Preliminary Specification Number : SP-PA1LD-L W-LAN + Bluetooth Combo Module Data Sheet Cypress for 802.11 b/g/n/Bluetooth 4.2 Chipset + STMicroelectronics MCU Tentative P/N : LBEE5PA1LD-TEMP Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 1 / 32 The revision history of the product specification Issued Date Revision Code Revision Page Jun.13.2016 - P4~9 Oct.5.2016 A Dec.6.2016 B Dec.13.2016 C P11 P12 P19 Changed Items Change Reason First Issue 5.Dimensions, Configurations Marking and Terminal 8.2.With nRESET control 8.3. nRESET Circuit 11.1 Schematic The pin assignment is changed on ES2 Corrected Corrected The pin assignment is changed on ES2 P8 5.3 internal connection Added P20 12. Tape and Reel Packing 11.1 Schematic Added 11.2. Boot mode selection pins Corrected Pin Number Corrected Pin name P19 Jan. 6. 2017 D P3 Part Number Feb. 21. 2017 E P3 P8 IC Part Number 5.3 internal connection Corrected Part Number Changed Corrected P9 5.4 Alternate functions table Corrected Mar.24.2017 F P10 7.Operation Condition Updated P13~18 Low Datarate condition P10 7.Operation Condition P3 Certification information Added Updated Operating Temperature Range Updated P4 Marking information Updated P31 APPENDIX P10 7. Operating Condition P11 7.Operatin Condition Added Updated Specification Temperature Range Added comment"a" P32 APPENDIX Updated BT version to BT4.2 9. RF Characteristics Mar.30, 2017 Jul.1.2017 G H Jul.12.2017 I Jan.9.2018 J Oct.15.2018 K Jun.3.2019 L P13 P29 14. PRECONDITION TO USE OUR PRODUCTS Corrected Updated Corrected Updated Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 2 / 32 TABLE OF CONTENTS 14. PRECONDITION TO USE OUR PRODUCTS ................................................................................. 1 1. Scope ...................................................................................................................................................... 3 2. Part Number ......................................................................................................................................... 3 3. Block Diagram....................................................................................................................................... 3 4. Certification Information ..................................................................................................................... 3 4.1. USA/Canada ................................................................................................................................... 3 4.2. Europe ............................................................................................................................................. 3 4.3. Japan ............................................................................................................................................... 3 5. Dimensions, Marking and Terminal Configurations ......................................................................... 4 5.1. Dimensions and Marking .............................................................................................................. 4 5.2. Terminal Configurations................................................................................................................ 5 5.3. Internal connection (STM32F412-CYW43438) ............................................................................ 8 5.4. Alternate functions table ............................................................................................................... 9 6. Absolute Maximum Rating ................................................................................................................ 10 7. Operating Condition ........................................................................................................................... 10 8. Power Up Sequence ............................................................................................................................ 11 8.1. Without nRESET control ............................................................................................................. 11 8.2. With nRESET control .................................................................................................................. 11 8.3. nRESET Circuit ........................................................................................................................... 12 9. RF Characteristics .............................................................................................................................. 13 9.1. RF Characteristics for IEEE802.11b .......................................................................................... 