Preliminary Specification Number : SP-PA1LD-L
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
W-LAN + Bluetooth Combo Module Data Sheet
Cypress for 802.11 b/g/n/Bluetooth 4.2 Chipset +
STMicroelectronics MCU
Tentative P/N : LBEE5PA1LD-TEMP
Preliminary Specification Number : SP-PA1LD-L
P. 1 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
The revision history of the product specification
Issued
Date
Revision
Code
Revision
Page
Changed Items
Change Reason
Jun.13.2016
-
-
First Issue
Oct.5.2016
A
P4~9
P11
P12
P19
5.Dimensions, Marking and Terminal
Configurations
8.2.With nRESET control
8.3. nRESET Circuit
11.1 Schematic
The pin assignment is
changed on ES2
Corrected
Corrected
The pin assignment is
changed on ES2
Dec.6.2016
B
P8
P20
5.3 internal connection
12. Tape and Reel Packing
Added
Added
Dec.13.2016
C
P19
11.1 Schematic
11.2. Boot mode selection pins
Corrected Pin name
Corrected Pin Number
Jan. 6. 2017
D
P3
Part Number
Corrected Part
Number
Feb. 21. 2017
E
P3
IC Part Number
Changed
Mar.24.2017
F
P8
P9
P10
P13~18
5.3 internal connection
5.4 Alternate functions table
7.Operation Condition
Low Datarate condition
Corrected
Corrected
Updated
Added
Mar.30, 2017
G
P10
7.Operation Condition
Updated Operating
Temperature Range
Jul.1.2017
H
P3
P4
P31
Certification information
Marking information
APPENDIX
Updated
Updated
Added
Jul.12.2017
I
P10
7. Operating Condition
Updated Specification
Temperature Range
Jan.9.2018
J
P11
P32
7.Operatin Condition
APPENDIX
Added comment”a”
Corrected
Oct.15.2018
K
Updated BT version to BT4.2
Updated
Jun.3.2019
L
P13
P29
9. RF Characteristics
14. PRECONDITION TO USE OUR
PRODUCTS
Corrected
Updated
Preliminary Specification Number : SP-PA1LD-L
P. 2 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
TABLE OF CONTENTS
14. PRECONDITION TO USE OUR PRODUCTS ................................................................................. 1
1. Scope ...................................................................................................................................................... 3
2. Part Number ......................................................................................................................................... 3
3. Block Diagram ....................................................................................................................................... 3
4. Certification Information ..................................................................................................................... 3
4.1. USA/Canada ................................................................................................................................... 3
4.2. Europe ............................................................................................................................................. 3
4.3. Japan ............................................................................................................................................... 3
5. Dimensions, Marking and Terminal Configurations ......................................................................... 4
5.1. Dimensions and Marking .............................................................................................................. 4
5.2. Terminal Configurations ................................................................................................................ 5
5.3. Internal connection (STM32F412-CYW43438) ............................................................................ 8
5.4. Alternate functions table ............................................................................................................... 9
6. Absolute Maximum Rating ................................................................................................................ 10
7. Operating Condition ........................................................................................................................... 10
8. Power Up Sequence ............................................................................................................................ 11
8.1. Without nRESET control ............................................................................................................. 11
8.2. With nRESET control .................................................................................................................. 11
8.3. nRESET Circuit ........................................................................................................................... 12
9. RF Characteristics .............................................................................................................................. 13
9.1. RF Characteristics for IEEE802.11b .......................................................................................... 13
9.1.1. High Rate Condition for IEEE802.11b - 2.4GHz ................................................................. 13
9.1.2. Low Rate Condition for IEEE802.11b - 2.4GHz .................................................................. 14
9.2. RF Characteristics for IEEE802.11g .......................................................................................... 15
9.2.1. High Rate Condition for IEEE802.11g - 2.4GHz ................................................................. 15
9.2.2. Low Rate Condition for IEEE802.11g - 2.4GHz .................................................................. 16
9.3. RF Characteristics for IEEE802.11n .......................................................................................... 17
9.3.1. High Rate Condition for IEEE802.11n - 2.4GHz ................................................................ 17
9.3.2. Low Rate Condition for IEEE802.11n - 2.4GHz .................................................................. 18
9.4. DC/RF Characteristics for Bluetooth .......................................................................................... 19
9.5. DC/RF Characteristics for Bluetooth（LE） ............................................................................. 20
10. Land Patterns (Top View) ................................................................................................................. 21
11. Reference Circuit ............................................................................................................................... 22
11.1. Schematic .................................................................................................................................... 22
11.2. Boot mode selection pins ............................................................................................................ 22
12. Tape and Reel Packing ..................................................................................................................... 23
13. NOTICE ............................................................................................................................................. 26
13.1. Storage Conditions: .................................................................................................................... 26
13.2. Handling Conditions: ................................................................................................................. 26
13.3. Standard PCB Design (Land Pattern and Dimensions): ........................................................ 26
13.4. Notice for Chip Placer: ............................................................................................................... 26
13.5. Soldering Conditions: ................................................................................................................. 27
13.6. Cleaning: ..................................................................................................................................... 27
13.7. Operational Environment Conditions: ..................................................................................... 27
13.8. Input Power Capacity: ............................................................................................................... 28
13.9. Errata on MCU ........................................................................................................................... 28
14. PRECONDITION TO USE OUR PRODUCTS ............................................................................... 29
Please be aware that an important notice concerning availability, standard warranty and use in
critical applications of Murata products and disclaimers thereto appears at the end of this
specification sheet.
Preliminary Specification Number : SP-PA1LD-L
P. 3 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
1. Scope
This specification is applied to the IEEE802.11b/g/n W-LAN/Bluetooth 4.2+ STM32F412 MCU
complete module.
- IC : Cypress/CYW43438 + STMicroelectronics/STM32F412
- RoHS : This module is compliant with the RoHS directive.
- MSL : 3
- MAC/BD address : MAC/BD address is embedded
2. Part Number
Sample Part Number
LBEE5PA1LD-TEMP
3. Block Diagram
4. Certification Information
4.1. USA/Canada
FCC ID : VPYLB1LD
IC : 772C-LB1LD
*Please follow user/installation manual of Appendix
4.2. Europe
EN300328 v2.1.1 conducted test report is prepared.
4.3. Japan
Japanese type certification is prepared.
