mode.
RST# Input Reset: Applies a hardware reset to the device, which is achieved by holding RST# LOW for at
least tPLPX. After RST# goes HIGH, the device is ready for READ and WRITE operations (after
tPHEL or tRHEL, whichever occurs last). (See RESET AC Specifications for more details.)
DQ[7:0] I/O Data I/O: Outputs the data stored at the selected address during a READ operation. During
WRITE operations, they represent the commands sent to the command interface of the inter-
nal state machine.
DQ[14:8] I/O Data I/O: Outputs the data stored at the selected address during a READ operation when
BYTE# is HIGH. When BYTE# is LOW, these pins are not used and are High-Z. During WRITE
operations, these bits are not used. When reading the status register, these bits should be ig-
nored.
DQ15/A-1 I/O Data I/O or address input: When the device operates in x16 bus mode, this pin behaves as
data I/O, together with DQ[14:8]. When the device operates in x8 bus mode, this pin behaves
as the least significant bit of the address.
Except where stated explicitly otherwise, DQ15 = data I/O (x16 mode); A-1 = address input (x8
mode).
RY/BY# Output Ready/busy: Open-drain output that can be used to identify when the device is performing
a PROGRAM or ERASE operation. During PROGRAM or ERASE operations, RY/BY# is LOW,
and is High-Z during read mode, auto select mode, and erase suspend mode. After a hard-
ware reset, READ and WRITE operations cannot begin until RY/BY# goes High-Z. (See RESET
AC Specifications for more details.)
The use of an open-drain output enables the RY/BY# pins from several devices to be connec-
ted to a single pull-up resistor to VCCQ. A low value will then indicate that one (or more) of
the devices is (are) busy. A 10,000Ω or higher resistor is recommended as pull-up resistor to
achieve 0.1V VOL.
256Mb: 3V Embedded Parallel NOR Flash
Signal Descriptions
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Table 2: Signal Descriptions (Continued)
Name Type Description
VCC Supply Supply voltage: Provides the power supply for READ, PROGRAM, and ERASE operations.
The command interface is disabled when VCC ≤ VLKO. This prevents WRITE operations from ac-
cidentally damaging the data during power-up, power-down, and power surges. If the pro-
gram/erase controller is programming or erasing during this time, then the operation aborts,
and the contents being altered will be invalid.
A 0.1μF capacitor should be connected between VCC and VSS to decouple the current surges
from the power supply. The PCB track widths must be sufficient to carry the currents required
during PROGRAM and ERASE operations. (See DC Characteristics.)
VCCQ Supply I/O supply voltage: Provides the power supply to the I/O pins and enables all outputs to be
powered independently from VCC.
VSS Supply Ground: All VSS pins must be connected to the system ground.
RFU – Reserved for future use: RFUs should be not connected.
Memory Organization
Memory Configuration
The main memory array is divided into 128KB or 64KW uniform blocks.
Memory Map – 256Mb Density
Table 3: 256Mb, Blocks[255:0]
Block
Block
Size
Address Range (x8) Block
Size
Address Range (x16)
Start End Start End
255 128KB 1FE 0000h 1FF FFFFh 64KW 0FF 0000h 0FF FFFFh
⋮ ⋮ ⋮ ⋮ ⋮
127 0FE 0000h 0FF FFFFh 07F 0000h 07F FFFFh
⋮ ⋮ ⋮ ⋮ ⋮
63 07E 0000h 07F FFFFh 03F 0000h 03F FFFFh
⋮ ⋮ ⋮ ⋮ ⋮
0 000 0000h 001 FFFFh 000 0000h 000 FFFFh
256Mb: 3V Embedded Parallel NOR Flash
Memory Organization
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Bus Operations
Table 4: Bus Operations
Notes 1 and 2 apply to entire table
Operation CE# OE# WE# RST# VPP/WP#
8-Bit Mode 16-Bit Mode
A[MAX:0],
DQ15/A-1 DQ[14:8] DQ[7:0] A[MAX:0]
DQ15/A-1,
DQ[14:0]
READ L L H H X Cell address High-Z Data output Cell address Data output
WRITE L H L H X3Command
address
High-Z Data input4Command
address
Data input4
STANDBY H X X H X X High-Z High-Z X High-Z
OUTPUT
DISABLE
L H H H X X High-Z High-Z X High-Z
RESET X X X L X X High-Z High-Z X High-Z
Notes: 1. Typical glitches of less than 5ns on CE#, WE#, and RST# are ignored by the device and do
not affect bus operations.
2. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
3. If WP# is LOW, then the highest or the lowest block remains protected, depending on
line item.
4. Data input is required when issuing a command sequence or when performing data
polling or block protection.
Read
Bus READ operations read from the memory cells, registers, or CFI space. To accelerate
the READ operation, the memory array can be read in page mode where data is inter-
nally read and stored in a page buffer.
The page size is 8 words (16 bytes) and is addressed by address inputs A[2:0] in x16 bus
mode and A[2:0] plus DQ15/A-1 in x8 bus mode. The extended memory blocks and CFI
area do not support page read mode.
A valid READ operation requires setting the appropriate address on the address inputs,
taking CE# and OE# LOW, and holding WE# HIGH. Data I/O signals output the value.
Write
Bus WRITE operations write to the command interface. A valid WRITE operation re-
quires setting the appropriate address on the address inputs. These are latched by the
command interface on the falling edge of CE# or WE#, whichever occurs last. Values on
data I/O signals are latched by the command interface on the rising edge of CE# or
WE#, whichever occurs first. OE# must remain HIGH during the entire operation.
Standby and Automatic Standby
When the device is in read mode, driving CE# HIGH places the device in standby mode
and drives data I/Os to High-Z. Supply current is reduced to standby (ICC2) by holding
CE# within VCC ±0.3V.
256Mb: 3V Embedded Parallel NOR Flash
Bus Operations
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During PROGRAM or ERASE operations, the device continues to use the program/erase
supply current (ICC3) until the operation completes.
Automatic standby enables low power consumption during read mode. When CMOS
levels (VCC ± 0.3 V) drive the bus, and following a READ operation and a period of inac-
tivity specified in DC Characteristics, the memory enters automatic standby as internal
supply current is reduced to ICC2. Data I/O signals still output data if a READ operation
is in progress. Depending on load circuits connected with data bus, VCCQ can have a
null consumption when the memory enters automatic standby.
Output Disable
Data I/Os are High-Z when OE# is HIGH.
Reset
During reset mode, the device is deselected, and outputs are High-Z. The device is in
reset mode when RST# is LOW. Power consumption is reduced to standby level inde-
pendently from CE#, OE#, or WE# inputs.
256Mb: 3V Embedded Parallel NOR Flash
Bus Operations
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Registers
Status Register
Table 5: Status Register Bit Definitions
Note 1 applies to entire table
Bit Name Settings Description Notes
DQ7 Data polling
bit
0 or 1, depending on
operations
Monitors whether the program/erase controller has successful-
ly completed its operation, or has responded to an ERASE SUS-
PEND operation.
2, 3, 4
DQ6 Toggle bit Toggles: 0 to 1; 1 to 0;
and so on
Monitors whether the program/erase controller has successful-
ly completed its operations, or has responded to an ERASE
SUSPEND operation. During a PROGRAM/ERASE operation,
DQ6 toggles from 0 to 1, 1 to 0, and so on, with each succes-
sive READ operation from any address.
3, 4, 5
DQ5 Error bit 0 = Success
1 = Failure
Identifies errors detected by the program/erase controller. DQ5
is set to 1 when a PROGRAM, BLOCK ERASE, or CHIP ERASE op-
eration fails to write the correct data to the memory.
4, 6
DQ3 Erase timer
bit
0 = Erase not in progress
1 = Erase in progress
Identifies the start of program/erase controller operation dur-
ing a BLOCK ERASE command. Before the program/erase con-
troller starts, this bit set to 0, and additional blocks to be
erased can be written to the command interface.
4
DQ2 Alternative
toggle bit
Toggles: 0 to 1; 1 to 0;
and so on
Monitors the program/erase controller during ERASE opera-
tions. During CHIP ERASE, BLOCK ERASE, and ERASE SUSPEND
operations, DQ2 toggles from 0 to 1, 1 to 0, and so on, with
each successive READ operation from addresses within the
blocks being erased.
3, 4
DQ1 Buffered
program
abort bit
1 = Abort Indicates a BUFFER PROGRAM operation abort. The BUFFERED
PROGRAM ABORT and RESET command must be issued to re-
turn the device to read mode (see WRITE TO BUFFER PRO-
GRAM command).
Notes: 1. The status register can be read during PROGRAM, ERASE, or ERASE SUSPEND operations;
the READ operation outputs data on DQ[7:0].
2. For a PROGRAM operation in progress, DQ7 outputs the complement of the bit being
programmed. For a READ operation from the address previously programmed success-
fully, DQ7 outputs existing DQ7 data. For a READ operation from addresses with blocks
to be erased while an ERASE SUSPEND operation is in progress, DQ7 outputs 0; upon
successful completion of the ERASE SUSPEND operation, DQ7 outputs 1. For an ERASE
operation in progress, DQ7 outputs 0; upon either operation's successful completion,
DQ7 outputs 1.
3. After successful completion of a PROGRAM or ERASE operation, the device returns to
read mode.
4. During erase suspend mode, READ operations to addresses within blocks not being
erased output memory array data as if in read mode. A protected block is treated the
same as a block not being erased. See the Toggle Flowchart for more information.
5. During erase suspend mode, DQ6 toggles when addressing a cell within a block being
erased. The toggling stops when the program/erase controller has suspended the ERASE
operation. See the Toggle Flowchart for more information.
256Mb: 3V Embedded Parallel NOR Flash
Registers
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6. When DQ5 is set to 1, a READ/RESET command must be issued before any subsequent
command.
Table 6: Operations and Corresponding Bit Settings
Note 1 applies to entire table
Operation Address DQ7 DQ6 DQ5 DQ3 DQ2 DQ1 RY/BY# Notes
PROGRAM Any address DQ7# Toggle 0 – No toggle 0 0 2
PROGRAM during
ERASE SUSPEND
Any address DQ7# Toggle 0 – – – 0
ENHANCED
BUFFERED
PROGRAM
Any address – Toggle 0 – – – 0
BUFFERED
PROGRAM ABORT
Any address DQ7# Toggle 0 – – 1 0 2
PROGRAM error Any address DQ7# Toggle 1 – – – High-Z
CHIP ERASE Any address 0 Toggle 0 1 Toggle – 0
BLOCK ERASE
before time-out
Erasing block 0 Toggle 0 0 Toggle – 0
Non-erasing block 0 Toggle 0 0 No toggle – 0
BLOCK ERASE Erasing block 0 Toggle 0 1 Toggle – 0
Non-erasing block 0 Toggle 0 1 No toggle – 0
ERASE SUSPEND Erasing block 1 No toggle 0 – Toggle – High-Z
Non-erasing block Outputs memory array data as if in read mode – High-Z
BLOCK ERASE
error
Good block
address
0 Toggle 1 1 No toggle – High-Z
Faulty block
address
0 Toggle 1 1 Toggle – High-Z
Notes: 1. Unspecified data bits should be ignored.
2. DQ7# for buffer program is related to the last address location loaded.
256Mb: 3V Embedded Parallel NOR Flash
Registers
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Figure 4: Data Polling Flowchart
Start
DQ7 = Data
DQ5 = 1
DQ1 = 1
DQ7 = Data
No
No
No
No
Yes
Yes
Yes
Yes
Read DQ7, DQ5, and DQ1
at valid address1
Read DQ7 at valid address
SuccessFailure2
Notes: 1. Valid address is the address being programmed or an address within the block being
erased.
2. Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUF-
FER PROGRAM ABORT operation.
256Mb: 3V Embedded Parallel NOR Flash
Registers
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Figure 5: Toggle Bit Flowchart
DQ6 = Toggle
DQ5 = 1
DQ6 = Toggle
No
No
Yes
Yes
Yes
Start
Read DQ6 at valid address
Read DQ6, DQ5, and DQ1
at valid address
Read DQ6 (twice) at valid address
SuccessFailure1
DQ1 = 1
No
Yes
No
Note: 1. Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUF-
FER PROGRAM ABORT operation.
