Semiconductor Components Industries, LLC, 2002
May, 2002 − Rev. 6 682 Publication Order Number:
M1MA151AT1/D
$
Preferred Device
(& (+ (*+'&
)
These Silicon Epitaxial Planar Diodes are designed for use in ultra
high speed switching applications. These devices are housed in the
SC−59 package which is designed for low power surface mount
applications.
•Fast trr, < 3.0 ns
•Low CD, < 2.0 pF
•Available in 8 mm Tape and Reel
Use M1MA151/2AT1 to order the 7 inch/3000 unit reel.
Use M1MA151/2AT3 to order the 13 inch/10,000 unit reel.
MAXIMUM RATINGS (TA = 25°C)
Rating Symbol Value Unit
Reverse Voltage M1MA151AT1 VR40 Vdc
M1MA152AT1 80
Peak Reverse Voltage M1MA151AT1 VRM 40 Vdc
M1MA152AT1 80
Forward Current IF100 mAdc
Peak Forward Current IFM 225 mAdc
Peak Forward Surge Current IFSM
(Note 3) 500 mAdc
THERMAL CHARACTERISTICS
Rating Symbol Max Unit
Power Dissipation PD200 mW
Junction Temperature TJ150 °C
Storage Temperature Tstg −55 to +150 °C
3. t = 1 SEC
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
http://onsemi.com
Preferred devices are recommended choices for future use
and best overall value.
SC−59
SUFFIX
CASE 318D
SC−59 PACKAGE SINGLE SILICON
SWITCHING DIODES 40/80 V−100 mA
SURFACE MOUNT
MARKING DIAGRAM
21
3
Mx M
x = A for 151
B for 152
M = Date Code
M1MA151AT1, M1MA152AT1
http://onsemi.com
683
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic Symbol Condition Min Max Unit
Reverse Voltage Leakage Current M1MA151AT1 IRVR = 35 V —0.1 mAdc
M1MA152AT1 VR = 75 V —0.1
Forward Voltage VFIF = 100 mA —1.2 Vdc
Reverse Breakdown Voltage M1MA151AT1 VRIR = 100 mA40 —Vdc
M1MA152AT1 80 —
Diode Capacitance CDVR = 0, f = 1.0 MHz —2.0 pF
Reverse Recovery Time (Figure 1) trr (Note 4) IF = 10 mA, VR = 6.0 V,
RL = 100 W, Irr = 0.1 IR—3.0 ns
4. trr Test Circuit
tp = 2 ms
tr = 0.35 ns
IF = 10 mA
VR = 6 V
RL = 100 Ω
RECOVERY TIME EQUIVALENT TEST CIRCUIT INPUT PULSE OUTPUT PULSE
Figure 1. Reverse Recovery Time Equivalent Test Circuit
M1MA151AT1, M1MA152AT1
http://onsemi.com
684
PD = TJ(max) − TA
RθJA
PD = 150°C − 25°C
370°C/W = 338 milliwatts
•The soldering temperature and time should not exceed
260°C for more than 10 seconds.
•When shifting from preheating to soldering, the maxi-
mum temperature gradient should be 5°C or less.
•After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and re-
sult in latent failure due to mechanical stress.
•Mechanical stress or shock should not be applied dur-
ing cooling
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
INFORMATION FOR USING THE SC−59 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
SC−59 POWER DISSIPATION
The power dissipation of the SC−59 is a function of the
pad size. This can vary from the minimum pad size for sol-
dering to the pad size given for maximum power dissipa-
tion. Power dissipation for a surface mount device is deter-
mined b y T J(max), the maximum rated junction temperature
of the die, RθJA, the thermal resistance from the device
junction t o ambient; and the operating temperature, TA. Us-
ing the values provided on the data sheet, PD can be calcu-
lated as follows.
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one
can calculate the power dissipation of the device which in
this case is 338 milliwatts.
The 370°C/W assumes the use of the recommended foot-
print on a glass epoxy printed circuit board to achieve a
power dissipation of 338 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, the power dissipation can be doubled us-
ing the same footprint.
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are sub-
jected.
•Always preheat the device.
•The delta temperature between the preheat and solder-
ing should be 100°C or less.*
•When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum tem-
perature ratings as shown on the data sheet. When us-
ing infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
M1MA151AT1, M1MA152AT1
http://onsemi.com
685
°
°
°
°
° °
°
°
°
°
Figure 2. Typical Solder Heating Profile
°
For any given circuit board, there will be a group of con-
trol settings that will give the desired heat pattern. The op-
erator must set temperatures for several heating zones, and
a figure for belt speed. Taken together, these control set-
tings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the comput-
er remembers these profiles from one operating session to
the next. Figure 7 shows a typical heating profile for use
when soldering a surface mount device to a printed circuit
board. This profile will vary among soldering systems but
it is a good starting point. Factors that can af fect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This pro-
file shows temperature versus time.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177−189°C. When this type of furnace is used for solder re-
flow work, the circuit boards and solder joints tend to h ea t
first. The components on the board are then heated by con-
duction. The circuit board, because it has a large surface
area, absorbs the thermal ener gy more ef ficiently, then dis-
tributes this energy to the components. Because of this ef-
fect, the main body of a component may be up to 30 degrees
cooler than the adjacent solder joints.
