DS-CPC5610/5611-R9.0 www.clare.com 1
Features
•Full-duple x dat a and voice transmission
•Transformerless telephone line isolation interface
•Operates at all modem speeds, including V.90 (56K)
•3.3 or 5 V po w er supply operation
•Half-wave ring detector (CPC5610) or full- w ave ring
detector (CPC5611)
•Caller ID signal reception
•Small 32-pin SOIC plastic package
•Printed-circuit board space and cost savings
•Meets PC Card (PCMCIA) height requirements
•Easy interface with modem ICs and v oice CODECs
•W orldwide dial-up telephone network compatibility
•Supplied application circuit complies with the
requirements of TIA/EIA/I S-968 (FCC part 68),
UL1950, UL60950, EN60950, IEC60950,
EN55022B, CISPR22B, EN55024, and TBR-21
•CPC5610 and CPC5611 comply with UL1577
•TTL compatible logic inputs and output s
•Line-side circuit powe red from telephone line
Applications
•Satellite and cab le set-t op boxes
•V.90 (and other standard) modems
•Fax machines
•Voicemail systems
•Computer telephony
•PBXs
•Telephony gateways
•Embedded modems f or such applications as POS
terminals, automated banking, remote metering,
v ending machines, security, and surveillance
Description
Clare CPC5610 and CPC5611 LITELINKs are silicon
data access arrangement (DAA) ICs used in data and
v oice communication applications to make connec-
tions to the pub l ic switched telephone network
(PSTN). LITELINK uses on-chip opt ical component s
and a few inexpensive external components to form a
complete v oice or high- speed d ata teleph one line
interface.
LITELINK eliminates the need for the large isolation
transformers or capacitors as used in other DAA con-
figurations . It incorporates the required high-voltage
isolation barrier in the surface-mount SOIC package.
The CPC5610 (half-wave ring detect) and CPC56 11
(full-wave ring detect) build upon Clare’s existing
LITELINK line, wit h improved performance and 3.3 V
operation.
Ordering Information
Figure 1. CPC5610/CPC5611 Block Diagram
Part Number Description
CPC5610A 32-pin surface mount DAA with half-wave ring
detect, tubed
CPC5610ATR 32-pin surface mount DAA with half-wave ring
detect, tape and reel
CPC5611A 32-pin surface mount DAA with full-wave ring
detect, tubed
CPC5611ATR 32-pin surface mount DAA with full-wave ring
detect, tape and reel
Transconductance
Stage
2-4 Wire Hybrid
AC/DC Termination
Hookswitch
Isolation Barrier
Vref
AGC
Vref
AGC
Snoop Amplifier
Receive
Isolation
Amplifier
Transmit
Isolation
Amplifier
TIP+
RING-
Transmit
Diff.
Amplifier
Receive
Diff.
Amplifier
CID/
RING
MUX
Tx+
Tx-
OH
RING
CID
Rx+
Rx-
Current Limit Control
AC Impedance Control
VI Slope Control
CSNOOP
CSNOOP
RSNOOP
RSNOOP
CPC5610/CPC5611
LITELINK™ II Silicon Data Access Arrangement (DAA) IC
CPC5610/CPC5611
2 www.clare.com R9.0
1 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Resistive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.1 Resistive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Reactive Termination Application Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.1 Reactive Termination Application Circuit Part List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Using LITELINK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Switch Hook Control (On-hook and Off-hook States) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 On-hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.1 Ring Signal Detection via the Snoop Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.2 Polarity Reversal Detection with CPC5611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2.3 On-hook Caller ID Signal Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3 Off-Hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.1 Receive Signal Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.2 Transmit Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.5.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.5.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 LITELINK Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Clare, Inc. Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Third Party Design Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 LITELINK Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2 Tape and Reel Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.1 Moisture Reflow Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.2 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.4 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CPC5610/CPC5611
Rev. 9.0 www.clare.com 3
1. Electrical Specifications
1.1 Absolute Maximum Ratings Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure of
the device to the absolute maximum ratings for an
extended period may degrade the device and affect its reli-
ability.