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Registers
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Figure 6: Status Register Polling Flowchart
WRITE TO BUFFER
PROGRAM
Start
DQ7 = Valid data
DQ5 = 1
Yes
No
No
Yes
Yes
DQ6 = Toggling Yes
No No
No
Yes
PROGRAM operation
No
No
DQ6 = Toggling
No
DQ2 = Toggling
Yes
Yes
Yes
DQ1 = 1
Read 3 correct data?
No
Yes
Read 1
Read 2
Read 2
Read 3
Device busy: Repolling
Device busy: Repolling
Read 3
PROGRAM operation
complete
PROGRAM operation
failure
WRITE TO BUFFER
PROGRAM
abort
Timeout failure
ERASE operation
complete
Erase/suspend mode
Device error
Read2.DQ6 = Read3.DQ6
Read2.DQ2 = Read3.DQ2
Read1.DQ6 = Read2.DQ6
Lock Register
256Mb: 3V Embedded Parallel NOR Flash
Registers
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Table 7: Lock Register Bit Definitions
Note 1 applies to entire table
Bit Name Settings Description Notes
DQ2 Password
protection
mode lock bit
0 = Password protection
mode enabled
1 = Password protection
mode disabled (Default)
Places the device permanently in password protection mode. 2
DQ1 Nonvolatile
protection
mode lock bit
0 = Nonvolatile protection
mode enabled with pass-
word protection mode
permanently disabled
1 = Nonvolatile protection
mode enabled (Default)
Places the device in nonvolatile protection mode with pass-
word protection mode permanently disabled. When shipped
from the factory, the device will operate in nonvolatile protec-
tion mode, and the memory blocks are unprotected.
2
DQ0 Extended
memory
block
protection bit
0 = Protected
1 = Unprotected (Default)
If the device is shipped with the extended memory block un-
locked, the block can be protected by setting this bit to 0. The
extended memory block protection status can be read in auto
select mode by issuing an AUTO SELECT command.
Notes: 1. The lock register is a 16-bit, one-time programmable register. DQ[15:3] are reserved and
are set to a default value of 1.
2. The password protection mode lock bit and nonvolatile protection mode lock bit cannot
both be programmed to 0. Any attempt to program one while the other is programmed
causes the operation to abort, and the device returns to read mode. The device is ship-
ped from the factory with the default setting.
Table 8: Block Protection Status
Nonvolatile
Protection Bit
Lock Bit1
Nonvolatile
Protection
Bit2
Volatile
Protection
Bit3
Block
Protection
Status Block Protection Status
1 1 1 00h Block unprotected; nonvolatile protection bit changeable.
1 1 0 01h Block protected by volatile protection bit; nonvolatile protec-
tion bit changeable.
1 0 1 01h Block protected by nonvolatile protection bit; nonvolatile
protection bit changeable.
1 0 0 01h Block protected by nonvolatile protection bit and volatile
protection bit; nonvolatile protection bit changeable.
0 1 1 00h Block unprotected; nonvolatile protection bit unchangeable.
0 1 0 01h Block protected by volatile protection bit; nonvolatile protec-
tion bit unchangeable.
0 0 1 01h Block protected by nonvolatile protection bit; nonvolatile
protection bit unchangeable.
0 0 0 01h Block protected by nonvolatile protection bit and volatile
protection bit; nonvolatile protection bit unchangeable.
Notes: 1. Nonvolatile protection bit lock bit: when cleared to 1, all nonvolatile protection bits are
unlocked; when set to 0, all nonvolatile protection bits are locked.
256Mb: 3V Embedded Parallel NOR Flash
Registers
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2. Block nonvolatile protection bit: when cleared to 1, the block is unprotected; when set
to 0, the block is protected.
3. Block volatile protection bit: when cleared to 1, the block is unprotected; when set to 0,
the block is protected.
Figure 7: Lock Register Program Flowchart
Start
Done?
DQ5 = 1
No
No
Yes
Yes
Enter LOCK REGISTER command set
Address/data (unlock) cycle 1
Address/data (unlock) cycle 2
Address/data cycle 3
PROGRAM LOCK REGISTER
Address/data cycle 1
Address/data cycle 2
Polling algorithm
Success:
EXIT PROTECTION command set
(Returns to device read mode)
Address/data cycle 1
Address/data cycle 2
Failure:
READ/RESET
(Returns device to read mode)
Notes: 1. Each lock register bit can be programmed only once.
2. See the Block Protection Command Definitions table for address/data cycle details.
256Mb: 3V Embedded Parallel NOR Flash
Registers
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Standard Command Definitions – Address/Data Cycles
Table 9: Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit
Note 1 applies to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th 5th 6th
A D A D A D A D A D A D
READ and AUTO SELECT Operations
READ/RESET (F0h) x8 X F0
AAA AA 555 55 X F0
x16 X F0
555 AA 2AA 55 X F0
READ CFI (98h) x8 AA 98
x16 55
AUTO SELECT (90h) x8 AAA AA 555 55 AAA 90 Note
2
Note
2
2, 3, 4
x16 555 2AA 555
BYPASS Operations
UNLOCK BYPASS (20h) x8 AAA AA 555 55 AAA 20
x16 555 2AA 555
UNLOCK BYPASS
RESET (90h/00h)
x8 X 90 X 00
x16
PROGRAM Operations
PROGRAM (A0h) x8 AAA AA 555 55 AAA A0 PA PD
x16 555 2AA 555
UNLOCK BYPASS
PROGRAM (A0h)
x8 X A0 PA PD 5
x16
WRITE TO BUFFER
PROGRAM (25h)
x8 AAA AA 555 55 BAd 25 BAd N PA PD 6, 7, 8
x16 555 2AA
UNLOCK BYPASS
WRITE TO BUFFER
PROGRAM (25h)
x8 BAd 25 BAd N PA PD 5
x16
WRITE TO BUFFER
PROGRAM CONFIRM
(29h)
x8 BAd 29
x16
BUFFERED PROGRAM
ABORT and RESET (F0h)
x8 AAA AA 555 55 AAA F0
x16 555 2AA 555
ENTER ENHANCED
BUFFERED
PROGRAM (38h)
x8 NA
x16 555 AA 2AA 55 555 38
ENHANCED
BUFFERED
PROGRAM (33h)
x8 NA 9
x16 BAd 33 BAd
(00)
Data BAd
(01)
Data
256Mb: 3V Embedded Parallel NOR Flash
Standard Command Definitions – Address/Data Cycles
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Table 9: Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit (Continued)
Note 1 applies to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th 5th 6th
A D A D A D A D A D A D
EXIT ENHANCED
BUFFERED
PROGRAM (90h)
x8 NA
x16 X 90 X 00
ENHANCED
BUFFERED
PROGRAM ABORT (F0h)
x8 NA
x16 555 AA 2AA 55 555 F0
PROGRAM SUSPEND
(B0h)
x8 X B0
x16
PROGRAM RESUME
(30h)
x8 X 30
x16
ERASE Operations
CHIP ERASE (80/10h) x8 AAA AA 555 55 AAA 80 AAA AA 555 55 AAA 10
x16 555 2AA 555 555 2AA 555
UNLOCK BYPASS
CHIP ERASE (80/10h)
x8 X 80 X 10 5
x16
BLOCK ERASE (80/30h) x8 AAA AA 555 55 AAA 80 AAA AA 555 55 BAd 30 10
x16 555 2AA 555 555 2AA
UNLOCK BYPASS
BLOCK ERASE (80/30h)
x8 X 80 BAd 30 5
x16
ERASE SUSPEND (B0h) x8 X B0
x16
ERASE RESUME (30h) x8 X 30
x16
Notes: 1. A = Address; D = Data; X = "Don't Care"; BAd = Any address in the block; N = Number of
bytes to be programmed; PA = Program address; PD = Program data; Gray shading = Not
applicable. All values in the table are hexadecimal. Some commands require both a com-
mand code and subcode.
2. These cells represent READ cycles (versus WRITE cycles for the others).
3. AUTO SELECT enables the device to read the manufacturer code, device code, block pro-
tection status, and extended memory block protection indicator.
4. AUTO SELECT addresses and data are specified in the Electronic Signature table and the
Extended Memory Block Protection table.
5. For any UNLOCK BYPASS ERASE/PROGRAM command, the first two UNLOCK cycles are
unnecessary.
6. BAd must be the same as the address loaded during the WRITE TO BUFFER PROGRAM
third and fourth cycles.
7. WRITE TO BUFFER PROGRAM operation: maximum cycles = 68 (x8) and 36 (x16). UN-
LOCK BYPASS WRITE TO BUFFER PROGRAM operation: maximum cycles = 66 (x8) and 34
256Mb: 3V Embedded Parallel NOR Flash
Standard Command Definitions – Address/Data Cycles
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(x16). WRITE TO BUFFER PROGRAM operation: N + 1 = bytes to be programmed; maxi-
mum buffer size = 64 bytes (x8) and 32 words (x16).
8. For x8, A[MAX:5] address pins should remain unchanged while A[4:0] and A-1 pins are
used to select a byte within the N + 1 byte page. For x16, A[MAX:5] address pins should
remain unchanged while A[4:0] pins are used to select a word within the N + 1 word
page.
9. The following is content for address/data cycles 256 through 258: BAd (FE) - Data; BAd
(FF) - Data; BAd (00) - 29.
10. BLOCK ERASE address cycles can extend beyond six address/data cycles, depending on
the number of blocks to erase.
READ Operations
READ/RESET Command
The READ/RESET (F0h) command returns the device to read mode and resets the errors
in the status register. One or three bus WRITE operations can be used to issue the
READ/RESET command.
To return the device to read mode, this command can be issued between bus WRITE
cycles before the start of a PROGRAM or ERASE operation. If the READ/RESET com-
mand is issued during the timeout of a BLOCK ERASE operation, the device requires up
to 10μs to abort, during which time no valid data can be read.
READ CFI Command
The READ CFI (98h) command puts the device in read CFI mode and is valid only when
the device is in read array or auto select mode. One bus WRITE cycle is required to issue
the command.
Once in read CFI mode, bus READ operations will output data from the CFI memory
area. A READ/RESET command must be issued to return the device to the previous
mode (read array or auto select ). A second READ/RESET command is required to put
the device in read array mode from auto select mode.
256Mb: 3V Embedded Parallel NOR Flash
READ Operations
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AUTO SELECT Operations
AUTO SELECT Command
At power-up or after a hardware reset, the device is in read mode. It can then be put in
auto select mode by issuing an AUTO SELECT (90h) command or by applying VID to A9.
Auto select mode enables the following device information to be read:
• Electronic signature, which includes manufacturer and device code information, as
shown in the Electronic Signature table.
• Block protection, which includes the block protection status and extended memory
block protection indicator, as shown in the Block Protection table.
Electronic signature or block protection information is read by executing a READ opera-
tion with control signals and addresses set, as shown in the Read Electronic Signature
table or the Block Protection table, respectively.
Auto select mode can be used by the programming equipment to automatically match a
device with the application code to be programmed.
Three consecutive bus WRITE operations are required to issue an AUTO SELECT com-
mand. The device remains in auto select mode until a READ/RESET or READ CFI com-
mand is issued.
The device cannot enter auto select mode when a PROGRAM or ERASE operation is in
progress (RY/BY# LOW). However, auto select mode can be entered if the PROGRAM or
ERASE operation has been suspended by issuing a PROGRAM SUSPEND or ERASE SUS-
PEND command.
To enter auto select mode by appling VID to A9, see the Read Electronic Signature table
and the Block Protection table.
Auto select mode is exited by performing a reset. The device returns to read mode un-
less it entered auto select mode after an ERASE SUSPEND or PROGRAM SUSPEND
command, in which case it returns to erase or program suspend mode.
