2D, Dual-Channel, Ultrasensitive Hall-Effect Latch
A1262
18
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
POWER DERATING
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance (RθJA) is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity (K)
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case (RθJC) is relatively
small component of RθJA. Ambient air temperature (TA) and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ at PD.
PD = VIN × IIN (1)
∆T=PD × RθJA (2)
TJ = TA+∆T (3)
For example, given common conditions such as: TA = 25°C,
VDD = 12 V, IDD = 3 mA, and RθJA = 124°C/W for the LH5 pack-
age, then:
PD = VDD × IDD = 12 V × 3.0 mA = 36.0 mW
∆T=PD × RθJA = 36.0 mW × 124°C/W = 4.5°C
TJ = TA+∆T=25°C+4.5°C=29.5°C
A worst-case estimate (PD(max)) represents the maximum allow-
able power level (VDD(max), IDD(max)), without exceeding TJ(max),
at a selected RθJA and TA.
Example: Reliability for VDD at TA = 150°C, package LH5, using
low-K PCB.
Observe the worst-case ratings for the device, specifically:
RθJA = 124°C/W, TJ(max) = 165°C, VDD(max) = 24 V, and
IDD(max) = 7.5 mA.
Calculate the maximum allowable power level (PD(max)). First,
invert equation 3:
∆Tmax = TJ(max) – TA = 165°C – 150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max)=∆Tmax ÷ RθJA = 15°C ÷ 124°C/W = 121 mW
Finally, invert equation 1 with respect to voltage:
VDD(est) = PD(max) ÷ IDD(max)
VDD(est) = 121 mW ÷ 7.5 mA
VDD(est) = 16.1 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤ VDD(est).
Compare VDD(est) to VDD(max). If VDD(est) ≤ VDD(max), then reli-
able operation between VDD(est) and VDD(max) requires enhanced
RθJA. If VDD(est) ≥ VDD(max), then operation between VDD(est) and
VDD(max) is reliable under these conditions.