Preliminary Specification Number : SP-PA1LD-L
P. 4 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
5. Dimensions, Marking and Terminal Configurations
5.1. Dimensions and Marking
b1 m2 a1 c2
e6
m3
m5
e8
b2
m6
e5
m4
e4e3
c3
a2
e2
m1
e1
c1
L
W
T
e7
e9
Marking
A
B
C
D
E
F
G
Mark
Dimensions
Mark
Dimensions
Mark
Dimensions
L
8.9 +/- 0.2
W
7.8 +/- 0.2
T
1.2 max.
a1
0.3 +/- 0.1
a2
0.3 +/- 0.1
b1
0.3 +/- 0.2
b2
0.3 +/- 0.2
c1
0.6 +/- 0.1
c2
0.6 +/- 0.1
c3
0.45 +/- 0.10
e1
0.3 +/- 0.1
e2
0.3 +/- 0.1
e3
0.9 +/- 0.1
e4
0.9 +/- 0.1
e5
0.9 +/- 0.1
e6
1.15 +/- 0.10
e7
0.8 +/- 0.1
e8
0.45 +/- 0.10
e9
0.4 +/- 0.1
m1
0.3 +/- 0.1
m2
0.6 +/- 0.1
m3
0.7 +/- 0.1
m4
0.7 +/- 0.1
m5
0.35 +/- 0.1
m6
0.35 +/- 0.10
(unit : mm)
Structure
< Side View >
< Bottom View >
< Top View >
CYW43438
E
F
G
A
D
B
C
Preliminary Specification Number : SP-PA1LD-L
P. 5 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
5.2. Terminal Configurations <TOP VIEW>
1 2 3 4 5 6 7 8 9 10 11 12
13
14
15
16
17
18
19
20
21
22
23
2425262728293031323334
35
36
37
38
39
40
41
42
43
44
45
46
56
57
58
59
60
61
62
63
64 47
48
49
50
51
52
53
54
55
68
69
70 65
66
67
No.
Terminal Name
No.
Terminal Name
No.
Terminal Name
1
PC15/OSC32_OUT
23
GND
45
VBAT_MCU
2
PC14/OSC32_IN
24
PA9/USART1_TX
46
GND
3
GND
25
PA10/USART1_RX
47
GND
4
VDD_WLAN
26
PA11/USART1_CTS
48
GND
5
GND
27
PA12/USART1_RTS
49
PC5
6
BT_PCM_CLK
28
PB15/SPI2_MOSI
50
WL_GPIO_1
7
BT_PCM_IN
29
PB14/SPI2_MISO
51
WL_GPIO_2
8
BT_PCM_OUT
30
PB13/SPI2_SCK
52
WLRF_GPIO
9
BT_PCM_SYNC
31
PB12/SPI2_NSS
53
CLK_REQ
10
GND
32
nRESET
54
PB9
11
RF_OUT
33
GND
55
PB10
12
GND
34
VDD_IO
56
PB8/I2S5_SD
13
GND
35
GND
57
PB1/I2S5_WS
14
PC1/WAKE
36
PC7/USART6_RX
58
PB0/I2S5_CK
15
WL_GPIO_0_HOST_WAKE
37
PC6/USART6_TX
59
PC4
16
LPO_IN
38
BOOT0
60
PB5/I2C1_SMBA
17
PA8/MCO_1
39
PA7/SPI1_MOSI
61
PB6/12C1_SCL
18
PB3/JTDO
40
PA5/SPI1_SCK
62
PB7/I2C1_SDA
19
PB4/JTRST
41
PA4/SPI1_NSS
63
PB2/BOOT1
20
PA13/JTMS
42
PA6/SPI1_MISO
64
GND
21
PA14/JTCK
43
VSSA/VREF-
65~70
GND
22
PA15/JTDI
44
VDDA_MCU
-
-
Preliminary Specification Number : SP-PA1LD-L
P. 6 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
No.
Terminal Name
Type
Connection to
MCU
Connection
to WLAN IC
Description
1
PC15/OSC32_OUT
I/O
PC15/OSC32_
OUT
2
PC14/OSC32_IN
I/O
PC14/OSC32_I
N
3
GND
-
GND
GND
Ground
4
VDD_WLAN
I
LDO_VBAT5V
SR_VBAT5V
Power supply to WLAN IC
5
GND
-
GND
GND
Ground
6
BT_PCM_CLK
I/O
BT_PCM_CLK
7
BT_PCM_IN
I
BT_PCM_IN
8
BT_PCM_OUT
O
BT_PCM_OUT
9
BT_PCM_SYNC
I/O
BT_PCM_SYN
C
10
GND
-
GND
GND
Ground
11
RF_OUT
I/O
RF_OUT
12
GND
-
GND
GND
Ground
13
GND
-
GND
GND
Ground
14
PC1/WAKE
I/O
PC1
15
WL_GPIO_0_HOST
_WAKE
I/O
GPIO_0
16
LPO_IN
I
LPO_IN
17
PA8/MCO_1
I/O
PA8
18
PB3/JTDO
I/O
PB3
19
PB4/JTRST
I/O
PB4
20
PA13/JTMS
I/O
PA13
21
PA14/JTCK
I/O
PA14
22
PA15/JTDI
I/O
PA15
23
GND
-
GND
GND
Ground
24
PA9/USART1_TX
I/O
PA9
25
PA10/USART1_RX
I/O
PA10
26
PA11/USART1_CTS
I/O
PA11
27
PA12/USART1_RTS
I/O
PA12
Preliminary Specification Number : SP-PA1LD-L
P. 7 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
28
PB15/SPI2_MOSI
I/O
PB15
29
PB14/SPI2_MISO
I/O
PB14
30
PB13/SPI2_SCK
I/O
PB13
31
PB12/SPI2_NSS
I/O
PB12
32
nRESET
I/O
NRST
33
GND
-
GND
GND
Ground
34
VDD_IO
I
VDD
WCC_VDDIO
Power supply to WLAN IC and MCU
35
GND
-
GND
GND
Ground
36
PC7/USART6_RX
I/O
PC7
37
PC6/USART6_TX
I
PC6
38
BOOT0
I
BOOT0
Internal 10kohm pull down
39
PA7/SPI1_MOSI
I/O
PA7
40
PA5/SPI1_SCK
I/O
PA5
41
PA4/SPI1_NSS
I/O
PA4
42
PA6/SPI1_MISO
I/O
PA6
43
VSSA/VREF-
I
VSSA/VREF-
44
VDDA_MCU
I
VDDA/VREF+
Power supply to MCU
45
VBAT_MCU
I
VBAT
Power supply to MCU
46
GND
-
GND
GND
Ground
47
GND
-
GND
GND
Ground
48
GND
-
GND
GND
Ground
49
PC5
I/O
PC5
50
WL_GPIO_1
I/O
GPIO_1
51
WL_GPIO_2
I/O
GPIO_2
52
WLRF_GPIO
I/O
WLRF_GPIO
Test pin. Not connected in normal
operation.