Table 10: Read Electronic Signature
Note 1 applies to entire table
Signal
READ Cycle
Notes
Manufacturer
Code Device Code 1 Device Code 2 Device Code 3
CE# L L L L
OE# L L L L
WE# H H H H
Address Input, 8-Bit and 16-Bit
A[MAX:10] X X X X
A9 VID VID VID VID 2
A8 X X X X
A[7:5] L L L L
A4 X X X X
A[3:1] L L H H
256Mb: 3V Embedded Parallel NOR Flash
AUTO SELECT Operations
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Table 10: Read Electronic Signature (Continued)
Note 1 applies to entire table
Signal
READ Cycle
Notes
Manufacturer
Code Device Code 1 Device Code 2 Device Code 3
A0 L H L H
Address Input, 8-Bit Only
DQ[15]/A-1 X X X X
Data I/O, 8-Bit Only
DQ[14:8] X X X X
DQ[7:0] 20h 7Eh 22h 01h
Data I/O, 16-Bit Only
DQ[15]/A-1, and DQ[14:0] 0020h 227Eh 2222h 2201h
Notes: 1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
2. When using the AUTO SELECT command to enter auto select mode, applying VID to A9 is
not required. A9 can be either VIL or VIH.
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AUTO SELECT Operations
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Table 11: Block Protection
Note 1 applies to entire table
Signal
READ Cycle
Notes
Extended Memory
Block
Verify Indicator (GL)
Extended Memory
Block
Verify Indicator (GH)
Block Protection
Status Indicator
CE# L L L
OE# L L L
WE# H H H
Address Input, 8-Bit and 16-Bit
A[MAX:16] X X Block base address
A[15:10] X X X
A9 VID VID VID 2
A8 X X X
A[7:5] L L L
A4 X X X
A[3:2] L L L
A1 H H H
A0 H H L
Address Input, 8-Bit Only
DQ[15]/A-1 X X X
Data I/O, 8-Bit Only
DQ[14:8] X X X
DQ[7:0] 89h 99h 01h 3, 5
09h 19h 00h 4, 6
Data I/O, 16-Bit Only
DQ[15]/A-1, and DQ[14:0] 0089h 0099h 0001h 3, 5
0009h 0019h 0000h 4, 6
Notes: 1. Read cycle output to DQ7 = Extended memory block protection indicator; GH = High
block protection; GL = Low block protection; BPS = Block protection status; H = Logic
level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.
2. When using the AUTO SELECT command to enter auto select mode, applying VID to A9 is
not required. A9 can be either VIL or VIH.
3. Extended memory blocks are Micron-prelocked (permanent).
4. Extended memory blocks are customer-lockable.
5. Block protection status = protected: 01h (in x8 mode) is output on DQ[7:0].
6. Block protection status = unprotected: 00h (in x8 mode) is output on DQ[7:0].
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AUTO SELECT Operations
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Bypass Operations
UNLOCK BYPASS Command
The UNLOCK BYPASS (20h) command is used to place the device in unlock bypass
mode. Three bus WRITE operations are required to issue the UNLOCK BYPASS com-
mand.
When the device enters unlock bypass mode, the two initial UNLOCK cycles required
for a standard PROGRAM or ERASE operation are not needed, thus enabling faster total
program or erase time.
The UNLOCK BYPASS command is used in conjunction with UNLOCK BYPASS PRO-
GRAM or UNLOCK BYPASS ERASE commands to program or erase the device faster
than with standard PROGRAM or ERASE commands. Using these commands can save
considerable time when the cycle time to the device is long. When in unlock bypass
mode, only the following commands are valid:
• The UNLOCK BYPASS PROGRAM command can be issued to program addresses
within the device.
• The UNLOCK BYPASS BLOCK ERASE command can then be issued to erase one or
more memory blocks.
• The UNLOCK BYPASS CHIP ERASE command can be issued to erase the whole mem-
ory array.
• The UNLOCK BYPASS WRITE TO BUFFER PROGRAM and UNLOCK BYPASS EN-
HANCED WRITE TO BUFFER PROGRAM commands can be issued to speed up the
programming operation.
• The UNLOCK BYPASS RESET command can be issued to return the device to read
mode.
In unlock bypass mode, the device can be read as if in read mode.
In addition to the UNLOCK BYPASS command, when VPP/WP# is raised to VPPH, the de-
vice automatically enters unlock bypass mode. When V PP/WP# returns to VIH or VIL, the
device is no longer in unlock bypass mode, and normal operation resumes. The transi-
tions from VIH to VPPH and from VPPH to VIH must be slower than tVHVPP. (See the Accel-
erated Program, Data Polling/Toggle AC Characteristics.)
Note: Micron recommends entering and exiting unlock bypass mode using the ENTER
UNLOCK BYPASS and UNLOCK BYPASS RESET commands rather than raising VPP/WP#
to VPPH. VPP/WP# should never be raised to VPPH from any mode except read mode; oth-
erwise, the device may be left in an indeterminate state. VPP/WP# should not remain at
VPPH for than 80 hours cumulative.
UNLOCK BYPASS RESET Command
The UNLOCK BYPASS RESET (90/00h) command is used to return to read/reset mode
from unlock bypass mode. Two bus WRITE operations are required to issue the UN-
LOCK BYPASS RESET command. The READ/RESET command does not exit from un-
lock bypass mode.
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Bypass Operations
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Program Operations
PROGRAM Command
The PROGRAM (A0h) command can be used to program a value to one address in the
memory array. The command requires four bus WRITE operations; the final WRITE op-
eration latches the address and data in the internal state machine and starts the pro-
gram/erase controller. After programming has started, bus READ operations output the
status register content.
Programming can be suspended and then resumed by issuing a PROGRAM SUSPEND
command and a PROGRAM RESUME command, respectively.
If the address falls in a protected block, the PROGRAM command is ignored, and the
data remains unchanged. The status register is not read, and no error condition is given.
After the PROGRAM operation has completed, the device returns to read mode, unless
an error has occurred. When an error occurs, bus READ operations to the device contin-
ue to output the status register. A READ/RESET command must be issued to reset the
error condition and return the device to read mode.
The PROGRAM command cannot change a bit set to 0 back to 1, and an attempt to do
so is masked during a PROGRAM operation. Instead, an ERASE command must be used
to set all bits in one memory block or in the entire memory from 0 to 1.
The PROGRAM operation is aborted by performing a reset or by powering-down the de-
vice. In this case, data integrity cannot be ensured, and the words or bytes that were
aborted should be reprogrammed.
UNLOCK BYPASS PROGRAM Command
When the device is in unlock bypass mode, the UNLOCK BYPASS PROGRAM (A0h)
command can be used to program one address in the memory array. The command re-
quires two bus WRITE operations instead of four required by a standard PROGRAM
command; the final WRITE operation latches the address and data and starts the pro-
gram/erase controller. (The standard PROGRAM command requires four bus WRITE
operations.) The PROGRAM operation using the UNLOCK BYPASS PROGRAM com-
mand behaves identically to the PROGRAM operation using the PROGRAM command.
The operation cannot be aborted. A bus READ operation to the memory outputs the
status register.
WRITE TO BUFFER PROGRAM Command
The WRITE TO BUFFER PROGRAM (25h) command makes use of the 32-word program
buffer to speed up programming. A maximum of 32 words can be loaded into the pro-
gram buffer. The WRITE TO BUFFER PROGRAM command dramatically reduces system
programming time compared to the standard non-buffered PROGRAM command.
When issuing a WRITE TO BUFFER PROGRAM command, V PP/WP# can be either held
HIGH or raised to VPPH. Also, it can be held LOW if the block is not the lowest or highest
block, depending on the part number. The following successive steps are required to is-
sue the WRITE TO BUFFER PROGRAM command:
First, two UNLOCK cycles are issued. Next, a third bus WRITE cycle sets up the WRITE
TO BUFFER PROGRAM command. The set-up code can be addressed to any location
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within the targeted block. Then, a fourth bus WRITE cycle sets up the number of words/
bytes to be programmed. Value n is written to the same block address, where n + 1 is the
number of words/bytes to be programmed. Value n + 1 must not exceed the size of the
program buffer, or the operation will abort. A fifth cycle loads the first address and data
to be programmed. Last, n bus WRITE cycles load the address and data for each word/
byte into the program buffer. Addresses must lie within the range from the start address
+1 to the start address + (n - 1).
Optimum programming performance and lower power usage are achieved by aligning
the starting address at the beginning of a 32-word boundary. Any buffer size smaller
than 32 words is allowed within a 32-word boundary, while all addresses used in the op-
eration must lie within the 32-word boundary. In addition, any crossing boundary buf-
fer program will result in a program abort.
To program the content of the program buffer, this command must be followed by a
WRITE TO BUFFER PROGRAM CONFIRM command.
If an address is written several times during a WRITE TO BUFFER PROGRAM operation,
the address/data counter will be decremented at each data load operation, and the data
will be programmed to the last word loaded into the buffer.
Invalid address combinations or the incorrect sequence of bus WRITE cycles will abort
the WRITE TO BUFFER PROGRAM command.
The status register bits DQ1, DQ5, DQ6, DQ7 can be used to monitor the device status
during a WRITE TO BUFFER PROGRAM operation.
The WRITE BUFFER PROGRAM command should not be used to change a bit set to 0
back to 1, and an attempt to do so is masked during the operation. Rather than the
WRITE BUFFER PROGRAM command, the ERASE command should be used to set
memory bits from 0 to 1.
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Figure 8: WRITE TO BUFFER PROGRAM Flowchart
Abort
WRITE TO BUFFER
Write buffer data,
start address
Start
X = n
Write n,1
block address
WRITE TO BUFFER
and PROGRAM
aborted2
Write to a different
block address
X = 0
Write next data,3
program address pair
WRITE TO BUFFER
confirm, block address
X = X - 1
Yes
No
Yes
No
DQ7 = Data
No
Yes
DQ5 = 1
Yes
No
DQ1 = 1 No
Yes
WRITE TO BUFFER
command,
block address
Read data polling
register (DQ1, DQ5,
DQ7) at last loaded
DQ7 = Data4
No
Yes
Check data polling
register (DQ5, DQ7)
at last loaded address
Fail or
abort5End
First three cycles of the
WRITE TO BUFFER
PROGRAM command
address
Notes: 1. n + 1 is the number of addresses to be programmed.
2. The BUFFERED PROGRAM ABORT and RESET command must be issued to return the de-
vice to read mode.
3. When the block address is specified, any address in the selected block address space is
acceptable. However, when loading program buffer address with data, all addresses
must fall within the selected program buffer page.
4. DQ7 must be checked because DQ5 and DQ7 may change simultaneously.
5. If this flowchart location is reached because DQ5 = 1, then the WRITE TO BUFFER PRO-
GRAM command failed. If this flowchart location is reached because DQ1 = 1, then the
WRITE TO BUFFER PROGRAM command aborted. In both cases, the appropriate RESET
command must be issued to return the device to read mode: A RESET command if the
operation failed; a WRITE TO BUFFER PROGRAM ABORT AND RESET command if the op-
eration aborted.
6. See the Standard Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit table for
details about the WRITE TO BUFFER PROGRAM command sequence.
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UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command
When the device is in unlock bypass mode, the UNLOCK BYPASS WRITE TO BUFFER
(25h) command can be used to program the device in fast program mode. The com-
mand requires two bus WRITE operations fewer than the standard WRITE TO BUFFER
PROGRAM command.
The UNLOCK BYPASS WRITE TO BUFFER PROGRAM command behaves the same way
as the WRITE TO BUFFER PROGRAM command: the operation cannot be aborted, and
a bus READ operation to the memory outputs the status register.
The WRITE TO BUFFER PROGRAM CONFIRM command is used to confirm an UN-
LOCK BYPASS WRITE TO BUFFER PROGRAM command and to program the n + 1
words/bytes loaded in the program buffer by this command.
WRITE TO BUFFER PROGRAM CONFIRM Command
The WRITE TO BUFFER PROGRAM CONFIRM (29h) command is used to confirm a
WRITE TO BUFFER PROGRAM command and to program the n + 1 words/bytes loaded
in the program buffer by this command.
BUFFERED PROGRAM ABORT AND RESET Command
A BUFFERED PROGRAM ABORT AND RESET (F0h) command must be issued to reset
the device to read mode when the BUFFER PROGRAM operation is aborted. The buffer
programming sequence can be aborted in the following ways:
• Load a value that is greater than the page buffer size during the number of locations
to program in the WRITE TO BUFFER PROGRAM command.
• Write to an address in a different block than the one specified during the WRITE BUF-
FER LOAD command.
• Write an address/data pair to a different write buffer page than the one selected by
the starting address during the program buffer data loading stage of the operation.
