Rev. 1.2, Oct. 2010 M470T6464FBS M470T2863FB3 M470T2864FB3 M470T5663FB3 200pin Unbuffered SODIMM based on 1Gb F-die 60FBGA/84FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. 2010 Samsung Electronics Co., Ltd. All rights reserved. -1- Unbuffered SODIMM Rev. 1.2 datasheet DDR2 SDRAM Revision History Revision No. History Draft Date Remark Editor 1.0 - First Release Jun. 2010 - S.H.Kim 1.1 - Changed IDD current SPEC : IDD3PS Jul. 2010 - S.H.Kim 1.2 - Added 512MB x16, 1GB x8 Part no. Oct. 2010 - S.H.Kim -2- Unbuffered SODIMM datasheet Rev. 1.2 DDR2 SDRAM Table Of Contents 200pin Unbuffered SODIMM based on 1Gb F-die 1. DDR2 Unbuffered SODIMM Ordering Information........................................................................................................ 4 2. Key Features................................................................................................................................................................. 4 3. Address Configuration .................................................................................................................................................. 4 4. Pin Configurations (Front side/Back side)..................................................................................................................... 5 5. Pin Description.............................................................................................................................................................. 5 6. Input/Output Function Description ................................................................................................................................ 6 7. Functional Block Diagram : ........................................................................................................................................... 7 7.1 512MB, 64Mx64 Module - M470T6464FBS ............................................................................................................ 7 7.2 1GB, 128Mx64 Module - M470T2863FB3 ............................................................................................................... 8 7.3 1GB, 128Mx64 Module - M470T2864FB3 ............................................................................................................... 9 7.4 2GB, 256Mx64 Module - M470T5663FB3 ............................................................................................................... 10 8. Absolute Maximum DC Ratings .................................................................................................................................... 11 9. AC & DC Operating Conditions..................................................................................................................................... 11 9.1 Recommended DC Operating Conditions (SSTL - 1.8)........................................................................................... 11 9.2 Operating Temperature Condition ........................................................................................................................... 12 9.3 Input DC Logic Level ............................................................................................................................................... 12 9.4 Input AC Logic Level ............................................................................................................................................... 12 9.5 AC Input Test Conditions......................................................................................................................................... 12 10. IDD Specification Parameters Definition ..................................................................................................................... 13 11. Operating Current Table : ........................................................................................................................................... 14 11.1 M470T6464FBS : 64Mx64 512MB Module ........................................................................................................... 14 11.2 M470T2863FB3 : 128Mx64 1GB Module .............................................................................................................. 14 11.3 M470T2864FB3 : 128Mx64 1GB Module .............................................................................................................. 15 11.4 M470T5663FB3 : 256Mx64 2GB Module .............................................................................................................. 15 12. Input/Output Capacitance ........................................................................................................................................... 16 13. Electrical Characteristics & AC Timing for DDR2-800/667 ......................................................................................... 16 13.1 Refresh Parameters by Device Density................................................................................................................. 