AX-SFUS, AX-SFUS-API Ultra-Low Power, AT Command / API Controlled, Sigfox) Compliant Transceiver IC for Up-Link and Down-Link www.onsemi.com OVERVIEW * 8 GPIO pins Circuit Description AX-SFUS and AX-SFUS-API are ultra-low power single chip solutions for a node on the Sigfox network with both up- and down-link functionality. The AX-SFUS chip is delivered fully ready for operation and contains all the necessary firmware to transmit and receive data from the Sigfox network in the US (SIGFOX RCZ2 region). It connects to the customer product using a logic level RS232 UART. AT commands are used to send frames and configure radio parameters. The AX-SFUS-API variant is intended for customers wishing to write their own application software based on the AX-SF-LIB-1-GEVK library. Power Consumption** * Ultra-low Power Consumption: Charge required to send a Sigfox OOB packet at 24 dBm output power: 0.28 C Deepsleep mode current: 100 nA Sleep mode current: 1.3 mA Standby mode current: 0.5 mA Continuous radio RX-mode at 905.2 MHz : 34 mA Continuous radio TX-mode at 902.2 MHz 230 mA @ 24 dBm Features Functionality and Ecosystem * Sigfox up-link and down-link functionality controlled by AT commands or API * The AX-SFUS and AX-SF-API ICs are part of a whole development and product ecosystem available from ON Semiconductor for any Sigfox requirement. Other parts of the ecosystem include Ready to go development kit DVK-SFEU-[API]-1-GEVK including a 2 year Sigfox subscription Sigfox Ready(R) certified reference design for the AX-SFUS and AX-SFUS-API ICs High Performance Narrow-band Sigfox RF Transceiver * Receiver Carrier frequency 905.2 MHz Data-rate 600 bps FSK Sensitivity -128 dBm @ 600 bps, 905.2 MHz, GFSK 0 dBm maximum input power * Transmitter Carrier frequency 902.2 MHz Data-rate 600 bps PSK High efficiency, high linearity integrated power amplifier Maximum output power 24 dBm General Features * QFN40 5 mm x 7 mm package * Supply range 2.7 V* - 3.6 V * -40C to 85C * Temperature sensor * Supply voltage measurements *Includes the RF frontend module, circuit as in Figure 5. The AX-SFUS chip alone is operational from 1.8 V to 3.6 V, a supply voltage below 2.0 V is considered an extreme condition. **Includes the RF frontend module, circuit as in Figure 5. (c) Semiconductor Components Industries, LLC, 2017 July, 2017 - Rev. 3 2 GPIO pins with selectable voltage measure functionality, differential (1 V or 10 V range) or single ended (1 V range) with 10 bit resolution 2 GPIO pins with selectable sigma delta DAC output functionality 2 GPIO pins with selectable output clock 3 GPIO pins selectable as SPI master interface RX/TX switching Control Applications Sigfox networks up-link and down-link. 1 Publication Order Number: AX-SFUS/D AX-SFUS, AX-SFUS-API BLOCK DIAGRAM AX-SFUS / AX-SFUS-API CLKP CLKN TCXO interface ANTP1 CAL RF synthesis FILT Transmit PA Communication controller ANTP LNA ANTN UARTRX UARTTX Receive UART DAC GPIO[9:4,1:0] GPIO CPU ADC RADIO_LED CPU_LED TX_LED dedicated status outputs RX_LED TX_EN RX_EN power mode control RAM Program memory (FLASH) Sigfox identity (ID, PAC) RESET_N VTCXO VDD_ANA VDD_IO GND Sigfox compliant application (AX-SFUS only) Figure 1. Functional Block Diagram of the AX-SFUS / AX-SFUS-API www.onsemi.com 2 AX-SFUS, AX-SFUS-API Table 1. PIN FUNCTION DESCRIPTIONS Pin(s) Type VDD_ANA Symbol 1 P Analog power output, decouple to neighboring GND Description GND 2 P Ground, decouple to neighboring VDD_ANA ANTP 3 A Differential receive input ANTN 4 A Differential receive input ANTP1 5 N Single ended transmit output GND 6 P Ground, decouple to neighboring VDD_ANA VDD_ANA 7 P Analog power output, decouple to neighboring GND GND 8 P Ground FILT 9 A Synthesizer filter L2 10 A Must be connected to pin L1 L1 11 A Must be connected to pin L2 NC 12 N Do not connect GPIO8 13 I/O/PU General purpose IO GPIO7 14 I/O/PU General purpose IO, selectable SPI functionality (MISO) GPIO6 15 I/O/PU