53
CLK_REQ
O
CLK_REQ
Asserts CLK_REQ when WLAN directs
the host to turn on the reference clock.
The CLK_REQ polarity is active-high.
54
PB9
I/O
PB9
55
PB10
I/O
PB10
Preliminary Specification Number : SP-PA1LD-L
P. 8 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
56
PB8/I2S5_SD
I/O-
PB8
57
PB1/I2S5_WS
I/O
PB1
58
PB0/I2S5_CK
I/O
PB0
59
PC4
I/O
PC4
60
PB5/I2C1_SMBA
I/O
PB5
61
PB6/12C1_SCL
I/O
PB6
62
PB7/I2C1_SDA
I/O
PB7
63
PB2/BOOT1
I/O
PB2
Connect to Ground except GPIO used
64
GND
-
GND
GND
Ground
65
-70
GND
-
GND
GND
Ground
5.3. Internal connection (STM32F412-CYW43438)
STM32F412
CYW43438
STM32F412
X'tal (26MHz)
PA0
BT_UART_RTS_N
PH0
OSC_IN
PA1
BT_UART_CTS_N
PH1
OSC_OUT
PA2
BT_UART_RXD
PA3
BT_UART_TXD
PC0
BT_HOST_WAKE
PC2
BT_REG_ON
PC3
BT_DEV_WAKE
PC8
SDIO_D0
PC9
SDIO_D1
PC10
SDIO_D2
PC11
SDIO_D3
PC12
SDIO_CK
PC13
WL_REG_ON
PD2
SDIO_CMD
*Murata platform file follow this connection.
Preliminary Specification Number : SP-PA1LD-L
P. 9 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
5.4. Alternate functions table
The Items in Bold Letters are the murata platform file settings.
MCU
Pin
Module
Pin
Alternate Function
Additional
Function
AF0
AF1
AF2
AF3
AF4
AF5
AF6
AF7
AF8
AF9
AF10
AF12
AF15
PA4
Pin 41
-
-
-
-
-
SPI1_NSS/I
2S1_WS
SPI3_NSS/I
2S3_WS
USART2_C
K
DFSDM_DA
TIN1
-
-
FSMC_D6
EVENTOUT
ADC1_4
PA5
Pin 40
-
TIM2_CH1/
TIM2_ETR
-
TIM8_CH1
N
-
SPI1_SCK/I
2S1_CK
-
-
DFSDM_CK
IN1
-
-
FSMC_D7
EVENTOUT
ADC1_5
PA6
Pin 42
-
TIM1_BKIN
TIM3_CH1
TIM8_BKIN
-
SPI1_MISO
I2S2_MCK
-
-
TIM13_CH1
QUADSPI_
BK2_IO0
SDIO_CMD
EVENTOUT
ADC1_6
PA7
Pin 39
-
TIM1_CH1
N
TIM3_CH2
TIM8_CH1
N
-
SPI1_MOSI
/I2S1_SD
-
-
-
TIM14_CH1
QUADSPI_
BK2_IO1
-
EVENTOUT
ADC1_7
PA8
Pin 17
MCO_1
TIM1_CH1
-
-
I2C3_SCL
-
-
USART1_C
K
-
-
USB_FS_S
OF
SDIO_D1
EVENTOUT
-
PA9
Pin 24
-
TIM1_CH2
-
-
I2C3_SMBA
-
-
USART1_T
X
-
-
USB_FS_V
BUS
SDIO_D2
EVENTOUT
-
PA10
Pin 25
-
TIM1_CH3
-
-
-
-
SPI5_MOSI
/I2S5_SD
USART1_R
X
-
-
USB_FS_ID
-
EVENTOUT
-
PA11
Pin 26
-
TIM1_CH4
-
-
-
-
SPI4_MISO
USART1_C
TS
USART6_T
X
CAN1_RX
USB_FS_D
M
-
EVENTOUT
-
PA12
Pin 27
-
TIM1_ETR
-
-
-
-
SPI5_MISO
USART1_R
TS
USART6_R
X
CAN1_TX
USB_FS_D
P
-
EVENTOUT
-
PA13
Pin 20
JTMSSWDI
O
-
-
-
-
-
-
-
-
-
-
-
EVENTOUT
-
PA14
Pin 21
JTCKSWC
LK
-
-
-
-
-
-
-
-
-
-
-
EVENTOUT
-
PA15
Pin 22
JTDI
TIM2_CH1/
TIM2_ETR
-
-
-
SPI1_NSS/I
2S1_WS
SPI3_NSS/I
2S3_WS
USART1_T
X
-
-
-
-
EVENTOUT
-
PB0
Pin 58
-
TIM1_CH2
N
TIM3_CH3
TIM8_CH2
N
-
-
SPI5_SCK/I
2S5_CK
-
-
-
-
-
EVENTOUT
ADC1_8
PB1
Pin 57
-
TIM1_CH3
N
TIM3_CH4
TIM8_CH3
N
-
-
SPI5_NSS/I
2S5_WS
-
DFSDM_DA
TIN0
QUADSPI_
CLK
-
-
EVENTOUT
ADC1_9
PB2
Pin 63
-
-
-
-
-
-
DFSDM_CK
IN0
-
-
QUADSPI_
CLK
-
-
EVENTOUT
BOOT1
PB3
Pin 18
JTDOSWO
TIM2_CH2
-
-
I2CFMP1_S
DA
SPI1_SCK/I
2S1_CK
SPI3_SCK/I
2S3_CK
USART1_R
X
-
I2C2_SDA
-
-
EVENTOUT
-
PB4
Pin 19
JTRST
-
TIM3_CH1
-
-
SPI1_MISO
SPI3_MISO
I2S3ext_SD
-
I2C3_SDA
-
SDIO_D0
EVENTOUT
-
PB5
Pin 60
-
-
TIM3_CH2
-
I2C1_SMB
A
SPI1_MOSI
/I2S1_SD
SPI3_MOSI
/I2S3_SD
-
-
CAN2_RX
-
SDIO_D3
EVENTOUT
-
PB6
Pin 61
-
-
TIM4_CH1
-
I2C1_SCL
-
-
USART1_T
X
-
CAN2_TX
QUADSPI_
BK1_NCS
SDIO_D0
EVENTOUT
-
PB7
Pin 62
-
-
TIM4_CH2
-
I2C1_SDA
-
-
USART1_R
X
-
-
-
FSMC_NL
EVENTOUT
-
PB8
Pin 56
-
-
TIM4_CH3
TIM10_CH1
I2C1_SCL
-
SPI5_MOSI
/I2S5_SD
-
CAN1_RX
I2C3_SDA
-
SDIO_D4
EVENTOUT
-
PB9
Pin 54
-
-
TIM4_CH4
TIM11_CH1
I2C1_SDA
SPI2_NSS/I
2S2_WS
-
-
CAN1_TX
I2C2_SDA
-
SDIO_D5
EVENTOUT
-
PB10
Pin 55
-
TIM2_CH3
-
-
I2C2_SCL
SPI2_SCK/I
2S2_CK
I2S3_MCK