16 13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ................................................................ 16 13.3 Timing Parameters by Speed Grade ..................................................................................................................... 17 14. Physical Dimensions : ................................................................................................................................................. 19 14.1 64Mbx16 based 64Mx64 Module (1Rank)............................................................................................................. 19 14.2 128Mbx8 based 128Mx64 Module (1Rank)........................................................................................................... 20 14.3 64Mbx16 based 128Mx64 Module (2Ranks) ......................................................................................................... 21 14.4 128Mbx8 based 256Mx64 Module (2Ranks) ......................................................................................................... 22 -3- Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 1. DDR2 Unbuffered SODIMM Ordering Information Organization Component Composition Number of Rank Height 512MB 64Mx64 64Mx16(K4T1G164QF)*4 1 30mm 1GB 128Mx64 128Mx8(K4T1G084QF)*8 1 30mm Part Number Density M470T6464FBS-CE7/F7/E6 M470T2863FB3-CE7/F7/E6 M470T2864FB3-CE7/F7/E6 1GB 128Mx64 64Mx16(K4T1G164QF)*8 2 30mm M470T5663FB3-CE7/F7/E6 2GB 256Mx64 128Mx8(K4T1G084QF)*16 2 30mm NOTE : 1. "B" of Part number(11th digit) stands for Flip chip, Lead-Free, Halogen-Free and RoHS compliant products. 2. "3" of Part number(12th digit) stands for Dummy Pad PCB products. 3. "S" of Part number(12th digit) stands for reduced layer PCB products. 2. Key Features * Performance range E7 (DDR2-800) F7 (DDR2-800) E6 (DDR2-667) Unit Speed@CL3 400 - 400 Mbps Speed@CL4 533 533 533 Mbps Speed@CL5 800 667 667 Mbps Speed@CL6 - 800 - Mbps CL-tRCD-tRP 5-5-5 6-6-6 5-5-5 CK * JEDEC standard VDD = 1.8V 0.1V Power Supply * VDDQ = 1.8V 0.1V * 333MHz fCK for 667Mb/sec/pin * 4 Banks * Posted CAS * Programmable CAS Latency: 3, 4, 5, 6 * Programmable Additive Latency: 0, 1, 2, 3, 4, 5 * Write Latency(WL) = Read Latency(RL) -1 * Burst Length: 4 , 8(Interleave/Nibble sequential) * Programmable Sequential / Interleave Burst Mode * Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature) * Off-Chip Driver(OCD) Impedance Adjustment * On Die Termination with selectable values(50/75/150 ohms or disable) * Average Refresh Period 7.8us at lower than a TCASE 85C, 3.9us at 85C < TCASE < 95 C - Support High Temperature Self-Refresh rate enable feature * Package: 60ball FBGA - 128Mx8 84ball FBGA - 64Mx16 * All of base components are Flip chip and RoHS compliant NOTE : For detailed DDR2 SDRAM operation, please refer to Samsung's Device operation & Timing diagram. 3. Address Configuration Organization Row Address Column Address Bank Address Auto Precharge 128Mx8(1Gb) based Module A0-A13 A0-A9 BA0-BA1 A10 64Mx16(1Gb) based Module A0-A12 A0-A9 BA0-BA1 A10 -4- Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 4. Pin Configurations (Front side/Back side) Pin 1 Front VREF Pin 2 Back VSS Pin 51 Front DQS2 Pin 52 Back DM2 Pin 101 Front A1 Pin 102 Back A0 Pin 151 Front DQ42 Pin 152 Back DQ46 DQ47 3 VSS 4 DQ4 53 VSS 54 VSS 103 VDD 104 VDD 153 DQ43 154 5 DQ0 6 DQ5 55 DQ18 56 DQ22 105 A10/AP 106 BA1 155 VSS 156 VSS 7 DQ1 8 VSS 57 DQ19 58 DQ23 107 BA0 108 RAS 157 DQ48 158 DQ52 DQ53 9 VSS 10 DM0 59 VSS 60 VSS 109 WE 110 S0 159 DQ49 160 11 DQS0 12 VSS 61 DQ24 62 DQ28 111 VDD 112 VDD 161 VSS 162 VSS 13 15 DQS0 VSS 14 16 DQ6 DQ7 63 65 DQ25 VSS 64 66 DQ29 VSS 113 115 CAS NC/S1 114 116 ODT0 A13 163 165 NC, TEST VSS 164 166 CK1 CK1 17 DQ2 18 VSS 67 DM3 68 DQS3 117 VDD 118 VDD 167 DQS6 168 VSS 19 21 DQ3 VSS 20 22 DQ12 DQ13 69 71 NC VSS 70 72 DQS3 VSS 119 121 NC/ODT1 VSS 120 122 NC VSS 169 171 DQS6 VSS 170 172 DM6 VSS 23 DQ8 24 VSS 73 DQ26 74 DQ30 123 DQ32 124 DQ36 173 DQ50 174 DQ54 25 27 DQ9 VSS 26 28 DM1 VSS 75 77 DQ27 VSS 76 78 DQ31 VSS 125 127 DQ33 VSS 126 128 DQ37 VSS 175 177 DQ51 VSS 176 178 DQ55 VSS 29 31 DQS1 DQS1 30 32 CK0 CK0 79 81 CKE0 VDD 80 82 NC/CKE1 VDD 129 131 DQS4 DQS4 130 132 DM4 VSS 179 181 DQ56 DQ57 180 182 DQ60 DQ61 33 VSS 34 VSS 83 NC 84 NC 133 VSS 134 DQ38 183 VSS 184 VSS 35 37 DQ10 DQ11 36 38 DQ14 DQ15 85 87 BA2 VDD 86 88 NC VDD 135 137 DQ34 DQ35 136 138 DQ39 VSS 185 187 DM7 VSS 186 188 DQS7 DQS7 39 VSS 40 VSS 89 A12 90 A11 139 VSS 140 DQ44 189 DQ58 190 VSS 41 VSS 42 VSS 91 A9 92 A7 141 DQ40 142 DQ45 191 DQ59 192 DQ62 DQ63 43 DQ16 44 DQ20 93 A8 94 A6 143 DQ41 144 VSS 193 VSS 194 45 DQ17 46 DQ21 95 VDD 96 VDD 145 VSS 146 DQS5 195 SDA 196 VSS 47 VSS 48 VSS 97 A5 98 A4 147 DM5 148 DQS5 197 SCL 198 SA0 49 DQS2 50 NC 99 A3 100 A2 149 VSS 150 VSS 199 VDDSPD 200 SA1 NOTE :NC = No Connect; NC, TEST(pin 163)is for bus analysis tool and is not connected on normal memory modules. 