General purpose IO, selectable SPI functionality (MOSI) GPIO5 16 I/O/PU General purpose IO, selectable SPI functionality (SCK) GPIO4 17 I/O/PU General purpose IO, selectable SD DAC functionality, selectable dock functionality CPU_LED 18 O CPU activity indicator RADIO_LED 19 O Radio activity indicator VTCXO 20 O TCXO power GPIO9 21 I/O/PU UARTTX 22 O UART transmit UARTRX 23 I/PU UART receive RX_LED 24 O Receive activity indicator TX_LED 25 O Transmit activity indicator NC 26 PD Do not connect RESET_N 27 I/PU Optional reset pin. Internal pull-up resistor is permanently enabled, nevertheless it is recommended to connect this pin to VDD_IO if it is not used. GND 28 P Ground VDD_IO 29 P Unregulated power supply GPIO0 30 I/O/A/PU General purpose IO, selectable ADC functionality, selectable SD DAC functionality, selectable clock functionality GPIO1 31 I/O/A/PU General purpose IO, selectable ADC functionality TX_EN 32 O Transmitter Enable (to frontend) NC 33 N Do not connect NC 34 N Do not connect RX_EN 35 O Receiver Enable (to frontend) VDD_IO 36 P Unregulated power supply CAL 37 A Connect to FILT as shown in the application diagram NC 38 N Do not connect CLKN 39 A TCXO interface General purpose IO, wakeup from deep sleep www.onsemi.com 3 AX-SFUS, AX-SFUS-API Table 1. PIN FUNCTION DESCRIPTIONS Symbol Pin(s) Type Description CLKP 40 A TCXO interface GND Center pad P Ground on center pad of QFN, must be connected A = analog input I = digital input signal O = digital output signal PU = pull-up I/O = digital input/output signal N = not to be connected P = power or ground PD = pull-down Table 2. All digital inputs are Schmitt trigger inputs, digital input and output levels are LVCMOS/LVTTL compatible. Pins GPIO[3:0] must not be driven above VDD_IO, all other digital inputs are 5 V tolerant. All GPIO pins and UARTRX start up as input with pull-up. For explanations on how to use the GPIO pins, see chapter "AT Commands". Pin Possible GPIO Modes GPIO0 0, 1, Z, U, A, T GPIO1 0, 1, Z, U, A GPIO4 0, 1, Z, U, T GPIO5 0, 1, Z, U GPIO6 0, 1, Z, U GPIO7 0, 1, Z, U GPIO8 0, 1, Z, U GPIO9 0, 1, Z, U 0 = pin drives 1 = not to be connected Z = pin is high impedance input U = pin is input with pull-up A = pin is analog input T = pin is driven by clock or DAC CLKN NC CAL VDD_IO RX_EN NC NC TX_EN GPIO1 GPIO0 VDD_IO 40 39 38 37 36 35 34 33 32 31 30 29 1 28 GND GND 2 27 RESET_N ANTP 3 26 NC ANTN 4 25 TXLED ANTP1 5 24 RXLED GND 6 23 UARTRX 7 22 UARTTX 8 21 GPIO9 15 16 17 18 19 20 GPIO4 CPU_LED RADIO_LED VTCXO 14 GPIO5 13 GPIO6 12 GPIO7 11 GPIO8 10 NC 9 L1 GND QFN40 L2 VDD_ANA AX-SFEU / AX-SFEU-API FILT VDD_ANA CLKP Pinout Drawing Figure 2. Pinout Drawing (Top View) www.onsemi.com 4 AX-SFUS, AX-SFUS-API SPECIFICATIONS Table 3. ABSOLUTE MAXIMUM RATINGS Symbol Description Condition VDD_IO Supply voltage IDD Supply current Ptot Total power consumption Pi Absolute maximum input power at receiver input II1 DC current into any pin except ANTP, ANTN, ANTP1 II2 DC current into pins ANTP, ANTN, ANTP1 IO Output Current Via Input voltage ANTP, ANTN, ANTP1 pins Input voltage digital pins Min Max Units -0.5 5.5 V 200 mA 800 mW 10 dBm -10 10 mA -100 100 mA 40 mA -0.5 5.5 V -0.5 5.5 V -2000 2000 V ANTP and ANTN pins in RX mode Ves Electrostatic handling HBM Tamb Operating temperature -40 85 C Tstg Storage temperature -65 150 C Tj Junction Temperature 150 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.onsemi.com 5 AX-SFUS, AX-SFUS-API DC Characteristics Table 4. SUPPLIES Conditions for all current and charge values unless otherwise specified are for the hardware configuration described in the AX-SFUS Application Note: Sigfox Compliant Reference Design. Symbol Description Condition Min Typ Max Units TAMB Operational ambient temperature -40 27 85 C VDDIO I/O and voltage regulator supply voltage AX-SFUS chip only 1.8* 3.0 3.6 V VDDIO_mod I/O and voltage regulator supply voltage AX-SFUS with RF frontend module as in Figure 5 