• Write data other than the CONFIRM command after the specified number of data
load cycles.
The abort condition is indicated by DQ1 = 1, DQ7 = DQ7# (for the last address location
loaded), DQ6 = toggle, and DQ5 = 0 (all of which are status register bits). A BUFFERED
PROGRAM ABORT and RESET command sequence must be written to reset the device
for the next operation.
Note: The full three-cycle BUFFERED PROGRAM ABORT and RESET command se-
quence is required when using buffer programming features in unlock bypass mode.
PROGRAM SUSPEND Command
The PROGRAM SUSPEND (B0h) command can be used to interrupt a program opera-
tion so that data can be read from any block. When the PROGRAM SUSPEND command
is issued during a program operation, the device suspends the operation within the pro-
gram suspend latency time and updates the status register bits.
After the program operation has been suspended, data can be read from any address.
However, data is invalid when read from an address where a program operation has
been suspended.
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The PROGRAM SUSPEND command may also be issued during a PROGRAM operation
while an erase is suspended. In this case, data may be read from any address not in
erase suspend or program suspend mode. To read from the extended memory block
area (one-time programmable area), the ENTER/EXIT EXTENDED MEMORY BLOCK
command sequences must be issued.
The system may also issue the AUTO SELECT command sequence when the device is in
program suspend mode. The system can read as many auto select codes as required.
When the device exits auto select mode, the device reverts to program suspend mode
and is ready for another valid operation.
The PROGRAM SUSPEND operation is aborted by performing a device reset or power-
down. In this case, data integrity cannot be ensured, and the words or bytes that were
aborted should be reprogrammed.
PROGRAM RESUME Command
The PROGRAM RESUME (30h) command must be issued to exit a program suspend
mode and resume a PROGRAM operation. The controller can use DQ7 or DQ6 status
bits to determine the status of the PROGRAM operation. After a PROGRAM RESUME
command is issued, subsequent PROGRAM RESUME commands are ignored. Another
PROGRAM SUSPEND command can be issued after the device has resumed program-
ming.
ENTER and EXIT ENHANCED BUFFERED PROGRAM Command
The ENHANCED BUFFERED PROGRAM commands are available only in x16 mode.
When the ENTER ENHANCED BUFFERED PROGRAM command is issued, the device
accepts only these commands, which can be executed multiple times. Monitor the tog-
gle bit to ensure successful completion of the ENTER ENHANCED BUFFERED PRO-
GRAM command. The EXIT ENHANCED BUFFERED PROGRAM command returns the
device to read mode; two bus WRITE operations are required to issue the command.
ENHANCED BUFFERED PROGRAM Command
The ENHANCED BUFFERED PROGRAM command makes use of a 256-word write buf-
fer to speed up programming. Each write buffer has the same A[23:8] addresses. This
command dramatically reduces system programming time compared to both the
standard non-buffered PROGRAM command and the WRITE TO BUFFER command.
When issuing the ENHANCED BUFFERED PROGRAM command, the VPP/WP pin can
be held HIGH or raised to VPPH. (See Program/Erase Characteristics.) The following suc-
cessive steps are required to issue the WRITE TO BUFFER PROGRAM command:
First, the ENTER ENHANCED BUFFERED PROGRAM command is issued. Next, one bus
WRITE cycle sets up the ENHANCED BUFFERED PROGRAM command. The set-up
code can be addressed to any location within the targeted block. Then, a second bus
WRITE cycle loads the first address and the data to be programmed. There are a total of
256 address- and data-loading cycles. When the 256 words are loaded to the buffer, a
third WRITE cycle programs the content of the buffer. Last, when the command com-
pletes, the EXIT ENHANCED BUFFERED PROGRAM command is issued.
Address/data cycles must be loaded in an increasing address order, from A[7:0] =
00000000 to A[7:0] = 11111111 until all 256 words are loaded. Invalid address combina-
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Program Operations
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tions or the incorrect sequence of bus WRITE cycles will abort the WRITE TO BUFFER
PROGRAM command.
The status register bits DQ1, DQ5, DQ6, DQ7 can be used to monitor the device status
during a WRITE TO BUFFER PROGRAM operation.
An external 12V supply can be used to improve programming efficiency.
When reprogramming data in a portion of memory already programmed (changing
programmed data from 0 to 1) operation failure can be detected by a logical OR be-
tween the previous and the current value.
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Figure 9: ENHANCED BUFFERED PROGRAM Flowchart
Notes: 1. The ENHANCED BUFFERED PROGRAM ABORT AND RESET command must be issued to
return the device to read mode.
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Program Operations
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2. When the block address is specified, all addresses in the selected block address space
must be issued starting from 00h. Furthermore, when loading the write buffer address
with data, data program addresses must be consecutive.
3. DQ7 must be checked because DQ5 and DQ7 may change simultaneously.
4. If this flowchart location is reached because DQ5 = 1, then the ENHANCED WRITE TO
BUFFER PROGRAM command failed. If this flowchart location is reached because DQ1 =
1, then the ENHANCED WRITE TO BUFFER PROGRAM command aborted. In both cases,
the appropriate RESET command must be issued to return the device to read mode: a
RESET command if the operation failed; an ENHANCED WRITE TO BUFFER PROGRAM
ABORT AND RESET command if the operation aborted.
ENHANCED BUFFERED PROGRAM ABORT AND RESET Command
An ENHANCED BUFFERED PROGRAM ABORT AND RESET command must be issued
to reset the device to read mode when the ENHANCED BUFFERED PROGRAM opera-
tion is aborted. The buffer programming sequence can be aborted in the following
ways:
• Write to an address in a different block than the one specified during the buffer load.
• Write an address/data pair to a different write buffer page than the one selected by
the starting address during the program buffer data loading stage of the operation.
• Write data other than the CONFIRM command after the 256 data load cycles.
• Load a value that is greater than or less than the 256 buffer size.
• Load address/data pairs in an incorrect sequence.
The abort condition is indicated by DQ1 = 1, DQ6 = toggle, and DQ5 = 0 (all of which are
status register bits).
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Erase Operations
CHIP ERASE Command
The CHIP ERASE (80/10h) command erases the entire chip. Six bus WRITE operations
are required to issue the command and start the program/erase controller.
Protected blocks are not erased. If all blocks are protected, the CHIP ERASE operation
appears to start, but will terminate within approximately100μs, leaving the data un-
changed. No error is reported when protected blocks are not erased.
During the CHIP ERASE operation, the device ignores all other commands, including
ERASE SUSPEND. It is not possible to abort the operation. All bus READ operations dur-
ing CHIP ERASE output the status register on the data I/Os. (See the Status Register sec-
tion for more details.)
After the CHIP ERASE operation completes, the device returns to read mode, unless an
error has occurred. If an error occurs, the device will continue to output the status regis-
ter. A READ/RESET command must be issued to reset the error condition and return to
read mode.
The CHIP ERASE command sets all of the bits in unprotected blocks of the device to 1.
All previous data is lost.
The operation is aborted by performing a reset or by powering-down the device. In this
case, data integrity cannot be ensured, and the entire chip should be erased again.
UNLOCK BYPASS CHIP ERASE Command
When the device is in unlock bypass mode, the UNLOCK BYPASS CHIP ERASE (80/10h)
command can be used to erase all memory blocks at one time. The command requires
only two bus WRITE operations instead of six using the standard CHIP ERASE com-
mand. The final bus WRITE operation starts the program/erase controller.
The UNLOCK BYPASS CHIP ERASE command behaves the same way as the CHIP
ERASE command: the operation cannot be aborted, and a bus READ operation to the
memory outputs the status register.
BLOCK ERASE Command
The BLOCK ERASE (80/30h) command erases a list of one or more blocks. It sets all of
the bits in the unprotected selected blocks to 1. All previous data in the selected blocks
is lost.
Six bus WRITE operations are required to select the first block in the list. Each addition-
al block in the list can be selected by repeating the sixth bus WRITE operation using the
address of the additional block. After the command sequence is written, a block erase
timeout occurs. During the timeout period, additional block addresses and BLOCK
ERASE commands can be written. After the program/erase controller has started, it is
not possible to select any more blocks. Each additional block must therefore be selected
within the timeout period of the last block. The timeout timer restarts when an addi-
tional block is selected. After the sixth bus WRITE operation, a bus READ operation out-
puts the status register. (See the WE#-Controlled Program waveforms for details on how
to identify if the program/erase controller has started the BLOCK ERASE operation.)
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After the BLOCK ERASE operation completes, the device returns to read mode, unless
an error has occurred. If an error occurs, bus READ operations will continue to output
the status register. A READ/RESET command must be issued to reset the error condi-
tion and return to read mode.
If any selected blocks are protected, they are ignored, and all the other selected blocks
are erased. If all the selected blocks are protected, the BLOCK ERASE operation appears
to start, but will terminate within approximately100μs, leaving the data unchanged. No
error condition is given when protected blocks are not erased.
During the BLOCK ERASE operation, the device ignores all commands except the
ERASE SUSPEND command and the READ/RESET command, which is accepted only
during the timeout period. The operation is aborted by performing a reset or powering-
down the device. In this case, data integrity cannot be ensured, and the aborted blocks
should be erased again.
UNLOCK BYPASS BLOCK ERASE Command
When the device is in unlock bypass mode, the UNLOCK BYPASS BLOCK ERASE
(80/30h) command can be used to erase one or more memory blocks at a time. The
command requires two bus WRITE operations instead of six using the standard BLOCK
ERASE command. The final bus WRITE operation latches the address of the block and
starts the program/erase controller.
To erase multiple blocks (after the first two bus WRITE operations have selected the first
block in the list), each additional block in the list can be selected by repeating the sec-
ond bus WRITE operation using the address of the additional block.
The UNLOCK BYPASS BLOCK ERASE command behaves the same way as the BLOCK
ERASE command: the operation cannot be aborted, and a bus READ operation to the
memory outputs the status register. (See the BLOCK ERASE Command section for de-
tails.)
ERASE SUSPEND Command
The ERASE SUSPEND (B0h) command temporarily suspends a BLOCK ERASE opera-
tion. One bus WRITE operation is required to issue the command. The block address is
"Don't Care."
The program/erase controller suspends the ERASE operation within the erase suspend
latency time of the ERASE SUSPEND command being issued. However, when the
ERASE SUSPEND command is written during the block erase timeout, the device im-
mediately terminates the timeout period and suspends the ERASE operation. After the
program/erase controller has stopped, the device operates in read mode, and the erase
is suspended.
During an ERASE SUSPEND operation, it is possible to read and execute PROGRAM op-
erations or WRITE TO BUFFER PROGRAM operations in blocks that are not suspended.
Both READ and PROGRAM operations behave normally on these blocks. Reading from
blocks that are suspended will output the status register. If any attempt is made to pro-
gram in a protected block or in the suspended block, the PROGRAM command is ignor-
ed, and the data remains unchanged. In this case, the status register is not read, and no
error condition is given.
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It is also possible to issue AUTO SELECT and UNLOCK BYPASS commands during an
ERASE SUSPEND operation. The READ/RESET command must be issued to return the
device to read array mode before the RESUME command will be accepted.
During an ERASE SUSPEND operation, a bus READ operation to the extended memory
block will output the extended memory block data. After the device enters extended
memory block mode, the EXIT EXTENDED MEMORY BLOCK command must be issued
before the ERASE operation can be resumed.
An ERASE SUSPEND command is ignored if it is written during a CHIP ERASE opera-
tion.
If the ERASE SUSPEND operation is aborted by performing a device reset or power-
down, data integrity cannot be ensured, and the suspended blocks should be erased
again.
ERASE RESUME Command
The ERASE RESUME (30h) command restarts the program/erase controller after an
ERASE SUSPEND operation.
The device must be in read array mode before the RESUME command will be accepted.
An erase can be suspended and resumed more than once.