13 9.1.1. High Rate Condition for IEEE802.11b - 2.4GHz................................................................. 13 9.1.2. Low Rate Condition for IEEE802.11b - 2.4GHz .................................................................. 14 9.2. RF Characteristics for IEEE802.11g .......................................................................................... 15 9.2.1. High Rate Condition for IEEE802.11g - 2.4GHz ................................................................. 15 9.2.2. Low Rate Condition for IEEE802.11g - 2.4GHz .................................................................. 16 9.3. RF Characteristics for IEEE802.11n .......................................................................................... 17 9.3.1. High Rate Condition for IEEE802.11n - 2.4GHz ................................................................ 17 9.3.2. Low Rate Condition for IEEE802.11n - 2.4GHz .................................................................. 18 9.4. DC/RF Characteristics for Bluetooth.......................................................................................... 19 9.5. DC/RF Characteristics for BluetoothLE ............................................................................. 20 10. Land Patterns (Top View)................................................................................................................. 21 11. Reference Circuit............................................................................................................................... 22 11.1. Schematic .................................................................................................................................... 22 11.2. Boot mode selection pins ............................................................................................................ 22 12. Tape and Reel Packing ..................................................................................................................... 23 13. NOTICE ............................................................................................................................................. 26 13.1. Storage Conditions: .................................................................................................................... 26 13.2. Handling Conditions: ................................................................................................................. 26 13.3. Standard PCB Design (Land Pattern and Dimensions): ........................................................ 26 13.4. Notice for Chip Placer: ............................................................................................................... 26 13.5. Soldering Conditions: ................................................................................................................. 27 13.6. Cleaning: ..................................................................................................................................... 27 13.7. Operational Environment Conditions: ..................................................................................... 27 13.8. Input Power Capacity: ............................................................................................................... 28 13.9. Errata on MCU........................................................................................................................... 28 14. PRECONDITION TO USE OUR PRODUCTS ............................................................................... 29 Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 3 / 32 1. Scope This specification is applied to the IEEE802.11b/g/n W-LAN/Bluetooth 4.2+ STM32F412 MCU complete module. - IC - RoHS - MSL - MAC/BD address : Cypress/CYW43438 + STMicroelectronics/STM32F412 : This module is compliant with the RoHS directive. :3 : MAC/BD address is embedded 2. Part Number Sample Part Number LBEE5PA1LD-TEMP 3. Block Diagram 4. Certification Information 4.1. USA/Canada FCC ID : VPYLB1LD IC : 772C-LB1LD *Please follow user/installation manual of Appendix 4.2. Europe EN300328 v2.1.1 conducted test report is prepared. 4.3. Japan Japanese type certification is prepared. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 4 / 32 5. Dimensions, Marking and Terminal Configurations 5.1. Dimensions and Marking E < Top View > C < Bottom View > < Side View > L b1 T m2 e9 e1 c2 a1 c3 e6 m3 a2 e2 W m1 F e7 m5 G e8 c1 b2 A D B e3 Marking A B C D E F G Mark L a1 b2 c3 e3 e6 e9 m3 m6 e4 m4 e5 m6 Meaning Pin 1 Marking Murata Logo Module Type Inspection Number Telec certification No. FCC ID certification No. IC certification No. Dimensions 8.9 +/- 0.2 0.3 +/- 0.1 0.3 +/- 0.2 0.45 +/- 0.10 0.9 +/- 0.1 1.15 +/- 0.10 0.4 +/- 0.1 0.7 +/- 0.1 0.35 +/- 0.10 Mark W a2 c1 e1 e4 e7 m1 m4 Dimensions 7.8 +/- 0.2 0.3 +/- 0.1 0.6 +/- 0.1 0.3 +/- 0.1 0.9 +/- 0.1 0.8 +/- 0.1 0.3 +/- 0.1 0.7 +/- 0.1 Mark T b1 c2 e2 e5 e8 m2 m5 Dimensions 1.2 max. 0.3 +/- 0.2 0.6 +/- 0.1 0.3 +/- 0.1 0.9 +/- 0.1 0.45 +/- 0.10 0.6 +/- 0.1 0.35 +/- 0.1 (unit : mm) Structure CYW43438 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 5 / 32 5.2. Terminal Configurations <TOP VIEW> 35 34 33 32 31 30 29 28 27 26 25 24 22 36 56 55 57 54 37 21 68 38 67 20 58 53 59 52 19 39 40 18 66 69 60 51 41 17 61 50 62 49 42 16 70 43 65 15 63 48 64 47 44 14 45 46 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 13 1 2 Terminal Name PC15/OSC32_OUT PC14/OSC32_IN GND VDD_WLAN GND BT_PCM_CLK BT_PCM_IN BT_PCM_OUT BT_PCM_SYNC GND RF_OUT GND GND PC1/WAKE WL_GPIO_0_HOST_WAKE LPO_IN PA8/MCO_1 PB3/JTDO PB4/JTRST PA13/JTMS PA14/JTCK PA15/JTDI 23 3 No. 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 4 5 6 7 8 9 Terminal Name GND PA9/USART1_TX PA10/USART1_RX PA11/USART1_CTS PA12/USART1_RTS PB15/SPI2_MOSI PB14/SPI2_MISO PB13/SPI2_SCK PB12/SPI2_NSS nRESET GND VDD_IO GND PC7/USART6_RX PC6/USART6_TX BOOT0 PA7/SPI1_MOSI PA5/SPI1_SCK PA4/SPI1_NSS PA6/SPI1_MISO VSSA/VREFVDDA_MCU 10 11 12 No. 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65~70 - Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Terminal Name VBAT_MCU GND GND GND PC5 WL_GPIO_1 WL_GPIO_2 WLRF_GPIO CLK_REQ PB9 PB10 PB8/I2S5_SD PB1/I2S5_WS PB0/I2S5_CK PC4 PB5/I2C1_SMBA PB6/12C1_SCL PB7/I2C1_SDA PB2/BOOT1 GND GND - Preliminary Specification Number : SP-PA1LD-L P. 6 / 32 No. Type Terminal Name Connection to MCU Connection to WLAN IC Description 1 PC15/OSC32_OUT I/O PC15/OSC32_ OUT 2 PC14/OSC32_IN I/O PC14/OSC32_I N 3 GND - GND 4 VDD_WLAN I 5 GND - 6 BT_PCM_CLK I/O BT_PCM_CLK 7 BT_PCM_IN I BT_PCM_IN 8 BT_PCM_OUT O BT_PCM_OUT 9 BT_PCM_SYNC I/O BT_PCM_SYN C 10 GND - 11 RF_OUT I/O 12 GND - GND GND Ground 13 GND - GND GND Ground 14 PC1/WAKE I/O PC1 15 WL_GPIO_0_HOST _WAKE I/O GPIO_0 16 LPO_IN I LPO_IN 17 PA8/MCO_1 I/O PA8 18 PB3/JTDO I/O PB3 19 PB4/JTRST I/O PB4 20 PA13/JTMS I/O PA13 21 PA14/JTCK I/O PA14 22 PA15/JTDI I/O PA15 23 GND - GND 24 PA9/USART1_TX I/O PA9 25 PA10/USART1_RX I/O PA10 26 PA11/USART1_CTS I/O PA11 27 PA12/USART1_RTS I/O PA12 GND GND GND Ground LDO_VBAT5V SR_VBAT5V Power supply to WLAN IC GND Ground GND Ground RF_OUT GND Ground Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 7 / 32 28 PB15/SPI2_MOSI I/O PB15 29 PB14/SPI2_MISO I/O PB14 30 PB13/SPI2_SCK I/O PB13 31 PB12/SPI2_NSS I/O PB12 32 nRESET I/O NRST 33 GND - GND GND Ground 34 VDD_IO I VDD WCC_VDDIO Power supply to WLAN IC and MCU 35 GND - GND GND Ground 36 PC7/USART6_RX I/O PC7 37 PC6/USART6_TX I PC6 38 BOOT0 I BOOT0 39 PA7/SPI1_MOSI I/O PA7 40 PA5/SPI1_SCK I/O PA5 41 PA4/SPI1_NSS I/O PA4 42 PA6/SPI1_MISO I/O PA6 43 VSSA/VREF- I VSSA/VREF- 44 VDDA_MCU I VDDA/VREF+ Power supply to MCU 45 VBAT_MCU I VBAT Power supply to MCU 46 GND - GND GND Ground 47 GND - GND GND Ground 48 GND - GND GND Ground 49 PC5 I/O PC5 50 WL_GPIO_1 I/O GPIO_1 51 WL_GPIO_2 I/O GPIO_2 52 WLRF_GPIO I/O WLRF_GPIO 53 CLK_REQ O CLK_REQ 54 PB9 I/O PB9 55 PB10 I/O PB10 Internal 10kohm pull down Test pin. Not connected in normal operation. Asserts CLK_REQ when WLAN directs the host to turn on the reference clock. The CLK_REQ polarity is active-high. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 8 / 32 56 PB8/I2S5_SD I/O- PB8 57 PB1/I2S5_WS I/O PB1 58 PB0/I2S5_CK I/O PB0 59 PC4 I/O PC4 60 PB5/I2C1_SMBA I/O PB5 61 PB6/12C1_SCL I/O PB6 62 PB7/I2C1_SDA I/O PB7 63 PB2/BOOT1 I/O PB2 64 GND - GND GND Ground 65 -70 GND - GND GND Ground Connect to Ground except GPIO used 5.3. Internal connection (STM32F412-CYW43438) STM32F412 CYW43438 STM32F412 X'tal (26MHz) PA0 PA1 PA2 PA3 PC0 PC2 PC3 PC8 PC9 PC10 PC11 PC12 PC13 PD2 BT_UART_RTS_N BT_UART_CTS_N BT_UART_RXD BT_UART_TXD BT_HOST_WAKE BT_REG_ON BT_DEV_WAKE SDIO_D0 SDIO_D1 SDIO_D2 SDIO_D3 SDIO_CK WL_REG_ON SDIO_CMD PH0 PH1 OSC_IN OSC_OUT *Murata platform file follow this connection. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 9 / 32 5.4. Alternate functions table The Items in Bold Letters are the murata platform file settings. MCU Module Pin Pin PA4 PA5 Pin 41 Pin 40 AF0 AF1 AF2 AF3 AF4 - - - TIM2_CH1/ TIM2_ETR - - - - TIM8_CH1 N - Alternate Function AF5 AF6 AF7 AF8 SPI1_NSS/I SPI3_NSS/I USART2_C DFSDM_DA 2S1_WS 2S3_WS K TIN1 SPI1_SCK/I DFSDM_CK 2S1_CK IN1 PA6 Pin 42 - TIM1_BKIN TIM3_CH1 TIM8_BKIN - SPI1_MISO I2S2_MCK - - PA7 Pin 39 - TIM1_CH1 TIM8_CH1 TIM3_CH2 N N - SPI1_MOSI /I2S1_SD - - - PA8 Pin 17 MCO_1 TIM1_CH1 - - I2C3_SCL - - PA9 Pin 24 - TIM1_CH2 - - I2C3_SMBA - - AF10 - - FSMC_D6 EVENTOUT ADC1_4 - - FSMC_D7 EVENTOUT ADC1_5 USART1_C K USART1_T X USART1_R USB_FS_ID X USART1_C USART6_T USB_FS_D CAN1_RX TS X M USART1_R USART6_R USB_FS_D CAN1_TX TS X P PA10 Pin 25 - TIM1_CH3 - - - - PA11 Pin 26 - TIM1_CH4 - - - - SPI4_MISO PA12 Pin 27 - TIM1_ETR - - - - SPI5_MISO - - - - - - - - - - - - - - - - - - PA15 Pin 22 JTDI TIM2_CH1/ TIM2_ETR TIM1_CH2 TIM8_CH2 TIM3_CH3 N N TIM1_CH3 TIM8_CH3 TIM3_CH4 N N PB0 Pin 58 - PB1 Pin 57 - PB2 Pin 63 - PB3 Pin 18 JTDOSWO TIM2_CH2 PB4 Pin 19 JTRST - TIM3_CH1 PB5 Pin 60 - - TIM3_CH2 PB6 Pin 61 - - TIM4_CH1 PB7 Pin 62 - - TIM4_CH2 PB8 Pin 56 - - TIM4_CH3 PB9 Pin 54 - - TIM4_CH4 PB10 Pin 55 - TIM2_CH3 - PB12 Pin 31 - TIM1_BKIN - - TIM1_CH1 N TIM1_CH2 PB14 Pin 29 N TIM1_CH3 PB15 Pin 28 RTC_50Hz N PB13 Pin 30 - - - - - - - - - - - - - Pin 59 - - - - - I2S1_MCK - - - - PC5 Pin 49 - - PC6 Pin 37 - - Pin 36 - - Pin 2 - - PC15 Pin 1 - - I2CFMP1_S USART3_R MBA X USART6_T I2CFMP1_S DFSDM_CK TIM3_CH1 TIM8_CH1 I2S2_MCK X CL IN3 USART6_R I2CFMP1_S SPI2_SCK/I TIM3_CH2 TIM8_CH2 I2S3_MCK X DA 2S2_CK - - - - EVENTOUT - - EVENTOUT - - EVENTOUT - - - EVENTOUT - - - EVENTOUT - TIM8_CH2 I2CFMP1_S USART3_R DFSDM_DA SPI2_MISO I2S2ext_SD TIM12_CH1 FSMC_D0 N DA TS TIN2 TIM8_CH3 I2CFMP1_S SPI2_MOSI DFSDM_CK TIM12_CH2 /I2S2_SD N CL IN2 Pin 14 PC7 ADC1_7 - SPI1_NSS/I SPI3_NSS/I USART1_T EVENTOUT 2S1_WS 2S3_WS X SPI5_SCK/I EVENTOUT 2S5_CK SPI5_NSS/I DFSDM_DA QUADSPI_ EVENTOUT 2S5_WS TIN0 CLK DFSDM_CK QUADSPI_ EVENTOUT IN0 CLK I2CFMP1_S SPI1_SCK/I SPI3_SCK/I USART1_R I2C2_SDA EVENTOUT DA 2S1_CK 2S3_CK X SPI1_MISO SPI3_MISO I2S3ext_SD I2C3_SDA SDIO_D0 EVENTOUT I2C1_SMB SPI1_MOSI SPI3_MOSI CAN2_RX SDIO_D3 EVENTOUT A /I2S1_SD /I2S3_SD USART1_T QUADSPI_ I2C1_SCL CAN2_TX SDIO_D0 EVENTOUT X BK1_NCS USART1_R I2C1_SDA FSMC_NL EVENTOUT X SPI5_MOSI TIM10_CH1 I2C1_SCL CAN1_RX I2C3_SDA SDIO_D4 EVENTOUT /I2S5_SD SPI2_NSS/I TIM11_CH1 I2C1_SDA CAN1_TX I2C2_SDA SDIO_D5 EVENTOUT 2S2_WS SPI2_SCK/I USART3_T I2CFMP1_S I2C2_SCL I2S3_MCK SDIO_D7 EVENTOUT 2S2_CK X CL FSMC_D13/ SPI2_NSS/I SPI4_NSS/I SPI3_SCK/I USART3_C DFSDM_DA I2C2_SMBA CAN2_RX FSMC_DA1 EVENTOUT 2S2_WS 2S4_WS 2S3_CK K TIN1 3 I2CFMP1_S SPI2_SCK/I SPI4_SCK/I USART3_C DFSDM_CK CAN2_TX EVENTOUT 2S2_CK MBA 2S4_CK TS IN1 PC4 PC14 ADC1_6 - PC1 - AF15 QUADSPI_ TIM13_CH1 SDIO_CMD EVENTOUT BK2_IO0 QUADSPI_ TIM14_CH1 EVENTOUT BK2_IO1 USB_FS_S SDIO_D1 EVENTOUT OF USB_FS_V SDIO_D2 EVENTOUT BUS SPI5_MOSI /I2S5_SD JTMSSWDI PA13 Pin 20 O JTCKSWC PA14 Pin 21 LK AF12 Additional Function AF9 - - - - - - - ADC1_8 ADC1_9 BOOT1 - SDIO_D6 EVENTOUT - SDIO_CK EVENTOUT - - ADC1_11, EVENTOUT WKUP3 QUADSPI_ FSMC_NE4 EVENTOUT ADC1_14 BK2_IO2 QUADSPI_ FSMC_NO EVENTOUT ADC1_15 BK2_IO3 E FSMC_D1 SDIO_D6 EVENTOUT - DFSDM_DA SDIO_D7 EVENTOUT TIN3 EVENTOUT OSC32_IN OSC32_OU EVENTOUT T (*)PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC14 and PC15 in output mode is limited: - The speed should not exceed 2 MHz with a maximum load of 30 pF. - These I/Os must not be used as a current source (e.g. to drive an LED). Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 10 / 32 6. Absolute Maximum Rating Storage Temperature Supply Voltage VDD_WLAN VDD_IO VBAT_MCU VDDA_MCU min. -40 -0.3 -0.3 -0.3 -0.4 max. 85 6.0 3.9 4.0 4.0 unit deg.C V V V V Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters is set within operating condition 7. Operating Condition min. typ. max. Unit Operating Temperature Range -40 85 deg.C Specification Temperature Range -20 70 deg.C a VDD_WLAN 3.2 4.8 V VDD_IOb 1.8 3.3 3.6 V Supply Voltage b VBAT_MCU 1.8 3.3 3.6 V b VDDA_MCU 1.8 3.3 3.6 V *a: Maximum continuous voltage is 4.8V. Voltages up to 6.0V for up to 10 seconds, cumulative duration over the lifetime of the device are allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative duration over the lifetime of the device are allowed. *b: MCU behavior depends on input voltage. Please refer to Datasheet of STM32F412. [Note] All RF characteristics in this datasheet are defined by Specification Temperature Range. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 11 / 32 8. Power Up Sequence 8.1. Without nRESET control Ramp time 90% > 40s VDD_IO Timing same as VDD_IO VDD_WLAN Timing same as VDD_IO VBAT_MCU Timing same as VDD_IO VDDA_MCU *Power down sequence is opposite sequence of power up. 8.2. With nRESET control Ramp time 90% > 40s VDD_IO Timing same as VDD_IO VDD_WLAN Timing same as VDD_IO VBAT_MCU Timing same as VDD_IO VDDA_MCU nRESET Timing of deassertion Reset signal same as VDD_IO *Power down sequence is opposite sequence of power up. *nRESET pin must be controlled by Open Drain. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 12 / 32 8.3. nRESET Circuit VDD_IO nRESET(32pin) 40k Filter Internal Reset 0.1uF Type1LD module (1) The reset network protects the device against parasitic resets. (2) The use must ensure that the level on the nRESET pin can go below the VIL(NRST) max level specified in below table. Otherwise the reset is not taken into account by the device. (3) nRESET pin must be controlled by Open Drain. High signal must not input to this pin. Symbol Parameter Min Typ Max Unit VIL nRESET I/O input low level voltage - - 0.1VDD_IO+0.1 V Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 13 / 32 9. RF Characteristics 9.1. RF Characteristics for IEEE802.11b Specification Mode Frequency Data rate IEEE802.11b DSSS / CCK 2400 - 2483.5MHz 1, 2, 5.5, 11Mbps 9.1.1. High Rate Condition for IEEE802.11b - 2.4GHz Conditions 25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 11Mbps mode Items Contents - DC Characteristics min. Typ. max. 1. DC current 1) Tx mode (1024byte, 20usec interval) 330 410 *1 2) Rx mode 55 100 - Tx Characteristics *1 min. Typ. max. 2. Output Power 15.0 17.0 19.0 3. Spectrum Mask Margin 1) 1st side lobes(-30dBr) 0 10 2) 2nd side lobes(-50dBr) 0 6 4. Power-on and Power-down ramp 2.0 5. RF Carrier Suppression 15 6. Modulation Accuracy (EVM) 18 35 7. Outband Spurious Emissions 1) 30MHz to 1GHz (BW=100kHz) -36 2) 1GHz to 12.75GHz (BW=100kHz) -30 3) 1.8GHz to 1.9GHz (BW=100kHz) -47 4) 5.15GHz to 5.3GHz (BW=100kHz) -47 - Rx Characteristics min. typ. max. 8. Minimum Input Level Sensitivity 1) 11Mbps (FER < 8%) -89 -76 9. Maximum Input Level (FER < 8%) -10 10. Adjacent Channel Rejection 35 (FER < 8%) *1: Defined when output power setting is 17dBm at Murata module antenna pad Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit mA mA Unit dBm dB dB usec dB % dBm dBm dBm dBm Unit dBm dBm dB Preliminary Specification Number : SP-PA1LD-L P. 14 / 32 9.1.2. Low Rate Condition for IEEE802.11b - 2.4GHz Conditions 25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 1Mbps mode Items Contents - DC Characteristics min. Typ. max. 1. DC current 1) Tx mode (1024byte, 20usec interval) 330 410 *2 2) Rx mode 55 100 - Tx Characteristics *2 min. Typ. max. 2. Output Power 15.0 17.0 19.0 3. Spectrum Mask Margin 1) 1st side lobes(-30dBr) 0 12 2) 2nd side lobes(-50dBr) 0 5 4. Power-on and Power-down ramp 2.0 5. RF Carrier Suppression 15 6. Modulation Accuracy (EVM) 14 35 7. Outband Spurious Emissions 1) 30MHz to 1GHz (BW=100kHz) -36 2) 1GHz to 12.75GHz (BW=100kHz) -30 3) 1.8GHz to 1.9GHz (BW=100kHz) -47 4) 5.15GHz to 5.3GHz (BW=100kHz) -47 - Rx Characteristics min. typ. max. 8. Minimum Input Level Sensitivity 1) 1Mbps (FER < 8%) -96 -80 9. Maximum Input Level (FER < 8%) -4 10. Adjacent Channel Rejection 35 (FER < 8%) *2: Defined when output power setting is 17dBm at Murata module antenna pad Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit mA mA Unit dBm dB dB usec dB % dBm dBm dBm dBm Unit dBm dBm dB Preliminary Specification Number : SP-PA1LD-L P. 15 / 32 9.2. RF Characteristics for IEEE802.11g Specification Mode Frequency Data rate IEEE802.11g OFDM 2400 - 2483.5MHz 6, 9, 12, 18, 24, 36, 48, 54Mbps 9.2.1. High Rate Condition for IEEE802.11g - 2.4GHz Conditions: 25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=13dBm, 54Mbps mode Items Contents - DC Characteristics min. Typ. max. 1. DC current 1) Tx mode (1024byte, 20usec interval) 250 330 *3 2) Rx mode 55 100 - Tx Characteristics*3 min. typ. max. 2. Output Power 11.0 13.0 15.0 3. Spectrum Mask Margin 1) 9MHz to 11MHz (0~ -20dBr) 0 10 2) 11MHz to 20MHz (-20~ -28dBr) 0 10 3) 20MHz to 30MHz (-28~ -40dBr) 0 10 4) 30MHz to 33MHz (-40dBr) 0 10 4. Constellation Error (EVM) -34 -25 5. Outband Spurious Emissions 1) 30MHz to 1GHz (BW=100kHz) -36 2) 1GHz to 12.75GHz (BW=100kHz) -30 3) 1.8GHz to 1.9GHz (BW=100kHz) -47 4) 5.15GHz to 5.3GHz (BW=100kHz) -47 - Rx Characteristics min. typ. max. 6. Minimum Input Level Sensitivity 1) 54Mbps (PER < 10%) -76 -65 7. Maximum Input Level (PER < 10%) -20 8. Adjacent Channel Rejection -1 (PER < 10%) *3: Defined when output power setting is 13dBm at Murata module antenna pad Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit mA mA unit dBm dB dB dB dB dB dBm dBm dBm dBm Unit dBm dBm dB Preliminary Specification Number : SP-PA1LD-L P. 16 / 32 9.2.2. Low Rate Condition for IEEE802.11g - 2.4GHz Conditions: 25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 6Mbps mode Items Contents - DC Characteristics min. Typ. max. 1. DC current 1) Tx mode (1024byte, 20usec interval) 320 400 *3 2) Rx mode 55 100 - Tx Characteristics*3 min. typ. max. 2. Output Power 15.0 17.0 19.0 3. Spectrum Mask Margin 1) 9MHz to 11MHz (0~ -20dBr) 0 10 2) 11MHz to 20MHz (-20~ -28dBr) 0 10 3) 20MHz to 30MHz (-28~ -40dBr) 0 10 4) 30MHz to 33MHz (-40dBr) 0 10 4. Constellation Error (EVM) -29 -5 5. Outband Spurious Emissions 1) 30MHz to 1GHz (BW=100kHz) -36 2) 1GHz to 12.75GHz (BW=100kHz) -30 3) 1.8GHz to 1.9GHz (BW=100kHz) -47 4) 5.15GHz to 5.3GHz (BW=100kHz) -47 - Rx Characteristics min. typ. max. 6. Minimum Input Level Sensitivity 1) 6Mbps (PER < 10%) -91 -82 7. Maximum Input Level (PER < 10%) -20 8. Adjacent Channel Rejection -1 (PER < 10%) *3: Defined when output power setting is 17dBm at Murata module antenna pad Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit mA mA unit dBm dB dB dB dB dB dBm dBm dBm dBm Unit dBm dBm dB Preliminary Specification Number : SP-PA1LD-L P. 17 / 32 9.3. RF Characteristics for IEEE802.11n Specification Mode Frequency Data rate IEEE802.11n OFDM 2400 - 2483.5MHz 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps 9.3.1. High Rate Condition for IEEE802.11n - 2.4GHz Conditions: 25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=12dBm, 65Mbps(MCS7) mode Items Contents - DC Characteristics min. Typ. max. Unit 1. DC current 1) Tx mode (1024byte, 20usec interval) 240 320 mA *5 2) Rx mode 55 100 mA - Tx Characteristics*5 min. typ. max. Unit 2. Output Power 10.0 12.0 14.0 dBm 3. Spectrum Mask Margin 1) 9MHz to 11MHz (0 ~ -20dBr) 0 10 dB 2) 11MHz to 20MHz (-20 ~ -28dBr) 0 10 dB 3) 20MHz to 30MHz (-28 ~ -45dBr) 0 6 dB 4) 30MHz to 33MHz (-45dBr) 0 6 dB 4. Constellation Error (EVM) -35 -27 dB 5. Outband Spurious Emissions 1) 30MHz to 1GHz -36 dBm 2) 1GHz to 12.75GHz -30 dBm 3) 1.8GHz to 1.9GHz -47 dBm 4) 5.15GHz to 5.3GHz -47 dBm - Rx Characteristics min. typ. max. Unit 6. Minimum Input Level Sensitivity 1) 65Mbps (PER < 10%) -73 -64 dBm 7. Maximum Input Level (PER < 10%) -20 dBm 8. Adjacent Channel Rejection -2 dB (PER < 10%) *5: Defined when output power setting is 12dBm at Murata module antenna pad Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 18 / 32 9.3.2. Low Rate Condition for IEEE802.11n - 2.4GHz Conditions: 25deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V, Output power setting=17dBm, 6.5Mbps(MCS0) mode Items Contents - DC Characteristics min. Typ. max. Unit 1. DC current 1) Tx mode (1024byte, 20usec interval) 310 390 mA *6 2) Rx mode 55 100 mA - Tx Characteristics*6 min. typ. max. Unit 2. Output Power 15.0 17.0 19.0 dBm 3. Spectrum Mask Margin 1) 9MHz to 11MHz (0 ~ -20dBr) 0 9 dB 2) 11MHz to 20MHz (-20 ~ -28dBr) 0 9 dB 3) 20MHz to 30MHz (-28 ~ -45dBr) 0 6 dB 4) 30MHz to 33MHz (-45dBr) 0 6 dB 4. Constellation Error (EVM) -29 -5 dB 5. Outband Spurious Emissions 1) 30MHz to 1GHz -36 dBm 2) 1GHz to 12.75GHz -30 dBm 3) 1.8GHz to 1.9GHz -47 dBm 4) 5.15GHz to 5.3GHz -47 dBm - Rx Characteristics min. typ. max. Unit 6. Minimum Input Level Sensitivity 1) 6.5Mbps (PER < 10%) -90 -82 dBm 7. Maximum Input Level (PER < 10%) -20 dBm 8. Adjacent Channel Rejection -2 dB (PER < 10%) *6: Defined when output power setting is 17dBm at Murata module antenna pad Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 19 / 32 9.4. DC/RF Characteristics for Bluetooth Normal conditions : 25 deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V Items Contents Bluetooth specification (power class) Version 4.2 (Class1) Channel frequency (spacing) 2402 to 2480 MHz (1MHz) Transmitter Min. Typ. Max. Output Power BR 8.5 12 Frequency range 2400 2483.5 20dB bandwidth 1 Modulation characteristics (a) Modulation f1avg 140 175 (b) Modulation f2max 115 (c) Modulation f2avg / f1avg 0.8 Carrier Frequency Drift (a) 1slot -25 +25 (b) 3slot / 5slot -40 +40 (c) Maximum drift rate -20 +20 EDR Relative Power -4 +1 EDR Carrier Frequency Stability and Modulation Accuracy (a) i -75 +75 (b) i+o -75 +75 (c) o -10 +10 20 (d) RMS DEVM (/4 DQPSK) 35 (e) Peak DEVM (/4 DQPSK) 30 (f) 99% DEVM (/4 DQPSK) (g) RMS DEVM (8DPSK) 13 (h) Peak DEVM (8DPSK) 25 (i) 99% DEVM (8DPSK) 20 Spurious Emissions (BW=100kHz) -36 (a) 10MHzf<2387MHz -30 (b) 2387MHzf<2400MHz -47 (c) 2483.5MHz<f2496.5MHz -47 (d) 2496.5MHz<f8GHz Receiver Min. Typ. Max. Sensitivity (BER<0.1%) -92 -70 Maximum Input Level (BER<0.1%) -20 EDR Sensitivity (BER<0.007%) (a) 8DPSK -88 -70 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit dBm MHz MHz kHz kHz kHz kHz kHz/50u s dB kHz kHz kHz % % % % % % dBm dBm dBm dBm Unit dBm dBm dBm Preliminary Specification Number : SP-PA1LD-L P. 20 / 32 9.5. DC/RF Characteristics for BluetoothLE Normal conditions : 25 deg.C, VDD_WLAN=3.3V, VDD_IO= 3.3V Items Contents Bluetooth specification (power class) Version 4.2 (LE) Channel frequency (spacing) 2402 to 2480 MHz (2MHz) Number of RF Channel 40 Item / Condition Min. Typ. Max. Center Frequency 2402 2480 Channel Spacing 2 Number of RF channel 40 Output power 10 Modulation Characteristics 1) f1avg 225 275 2) f2max (at 99.9%) 185 3) f2avg / f1avg 0.8 Carrier frequency offset and drift 1) Frequency offset -150 150 2) Frequency drift 50 3) Drift rate 20 Receiver sensitivity (PER < 30.8%) -96 -70 Maximum input signal level (PER < 30.8%) -10 PER Report Integrity (-30dBm input) 50 65.4 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit MHz MHz dBm kHz kHz kHz