2.7 3.3 3.6 V VDDIO_R1 I/O voltage ramp for reset activation; Note 1 Ramp starts at VDD_IO 0.1 V 0.1 V/ms VDDIO_R2 I/O voltage ramp for reset activation; Note 1 Ramp starts at 0.1 V < VDD_IO < 0.7 V 3.3 V/ms IDS Deep sleep mode current; Note 3 AT$P=2 350 nA ISLP Sleep mode current; Note 3 AT$P=1 1.6 mA ISTDBY Standby mode current Notes 2, 3 0.5 mA IRX_CONT Current consumption continuous RX; Note 3 AT$TM=3,255 34 mA QSFX_OOB_24 Charge to send a Sigfox out of band message, 24 dBm; Note 3 AT$S0 0.25 C QSFX_BIT_24 Charge to send a bit, 24 dBm; Note 3 AT$SB=0 0.22 C QSFX_BITDL_24 Charge to send a bit with downlink receive, 24 dBm; Note 3 AT$SB=0,1 0.28 C QSFX_LFR_24 Charge to send the longest possible Sigfox frame (12 byte) , 24 dBm; Note 3 AT$SF=00112233445566778899aabb 0.73 C QSFX_LFRDL_24 Charge to send the longest possible Sigfox frame (12 byte) with downlink receive, 24 dBm; Note 3 AT$SF=00112233445566778899aabb,1 0.84 C ITXMOD24AVG Modulated Transmitter Current; Note 3 Pout=24 dBm; average 230 mA *The device is operational from 1.8 V to 3.6 V. However, a supply voltage below 2.0 V is considered an extreme condition and operation can lead to reduced output power and increased spurious emission. 1. If VDD_IO ramps cannot be guaranteed, an external reset circuit is recommended, see the AX8052 Application Note: Power On Reset 2. Internal 20 MHz oscillator, voltage conditioning and supervisory circuit running. 3. Includes Front End Module, TCXO. www.onsemi.com 6 AX-SFUS, AX-SFUS-API Typical Current Waveform Typical Current Waveform - Maximum Length Frame with Downlink Receive, Pout = 24 dBm 250 Current [mA] 200 150 100 50 0 0 10 20 Time [s] 30 40 Figure 3. Typical Current Waveform for a Maximum Length Frame with Downlink Receive at 24 dBm Output Power Battery Life Examples * Four maximum length frames with downlink receive Scenario: * 2 AAA Alkaline batteries in series * One OOB frame transmitter per day at Pout=24 dBm * * per day at Pout=24 dBm Device in Sleep Neglecting battery self discharge 2 AAA alkaline capacity 1500 mAh * 3600 s/h 5400 C Sleep charge per day 1.6 mA * 86400 s 0.14 C/day OOB frame transmission Frame transmission with downlink 0.25 C/day 4 * 0.84 C/day 3.36 C/day Total Charge consumption 3.75 C/day Battery life 3.9 Years www.onsemi.com 7 AX-SFUS, AX-SFUS-API Table 5. LOGIC Symbol Description Condition Min Typ Max Units Digital Inputs VDD_IO = 3.3 V VT+ Schmitt trigger low to high threshold point 1.55 V VT- Schmitt trigger high to low threshold point 1.25 V VIL Input voltage, low VIH Input voltage, high 2.0 VIPA Input voltage range, GPIO[3:0] -0.5 VDD_IO V VIPBC Input voltage range, GPIO[9:4], UARTRX -0.5 5.5 V IL Input leakage current -10 10 mA RPU Programmable Pull-Up Resistance 0.8 V V 65 kW Digital Outputs IOH Output Current, high Ports GPIO[9:0], UARTTX, TXLED, RXLED, TXLED, CPULED VOH = 2.4 V 8 mA IOL Output Current, low GPIO[9:0], UARTTX, TXLED, RXLED, TXLED, CPULED VOL = 0.4 V 8 mA IOZ Tri-state output leakage current -10 10 mA AC Characteristics Table 6. TCXO REFERENCE INPUT Symbol fTCXO Description TCXO frequency Condition Min A passive network between the TCXO output and the pins CLKP and CLKN is required. For detailed TCXO network recommendations depending on the TCXO output swing refer to the AX5043 Application Note: Use with a TCXO Reference Clock. For TCXO recommendations see the AX-SFUS Application Note: Sigfox Compliant Reference Design Typ Max 48 Units MHz Table 7. TRANSMITTER Conditions for transmitter specifications unless otherwise specified with the antenna network from AX-SFUS Application Note: Sigfox Compliant Reference Design and at 902.2 MHz. Symbol Description Condition Min Typ Max Units SBR Signal bit rate PTX Highest Transmitter output power AT$CW=902200000,1,24 dTXtemp Transmitter power variation vs. temperature -40C to +85C dTXVdd Transmitter power variation vs. VDD_IO 1.8 to 3.6 V 0.5 dB PTXharm2 Emission @ 2nd harmonic -51 dBc PTXharm3 