USART3_T
X
-
I2CFMP1_S
CL
-
SDIO_D7
EVENTOUT
-
PB12
Pin 31
-
TIM1_BKIN
-
-
I2C2_SMBA
SPI2_NSS/I
2S2_WS
SPI4_NSS/I
2S4_WS
SPI3_SCK/I
2S3_CK
USART3_C
K
CAN2_RX
DFSDM_DA
TIN1
FSMC_D13/
FSMC_DA1
3
EVENTOUT
-
PB13
Pin 30
-
TIM1_CH1
N
-
-
I2CFMP1_S
MBA
SPI2_SCK/I
2S2_CK
SPI4_SCK/I
2S4_CK
-
USART3_C
TS
CAN2_TX
DFSDM_CK
IN1
-
EVENTOUT
-
PB14
Pin 29
-
TIM1_CH2
N
-
TIM8_CH2
N
I2CFMP1_S
DA
SPI2_MISO
I2S2ext_SD
USART3_R
TS
DFSDM_DA
TIN2
TIM12_CH1
FSMC_D0
SDIO_D6
EVENTOUT
-
PB15
Pin 28
RTC_50Hz
TIM1_CH3
N
-
TIM8_CH3
N
I2CFMP1_S
CL
SPI2_MOSI
/I2S2_SD
-
-
DFSDM_CK
IN2
TIM12_CH2
-
SDIO_CK
EVENTOUT
-
PC1
Pin 14
-
-
-
-
-
-
-
-
-
-
-
-
EVENTOUT
ADC1_11,
WKUP3
PC4
Pin 59
-
-
-
-
-
I2S1_MCK
-
-
-
-
QUADSPI_
BK2_IO2
FSMC_NE4
EVENTOUT
ADC1_14
PC5
Pin 49
-
-
-
-
I2CFMP1_S
MBA
-
-
USART3_R
X
-
-
QUADSPI_
BK2_IO3
FSMC_NO
E
EVENTOUT
ADC1_15
PC6
Pin 37
-
-
TIM3_CH1
TIM8_CH1
I2CFMP1_S
CL
I2S2_MCK
DFSDM_CK
IN3
-
USART6_T
X
-
FSMC_D1
SDIO_D6
EVENTOUT
-
PC7
Pin 36
-
-
TIM3_CH2
TIM8_CH2
I2CFMP1_S
DA
SPI2_SCK/I
2S2_CK
I2S3_MCK
-
USART6_R
X
-
DFSDM_DA
TIN3
SDIO_D7
EVENTOUT
-
PC14
Pin 2
-
-
-
-
-
-
-
-
-
-
-
-
EVENTOUT
OSC32_IN
PC15
Pin 1
-
-
-
-
-
-
-
-
-
-
-
-
EVENTOUT
OSC32_OU
T
(*)PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use
of GPIOs PC14 and PC15 in output mode is limited: - The speed should not exceed 2 MHz with a maximum load of 30 pF. - These
I/Os must not be used as a current source (e.g. to drive an LED).
Preliminary Specification Number : SP-PA1LD-L
P. 10 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
6. Absolute Maximum Rating
min.
max.
unit
Storage Temperature
-40
85
deg.C
Supply Voltage
VDD_WLAN
-0.3
6.0
V
VDD_IO
-0.3
3.9
V
VBAT_MCU
-0.3
4.0
V
VDDA_MCU
-0.4
4.0
V
Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under
these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No
damage assuming only one parameter is set at limit at a time with all other parameters is set within operating
condition
7. Operating Condition
min.
typ.
max.
Unit
Operating Temperature Range
-40
85
deg.C
Specification Temperature Range
-20
70
deg.C
Supply Voltage
VDD_WLAN
3.2
4.8a
V
VDD_IOb
1.8
3.3
3.6
V
VBAT_MCUb
1.8
3.3
3.6
V
VDDA_MCUb
1.8
3.3
3.6
V
*a: Maximum continuous voltage is 4.8V. Voltages up to 6.0V for up to 10 seconds, cumulative duration
over the lifetime of the device are allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative
duration over the lifetime of the device are allowed.
*b: MCU behavior depends on input voltage. Please refer to Datasheet of STM32F412.
[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range.
Preliminary Specification Number : SP-PA1LD-L
P. 11 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
8. Power Up Sequence
8.1. Without nRESET control
*Power down sequence is opposite sequence of power up.
8.2. With nRESET control
*Power down sequence is opposite sequence of power up.
*nRESET pin must be controlled by Open Drain.
VDD_IO
Ramp time 90% > 40µs
VDD_WLAN
Timing same as VDD_IO
VBAT_MCU
nRESET
VDDA_MCU
Timing same as VDD_IO
VBAT_MCU
Timing same as VDD_IO
VDDA_MCU
Timing same as VDD_IO
VDD_IO
Ramp time 90% > 40µs
Timing same as VDD_IO
VDD_WLAN
Timing same as VDD_IO
Timing of deassertion Reset signal same as VDD_IO
Preliminary Specification Number : SP-PA1LD-L
P. 12 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
8.3. nRESET Circuit
(1) The reset network protects the device against parasitic resets.