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Block Protection Command Definitions – Address/Data Cycles
Table 12: Block Protection Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit
Notes 1 and 2 apply to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th
…
nth
A D A D A D A D A D
LOCK REGISTER Commands
ENTER LOCK REGISTER
COMMAND SET (40h)
x8 AAA AA 555 55 AAA 40 3
x16 555 AA 2AA 55 555
PROGRAM LOCK REGISTER
(A0h)
x8 X A0 X Data 5
x16
READ LOCK REGISTER x8 X Data 4, 5, 6
x16
PASSWORD PROTECTION Commands
ENTER PASSWORD
PROTECTION COMMAND
SET (60h)
x8 AAA AA 555 55 AAA 60 3
x16 555 AA 2AA 55 555
PROGRAM PASSWORD
(A0h)
x8 X A0 PWAn PWDn 7
x16
READ PASSWORD x8 00 PWD0 01 PWD1 02 PWD2 03 PWD3 … 07 PWD7 4, 6, 8,
9
x16 00 PWD0 01 PWD1 02 PWD2 03 PWD3
UNLOCK PASSWORD (25h/
03h)
x8 00 25 00 03 00 PWD0 01 PWD1 … 00 29 8, 10
x16
NONVOLATILE PROTECTION Commands
ENTER NONVOLATILE
PROTECTION COMMAND
SET (C0h)
x8 AAA AA 555 55 AAA C0 3
x16 555 AA 2AA 55 555
PROGRAM NONVOLATILE
PROTECTION BIT (A0h)
x8 X A0 BAd 00
x16
READ NONVOLATILE
PROTECTION BIT STATUS
x8 BAd READ(0) 4, 6,
11
x16
CLEAR ALL NONVOLATILE
PROTECTION BITS (80h/
30h)
x8 X 80 00 30 12
x16
NONVOLATILE PROTECTION BIT LOCK BIT Commands
ENTER NONVOLATILE
PROTECTION BIT LOCK BIT
COMMAND SET (50h)
x8 AAA AA 555 55 AAA 50 3
x16 555 AA 2AA 55 555
PROGRAM NONVOLATILE
PROTECTION BIT LOCK BIT
(A0h)
x8 X A0 X 00 11
x16
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Table 12: Block Protection Command Definitions – Address/Data Cycles, 8-Bit and 16-Bit (Continued)
Notes 1 and 2 apply to entire table
Command and
Code/Subcode
Bus
Size
Address and Data Cycles
Notes
1st 2nd 3rd 4th
…
nth
A D A D A D A D A D
READ NONVOLATILE
PROTECTION BIT LOCK BIT
STATUS
x8 X READ(0) 4, 6,
11
x16
VOLATILE PROTECTION Commands
ENTER VOLATILE
PROTECTION COMMAND
SET (E0h)
x8 AAA AA 555 55 AAA E0 3
x16 555 AA 2AA 55 555
PROGRAM VOLATILE
PROTECTION BIT (A0h)
x8 X A0 BAd 00
x16
READ VOLATILE
PROTECTION BIT STATUS
x8 BAd READ(0) 4, 6,
11
x16
CLEAR VOLATILE
PROTECTION BIT (A0h)
x8 X A0 BAd 01
x16
EXTENDED MEMORY BLOCK Commands
ENTER EXTENDED
MEMORY BLOCK (88h)
x8 AAA AA 555 55 AAA 88 3
x16 555 AA 2AA 55 555
EXIT EXTENDED
MEMORY BLOCK (90h/00h)
x8 AAA AA 555 55 AAA 90 X 00
x16 555 AA 2AA 55 555
EXIT PROTECTION Commands
EXIT PROTECTION
COMMAND SET (90h/00h)
x8 X 90 X 00 3
x16
Notes: 1. Key: A = Address and D = Data; X = "Don’t Care"; BAd = Any address in the block; PWDn
= Password bytes 0 to 7; PWAn = Password address, n = 0 to 7; Gray = Not applicable. All
values in the table are hexadecimal.
2. DQ[15:8] are "Don’t Care" during UNLOCK and COMMAND cycles. A[MAX:16] are
"Don’t Care" during UNLOCK and COMMAND cycles, unless an address is required.
3. The ENTER command sequence must be issued prior to any operation. It disables READ
and WRITE operations from and to block 0. READ and WRITE operations from and to
any other block are allowed. Also, when an ENTER COMMAND SET command is issued,
an EXIT PROTECTION COMMAND SET command must be issued to return the device to
READ mode.
4. READ REGISTER/PASSWORD commands have no command code; CE# and OE# are driven
LOW, and data is read according to a specified address.
5. Data = Lock register content.
6. All address cycles shown for this command are READ cycles.
7. Only one portion of the password can be programmed or read by each PROGRAM PASS-
WORD command.
8. Each portion of the password can be entered or read in any order as long as the entire
64-bit password is entered or read.
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9. For the x8 READ PASSWORD command, the nth (and final) address cycle equals the
eighth address cycle. From the fifth to the eighth address cycle, the values for each ad-
dress and data pair continue the pattern shown in the table as follows: for x8, address
and data = 04 and PWD4; 05 and PWD5; 06 and PWD6; 07 and PWD7.
10. For the x8 UNLOCK PASSWORD command, the nth (and final) address cycle equals the
eleventh address cycle. From the fifth to the tenth address cycle, the values for each ad-
dress and data pair continue the pattern shown in the table as follows: address and data
= 02 and PWD2; 03 and PWD3; 04 and PWD4; 05 and PWD5; 06 and PWD6; 07 and
PWD7.
For the x16 UNLOCK PASSWORD command, the nth (and final) address cycle equals the
seventh address cycle. For the fifth and sixth address cycles, the values for the address
and data pair continue the pattern shown in the table as follows: address and data = 02
and PWD2; 03 and PWD3.
11. Both nonvolatile and volatile protection bit settings are as follows: Protected state = 00;
Unprotected state= 01.
12. The CLEAR ALL NONVOLATILE PROTECTION BITS command programs all nonvolatile pro-
tection bits before erasure. This prevents over-erasure of previously cleared nonvolatile
protection bits.
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Protection Operations
Blocks can be protected individually against accidental PROGRAM, ERASE, or READ op-
erations on both 8-bit and 16-bit configurations. The block protection scheme is shown
in the Software Protection Scheme figure. Memory block and extended memory block
protection is configured through the lock register.
LOCK REGISTER Commands
The ENTER LOCK REGISTER COMMAND SET (40h) command enables execution of all
READ or PROGRAM LOCK REGISTER commands. PROGRAM LOCK REGISTER (A0h)
configures the lock register, and READ LOCK REGISTER reads/confirms programmed
data.
PASSWORD PROTECTION Commands
The ENTER PASSWORD PROTECTION COMMAND SET (60h) command enables execu-
tion of password protection commands. PROGRAM PASSWORD (A0h) programs the 64-
bit password used in the password protection mode. To program the 64-bit password in
8-bit mode, the complete command sequence must be entered eight times at eight con-
secutive addresses selected by A[1:0] plus DQ15/A-1; in 16-bit mode, the command se-
quence must be entered four times at four consecutive addresses selected by A[1:0]. By
default, all password bits are set to 1. The password can be checked by issuing a READ
PASSWORD command.
READ PASSWORD verifies the password used in password protection mode. To verify
the 64-bit password in 8-bit mode, the complete command sequence must be entered
eight times at eight consecutive addresses selected by A[1:0] plus DQ15/A-1. In 16-bit
mode, the command sequence must be entered four times at four consecutive address-
es selected by A[1:0]. If the password mode lock bit is programmed, and a user attempts
to read the password, the device outputs FFh.
UNLOCK PASSWORD (25/03h) clears the nonvolatile protection bit lock bit, allowing
the nonvolatile protection bits to be modified. UNLOCK PASSWORD must be issued
with the correct password and requires a 1μs delay between successive UNLOCK PASS-
WORD commands. The delay helps prevent password intruders from trying all possible
64-bit combinations. If the delay does not occur, the latest command is ignored. After a
valid 64-bit password is entered, approximately 1μs is required to unlock the device.
NONVOLATILE PROTECTION Commands
The ENTER NONVOLATILE PROTECTION COMMAND SET (C0h) command enables
nonvolatile protection mode commands to be issued to the device. A block can be pro-
tected from PROGRAM or ERASE operations using a PROGRAM NONVOLATILE PRO-
TECTION BIT (A0h) command, along with the block address. This command sets the
nonvolatile protection bit to 0 for a given block.
The status of a nonvolatile protection bit for a given block or group of blocks can be
read using a READ NONVOLATILE MODIFY PROTECTION BIT command, along with
the block address. The nonvolatile protection bits are erased simultaneously using a
CLEAR ALL NONVOLATILE PROTECTION BITS (80/30h) command. No specific block
address is required. If the nonvolatile protection bit lock bit is set to 0, the command
fails.
256Mb: 3V Embedded Parallel NOR Flash
Protection Operations
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Figure 10: Program/Erase Nonvolatile Protection Bit Algorithm
No
No
Yes
Yes
DQ6 = Toggle
ENTER NONVOLATILE
PROTECTION
command set
Start
PROGRAM NONVOLATILE
PROTECTION BIT
Addr = BAd
Fail
Read byte twice
Addr = BAd
Read byte twice
Addr = BAd
No
No
Yes
Yes
DQ6 = Toggle
Reset
DQ5 = 1
EXIT PROTECTION
command set
DQ0 =
1 (erase)
0 (program)
Read byte twice
Addr = BAd
Wait 500µs
Pass
256Mb: 3V Embedded Parallel NOR Flash
Protection Operations
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NONVOLATILE PROTECTION BIT LOCK BIT Commands
After the ENTER NONVOLATILE PROTECTION BIT LOCK BIT COMMAND SET (50h)
command has been issued, the commands that allow the nonvolatile protection bit lock
bit to be set can be issued to the device.
The PROGRAM NONVOLATILE PROTECTION BIT LOCK BIT (A0h) command is used to
set the nonvolatile protection bit lock bit to 0, thus locking the nonvolatile protection
bits and preventing them from being modified.
The READ NONVOLATILE PROTECTION BIT LOCK BIT STATUS command is used to
read the status of the nonvolatile protection bit lock bit.
VOLATILE PROTECTION Commands
After the ENTER VOLATILE PROTECTION COMMAND SET (E0h) command has been
issued, commands related to the volatile protection mode can be issued to the device.
The PROGRAM VOLATILE PROTECTION BIT (A0h) command individually sets a vola-
tile protection bit to 0 for a given block. If the nonvolatile protection bit for the same
block is set, the block is locked regardless of the value of the volatile protection bit. (See
the Block Protection Status table.)
The status of a volatile protection bit for a given block can be read by issuing a READ
VOLATILE PROTECTION BIT STATUS command along with the block address.
The CLEAR VOLATILE PROTECTION BIT (A0h) command individually clears (sets to 1)
the volatile protection bit for a given block. If the nonvolatile protection bit for the same
block is set, the block is locked regardless of the value of the volatile protection bit. (See
the Block Protection Status table.)
EXTENDED MEMORY BLOCK Commands
The device has one extra 128-word extended memory block that can be accessed only
by the ENTER EXTENDED MEMORY BLOCK (88h) command. The extended memory
block is 128 words (x16) or 256 bytes (x8). It is used as a security block to provide a per-
manent 128-bit security identification number or to store additional information. The
device can be shipped with the extended memory block prelocked permanently by Mi-
cron, including the 128-bit security identification number. Or, the device can be ship-
ped with the extended memory block unlocked, enabling customers to permanently
program and lock it. (See Lock Register, the AUTO SELECT command, and the Block
Protection table.)
Table 13: Extended Memory Block Address and Data
Address Data
x8 x16 Micron-Prelocked Customer-Lockable
000000h–0000FFh 000000h–00007Fh Secure ID number Determined by customer
After the ENTER EXTENDED MEMORY BLOCK command has been issued, the device
enters the extended memory block mode. All bus READ or PROGRAM operations are
conducted on the extended memory block, and the extended memory block is ad-
dressed using the addresses occupied by block 0 in the other operating modes. (See the
Memory Map table.)
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Protection Operations
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In extended memory block mode, ERASE, CHIP ERASE, ERASE SUSPEND, and ERASE
RESUME commands are not allowed. The extended memory block cannot be erased,
and each bit of the extended memory block can only be programmed once.
The extended memory block is protected from further modification by programming
lock register bit 0. Once invoked, this protection cannot be undone.
The device remains in extended memory block mode until the EXIT EXTENDED MEM-
ORY BLOCK (90/00h) command is issued, which returns the device to read mode, or
until power is removed from the device. After a power-up sequence or hardware reset,
the device will revert to reading memory blocks in the main array.