Emission @ 3rd harmonic -63 PTXharm4 Emission @ 4th harmonic -84 www.onsemi.com 8 100 bps 24 dBm 0.5 dB AX-SFUS, AX-SFUS-API * RBW 1 MHz Ref -20 dBm Att Marker 1 [T1 ] -34.50 dBm 1.801282051 GHz * VBW 3 MHz * SWT 10 s 5 dB Marker 2 [T1 ] -78.31 2.706730769 Marker 3 [T1 ] -59.62 3.612179487 Marker 4 [T1 ] -67.47 4.509615385 -20 FCCP15H0 -30 1 AV * CLRWR FCCP15H1 1 -40 -50 dBm GHz A dBm GHz dBm GHz 3 -60 4 -70 2 3DB -80 -90 -100 -110 -120 Center 3.5 GHz 500 MHz/ Span 5 GHz Figure 4. Typical Spectrum with Harmonics at 24 dBm Output Power Table 8. RECEIVER Conditions for transmitter specifications unless otherwise specified with the antenna network from AX-SFUS Application Note: Sigfox Compliant Reference Design and at 869.525 MHz. Symbol SBR Description Signal bit rate ISBER868 BLK905 Condition AT$SB=x,1, AT$SF=x,1, AT$TM=3,x PER < 0.1 Blocking at 10 MHz offset Channel/Blocker @ PER = 0.1, wanted signal level is +3 dB above the typical sensitivity, the blocker signal is CW www.onsemi.com 9 Min Typ Max Units 600 bps -128 dBm 78 dB AX-SFUS, AX-SFUS-API Table 9. ADC / TEMPERATURE SENSOR Symbol Description Condition Min Typ Max 10 Units ADCRES ADC resolution VADCREF ADC reference voltage ZADC00 Input capacitance DNL Differential nonlinearity 1 LSB INL Integral nonlinearity 1 LSB OFF Offset 3 LSB GAIN_ERR Gain error 0.8 % 0.95 1 Bits 1.05 V 2.5 pF ADC in Differential Mode VABS_DIFF Absolute voltages & common mode voltage in differential mode at each input VFS_DIFF01 Full swing input for differential signals VFS_DIFF10 0 VDD_IO V Gain x1 -500 500 mV Gain x10 -50 50 mV ADC in Single Ended Mode VMID_SE Mid code input voltage in single ended mode VIN_SE00 Input voltage in single ended mode VFS_SE01 Full swing input for single ended signals 0.5 V 0 VDD_IO V Gain x1 0 1 V Temperature Sensor TRNG Temperature range AT$T? -40 85 C TERR_CAL Temperature error AT$T? -2 2 C www.onsemi.com 10 AX-SFUS, AX-SFUS-API COMMAND INTERFACE General Information mode can be activated with AT$P=2. To wake-up from Deep Sleep mode, GPIO9 is pulled to GND. When using Deep Sleep mode, keep two things in mind: Everything is turned off, timers are not running at all and all settings will be lost (use AT$WR to save settings to flash before entering Deep Sleep mode). Out-of-band messages will therefore not be sent. The pins states are frozen in Deep Sleep mode. The user must ensure that this will not result in condition which would draw a lot of current. The chapter "Command Interface" is a documentation of the AT-Command set for devices which do not have an API-interface. To see whether the device is capable of receiving AT-Commands, please refer to chapter "Part Numbers". If the device has been shipped with the API-Interface, please refer to the SW manual and "apiexample" code delivered with AX-SF-LIB-1-GEVK for an introduction on how to setup a project and how to use the API-Interface. AT Commands Serial Parameters: 9600, 8, N, 1 Numerical Syntax hexdigit ::= [0-9A-Fa-f] hexnum ::= "0x" hexdigit+ decnum ::= "0" | [1-9] [0-9]* octnum ::= "0" [0-7]+ binnum ::= "0b" [01]+ bit ::= [01] optnum ::= "-1" frame ::= (hexdigit hexdigit)+ uint ::= hexnum | decnum | octnum | binnum uint_opt ::= uint | optnum The AX-SFUS uses the UART (pins UARTTX, UARTRX) to communicate with a host and uses a bitrate of 9600 baud, no parity, 8 data bits and one stop bit. Power Modes Command Syntax A command starts with `AT' (everything is case sensitive!), continues with the actual command followed by parameters (if any) and ends with any kind of whitespace (space, tab, newline etc.) If incorrect syntax is detected ("parsing error") all input is ignored up until the next whitespace character. Also note that any number can be entered in any format (Hexadecimal, Decimal, Octal and binary) by adding the corresponding prefix (`0x', `0', `0b'). The only exception is the `Send Frame' command (AT$SF) which expects a list of hexadecimal digits without