(2) The use must ensure that the level on the nRESET pin can go below the VIL(NRST) max level
specified in below table. Otherwise the reset is not taken into account by the device.
(3) nRESET pin must be controlled by Open Drain. High signal must not input to this pin.
Symbol
Parameter
Min
Typ
Max
Unit
VIL
nRESET I/O input
low level voltage
-
-
0.1VDD_IO+0.1
V
nRESET(32pin)
Type1L
D
module
VDD_IO
40k
0.1uF
Filter
Internal
Reset
Preliminary Specification Number : SP-PA1LD-L
P. 13 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9. RF Characteristics
9.1. RF Characteristics for IEEE802.11b
Specification
IEEE802.11b
Mode
DSSS / CCK
Frequency
2400 - 2483.5MHz
Data rate
1, 2, 5.5, 11Mbps
9.1.1. High Rate Condition for IEEE802.11b - 2.4GHz
Conditions
25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 11Mbps mode
Items
Contents
- DC Characteristics -
min.
Typ.
max.
Unit
1. DC current
1) Tx mode (1024byte, 20usec interval)
*1
-
330
410
mA
2) Rx mode
-
55
100
mA
- Tx Characteristics *1 -
min.
Typ.
max.
Unit
2. Output Power
15.0
17.0
19.0
dBm
3. Spectrum Mask Margin
1) 1st side lobes(-30dBr)
0
10
-
dB
2) 2nd side lobes(-50dBr)
0
6
-
dB
4. Power-on and Power-down ramp
-
-
2.0
usec
5. RF Carrier Suppression
15
-
-
dB
6. Modulation Accuracy (EVM)
-
18
35
%
7. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
-
-
-36
dBm
2) 1GHz to 12.75GHz (BW=100kHz)
-
-
-30
dBm
3) 1.8GHz to 1.9GHz (BW=100kHz)
-
-
-47
dBm
4) 5.15GHz to 5.3GHz (BW=100kHz)
-
-
-47
dBm
- Rx Characteristics -
min.
typ.
max.
Unit
8. Minimum Input Level Sensitivity
1) 11Mbps (FER < 8%)
-
-89
-76
dBm
9. Maximum Input Level (FER < 8%)
-10
-
-
dBm
10. Adjacent Channel Rejection
(FER < 8%)
35
-
-
dB
*1: Defined when output power setting is 17dBm at Murata module antenna pad
Preliminary Specification Number : SP-PA1LD-L
P. 14 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9.1.2. Low Rate Condition for IEEE802.11b - 2.4GHz
Conditions
25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 1Mbps mode
Items
Contents
- DC Characteristics -
min.
Typ.
max.
Unit
1. DC current
1) Tx mode (1024byte, 20usec interval)
*2
-
330
410
mA
2) Rx mode
-
55
100
mA
- Tx Characteristics *2 -
min.
Typ.
max.
Unit
2. Output Power
15.0
17.0
19.0
dBm
3. Spectrum Mask Margin
1) 1st side lobes(-30dBr)
0
12
-
dB
2) 2nd side lobes(-50dBr)
0
5
-
dB
4. Power-on and Power-down ramp
-
-
2.0
usec
5. RF Carrier Suppression
15
-
-
dB
6. Modulation Accuracy (EVM)
-
14
35
%
7. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
-
-
-36
dBm
2) 1GHz to 12.75GHz (BW=100kHz)
-
-
-30
dBm
3) 1.8GHz to 1.9GHz (BW=100kHz)
-
-
-47
dBm
4) 5.15GHz to 5.3GHz (BW=100kHz)
-
-
-47
dBm
- Rx Characteristics -
min.
typ.
max.
Unit
8. Minimum Input Level Sensitivity
1) 1Mbps (FER < 8%)
-
-96
-80
dBm
9. Maximum Input Level (FER < 8%)
-4
-
-
dBm
10. Adjacent Channel Rejection
(FER < 8%)
35
-
-
dB
*2: Defined when output power setting is 17dBm at Murata module antenna pad
Preliminary Specification Number : SP-PA1LD-L
P. 15 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9.2. RF Characteristics for IEEE802.11g
Specification
IEEE802.11g
Mode
OFDM
Frequency
2400 - 2483.5MHz
Data rate
6, 9, 12, 18, 24, 36, 48, 54Mbps
9.2.1. High Rate Condition for IEEE802.11g - 2.4GHz
Conditions:
25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=13dBm, 54Mbps mode
Items
Contents
- DC Characteristics -
min.
Typ.
max.
Unit
1. DC current
1) Tx mode (1024byte, 20usec interval)
*3
-
250
330
mA
2) Rx mode
-
55
100
mA
- Tx Characteristics*3 -
min.
typ.
max.
unit
2. Output Power
11.0
13.0
15.0
dBm
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
0
10
-
dB
2) 11MHz to 20MHz (-20~ -28dBr)
0
10
-
dB
3) 20MHz to 30MHz (-28~ -40dBr)
0
10
-
dB
4) 30MHz to 33MHz (-40dBr)
0
10
-
dB
4. Constellation Error (EVM)
-
-34
-25
dB
5. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
-
-
-36
dBm
2) 1GHz to 12.75GHz (BW=100kHz)
-
-
-30
dBm
3) 1.8GHz to 1.9GHz (BW=100kHz)
-
-
-47
dBm
4) 5.15GHz to 5.3GHz (BW=100kHz)
-
-
-47
dBm
- Rx Characteristics -
min.
typ.
max.
Unit
6. Minimum Input Level Sensitivity
1) 54Mbps (PER < 10%)
-
-76
-65
dBm
7. Maximum Input Level (PER < 10%)
-20
-
-
dBm
8. Adjacent Channel Rejection
(PER < 10%)
-1
-
-
dB
*3: Defined when output power setting is 13dBm at Murata module antenna pad
Preliminary Specification Number : SP-PA1LD-L
P. 16 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9.2.2. Low Rate Condition for IEEE802.11g - 2.4GHz
Conditions:
25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 6Mbps mode
Items
Contents
- DC Characteristics -
min.
Typ.
max.