1.2 Performance
Parameter Minimum Maximum Unit
Isolation Voltage 1500 - VRMS
Continuous Tip to Ring
Current (RZDC = 5.2Ω)150 mA
Total Package Power Dis-
sipation 1W
Operating temperature 0 +85 °C
Storage temperature -40 +125 °C
Soldering temperature - +220 °C
Parameter Minimum Typical Maximum Unit Conditions
DC Characteristics
Operating Voltage VDD 3.0 - 5.50 V Host side
Operating Current IDD - - 10 mA Host side
Operating Voltage VDDL 2.8 - 3.2 V Line side, derived from tip and ring
Operating Current IDDL - 10.5 12 mA Line side, drawn from tip and ring while off-hook
On-hook Characteristics
Metallic DC Resistance 10 - - MΩTip to ring, 100 Vdc applied
Longitudinal DC Resistance 10 - - MΩ150 Vdc applied from tip and ring to Earth ground
Ring Signal Detect Level 5 - - VRMS 68 Hz ring signal applied to tip and ring
Ring Signal Detect Level 28 - - VRMS 15 Hz ring signal applied across tip and ring
Snoop Circuit Frequency Response 166 - >4000 Hz -3 dB corner frequency @ 166 Hz
Snoop Circuit CMRR - -40 - dB 120 VRMS 60 Hz common mode signal across tip
and ring
Ringer Equivalence - 0.1B - REN
Longitudinal Balance 60 - - dB Per FCC part 68.3
Off-Hook Characteristics
AC Impedance - 600 - ΩTip to ring, using resistive termination application
circuit
Longitudinal Balance 40 - - dB Per FCC part 68.3
Return Loss - 26 - dB Into 600 Ω at 1800 Hz
Transmit and Receive Characteristics
Frequency Response 30 - 4000 Hz -3 dB corner frequency 30 Hz
Trans-Hybrid Loss - 36 - dB Into 600 Ω at 1800 Hz, with C18
Transmit and Receive Insertion Loss -1 0 1 dB 30 Hz to 4 kHz
Average In-band Noise - -120 - dBm/Hz 4 kHz flat bandwidth
Harmonic Distortion - -80 - dB -3 dBm, 600 Hz, 2nd harmonic
CPC5610/CPC5611
4 www.clare.com Rev. 9.0
Transmit Level - 0 2.2 VP-P Single-tone sine wave. Or 0 dBm into 600 Ω.
Receive Level - - 2.2 VP-P Single-tone sine wave. Or 0 dBm into 600 Ω.
RX+/RX- Output Drive Current - - 0.5 mA Sink and source
TX+/TX- Input Impedance 60 90 120 kΩ
Isolation Characteristics
Isolation Voltage 1500 - - VRMS Line side to host side
Surge Rise Time 2000 - - V/µS No damage via tip and ring
OH and CID Control Logic Inputs
Input Threshold Voltage 0.8 - 2.0 V
High Level Input Current -120 - 0 µAVIN≤VDD
Low Level Input Current - - -120 µAVIN=GND
RING Output Logic Levels
Output High Voltage VDD -0.4 --V
IOUT = -400 µA
Output Low Voltage - - 0.4 V IOUT = 1 mA
Specifications subject to change wi thout notice. All performance characteristics based on the use of Clare, Inc. application circuits. Functional operation of the
device at condit ions beyond those specified here is not implied. Specification conditions: VDD = 5V, temperature = 25 °C, unless otherwise indicated.
Parameter Minimum Typical Maximum Unit Conditions
CPC5610/CPC5611
Rev. 9.0 www.clare.com 5
1.3 Pin Description Figure 2. Pinout
Pin Name Function
1 VDD Host (CPE) side power supply
2 TXSM Transmit summing junction
3TX- Negative differential transmit signal to DAA
from host
4TX+ Positive differential transmit signal to DAA from
host
5 TX Transmit differential amplifier output
6 REFM Internal voltage reference
7 GND Host (CPE) side analog ground
8OH Assert logic low for off-hook operation
9RING Indicates ring signal, pulsed high to low
10 CID Assert logic low while on hook to place CID
information on RX pins.
11 RX-
Negative differential analog signal received
from the telephone line. Must be AC coupled
with 0.1 µF.
12 RX+
Positive differential analog signal received from
the telephone line. Must be AC coupled with
0.1 µF.