any prefix. Standby After Power-Up and after finishing a SIGFOX transmission, AX-SFUS enters Standby mode. In Standby mode, AX-SFUS listens on the UART for commands from the host. Also, OOB frames are transmitted whenever the OOB timer fires. To conserve power, the AX-SFUS can be put into Sleep or turned off (Deep Sleep) completely. Return Codes A successful command execution is indicated by sending `OK'. If a command returns a value (e.g. by querying a register) only the value is returned. Sleep The command AT$P=1 is used to put the AX-SFUS into Sleep mode. In this mode, only the wakeup timer for out-of-band messages is still running. To wake the AX-SFUS up from Sleep mode toggle the serial UARTRX pin, e.g. by sending a break (break is an RS232 framing violation, i.e. at least 10 bit durations low). When an Out of Band (OOB) message is due, AX-SFUS automatically wakes up to transmit the message, and then returns to Sleep mode. Examples Bold text is sent to AX-SFUS. AT$I=0 AXSEM AT Command Interface Here, we execute command `I' to query some general information. AT$SF=aabb1234 OK This sends a Sigfox frame containing { 0x00 : 0x11 : 0x22 : 0x33 : 0x44 }, then waits for a downlink response telegram, which in this example contains { 0xAA : 0xBB : 0xCC : 0xDD }. Deep Sleep In Deep Sleep mode, the AX-Sigfox is completely turned off and only draws negligible leakage current. Deep Sleep www.onsemi.com 11 AX-SFUS, AX-SFUS-API The `CB' command sends out a continuous pattern of bits, in this case 0xAA = 0b10101010. AT$P=1 OK This transitions the device into sleep mode. Out-of-band transmissions will still be triggered. The UART is powered down. The device can be woken up by a low level on the UART signal, i.e. by sending break. AT$CB=0011223344,1 OK RX=AA BB CC DD This sends a Sigfox frame containing { 0xAA : 0xBB : 0x12 : 0x34 } without waiting for a response telegram. AT$CB=0xAA,1 OK Table 10. COMMANDS Command Name Description AT Dummy Command Just returns `OK' and does nothing else. Can be used to check communication. AT$SB=bit[,bit] Send Bit Send a bit status (0 or 1). Optional bit flag indicates if AX-SFUS should receive a downlink frame. AT$SF=frame[,bit] Send Frame Send payload data, 1 to 12 bytes. Optional bit flag indicates if AX-SFUS should receive a downlink frame. AT$SO Manually send out of band message Send the out-of-band message. AT$TR? Get the transmit repeat Returns the number of transmit repeats. Default: 2 AT$TR=? Get transmit range Returns the allowed range of transmit repeats. AT$TR=uint Get transmit repeat Sets the transmit repeat. ATSuint? Get Register Query a specific configuration register's value. See chapter "Registers" for a list of registers. ATSuint=uint Set Register Change a configuration register. ATSuint=? Get Register Range Returns the allowed range of transmit repeats. AT$IF=uint Set TX Frequency Set the output carrier macro channel for Sigfox frames. AT$IF? Get TX Frequency Get the currently chosen TX frequency. AT$DR=uint Set RX Frequency Set the reception carrier macro channel for Sigfox frames. AT$DR? Get RX Frequency Get the currently chosen RX frequency. AT$CW=uint,bit[,uint_opt] Continuous Wave To run emission tests for Sigfox certification it is necessary to send a continuous wave, i.e. just the base frequency without any modulation. Parameters: AT$CB=uint_opt,bit Test Mode: TX constant byte Name Range Description Frequency 800000000- Continuous wave frequency in Hz. 999999999, 0 Use 902200000 for Sigfox or 0 to keep previous frequency. Mode 0, 1 Enable or disable carrier wave. Power 24 dBm of signal | Default: 24 For emission testing it is useful to send a specific bit pattern. The first parameter specifies the byte to send. Use `-1' for a (pseudo-)random pattern. Parameters: Name Range Decsription Pattern 0-255, -1 Byte to send. Use `-1' for a (pseudo-)random pattern. Mode 0, 1 Enable or disable pattern test mode. AT$RC Reset FCC Macrochannel This