Unit
1. DC current
1) Tx mode (1024byte, 20usec interval)
*3
-
320
400
mA
2) Rx mode
-
55
100
mA
- Tx Characteristics*3 -
min.
typ.
max.
unit
2. Output Power
15.0
17.0
19.0
dBm
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
0
10
-
dB
2) 11MHz to 20MHz (-20~ -28dBr)
0
10
-
dB
3) 20MHz to 30MHz (-28~ -40dBr)
0
10
-
dB
4) 30MHz to 33MHz (-40dBr)
0
10
-
dB
4. Constellation Error (EVM)
-
-29
-5
dB
5. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
-
-
-36
dBm
2) 1GHz to 12.75GHz (BW=100kHz)
-
-
-30
dBm
3) 1.8GHz to 1.9GHz (BW=100kHz)
-
-
-47
dBm
4) 5.15GHz to 5.3GHz (BW=100kHz)
-
-
-47
dBm
- Rx Characteristics -
min.
typ.
max.
Unit
6. Minimum Input Level Sensitivity
1) 6Mbps (PER < 10%)
-
-91
-82
dBm
7. Maximum Input Level (PER < 10%)
-20
-
-
dBm
8. Adjacent Channel Rejection
(PER < 10%)
-1
-
-
dB
*3: Defined when output power setting is 17dBm at Murata module antenna pad
Preliminary Specification Number : SP-PA1LD-L
P. 17 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9.3. RF Characteristics for IEEE802.11n
Specification
IEEE802.11n
Mode
OFDM
Frequency
2400 - 2483.5MHz
Data rate
6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
9.3.1. High Rate Condition for IEEE802.11n - 2.4GHz
Conditions:
25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=12dBm, 65Mbps(MCS7) mode
Items
Contents
- DC Characteristics -
min.
Typ.
max.
Unit
1. DC current
1) Tx mode (1024byte, 20usec interval)
*5
-
240
320
mA
2) Rx mode
-
55
100
mA
- Tx Characteristics*5 -
min.
typ.
max.
Unit
2. Output Power
10.0
12.0
14.0
dBm
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0 ~ -20dBr)
0
10
-
dB
2) 11MHz to 20MHz (-20 ~ -28dBr)
0
10
-
dB
3) 20MHz to 30MHz (-28 ~ -45dBr)
0
6
-
dB
4) 30MHz to 33MHz (-45dBr)
0
6
-
dB
4. Constellation Error (EVM)
-
-35
-27
dB
5. Outband Spurious Emissions
1) 30MHz to 1GHz
-
-
-36
dBm
2) 1GHz to 12.75GHz
-
-
-30
dBm
3) 1.8GHz to 1.9GHz
-
-
-47
dBm
4) 5.15GHz to 5.3GHz
-
-
-47
dBm
- Rx Characteristics -
min.
typ.
max.
Unit
6. Minimum Input Level Sensitivity
1) 65Mbps (PER < 10%)
-
-73
-64
dBm
7. Maximum Input Level (PER < 10%)
-20
-
-
dBm
8. Adjacent Channel Rejection
(PER < 10%)
-2
-
-
dB
*5: Defined when output power setting is 12dBm at Murata module antenna pad
Preliminary Specification Number : SP-PA1LD-L
P. 18 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9.3.2. Low Rate Condition for IEEE802.11n - 2.4GHz
Conditions:
25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 6.5Mbps(MCS0) mode
Items
Contents
- DC Characteristics -
min.
Typ.
max.
Unit
1. DC current
1) Tx mode (1024byte, 20usec interval)
*6
-
310
390
mA
2) Rx mode
-
55
100
mA
- Tx Characteristics*6 -
min.
typ.
max.
Unit
2. Output Power
15.0
17.0
19.0
dBm
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0 ~ -20dBr)
0
9
-
dB
2) 11MHz to 20MHz (-20 ~ -28dBr)
0
9
-
dB
3) 20MHz to 30MHz (-28 ~ -45dBr)
0
6
-
dB
4) 30MHz to 33MHz (-45dBr)
0
6
-
dB
4. Constellation Error (EVM)
-
-29
-5
dB
5. Outband Spurious Emissions
1) 30MHz to 1GHz
-
-
-36
dBm
2) 1GHz to 12.75GHz
-
-
-30
dBm
3) 1.8GHz to 1.9GHz
-
-
-47
dBm
4) 5.15GHz to 5.3GHz
-
-
-47
dBm
- Rx Characteristics -
min.
typ.
max.
Unit
6. Minimum Input Level Sensitivity
1) 6.5Mbps (PER < 10%)
-
-90
-82
dBm
7. Maximum Input Level (PER < 10%)
-20
-
-
dBm
8. Adjacent Channel Rejection
(PER < 10%)
-2
-
-
dB
*6: Defined when output power setting is 17dBm at Murata module antenna pad
Preliminary Specification Number : SP-PA1LD-L
P. 19 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9.4. DC/RF Characteristics for Bluetooth
Normal conditions : 25 deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V
Items
Contents
Bluetooth specification (power class)
Version 4.2 (Class1)
Channel frequency (spacing)
2402 to 2480 MHz (1MHz)
Transmitter
Min.
Typ.
Max.
Unit
Output Power
BR
-
8.5
12
dBm
Frequency range
2400
-
2483.5
MHz
20dB bandwidth
-
1
MHz
Modulation characteristics
(a) Modulation Δf1avg
140
-
175
kHz
(b) Modulation Δf2max
115
-
kHz
(c) Modulation Δf2avg / Δf1avg
0.8
-
-
Carrier Frequency Drift
(a) 1slot
-25
-
+25
kHz
(b) 3slot / 5slot
-40
-
+40
kHz
(c) Maximum drift rate
-20
-
+20
kHz/50u
s
EDR Relative Power
-4
-
+1
dB
EDR Carrier Frequency Stability and Modulation Accuracy
(a) ωi
-75
-
+75
kHz
(b) ωi+ωo
-75
-
+75
kHz
(c) ωo
-10
-
+10
kHz
(d) RMS DEVM (π/4 DQPSK)
-
-
20
%
(e) Peak DEVM (π/4 DQPSK)
-
-
35
%
(f) 99% DEVM (π/4 DQPSK)
-
-
30
%
(g) RMS DEVM (8DPSK)
-
-
13
%
(h) Peak DEVM (8DPSK)
-
-
25
%
(i) 99% DEVM (8DPSK)
-
-
20
%
Spurious Emissions (BW=100kHz)
(a) 10MHz≦f<2387MHz
-
-
-36
dBm
(b) 2387MHz≦f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz<f≦2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f≦8GHz
-
-
-47
dBm
Receiver
Min.