kHz kHz dBm dBm % Preliminary Specification Number : SP-PA1LD-L P. 21 / 32 10. Land Patterns (Top View) Unit : mm Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 22 / 32 11. Reference Circuit 11.1. Schematic B C D PC14/OSC32_IN BT_PCM_IN BT_PCM_CLK BT_PCM_SYNC RF_OUT BT_PCM_OUT VDD_WLAN 1 4.7uF E F G H PC15/OSC32_OUT A 1 JTDI 65-70 GND 1 PC15/OSC32_OUT 3 2 GND PC14/OSC32_IN 5 4 GND BT_PCM_CLK VDD_WLAN 6 7 BT_PCM_IN 9 8 BT_PCM_OUT BT_PCM_SYNC GND RF_OUT CLK_REQ PB0/I2S5_CK PA13/JTMS PB1/I2S5_WS PA14/JTCK PB8/I2S5_SD PA15/JTDI GND 42 25 GND SPI1_MISO I2C1_SCL 41 X'tal SPI1_NSS 60 40 PC14/OSC32_IN SPI1_SCK 32.768kHz PC4 39 SPI1_MOSI 58 PC15/OSC32_OUT 0ohm I2S5_CK 38 BOOT0 57 GND I2S5_WS 37 4 I2S5_SD 36 RF line USART6_RX 35 GND PI-network attenuator U1 SPI2_NSS nRESET SPI2_MISO SPI2_SCK SPI2_MOSI USART1_RTS USART1_CTS USART1_RX USART1_TX 0.1uF 0 DEPOP DEPOP DEPOP DEPOP 5 VDD_IO GND 4.7uF C GND GND GND *0ohm and DEPOP are for initial evaluation. Please make sure to tune "Antenna matching" and "PI-network attenuator GND B Antenna matching 0 RF_OUT GND A GND USART6_TX 56 GND 5 3 I2C1_SMBA 59 PC7/USART6_RX 4.7uF I2C1_SDA 61 PC6/USART6_TX PB10 0.1uF 62 BOOT0 PB9 PB2/BOOT1 43 PA7/SPI1_MOSI 24 23 PB4/JTRST VDD_IO 22 PC4 34 55 PB10 44 PA5/SPI1_SCK WLRF_GPIO GND 21 JTCK PB3/JTDO 33 54 PB9 4 PB5/I2C1_SMBA LBEE5PA1LD 2 VDDA_MCU 63 PA4/SPI1_NSS WL_GPIO_2 PB12/SPI2_NSS 20 PA8/MCO_1 nRESET 53 CLK_REQ JTMS PB6/I2C1_SCL 4.7uF 64 PA6/SPI1_MISO WL_GPIO_1 31 19 JTRST LPO_IN 32 52 WLRF_GPIO PB7/I2C1_SDA PB14/SPI2_MISO 18 JTDO PC5 PB13/SPI2_SCK 51 WL_GPIO_2 VSSA/VREF- 29 17 3 WL_GPIO_0_HOST_WAKE 30 50 VDDA_MCU PB15/SPI2_MOSI 16 WL_GPIO_1 GND 0.1uF 45 VBAT_MCU PB2/BOOT1 28 49 PC5 VBAT_MCU GND PA12/USART1_RTS 15 GND 46 GND PC1/WAKE 27 48 GND PA10/USART1_RX 14 GND PA11/USART1_CTS 47 26 13 2 GND PA9/USART1_TX 12 10 11 0.1uF D E F G 11.2. Boot mode selection pins Boot mode selection pins must be set as below table. BOOT0 (No.38) BOOT1 (No.63) Boot mode 0 X Main Flash memory Main Flash memory is selected as the boot space. 1 0 System memory System memory is selected as the boot space 1 1 Inhibition State It is prohibited to set this status. Aliasing 63 BOOT1(47pin) STM32F412 38 BOOT0(37pin) 10k Type1LD module BOOT0 pin have an internal 10kohm pull-down resister inside the module. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. H Preliminary Specification Number : SP-PA1LD-L P. 23 / 32 12. Tape and Reel Packing (1) Dimensions of Tape (Plastic tape) 2.00.1 4.00.1 *1 1.5+0.1/-0 0.300.05 7.50.1 9.30.05 16.00.2 1.750.1 *1. Cumulative tolerance of max. 40.0 0.15 every 10 pitches 1.50.1 16.00.1 8.20.05 1.30.1 feeding direction (Unit : mm) (2) Dimensions of Reel 17.5 ( 330) ( 100) 20.5 132 22.5 max. (unit : mm) Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 24 / 32 (3) Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62m in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Pin 1 Marking Chip (4) Leader and Tail tape Feeding direction Tail tape (No components) 40 to 200mm Components No components Leader tape (Cover tape alone) 150mm min. 250mm min. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 25 / 32 (5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (6) The cover tape and base tape are not adhered at no components area for 250mm min. (7) Tear off strength against pulling of cover tape : 5N min. (8) Packaging unit : 1000pcs./ reel (9) material : Base tape : Plastic Real : Plastic Cover tape, cavity tape and reel are made the anti-static processing. (10) Peeling of force : 1.1N max. in the direction of peeling as shown below. 1.1 N max. 165 to 180 Cover tape Base tape (11) Packaging (Humidity proof Packing) Label Desiccant Humidity Indicator Label Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 26 / 32 13. NOTICE 13.1. Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) - After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 13.2. Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 13.3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 13.4. Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 27 / 32 13.5. Soldering Conditions: The recommendation conditions of soldering are as in the following figure. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions (Example) Within 10s 250 deg.C Tpeak-5deg.C 220 deg.C Cooling down Slowly 180 deg.C 150 deg.C Pre-heating Within 120s time(s) Within 60s Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 13.6. Cleaning: Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is done the customer is responsible for any issues or failures caused by the cleaning process. 13.7. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 28 / 32 13.8. Input Power Capacity: Products shall be used in the input power capacity as specified in this specification. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. 13.9. Errata on MCU Please refer the errata documents of STM32F412 on the following site. http://www.st.com/content/st_com/en/products/microcontrollers/stm32-32-bit-arm-cortex-mcus/stm32f4series/stm32f412/stm32f412rg.html The site address may change without notices. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 29 / 32 14. PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You agree that you will use any and all software or program code (including but not limited to hcd, firmware, nvram, and blob) we may provide or to be embedded into our product ("Software") provided that you use the Software bundled with our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU "AS- IS" BASIS, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE WITHOUT INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM ANY AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE NOR THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. You shall indemnify and hold harmless us, our affiliates and our licensor from and against any and all claims, costs, expenses and liabilities (including attorney's fees), which arise in connection with the using the Software. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS AND THE SOFTWARE IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. -Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by - the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, -deviation or lapse in function of engineering sample, -improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you can't agree the above contents, you should inquire our sales. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 30 / 32 APPENDIX Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 31 / 32 User Manual Model Number : Type1LD FCC ID and IC Number for this product is as follows. FCC ID: VPYLB1LD IC : 772C-LB1LD For OEM integration only - device cannot be sold to general public. Therefore we will ask OEM to include the following statements required by FCC/IC on the product and in the Installation manual Notice. Please describe the following warning on the final product which contains this module. Contains Transmitter Module FCC ID:VPYLB1LD or Contains FCC ID: VPYLB1LD Contains IC: 772C-LB1LD This device complies with part 15 of FCC Rules and Industry Canada's licence-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Le present appareil est conforme a la partie 15 des regles de la FCC et aux normes des CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'appareil doit accepter tout brouillage subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. When the product is small, as for these words mentioned above, the posting to a manual is possible. Please describe the following warning to the manual. FCC CAUTION Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter. When installing it in a mobile equipment. Please describe the following warning to the manual. This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS-102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and operated keeping the radiator at least 20cm or more away from person's body. Cet equipement est conforme aux limites d'exposition aux rayonnements enoncees pour un environnement non controle et respecte les regles les radioelectriques (RF) de la FCC lignes directrices d'exposition et d'exposition aux frequences radioelectriques (RF) CNR-102 de l'IC. Cet equipement doit etre installe et utilise en gardant une distance de 20 cm ou plus entre le radiateur et le corps humain. When installing it in a portable equipment. FCCClass II permissive change application and SAR test are necessary. IC Class II permissive change application and SAR test are necessary. Please contact Murata. Note) Portable equipment : Equipment for which the spaces between human body and antenna are used within 20cm. Mobile equipment : Equipment used at position in which the spaces between human body and antenna exceeded 20cm. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-PA1LD-L P. 32 / 32 Installation Manual Model Number : Type1LD Contents 1. Operational Discription (Frequency, Output power) 2. Antenna Design 1.Operational Discription Operational Systems WLAN: 802.11b/g/n(HT20) Bluetooth: BR/EDR/LE Operating Frequencies WLAN: 2412 - 2462 MHz Bluetooth: 2402 - 2480 MHz Setting Output Powers WLAN: Show right table Bluetooth: BR=9dBm, EDR=5dBm, LE=8dBm 2. Antenna Discription We got approval by the antenna in the pattern of the figure. When using our authorization ID, it is necessary to use an equivalent antenna pattern. Used for tuning antenna gain * Antenna peak gain should be 0 dBi or less Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.