command resets the FCC Macrochannel. Subsequent transmit operations (AT$SO, AT$SB, AT$SF) may pause up to 20 s to ensure FCC compliance AT$T? Get Temperature Measure internal temperature and return it in 1/10th of a degree Celsius. www.onsemi.com 12 AX-SFUS, AX-SFUS-API Table 10. COMMANDS Command Name Description AT$V? Get Voltages Return current voltage and voltage measured during the last transmission in mV. AT$I=uint Information Display various product information: 0: Software Name & Version Example Response: AX-Sigfox 1.1.1-FCC 1: Contact Details Example Response: support@axsem.com 2: Silicon revision lower byte Example Response: 8F 3: Silicon revision upper byte Example Response: 51 4: Major Firmware Version Example Response: 1 5: Minor Firmware Version Example Response: 1 7: Firmware Variant (Frequency Band etc. (EU/US)) Example Response: FCC 9: SIGFOX Library Version Example Response: UDL1-1.8.7 10: Device ID Example Response: 00012345 11: PAC Example Response: 0123456789ABCDEF AT$P=uint Set Power Mode To conserve power, the AX-SFUS can be put to sleep manually. Depending on power mode, you will be responsible for waking up the AX-SFUS again! 0: software reset (settings will be reset to values in flash) 1: sleep (send a break to wake up) 2: deep sleep (toggle GPIO9 or RESET_N pin to wake up; the AX-SFUS is not running and all settings will be reset!) AT$WR Save Config Write all settings to flash (RX/TX frequencies, registers) so they survive reset/deep sleep or loss of power. Use AT$P=0 to reset the AX-SFUS and load settings from flash. AT:Pn? Get GPIO Pin Return the setting of the GPIO Pin n; n can range from 0 to 9. A character string is returned describing the mode of the pin, followed by the actual value. If the pin is configured as analog pin, then the voltage (range 0...1 V) is returned. The mode characters have the following meaning: Mode Description 0 1 Z U A T Pin drives low Pin drives high Pin is high impedance input Pin is input with pull-up Pin is analog input (GPIO pin 0...3 only) Pin is driven by clock or DAC (GPIO pin 0 and 4 only) The default mode after exiting reset is U on all GPIO pins. AT:Pn=? Get GPIO Pin Range Print a list of possible modes for a pin. The table below lists the response. Pin P0 P1 P4 P5 P6 P7 P8 P9 AT:Pn=mode Set GPIO Pin Modes 0, 1, Z, U, A, T 0, 1, Z, U, A 0, 1, Z, U, T 0, 1, Z, U 0, 1, Z, U 0, 1, Z, U 0, 1, Z, U 0, 1, Z, U Set the GPIO pin mode. For a list of the modes see the command AT:Pn? www.onsemi.com 13 AX-SFUS, AX-SFUS-API Table 10. COMMANDS Command Name Description AT:ADC Pn[-Pn[ (1V|10V)]]? Get GPIO Pin Analog Voltage Measure the voltage applied to a GPIO pin. The command also allows measurement of the voltage difference across two GPIO pins. In differential mode, the full scale range may also be specified as 1 V or 10 V. Note however that the pin input voltages must not exceed the range 0..VDD_IO. The command returns the result as fraction of the full scale range (1 V if none is specified). The GPIO pins referenced should be initialized to analog mode before issuing this command. AT:SPI[(A|B|C|D)]=bytes SPI Transaction This command clocks out bytes on the SPI port. The clock frequency is 312.5 kHz. The command returns the bytes read on MISO during output. Optionally the clocking mode may be specified (default is A): Mode A B C D Clock Inversion Clock Phase normal normal inverted inverted normal alternate normal alternate Note that SEL, if needed, is not generated by this command, and must instead be driven using standard GPIO commands (AT:Pn=0|1). AT:CLK=freq,reffreq Set Clock Generator Output a square wave on the pin(s) set to T mode. The frequency of the square wave is (freq / 216) x reffreq. Possible values for reffreq are 20000000, 10000000, 5000000, 2500000, 1250000, 625000, 312500, 156250. Possible values if freq are 0...65535. AT:CLK=OFF Turn off Clock Generator Switch off the clock generator AT:CLK? Get Clock