Typ.
Max.
Unit
Sensitivity (BER<0.1%)
-
-92
-70
dBm
Maximum Input Level (BER<0.1%)
-20
-
-
dBm
EDR Sensitivity (BER<0.007%)
(a) 8DPSK
-
-88
-70
dBm
Preliminary Specification Number : SP-PA1LD-L
P. 20 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
9.5. DC/RF Characteristics for Bluetooth（LE）
Normal conditions : 25 deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V
Items
Contents
Bluetooth specification (power class)
Version 4.2 (LE)
Channel frequency (spacing)
2402 to 2480 MHz (2MHz)
Number of RF Channel
40
Item / Condition
Min.
Typ.
Max.
Unit
Center Frequency
2402
-
2480
MHz
Channel Spacing
-
2
-
MHz
Number of RF channel
-
40
-
-
Output power
-
-
10
dBm
Modulation Characteristics
1) Δf1avg
225
-
275
kHz
2) Δf2max (at 99.9%)
185
-
-
kHz
3) Δf2avg / Δf1avg
0.8
-
-
-
Carrier frequency offset and drift
1) Frequency offset
-150
-
150
kHz
2) Frequency drift
-
-
50
kHz
3) Drift rate
-
-
20
kHz
Receiver sensitivity (PER < 30.8%)
-
-96
-70
dBm
Maximum input signal level (PER < 30.8%)
-10
-
-
dBm
PER Report Integrity (-30dBm input)
50
-
65.4
%
Preliminary Specification Number : SP-PA1LD-L
P. 21 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
10. Land Patterns (Top View)
Unit : mm
Preliminary Specification Number : SP-PA1LD-L
P. 22 / 32
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
11. Reference Circuit
11.1. Schematic
1
2
3
4
5
A B C D E F G H
1
2
3
4
5
A B C D E F G H
BT_PCM_SYNC
GND
JTDO
JTRST
JTCK
JTDI
USART1_TX
USART1_RX
USART1_CTS
USART1_RTS
nRESET
GND
VDD_IO
PB2/BOOT1
PC4
BOOT0
USART6_TX
USART6_RX
I2C1_SCL
I2C1_SDA
I2C1_SMBA
I2S5_CK
I2S5_WS
I2S5_SD
GND GND
PC5
WL_GPIO_1
WL_GPIO_2
WLRF_GPIO
PB9
PB10
RF_OUT
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
JTMS
SPI2_MOSI
SPI2_MISO
SPI2_SCK
SPI2_NSS
SPI1_MOSI
SPI1_SCK
SPI1_NSS
SPI1_MISO
CLK_REQ
4.7uF
0.1uF
4.7uF
0.1uF
VDDA_MCU
GND
0.1uF 4.7uF
4.7uF
0.1uF
VBAT_MCU
0
DEPOP
GND GND
DEPOP
0
DEPOP
GND GND
DEPOP
RF_OUT
VDD_WLAN
PC15/OSC32_OUT
PC14/OSC32_IN
PC15/OSC32_OUT
PC14/OSC32_IN
32.768kHz
0ohm
GND GND
RF line
X'tal
*0ohm and DEPOP are for initial evaluation.
Please make sure to tune "Antenna matching" and "PI-network attenuator
VBAT_MCU 45
GND
13
GND
12
VDD_IO
34
GND
33
nRESET
32
PB12/SPI2_NSS
31
PB13/SPI2_SCK
30
PB14/SPI2_MISO
29
PB15/SPI2_MOSI
28
PA12/USART1_RTS
27
PA11/USART1_CTS
26
PA10/USART1_RX
25
PA9/USART1_TX
24
GND 46
PA14/JTCK
21
PC1/WAKE
14
WL_GPIO_0_HOST_WAKE
15
LPO_IN
16
PA8/MCO_1
17
PB3/JTDO
18
PB4/JTRST
19
PA13/JTMS
20
PA15/JTDI
22
GND
23
RF_OUT 11
GND 10
BT_PCM_SYNC 9
BT_PCM_OUT 8
BT_PCM_IN 7
BT_PCM_CLK 6
GND 5
VDD_WLAN 4
GND 3
PC14/OSC32_IN 2
PC15/OSC32_OUT 1
GND 65-70
GND 35
PC7/USART6_RX 36
PC6/USART6_TX 37
BOOT0 38
PA7/SPI1_MOSI 39
PA5/SPI1_SCK 40
PA4/SPI1_NSS 41
PA6/SPI1_MISO 42
VSSA/VREF- 43
VDDA_MCU 44
GND
47
GND
48
PC5
49
WL_GPIO_1
50
WL_GPIO_2
51
WLRF_GPIO
52
CLK_REQ
53
PB9
54
PB10
55
GND 64
PB2/BOOT1 63
PB7/I2C1_SDA 62
PB5/I2C1_SMBA 60
PC4 59
PB0/I2S5_CK 58
PB1/I2S5_WS 57
PB8/I2S5_SD 56
PB6/I2C1_SCL 61
LBEE5PA1LD
U1
PI-network attenuator Antenna matching
11.2. Boot mode selection pins
Boot mode selection pins must be set as below table.
BOOT0
(No.38)
BOOT1
(No.63)
Boot mode
Aliasing
0
X
Main Flash memory
Main Flash memory is selected as the boot space.
1
0
System memory
System memory is selected as the boot space
1
1
Inhibition State
It is prohibited to set this status.
STM32F412
BOOT1(47pin)
BOOT0(37pin)
10kΩ
Type1LD
module
63
38
BOOT0 pin have an internal 10kohm pull-down resister inside the module.
Preliminary Specification Number : SP-PA1LD-L
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
12. Tape and Reel Packing
(1) Dimensions of Tape (Plastic tape)
*1. Cumulative tolerance of max. 40.0 ± 0.15 every 10 pitches
(Unit : mm)
(2) Dimensions of Reel
Φ13±2
2±0.5
(Φ100)
(Φ330)
17.5
22.5 max.