13 SNP+ Positive differential snoop input
14 SNP- Negative differential snoop input
15 RXF Receive photodiode amplifier output
16 RX Receive photodiode summing junction
17 VDDL Power supply for line side, regulated from tip
and ring.
18 RXS Receive isolation amp summing junction
19 RPB Receive LED pre-bias current set
20 BR- Bridge rectifier return
21 ZDC Electronic inductor and DC current limit
22 DCS2 DC feedback output
23 DCS1 V to I slope control
24 REFB 0.625 Vdc reference
25 GAT External MOSFET gate control
26 NTS Receive signal input
27 BR- Bridge rectifier return
28 TXSL Transmit photodiode summing junction
29 ZNT Receiver impedance set
30 ZTX Transmit transconductance gain set
31 TXF Transmit photodiode amplifier output
32 REFL 1.25 Vdc reference
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
TXSM
TX-
TX+
TX
REFM
GND
OH
RING
CID
RX-
RX+
SNP+
SNP-
RXF
RX
REFL
TXF
ZTX
ZNT
TXSL
BR-
NTS
GAT
REFB
DCS1
DCS2
ZDC
BR-
RPB
RXS
VDDL
CPC5610/CPC5611
6 www.clare.com Rev. 9.0
2. Application Circuits
LITELINK can be used with telephone networks world-
wide. Some pub lic telephone netw orks, notab ly in
North America and Japan require resistive line temri-
nation. Other telephon e netw orks in Europe and else-
where require reactive line termination.
The application circuits belo w address both line termi-
nation models. The rea ctive termination application
circuit (see Section 2.2 on page 8) describes a TBR-21
implementation. This circuit can be adapted easily for
other reactiv e termination needs. Worldwide applica-
tion of LITELINK is described more fully in Clare appli-
cation note AN-147, Worldwide Application of LITELINK.
2.1 Resistive Termination Application Circuit
Figure 3. Resistive Termination Application Circuit Schematic
1This design w as tested and found to co mply with FCC Part 68 with this
part. Other compliance requirements ma y require a different part.
2Higher-noise pow er suppl ies ma y re quire substit ution of a 220 µH inductor,
Toko 380HB-2215 or simi lar. See the Power Quality section of Cla re applica-
tion note AN-146, Guidelines for Effective LITELINK Designs for more infor ma-
tion.
3Optional for enhanced trans-hybrid loss, see “Trans-Hybrid Loss” on page 16.
1
2
+
-
OH
RING
CID
TX+
RX+
TX-
RX-
3.3 or 5 V
C13 0.1
C14 0.1
C2 0.1
C3 0.1
C4 0.1
R1 (R ) 80.6K 1%
TX
R23
10²
-BR
-BR
-BR
TIP
RING
U1
LITELINK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
TXSM
TX-
TX+
TX
REFM
GND
RX-
RX+
SNP+
SNP-
RXF
RX
OH
RING
CID
REFL
TXF
ZTX
ZNT
TXSL
BR1-
NTS
GAT
REFB
DCS1
DCS2
ZDC
BR2-
RPB
RXS
VDDL
DB1
SIZB60
600V_60A
SP1
P3100SB
¹
-BR
-BR
A
A
A
C9
0.1
C16
10 FB1
600
200 mA
Ω
C1
1
R5 (R )
42.2K
1%
TXF
R13
(R )
1M
1%
NTS
C10
0.01
500V
R15 (R ) 1.69M 1%
DCS2
R14
(R )
47
GAT
R20
(R )
2
VDDL
R21 (R )
1%
DCS1B
6.2 M
R22 (R )
6.8 M 1%
DCS1A
C12 (C )
0.027
DCS
R2
(R )
127K
1%
RXF
R3
(R )
1.5M
1%
SNPD
C7
(C )
220pF
2000V
SNP-
C8
(C )
220pF
2000V
SNP+
R6 (R )
1.8M 1/10W 1%
SNP-2
R44 (R )
1.8M 1/10W 1%
SNP-1
R7 (R )
1.8M 1/10W 1%
SNP+2
R45 (R )
1.8M 1/10W 1%
SNP+1
R4
(R )
68.1
1%
PB
R8 (R )
200K 1%
HTX
R9 (R )
200K 1%
HNT
-BR
NOTE: Unless otherwise
noted, all resistors are in
Ohms, 5%. All capacitors