Generator Return the settings of the clock generator. Two numbers are returned, freq and reffreq. AT:DAC=value Set SD DAC Output a SD DAC value on the pin(s) set to T mode. Parameter value may be in the range -32768...32767. The average output voltage is (1/2 + value / 217) x VDD. An external low pass filter is needed to get smooth output voltages. The modulation frequency is 20 MHz. A possible low pass filter choice is a simple RC low pass filter with R = 10 kW and C = 1 mF. AT:DAC=OFF Turn off SD DAC Switch off the DAC AT:DAC? Get SD DAC Return the DAC value www.onsemi.com 14 AX-SFUS, AX-SFUS-API Table 10. COMMANDS Command Name Description AT$TM=mode,config Activates the Sigfox Testmode Available test modes: 0. TX BPSK Send only BPSK with Synchro Bit + Synchro frame + PN sequence: No hopping centered on the TX_frequency. Config bits 0 to 6 define the number of repetitions. Bit 7 of config defines if a delay is applied of not in the loop 1. TX Protocol: Tx mode with full protocol with Sigfox key: Send Sigfox protocol frames with initiate downlink flag = True. Config defines the number of repetitions. 2. RX Protocol: This mode tests the complete downlink protocol in Downlink only. Config defines the number of repetitions. 3. RX GFSK: RX mode with known pattern with SB + SF + Pattern on RX_frequency (internal comparison with received frame known pattern = AA AA B2 27 1F 20 41 84 32 68 C5 BA AE 79 E7 F6 DD 9B. Config defines the number of repetitions. Config defines the number of repetitions. 4. RX Sensitivity: Does uplink + downlink frame with Sigfox key and specific timings. This test is specific to SIGFOX's test equipments & softwares. 5. TX Synthesis: Does one uplink frame on each Sigfox channel to measure frequency synthesis step AT$SE Starts AT$TM-3,255 indefinitely Convenience command for sensitivity tests AT$SL[=frame] Send local loop Sends a local loop frame with optional payload of 1 to 12 bytes. Default payload: 0x84, 0x32, 0x68, 0xC5, 0xBA, 0x53, 0xAE, 0x79, 0xE7, 0xF6, 0xDD, 0x9B. AT$RL Receive local loop Starts listening for a local loop. Table 11. REGISTERS Number Name Description 300 Out Of Band Period 400 Macrochannel Mask The mask of Macrochannels to use. <000001FF> <00000000> <00000000>,1 410 Encryption Key Configuration Set to zero for normal operation. Set to one for use with the SIGFOX Network Emulator Kit (SNEK) 0 AX-SFUS sends periodic static messages to indicate that they are alive. Set to 0 to disable. www.onsemi.com 15 Default Range Units 24 0-24 hours 0-1 0: private key 1: public key AX-SFUS, AX-SFUS-API APPLICATION INFORMATION Typical Application Diagrams Typical AX-SFUS / AX-SFUS-API Application Diagram Figure 5. Typical Application Diagram For detailed application configuration and BOM see the AX-SFUS Application Note: Sigfox Compliant Reference Design. www.onsemi.com 16 AX-SFUS, AX-SFUS-API QFN40 PACKAGE INFORMATION QFN40 7x5, 0.5P CASE 485EG ISSUE A PIN ONE REFERENCE EE EE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30mm FROM TERMINAL 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L A B D L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e L L1 0.15 C 2X 2X EXPOSED Cu 0.15 C TOP VIEW (A3) DETAIL B 0.10 C ALTERNATE CONSTRUCTION A1 NOTE 4 MOLD CMPD DETAIL B A 0.08 C EE CC C SIDE VIEW SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* D2 40X DETAIL A MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 7.00 BSC 5.30 5.50 5.00 BSC 3.30 3.50 0.50 BSC 0.30 0.50 --- 0.15 L 9 7.30 21 5.60 40X E2 b 0.10 C A B 0.05 C 1 40 PACKAGE OUTLINE 40X 0.60 1 NOTE 3 29 3.60 e e/2 BOTTOM VIEW 5.30 0.50 PITCH 40X 0.32 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 17 AX-SFUS, AX-SFUS-API QFN40 Soldering Profile Preheat Reflow Cooling tP TP Temperature TL tL TsMAX TsMIN ts 25C T25C to Peak Time Figure 6. QFN40 Soldering Profile Table 12. Profile Feature Pb-Free Process Average Ramp-Up Rate 3C/s max. Preheat Preheat Temperature Min TsMIN 150C