EXIT PROTECTION Command
The EXIT PROTECTION COMMAND SET (90/00h) command is used to exit the lock
register, password protection, nonvolatile protection, volatile protection, and nonvola-
tile protection bit lock bit command set modes and return the device to read mode.
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Protection Operations
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Device Protection
Hardware Protection
The VPP/WP# function provides a hardware method of protecting the highest or lowest
block. When V PP/WP# is LOW, PROGRAM and ERASE operations on either of these
blocks is ignored to provide protection. When V PP/WP# is HIGH, the device reverts to
the previous protection status for the highest or lowest block. PROGRAM and ERASE
operations can modify the data in this block unless the block is protected using block
protection.
When VPP/WP# protect is raised to VPPH, the device automatically enters the unlock by-
pass mode, and command execution time is faster. This must never be done from any
mode except read mode; otherwise, the device might be left in an indeterminate state.
A 0.1μF capacitor should be connected between VPP/WP# and the VSS ground pin to de-
couple the current surges from the power supply. The PCB track widths must be suffi-
cient to carry the currents required during unlock bypass program.
When VPP/WP# returns to HIGH or LOW, normal operation resumes. When operations
execute in unlock bypass mode, the device draws IPP from the pin to supply the pro-
gramming circuits. Transitions from HIGH to VPPH and from VPPH to LOW must be slow-
er than tVHVPP.
Note: Micron highly recommends driving VPP/WP# HIGH or LOW. If a system needs to
float VPP/WP#, without a pull-up/pull-down resistor and no capacitor, then an internal
pull-up resistor is enabled.
Table 14: VPP/WP# Functions
VPP/WP# Settings Function
VIL Highest (29WxxxGH) or lowest (29WxxxGL) block is protected.
VIH Highest or lowest block is unprotected unless software protection is activated.
VPPH Unlock bypass mode supplies current necessary to speed up PROGRAM execution time.
Software Protection
Software protection includes volatile, nonvolatile, and password protection as well as
password access. The device is shipped with all blocks unprotected. On first use, the de-
vice defaults to the nonvolatile protection mode but can be activated in either the non-
volatile protection or password protection mode.
The desired protection mode is activated by setting either the nonvolatile protection
mode lock bit or the password protection mode lock bit of the lock register. (See the
Lock Register section.) Both bits are one-time-programmable and nonvolatile; there-
fore, after the protection mode has been activated, it cannot be changed, and the device
is set permanently to operate in the selected protection mode. It is recommended that
the desired software protection mode be activated when first programming the device.
For the lowest and highest blocks, a higher level of block protection can be achieved by
locking the blocks using nonvolatile protection mode and holding VPP /WP# LOW.
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Device Protection
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Blocks with volatile protection and nonvolatile protection can coexist within the memo-
ry array. If the user attempts to program or erase a protected block, the device ignores
the command and returns to read mode.
The block protection status can be read by performing a read electronic signature or by
issuing an AUTO SELECT command. (See the Block Protection table.)
Refer to the Block Protection Status table and the Software Protection Scheme figure for
details on the block protection scheme. Refer to the Protection Operations section for a
description of the command sets.
Volatile Protection Mode
Volatile protection enables the software application to protect blocks against inadver-
tent change and can be disabled when changes are needed. Volatile protection bits are
unique for each block and can be individually modified. Volatile protection bits control
the protection scheme only for unprotected blocks whose nonvolatile protection bits
are cleared to 1. Issuing a PROGRAM VOLATILE PROTECTION BIT or CLEAR VOLATILE
PROTECTION BIT command sets to 0 or clears to 1 the volatile protection bits and pla-
ces the associated blocks in the protected (0) or unprotected (1) state, respectively. The
volatile protection bit can be set or cleared as often as needed.
When the device is first shipped, or after a power-up or hardware reset, the volatile pro-
tection bits default to 1 (unprotected).
Nonvolatile Protection Mode
A nonvolatile protection bit is assigned to each block. Each of these bits can be set for
protection individually by issuing a PROGRAM NONVOLATILE PROTECTION BIT com-
mand. Also, each device has one global volatile bit called the nonvolatile protection bit
lock bit; it can be set to protect all nonvolatile protection bits at once. This global bit
must be set to 0 only after all nonvolatile protection bits are configured to the desired
settings. When set to 0, the nonvolatile protection bit lock bit prevents changes to the
state of the nonvolatile protection bits. When cleared to 1, the nonvolatile protection
bits can be set and cleared using the PROGRAM NONVOLATILE PROTECTION BIT and
CLEAR ALL NONVOLATILE PROTECTION BITS commands, respectively.
No software command unlocks the nonvolatile protection bit lock bit unless the device
is in password protection mode; in nonvolatile protection mode, the nonvolatile protec-
tion bit lock bit can be cleared only by taking the device through a hardware reset or
power-up.
Nonvolatile protection bits cannot be cleared individually; they must be cleared all at
once using a CLEAR ALL NONVOLATILE PROTECTION BITS command. They will re-
main set through a hardware reset or a power-down/power-up sequence.
If one of the nonvolatile protection bits needs to be cleared (unprotected), additional
steps are required. First, the nonvolatile protection bit lock bit must be cleared to 1, us-
ing either a power-cycle or hardware reset. Then, the nonvolatile protection bits can be
changed to reflect the desired settings. Finally, the nonvolatile protection bit lock bit
must be set to 0 to lock the nonvolatile protection bits. The device now will operate nor-
mally.
To achieve the best protection, the PROGRAM NONVOLATILE PROTECTION LOCK BIT
command should be executed early in the boot code, and the boot code should be pro-
tected by holding VPP/WP# LOW.
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Device Protection
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Nonvolatile protection bits and volatile protection bits have the same function when
VPP/WP# is HIGH or when VPP/WP# is at the voltage for program acceleration (VPPH ).
Password Protection Mode
Password protection mode provides a higher level of security than the nonvolatile pro-
tection mode by requiring a 64-bit password to unlock the nonvolatile protection bit
lock bit. In addition to this password requirement, the nonvolatile protection bit lock
bit is set to 0 after power-up and reset to maintain the device in password protection
mode.
Executing the UNLOCK PASSWORD command by entering the correct password clears
the nonvolatile protection bit lock bit, enabling the block nonvolatile protection bits to
be modified. If the password provided is incorrect, the nonvolatile protection bit lock
bit remains locked, and the state of the nonvolatile protection bits cannot be modified.
To place the device in password protection mode, the following two steps are required:
First, before activating the password protection mode, a 64-bit password must be set
and the setting verified. Password verification is allowed only before the password pro-
tection mode is activated. Next, password protection mode is activated by program-
ming the password protection mode lock bit to 0. This operation is irreversible. After the
bit is programmed, it cannot be erased, the device remains permanently in password
protection mode, and the 64-bit password can be neither retrieved nor reprogrammed.
In addition, all commands to the address where the password is stored are disabled.
Note: There is no means to verify the password after password protection mode is ena-
bled. If the password is lost after enabling the password protection mode, there is no
way to clear the nonvolatile protection bit lock bit.
Figure 11: Software Protection Scheme
1 = unprotected (default)
0 = protected
1 = unprotected
0 = protected
(Default setting depends on the product order option)
Volatile protection bit Nonvolatile protection bit
1 = unlocked (default, after power-up or hardware reset)
0 = locked
Nonvolatile protection bit lock bit (volatile)
Nonvolatile protection
mode
Password protection
mode
Volatile
protection
Nonvolatile
protection
Array block
Notes: 1. Volatile protection bits are programmed and cleared individually. Nonvolatile protection
bits are programmed individually and cleared collectively.
2. Once programmed to 0, the nonvolatile protection bit lock bit can be reset to 1 only by
taking the device through a power-up or hardware reset.
256Mb: 3V Embedded Parallel NOR Flash
Device Protection
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Common Flash Interface
The common Flash interface (CFI) is a JEDEC-approved, standardized data structure
that can be read from the Flash memory device. It allows a system's software to query
the device to determine various electrical and timing parameters, density information,
and functions supported by the memory. The system can interface easily with the de-
vice, enabling the software to upgrade itself when necessary.
When the READ CFI command is issued, the device enters CFI query mode, and the da-
ta structure is read from memory. The following tables show the addresses (A-1, A[7:0])
used to retrieve the data. The query data is always presented on the lowest order data
outputs (DQ[7:0]), and the other data outputs (DQ[15:8]) are set to 0.
Table 15: Query Structure Overview
Note 1 applies to entire table
Address
Subsection Name Descriptionx16 x8
10h 20h CFI query identification string Command set ID and algorithm data offset
1Bh 36h System interface information Device timing and voltage information
27h 4Eh Device geometry definition Flash device layout
40h 80h Primary algorithm-specific extended query table Additional information specific to the primary al-
gorithm (optional)
61h C2h Security code area 64-bit unique device number
Note: 1. Query data are always presented on the lowest order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
Table 16: CFI Query Identification String
Note 1 applies to entire table
Address
Data Description Valuex16 x8
10h 20h 0051h Query unique ASCII string "QRY" "Q"
11h 22h 0052h "R"
12h 24h 0059h "Y"
13h
14h
26h
28h
0002h
0000h
Primary algorithm command set and control interface ID code 16-bit ID
code defining a specific algorithm
–
15h
16h
2Ah
2Ch
0040h
0000h
Address for primary algorithm extended query table (See the Primary Algo-
rithm-Specific Extended Query Table.)
P = 40h
17h
18h
2Eh
30h
0000h
0000h
Alternate vendor command set and control interface ID code second ven-
dor-specified algorithm supported
–
19h
1Ah
32h
34h
0000h
0000h
Address for alternate algorithm extended query table –
Note: 1. Query data are always presented on the lowest-order data outputs (DQ[7:0]). DQ[15:8]
are set to 0.
256Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
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Table 17: CFI Query System Interface Information
Note 1 applies to entire table
Address
Data Description Valuex16 x8
1Bh 36h 0027h VCC logic supply minimum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
2.7V
1Ch 38h 0036h VCC logic supply maximum program/erase voltage
Bits[7:4] BCD value in volts
Bits[3:0] BCD value in 100mV
3.6V
1Dh 3Ah 00B5h VPPH (programming) supply minimum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
1Eh 3Ch 00C5h VPPH (programming) supply maximum program/erase voltage
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
12.5V
1Fh 3Eh 0004h Typical timeout for single byte/word program = 2nμs 16µs
20h 40h 0004h Typical timeout for maximum size buffer program = 2nμs 16µs
21h 42h 0009h Typical timeout per individual block erase = 2nms 0.5s
22h 44h 0011h Typical timeout for full chip erase = 2nms 80s
23h 46h 0004h Maximum timeout for byte/word program = 2n times typical 200µs
24h 48h 0004h Maximum timeout for buffer program = 2n times typical 200µs
25h 4Ah 0003h Maximum timeout per individual block erase = 2n times typical 2.3s
26h 4Ch 0004h Maximum timeout for chip erase = 2n times typical 800s
Note: 1. The values in this table are valid for both packages.
Table 18: Device Geometry Definition
Address
Data Description Valuex16 x8
27h 4Eh 0019h Device size = 2n in number of bytes 32MB
28h
29h
50h
52h
0002h
0000h
Flash device interface code description x8, x16
asynchronous
2Ah
2Bh
54h
56h
0006h
0000h
Maximum number of bytes in multibyte program or page =
2n
64B
2Ch 58h 0001h Number of erase block regions. It specifies the number of
regions containing contiguous erase blocks of the same size.