(unit : mm)
2.0±0.1
1.75±0.1
0.30±0.05
1.3±0.1
16.0±0.1
7.5±0.1
1.5+0.1/-0
16.0±0.2
feeding direction
4
.0±0.1
8.2±0.05
*1
1.5±0.1
9.3±0.05
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Preliminary
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Murata Manufacturing Co., Ltd.
(3) Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62μm in thickness
[4] Base tape : As specified in (1)
(4) Leader and Tail tape
Feeding Hole
Chip
Feeding Direction
Pin 1 Marking
Tail tape
(No components)
40 to 200mm
Components
No components
150mm min.
Leader tape
(Cover tape alone)
250mm min.
Feeding direction
[2]
[3]
[4]
[3]
[1]
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Murata Manufacturing Co., Ltd.
(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250mm min.
(7) Tear off strength against pulling of cover tape : 5N min.
(8) Packaging unit : 1000pcs./ reel
(9) material : Base tape : Plastic
Real : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
(10) Peeling of force : 1.1N max. in the direction of peeling as shown below.
(11) Packaging (Humidity proof Packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
165 to 180 °
1.1 N max.
Base tape
Cover tape
　湿度
インジケ－タ
乾燥剤
表示ラべル
防湿梱包袋
表示ラベル
Label
Label
Desiccant
Humidity
Indicator
Anti-humidity
Plastic Bag
Preliminary Specification Number : SP-PA1LD-L
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
13. NOTICE
13.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
13.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
13.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
13.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
13.5. Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set
up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other
soldering conditions.
Reflow soldering standard conditions (Example)
Please use the reflow within 2 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
13.6. Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is
done the customer is responsible for any issues or failures caused by the cleaning process.
13.7. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it
may damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
Within 120s
Pre-heating
time(s)
220 deg.C
Within 60s
Cooling down
Slowly
180 deg.C
150 deg.C
250 deg.C
Within 10s
Tpeak-5deg.C
Preliminary Specification Number : SP-PA1LD-L
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
13.8. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specification.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
13.9. Errata on MCU
Please refer the errata documents of STM32F412 on the following site.
http://www.st.com/content/st_com/en/products/microcontrollers/stm32-32-bit-arm-cortex-mcus/stm32f4-
series/stm32f412/stm32f412rg.html
The site address may change without notices.
Preliminary Specification Number : SP-PA1LD-L
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
14. PRECONDITION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications
of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our
product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided
herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products,
which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE
DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
You agree that you will use any and all software or program code (including but not limited to hcd, firmware, nvram, and
blob) we may provide or to be embedded into our product (“Software”) provided that you use the Software bundled with
our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU “AS- IS” BASIS, MURATA MAKES
NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE WITHOUT
INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND
WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM ANY
AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE NOR
THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
You shall indemnify and hold harmless us, our affiliates and our licensor from and against any and all claims,
costs, expenses and liabilities (including attorney’s fees), which arise in connection with the using the
Software.
The product shall not be used in any application listed below which requires especially high reliability for the prevention of
such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if
you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS AND THE SOFTWARE IN SUCH APPLICATIONS.
- Aircraft equipment. - Aerospace equipment - Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment. - Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the
regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,
mask work right, or our other intellectual property right relating to any combination, machine, or process in which our
products or services are used. Information provided by us regarding third-party products or services does not constitute a
license from us to use such products or services or a warranty or endorsement thereof. Use of such information may
require a license from a third party under the patents or other intellectual property of the third party, or a license from us
under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of
mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
Preliminary Specification Number : SP-PA1LD-L
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Murata Manufacturing Co., Ltd.
APPENDIX
Preliminary Specification Number : SP-PA1LD-L
P. 31 / 32
Preliminary
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Murata Manufacturing Co., Ltd.
User Manual
Model Number : Type1LD
FCC ID and IC Number for this product is as follows.
FCC ID: VPYLB1LD
IC : 772C-LB1LD
For OEM integration only – device cannot be sold to general public.
Therefore we will ask OEM to include the following statements required
by FCC/IC on the product and in the Installation manual Notice.
Please describe the following warning on the final product which contains this module.
This device complies with part 15 of FCC Rules and Industry Canada’s licence-exempt RSSs.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference,
and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Le présent appareil est conforme à la partie 15 des règles de la FCC et aux normes des CNR
d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux
deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'appareil doit
accepter tout brouillage subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
●Please describe the following warning to the manual.
●When installing it in a mobile equipment.
Please describe the following warning to the manual.
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled
environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS-102 of the IC
radio frequency (RF) Exposure rules. This equipment should be installed and operated keeping the
radiator at least 20cm or more away from person’s body.
Cet équipement est conforme aux limites d’exposition aux rayonnements énoncées pour un
environnement non contrôlé et respecte les règles les radioélectriques (RF) de la FCC lignes
directrices d'exposition et d’exposition aux fréquences radioélectriques (RF) CNR-102 de l’IC. Cet
équipement doit être installé et utilisé en gardant une distance de 20 cm ou plus entre le radiateur et le
corps humain.
●When installing it in a portable equipment.
FCC：Class II permissive change application and SAR test are necessary.
IC： Class II permissive change application and SAR test are necessary.
Please contact Murata.
Contains Transmitter Module FCC ID:VPYLB1LD
or
Contains FCC ID: VPYLB1LD
Contains IC: 772C-LB1LD
※When the product is small, as for these words mentioned above, the posting to a manual is possible.
FCC CAUTION
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter.
Note)
Portable equipment : Equipment for which the spaces between human body and antenna are used within 20cm.
Mobile equipment : Equipment used at position in which the spaces between human body and antenna exceeded 20cm.
Preliminary Specification Number : SP-PA1LD-L
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Murata Manufacturing Co., Ltd.
Installation Manual
Model Number : Type1LD
Contents
1. Operational Discription (Frequency, Output power)
2. Antenna Design
1.Operational Discription
Operational Systems
WLAN: 802.11b/g/n(HT20)
Bluetooth: BR/EDR/LE
Operating Frequencies
WLAN: 2412 – 2462 MHz
Bluetooth: 2402 – 2480 MHz
Setting Output Powers
WLAN: Show right table
Bluetooth: BR=9dBm, EDR=5dBm, LE=8dBm
2. Antenna Discription
We got approval by the antenna in the pattern of the figure.
When using our authorization ID, it is necessary to use an
equivalent antenna pattern.
Used for tuning antenna gain
* Antenna peak gain should be 0 dBi or less