Temperature Max TsMAX 200C Time (TsMIN to TsMAX) ts 60 - 180 sec Time 25C to Peak Temperature T25C to Peak 8 min max. Liquidus Temperature TL 217C Time over Liquidus Temperature tL 60 - 150 s Peak Temperature tp 260C Time within 5C of actual Peak Temperature Tp 20 - 40 s Reflow Phase Cooling Phase Ramp-down rate 6C/s max. 1. All temperatures refer to the top side of the package, measured on the the package body surface. www.onsemi.com 18 AX-SFUS, AX-SFUS-API QFN40 Recommended Pad Layout 1. PCB land and solder masking recommendations are shown in Figure 7. A = Clearance from PCB thermal pad to solder mask opening, 0.0635 mm minimum B = Clearance from edge of PCB thermal pad to PCB land, 0.2 mm minimum C = Clearance from PCB land edge to solder mask opening to be as tight as possible to ensure that some solder mask remains between PCB pads. D = PCB land length = QFN solder pad length + 0.1 mm E = PCB land width = QFN solder pad width + 0.1 mm Figure 7. PCB Land and Solder Mask Recommendations 3. For the PCB thermal pad, solder paste should be printed on the PCB by designing a stencil with an array of smaller openings that sum to 50% of the QFN exposed pad area. Solder paste should be applied through an array of squares (or circles) as shown in Figure 8. 4. The aperture opening for the signal pads should be between 50-80% of the QFN pad area as shown in Figure 9. 5. Optionally, for better solder paste release, the aperture walls should be trapezoidal and the corners rounded. 6. The fine pitch of the IC leads requires accurate alignment of the stencil and the printed circuit board. The stencil and printed circuit assembly should be aligned to within + 1 mil prior to application of the solder paste. 7. No-clean flux is recommended since flux from underneath the thermal pad will be difficult to clean if water-soluble flux is used. 2. Thermal vias should be used on the PCB thermal pad (middle ground pad) to improve thermal conductivity from the device to a copper ground plane area on the reverse side of the printed circuit board. The number of vias depends on the package thermal requirements, as determined by thermal simulation or actual testing. 3. Increasing the number of vias through the printed circuit board will improve the thermal conductivity to the reverse side ground plane and external heat sink. In general, adding more metal through the PC board under the IC will improve operational heat transfer, but will require careful attention to uniform heating of the board during assembly. Assembly Process Stencil Design & Solder Paste Application 1. Stainless steel stencils are recommended for solder paste application. 2. A stencil thickness of 0.125 - 0.150 mm (5 - 6 mils) is recommended for screening. Figure 8. Solder Paste Application on Exposed Pad www.onsemi.com 19 AX-SFUS, AX-SFUS-API Minimum 50% coverage 62% coverage Maximum 80% coverage Figure 9. Solder Paste Application on Pins Life Support Applications and agree to fully indemnify ON Semiconductor for any damages resulting from such improper use or sale. This product is not designed for use in life support appliances, devices, or in systems where malfunction of this product can reasonably be expected to result in personal injury. ON Semiconductor customers using or selling this product for use in such applications do so at their own risk Device Information The following device information can be queried using the AT-Commands AT$I=4, AT$I=5 for the APP version and AT$I=2, AT$I=3 for the chip version. Table 13. DEVICE VERSIONS APP Version Chip Version Product Part Number [0] [1] [0] [1] AX-SFUS AX-SFUS-1-01-XXXX1 0x01 0x01 0x8F 0x51 AX-SFUS-API AX-SFUS-API-1-01-XXXX1 0x01 0x01 0x8F 0x51 1. TB05 for Reel 500, TX30 for Reel 3000 reel Sigfox and Sigfox Ready are registered trademarks of Sigfox SARL. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 www.onsemi.com 20 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative AX-SFUS/D