1
2Dh
2Eh
5Ah
5Ch
00FFh
0000h
Erase block region 1 information
Number of identical-size erase blocks = 00FFh + 1
256 block
2Fh
30h
5Eh
60h
0000h
0002h
Erase block region 1 information
Block size in region 1 = 0200h × 256 bytes
128KB
256Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
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Table 18: Device Geometry Definition (Continued)
Address
Data Description Valuex16 x8
31h
32h
33h
34h
62h
64h
66h
68h
0000h
0000h
0000h
0000h
Erase block region 2 information 0
35h
36h
37h
38h
6Ah
6Ch
6Eh
70h
0000h
0000h
0000h
0000h
Erase block region 3 information 0
39h
3Ah
3Bh
3Ch
72h
74h
76h
78h
0000h
0000h
0000h
0000h
Erase block region 4 information 0
Table 19: Primary Algorithm-Specific Extended Query Table
Note 1 applies to entire table
Address
Data Description Valuex16 x8
40h 80h 0050h Primary algorithm extended query table unique ASCII string “PRI” "P"
41h 82h 0052h "R"
42h 84h 0049h "I"
43h 86h 0031h Major version number, ASCII "1"
44h 88h 0033h Minor version number, ASCII "3"
45h 8Ah 0010h Address-sensitive unlock (bits[1:0]):
00 = Required
01 = Not required
Silicon revision number (bits[7:2])
Yes
65nm
46h 8Ch 0002h Erase suspend:
00 = Not supported
01 = Read only
02 = Read and write
2
47h 8Eh 0001h Block protection:
00 = Not supported
x = Number of blocks per group
1
48h 90h 0000h Temporary block unprotect:
00 = Not supported
01 = Supported
00
49h 92h 0008h Block protect/unprotect:
06 = M29W256GH/M29W256GL
06
4Ah 94h 0000h Simultaneous operations:
Not supported
–
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Common Flash Interface
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Table 19: Primary Algorithm-Specific Extended Query Table (Continued)
Note 1 applies to entire table
Address
Data Description Valuex16 x8
4Bh 96h 0000h Burst mode:
00 = Not supported
01 = Supported
00
4Ch 98h 0002h Page mode:
00 = Not supported
02 = 8-word page
02
4Dh 9Ah 00B5h VPPH supply minimum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
11.5V
4Eh 9Ch 00C5h VPPH supply maximum program/erase voltage:
Bits[7:4] hex value in volts
Bits[3:0] BCD value in 100mV
12.5V
4Fh 9Eh 00xxh Top/bottom boot block flag:
xx = 04h: M29W256GL, first block protected by VPP/WP#
xx = 05h: M29W256GH, last block protected by VPP/WP#
Uniform +
VPP/WP# protect-
ing highest or
lowest block
50h A0h 0001h Program suspend:
00 = Not supported
01 = Supported
01
Note: 1. The values in this table are valid for both packages.
Table 20: Security Code Area
Address
Data Descriptionx16 x8
61h C3h, C2h XXXX 64-bit unique device number
62h C5h, C4h XXXX
63h C7h, C6h XXXX
64h C9h, C8h XXXX
256Mb: 3V Embedded Parallel NOR Flash
Common Flash Interface
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Power-Up and Reset Characteristics
Table 21: Power-Up Wait Timing Specifications
Note 1 applies to entire table
Parameter
Symbol
Min Unit NotesLegacy JEDEC
VCC HIGH to CE# LOW tVCH tVCHEL 55 µs 2, 3
VCCQ HIGH to CE# LOW – tVCQHEL 55 µs 2, 3
VCC HIGH to WE# LOW – tVCHWL 500 µs
VCCQ HIGH to WE# LOW – tVCQHWL 500 ns
Notes: 1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. VCC and VCCQ ramps must be synchronized during power-up.
3. If RST# is not stable for tVCS or tVIOS, the device will not allow any READ or WRITE oper-
ations, and a hardware reset is required.
Figure 12: Power-Up Timing
VCC
tVCQHEL
CE#
VCCQ
tVCQHWL
WE#
tVCHEL
tVCHWL
tRH
RST#
256Mb: 3V Embedded Parallel NOR Flash
Power-Up and Reset Characteristics
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Table 22: Reset AC Specifications
Note 1 applies to entire table
Condition/Parameter
Symbol
Min Max Unit NotesLegacy JEDEC
RST# LOW to read mode during program or
erase
tREADY tPLRH – 55 µs 2
RST# pulse width tRP tPLPH 20 – µs
RST# HIGH to CE# LOW, OE# LOW tRH tPHEL,
tPHGL,
tPHWL
55 – ns 2
RST# LOW to standby mode during read mode tRPD – 20 – µs
RST# LOW to standby mode during program or
erase
55 – µs
RY/BY# HIGH to CE# LOW, OE# LOW tRB tRHEL,
tRHGL,
tRHWL
0 – ns 2
Notes: 1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. Sampled only; not 100% tested.
Figure 13: Reset AC Timing – No PROGRAM/ERASE Operation in Progress
tRH
RY/BY#
CE#, OE#, WE#
RST#
tRP
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Power-Up and Reset Characteristics
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Figure 14: Reset AC Timing During PROGRAM/ERASE Operation
tRB
RY/BY#
CE#, OE#, WE#
RST#
tRP
tRH
tREADY
256Mb: 3V Embedded Parallel NOR Flash
Power-Up and Reset Characteristics
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Absolute Ratings and Operating Conditions
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other condi-
tions outside those indicated in the operational sections of this specification is not im-
plied. Exposure to absolute maximum rating conditions for extended periods may ad-
versely affect reliability.
Table 23: Absolute Maximum/Minimum Ratings
Parameter Symbol Min Max Unit Notes
Temperature under bias TBIAS –50 125 °C
Storage temperature TSTG –65 150 °C
I/O voltage VIO –0.6 VCC + 0.6 V 1, 2
Supply voltage VCC –0.6 4 V
I/O supply voltage VCCQ –0.6 4 V
Identification voltage VID –0.6 13.5 V
Program voltage VPPH –0.6 13.5 V 3
Notes: 1. During signal transitions, minimum voltage may undershoot to −2V for periods less than
20ns.
2. During signal transitions, maximum voltage may overshoot to VCC + 2V for periods less
than 20ns.
3. VPPH must not remain at 12V for more than 80 hours cumulative.
Table 24: Operating Conditions
Note 1 applies to entire table
Parameter Symbol Min Max Unit Notes
Supply voltage VCC 2.7 3.6 V
Input/output supply voltage (VCCQ ≤ VCC) VCCQ 1.65 3.6 V 2
Ambient operating temperature (range 1) TA0 70 °C
Ambient operating temperature (range 6) TA–40 125 °C
Load capacitance CL30 pF
Input rise and fall times – – 10 ns
Input pulse voltages – 0 to VCCQ V
Input and output timing reference voltages – VCCQ/2 V
Notes: 1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. For the 80ns device, I/O supply voltage (VCCQ ≤ VCC) = 1.65V (MIN) and 3.6V (MAX). For
the 60ns and 70ns devices, I/O supply voltage (VCCQ ≤ VCC) = 2.7V (MIN) and 3.6V (MAX).
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Figure 15: AC Measurement Load Circuit
CL
VCCQ
25kΩ
Device
under
test
0.1µF
VCC
0.1µF
VPP
25kΩ
Note: 1. CL includes jig capacitance.
Figure 16: AC Measurement I/O Waveform
VCCQ
0V
VCCQ/2
Table 25: I/O Capacitance1
Parameter Symbol Test Condition Min Max Unit
Input capacitance CIN VIN = 0V – 6 pF
Output capacitance COUT VOUT = 0V – 12 pF
Note: 1. Sampled only; not 100% tested.
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DC Characteristics
Table 26: DC Current Characteristics
Parameter Symbol Conditions Min Typ Max Unit Notes
Input leakage current ILI 0V ≤ VIN ≤ VCC – – ±1 µA 1
Output leakage current ILO 0V ≤ VOUT ≤ VCC – – ±1 µA
VCC read
current
Random read ICC1 CE# = VIL, OE# = VIH,
f = 6 MHz
– – 10 mA
Page read CE# = VIL, OE# = VIH,
f = 10 MHz
– – 1 mA
VCC standby
current
Grade 6 ICC2 CE# = VCCQ ±0.2V,
RST# = VCCQ ±0.2V
– – 100 µA 2
Grade 3 – – 200 µA 2
VCC program/erase current ICC3 Program/
erase
controller
active
VPP/WP# =
VIL or VIH
– – 20 mA 3
VPP/WP# =
VPPH
– – 15 mA
VPP current Read IPP1 VPP/WP# ≤ VCC – 1 5 µA
Standby – 1 5 µA
Reset IPP2 RST# = VSS ±0.2V – 1 5 µA
PROGRAM operation
ongoing
IPP3 VPP/WP# = 12V ±5% – 1 10 mA
VPP/WP# = VCC – 1 5 µA
ERASE operation
ongoing
IPP4 VPP/WP# = 12V ±5% – 3 10 mA
VPP/WP# = VCC – 1 5 µA
Notes: 1. The maximum input leakage current is ±5µA on the VPP/WP# pin.
2. When the bus is inactive for tAVQV + 30ns or more, the memory enters automatic stand-
by.
3. Sampled only; not 100% tested.
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Table 27: DC Voltage Characteristics
Parameter Symbol Conditions Min Typ Max Unit Notes
Input LOW voltage VIL VCC ≥ 2.7V –0.5 – 0.3VCCQ V
Input HIGH voltage VIH VCC ≥ 2.7V 0.7VCCQ – VCCQ + 0.4 V
Output LOW voltage VOL IOL = 100µA,
VCC = VCC,min,
VCCQ = VCCQ,min
– – 0.15VCCQ V
Output HIGH voltage VOH IOH = 100µA,
VCC = VCC,min,
VCCQ = VCCQ,min
0.85VCCQ – – V
Identification voltage VID – 11.5 – 12.5 V
Voltage for VPP/WP# program
acceleration
VPPH – 11.5 – 12.5 V
Program/erase lockout supply
voltage
VLKO – 1.8 – 2.5 V 1
Note: 1. Sampled only; not 100% tested.
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Read AC Characteristics
Table 28: Read AC Characteristics
Parameter
Symbol
Condition
60ns
VCCQ = VCC
70ns
VCCQ = VCC
80ns
VCCQ =
1.65V to
VCC
Unit NotesMin Max Min Max Min MaxLegacy JEDEC
Address valid to next ad-
dress
valid
tRC tAVAV CE# = VIL,
OE# = VIL
60 – 70 – 80 – ns
Address valid to output
valid
tACC tAVQV CE# = VIL,
OE# = VIL
– 60 – 70 – 80 ns
Address valid to output
valid (page)
tPAGE tAVQV1 CE# = VIL,
OE# = VIL
– 25 – 25 – 30 ns
CE# LOW to output
transition
tLZ tELQX OE# = VIL 0 – 0 – 0 – ns 2
CE# LOW to output valid tEtELQV OE# = VIL – 60 – 70 – 80 ns
OE# LOW to output
transition
tOLZ tGLQX CE# = VIL 0 – 0 – 0 – ns 2
OE# LOW to output valid tOE tGLQV CE# = VIL – 25 – 25 – 30 ns
CE# HIGH to output High-Z tHZ tEHQZ OE# = VIL – 25 – 25 – 30 ns 2
OE# HIGH to output High-Z tDF tGHQZ CE# = VIL – 25 – 25 – 30 ns 2
CE#, OE#, or address
transition to output
transition
tOH tEHQX,
tGHQX,
tAXQX
– 0 – 0 – 0 – ns
tEHQV
CE# to BYTE# LOW tELFL tELBL – – 5 – 5 – 5 ns
CE# to BYTE# HIGH tELFH tELBH – – 5 – 5 – 5 ns
tELQZ
BYTE# LOW to output
High-Z
tFLQZ tBLQZ – – 25 – 25 – 30 ns
BYTE# HIGH to output valid tFHQV tBHQV – – 30 – 30 – 30 ns
Notes: 1. The 60ns device is available upon customer request.
2. Sampled only; not 100% tested.
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Figure 17: Random Read AC Timing (8-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tCE
tELFL
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]/A-1
CE#
OE#
DQ[7:0]
BYTE#
Note: 1. BYTE# = VIL
Figure 18: Random Read AC Timing (16-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tE
tELFH
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]
CE#
OE#
DQ[14:0]
DQ15A-1
BYTE#
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Figure 19: Page Read AC Timing (16-Bit Mode)
Valid
Valid Valid Valid ValidValid Valid Valid
tACC
tE
tPAGE
tOH
tHZ
tOH
tOE
tDF
A[MAX:3]
A[2:0]
CE#
OE#
DQ[15:0]
DQ15A-1
Valid Valid Valid Valid Valid Valid Valid
Note: 1. Page size is 8 words (16 bytes) and is addressed by address inputs A[2:0] in x16 bus mode
and A[2:0] plus DQ15/A−1 in x8 bus mode.
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Write AC Characteristics
Table 29: WE#-Controlled Write AC Characteristics
Parameter
Symbol
60ns2
VCCQ = VCC
70ns
VCCQ = VCC
80ns
VCCQ = 1.65V
to VCC Unit Notes
Legacy JEDEC Min Max Min Max Min Max
Address valid to next address
valid
tWC tAVAV 65 – 75 – 85 – ns
CE# LOW to WE# LOW tCS tELWL 0 – 0 – 0 – ns
WE# LOW to WE# HIGH tWP tWLWH 35 – 35 – 35 – ns
Input valid to WE# HIGH tDS tDVWH 45 – 45 – 45 – ns 2
WE# HIGH to input transition tDH tWHDX 0 – 0 – 0 – ns
WE# HIGH to CE# HIGH tCH tWHEH 0 – 0 – 0 – ns
WE# HIGH to WE# LOW tWPH tWHWL 30 – 30 – 30 – ns
Address valid to WE# LOW tAS tAVWL 0 – 0 – 0 – ns
WE# LOW to address transi-
tion
tAH tWLAX 45 – 45 – 45 – ns
OE# HIGH to WE# LOW – tGHWL 0 – 0 – 0 – ns
WE# HIGH to OE# LOW tOEH tWHGL 0 – 0 – 0 – ns
Program/erase valid to
RY/BY# LOW
tBUSY tWHRL – 30 – 30 – 30 ns 3
VCC HIGH to CE# LOW tVCS tVCHEL 50 – 50 – 50 – µs
Notes: 1. The 60ns device is available upon customer request.
2. The user's write timing must comply with this specification. Any violation of this write
timing specification may result in permanent damage to the NOR Flash device.
3. Sampled only; not 100% tested.
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Figure 20: WE#-Controlled Program AC Timing (8-Bit Mode)
AAAh PA PA
3rd Cycle 4th Cycle READ CycleData Polling
tWC tWC
tAS
tWP
tDS
tWHWH1 tDF
tWPH
tAH
tCE
tCS
tGHWL tOE
tDH
tOH
tCH
A[MAX:0]/A-1
CE#
OE#
WE#
DQ[7:0] A0h PD DQ7# DOUT DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit and by a
READ operation that outputs the data (DOUT) programmed by the previous PROGRAM
command.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Figure 21: WE#-Controlled Program AC Timing (16-Bit Mode)
555h PA PA
3rd Cycle 4th Cycle READ CycleData Polling
tWC tWC
tAS
tWP
tDS
tDF
tWHWH1
tWPH
tAH
tE
tCS
tGHWL tOE
tDH
tOH
tCH
A[MAX:0]
CE#
OE#
WE#
DQ[14:0]/A-1 AOh PD DQ7# DOUT DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit and by a
READ operation that outputs the data (DOUT) programmed by the previous PROGRAM
command.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Table 30: CE#-Controlled Write AC Characteristics
Parameter Symbol
60ns2
VCCQ = VCC
70ns
VCCQ = VCC
80ns
VCCQ = 1.65V
to VCC Unit Notes
Legacy JEDEC Min Max Min Max Min Max
Address valid to next address
valid
tWC tAVAV 65 – 75 – 85 – ns
WE# LOW to CE# LOW tWS tWLEL 0 – 0 – 0 – ns
CE# LOW to CE# HIGH tCP tELEH 35 – 35 – 35 – ns
Input valid to CE# HIGH tDS tDVEH 45 – 45 – 45 – ns 2
CE# HIGH to input transition tDH tEHDX 0 – 0 – 0 – ns
CE# HIGH to WE# HIGH tWH tEHWH 0 – 0 – 0 – ns
CE# HIGH to CE# LOW tCPH tEHEL 30 – 30 – 30 – ns
Address valid to CE# LOW tAS tAVEL 0 – 0 – 0 – ns
CE# LOW to address transition tAH tELAX 45 – 45 – 45 – ns
OE# HIGH to CE# LOW – tGHEL 0 – 0 – 0 – ns
Notes: 1. The 60ns device is available upon customer request.
2. The user's write timing must comply with this specification. Any violation of this write
timing specification may result in permanent damage to the NOR Flash device.
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Figure 22: CE#-Controlled Program AC Timing (8-Bit Mode)
AAAh PA PA
3rd Cycle 4th Cycle Data Polling
tWC
tAS
tCP
tDS
tWHWH1
tCPH
tAH
tWS
tGHEL
tDH
tWH
A[MAX:0]/A-1
WE#
OE#
CE#
DQ[7:0] A0h PD DQ7# DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Figure 23: CE#-Controlled Program AC Timing (16-Bit Mode)
555h PA PA
3rd Cycle 4th Cycle Data Polling
tWC
tAS
tCP
tDS
tWHWH1
tCPH
tAH
tWS
tGHEL
tDH
tWH
A[MAX:0]
WE#
OE#
CE#
DQ[14:0]/A-1 AOh PD DQ7# DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-
GRAM command is followed by checking of the status register data polling bit.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-
grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7. (See Data Polling Bit
[DQ7].)
4. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Figure 24: Chip/Block Erase AC Timing (8-Bit Mode)
AAAh
tWC
tAS
tWP
tDS
tWPH
tAH
tCS
tGHWL
tDH
tCH
A[MAX:0]/
A–1
CE#
OE#
WE#
DQ[7:0] AAh
555h AAAh AAAh
BAh1
555hAAAh
55h 55hAAh80h 10h/
30h
Notes: 1. For a CHIP ERASE command, the address is AAAh, and the data is 10h; for a BLOCK
ERASE command, the address is BAd, and the data is 30h.
2. BAd is the block address.
3. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
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Accelerated Program, Data Polling/Toggle AC Characteristics
Table 31: Accelerated Program and Data Polling/Data Toggle AC Characteristics
Note 1 and 2 apply to entire table
Parameter
Symbol
Min Max UnitLegacy JEDEC
VPP/WP# rising or falling time – tVHVPP 250 – ns
Address setup time to OE# LOW during toggle bit polling tASO tAXGL 10 – ns
Address hold time from OE# during toggle bit polling tAHT tGHAX, tEHAX 10 – ns
CE# HIGH during toggle bit polling tEPH tEHEL2 10 – ns
Output hold time during data and toggle bit polling tOEH tWHGL2,
tGHGL2
20 – ns
Program/erase valid to RY/BY# LOW tBUSY tWHRL – 30 ns
Notes: 1. Specifications apply to 60, 70, and 80ns devices unless otherwise noted. The 60ns device
is available upon customer request.
2. Sampled only; not 100% tested.
Figure 25: Accelerated Program AC Timing
tVHVPP
tVHVPP
VPPH
VIL or VIH
VPP/WP#
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Figure 26: Data Polling AC Timing
DQ7#Data DQ7# Valid DQ7
Data
Output flagData Output flag
Valid
DQ[6:0] Data
tHZ/tDF
tCE
tOE tOPH
tCH
tBUSY
tOEH
CE#
OE#
WE#
DQ[6:0]
DQ7
RY/BY#
Notes: 1. DQ7 returns a valid data bit when the PROGRAM or ERASE command has completed.
2. See the following tables for timing details: Read AC Characteristics, Accelerated Pro-
gram and Data Polling/Data Toggle AC Characteristics.
Figure 27: Toggle/Alternative Toggle Bit Polling AC Timing (8-Bit Mode)
Toggle Toggle ToggleData
Stop
toggling
Output
Valid
tBUSY
tOPH tEPH
tOEH
CE#
WE#
OE#
DQ6/DQ2
RY/BY#
tOPH
tAHT tASO
tAHT
tDH
tASO
A[MAX:0]/
A–1
tOE tCE
Notes: 1. DQ6 stops toggling when the PROGRAM or ERASE command has completed. DQ2 stops
toggling when the CHIP ERASE or BLOCK ERASE command has completed.
2. See the following tables for timing details: Read AC Characteristics, Accelerated Pro-
gram and Data Polling/Data Toggle AC Characteristics.
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Program/Erase Characteristics
Table 32: Program/Erase Characteristics
Notes 1 and 2 apply to entire table
Parameter Min Typ Max Unit Notes
Chip erase – 145 400 s 3, 4
Chip erase VPP/WP# =
VPPH
– 125 400 s 4
Block erase (128KB) – 0.5 2 s 4, 5
Erase suspend latency time – 25 45 µs
Block erase timeout 50 – – µs
Erase to suspend – 1 – ms 6
Byte program Single-byte program – 16 200 µs 4
Write to buffer program
(64 bytes at a time)
VPP/WP# =
VPPH
– 50 200 µs 4
VPP/WP# =
VIH
– 70 200 µs 4
Word program Single-word program – 16 200 µs 4
Write to buffer program
(32 words at a time)
VPP/WP# =
VPPH
– 50 200 µs 4
VPP/WP# =
VIH
– 70 200 µs 4
Chip program (byte by byte) – 540 800 s 4
Chip program (word by word) – 270 400 s 4
Chip program (write to buffer program) – 25 200 s 4, 7
Chip program (write to buffer program with VPP/WP# = VPPH) – 13 50 s 4, 7
Chip program (enhanced buffered program) – 15 60 s 7
Chip program (enhanced buffered program with VPP/WP# = VPPH) – 10 40 s 7
Program suspend latency time – 5 15 µs
PROGRAM/ERASE cycles (per block) 100,000 – – cycles
Data retention 20 – – years
Notes: 1. Typical values are measured at room temperature and nominal voltages and are not for
cycled devices.
2. Typical and maximum values are sampled, but not 100% tested.
3. Time needed to program the whole array at 0 is included.
4. Maximum value measured at worst case conditions for both temperature and VCC after
100,000 PROGRAM/ERASE cycles.
5. Block erase polling cycle time. (See the Data Polling AC Waveforms figure.)
6. Erase to suspend is the typical time between an initial BLOCK ERASE or ERASE RESUME
command and a subsequent ERASE SUSPEND command. Violating the specification re-
peatedly during any particular block erase may cause erase failures.
7. Intrinsic program timing means without the time required to execute the bus cycles to
load the PROGRAM commands.
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Package Dimensions
Figure 28: 56-Pin TSOP – 14mm x 20mm
0.1 A
See Detail A
56X 0.1 ±0.05
0.15 ±0.05
56X 0.22 ±0.05 14 ±0.1
18.4 ±0.1
20 ±0.2
1.1 ±0.1
0.5 TYP
Pin A1 ID
29
56
1
28
Detail A
Seating plane
0.6 ±0.1
0.25 gage plane
(0.1 ±0.05) A
Plating material composition: Ni/Pd/Au.
Plastic package material: epoxy novolac.
Package width and length include mold flash.
Notes: 1. All dimensions are in millimeters.
2. For the lead width value of 0.22 ±0.05, there is also a legacy value of 0.15 ±0.05.
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Figure 29: 64-Ball TBGA – 10mm x 13mm
BALL "A1"
0.10 MAX
0.50 TYP
1.00 TYP 0.80 TYP
1.20 MAX
1.50 TYP
3.00 TYP
0.50 TYP
7.00 TYP
7.00 TYP
10.00 ±0.10
13.00 ±0.10
0.35 MIN/
0.50 MAX
0.30 -0.10
+0.05
Note: 1. All dimensions are in millimeters.
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Figure 30: 64-Ball Fortified BGA – 11mm x 13mm
Seating
plane
0.80 TYP
0.10
13.00 ±0.10
0.60 ±0.05
1.00
TYP
3.00
TYP
A
B
C
D
E
F
G
H
7.00 TYP
1.40 MAX
Ball A1 ID
1.00
TYP
2.00 TYP 0.48 ±0.05
11.00 ±0.10
7.00 TYP
64X
87654321
Note: 1. All dimensions are in millimeters.
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Revision History
Rev. E – 7/16
• Corrected Device ID
Rev. D – 5/15
• Updated TSOP package
Rev. C – 7/13
• Minor text edits
• Added Erase to suspend specifications to Program/Erase Characteristics
Rev. B – 5/13
• Synchronized TBGA (ZA) package dimensions in the order information table with di-
mensions in the package diagram
Rev. A – 5/12
• Initial Micron brand release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
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Revision History
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