5. Pin Description Pin Name CK0,CK1 Description Clock Inputs, positive line Pin Name SDA Description SPD Data Input/Output CK0,CK1 Clock Inputs, negative line SA1,SA0 SPD address CKE0,CKE1 Clock Enables DQ0~DQ63 Data Input/Output RAS Row Address Strobe DM0~DM7 Data Masks CAS Column Address Strobe DQS0~DQS7 Data strobes WE Write Enable DQS0~DQS7 Data strobes complement S0,S1 Chip Selects TEST Logic Analyzer specific test pin (No connect on So-DIMM) A0~A9, A11~A13 Address Inputs VDD Core and I/O Power A10/AP Address Input/Autoprecharge VSS Ground BA0,BA1 SDRAM Bank Address VREF Input/Output Reference ODT0,ODT1 On-die termination control VDDSPD SPD Power SCL Serial Presence Detect(SPD) Clock Input NC Spare pins, No connect CK0,CK1 Clock Inputs, positive line SDA SPD Data Input/Output NOTE : The VDD and VDDQ pins are tied to the single power-plane on PCB. -5- datasheet Unbuffered SODIMM Rev. 1.2 DDR2 SDRAM 6. Input/Output Function Description Symbol Type Description CK0-CK1 CK0-CK1 Input The system clock inputs. All address and command lines are sampled on the cross point of the rising edge of CK and falling edge of CK . A Delay Locked Loop (DLL) circuit is driven from the clock input and output timing for read operations is synchronized to the input clock. CKE0-CKE1 Input Activates the DDR2 SDRAM CK signal when high and deactivates the CK signal when low, By deactivating the clocks, CKE low initiates the Power Down mode or the Self Refesh mode. S0-S1 Input Enables the associated DDR2 SDRAM command decoder when low and disables the command decoder when high. When the command decoder is disabled, new commands are ignored but previous operations continue. Rank 0 is selected by S0, Rank 1 is selected by S1. Ranks are also called "Physical banks". RAS, CAS, WE Input When sampled at the cross point of the rising edge of CK and falling edge of CK, CAS, RAS, and WE define the operation to be executed by the SDRAM. BA0~BA2 Input Selects which DDR2 SDRAM internal bank is activated. ODT0~ODT1 Input Asserts on-die termination for DQ, DM, DQS, and DQS signals if enabled via the DDR2 SDRAM Extended Mode Register Set (EMRS). A0~A9, A10/AP, A11~A13 Input During a Bank Activate command cycle, defines the row address when sampled at the cross point of the rising edge of CK and falling edge of CK. During a Read or Write command cycle, defines the column address when sampled at the cross point of the rising edge of CK and falling edge of CK. In addition to the column address, AP is used to invoke autoprecharge operation at the end of the burst read or write cycle. If AP is high, autoprecharge is selected and BA0-BAn defines the bank to be precharged. If AP is low, autoprecharge is disabled. During a Precharge command cycle, AP is used in conjunction with BA0-BAn to control which bank(s) to precharge. If AP is high, all banks will be pecharged regardiess of the state of BA0-BAn inputs. If AP is low, then BA0-BAn are used to define which bank to precharge. DQ0~DQ63 In/Out Data Input/Output pins. DM0~DM7 Input The data write masks, associated with one data byte. In Write mode, DM operates as a byte mask by allowing input data to be written if it is low but blocks the write operation if it is high. In Read mode, DM lines have no effect. DQS0~DQS7 DQS0~DQS7 In/Out The data strobes, associated with one data byte, sourced with data transfers. In Write mode, the data strobe is sourced by the controller and is centered in the data window. In Read mode, the data strobe is sourced by the DDR2 SDRAMs and is sent at the leading edge of the data window. DQS signals are complements, and timing is relative to the crosspoint of respective DQS and DQS If the module is to be operated in single ended strobe mode, all DQS signals must be tied on the system board to VSS and DDR2 SDRAM mode registers programmed appropriately. VDD,VDDSPD,VSS Supply Power supplies for core, I/O, Serial Presence Detect, and ground for the module. SDA In/Out This is a bidirectional pin used to transfer data into or out of the SPD EEPROM. A resistor must be connected to VDD to act as a pull up. SCL Input This signal is used to clock data into and out of the SPD EEPROM. A resistor may be connected from SCL to VDD to act as a pull up. SA0~SA1 Input Address pins used to select the Serial Presence Detect base address. TEST In/Out The TEST pin is reserved for bus analysis tools and is not connected on normal memory modules(SODIMMs). -6- Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 7. Functional Block Diagram : 7.1 512MB, 64Mx64 Module - M470T6464FBS (Populated as 1 rank of x16 DDR2 SDRAMs) 3 + 5% CKE0 ODT0 S0 DQS0 DQS0 DM0 DQS1 DQS1 DM1 DQS2 DQS2 DM2 DQS3 DQS3 DM3 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 LDQS CS O D LDQS T LDM I/O 0 I/O 1 D0 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C K E LDQS CS O D LDQS T LDM I/O 0 I/O 1 D1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C K E DQS4 DQS4 DM4 DQS5 DQS5 DM5 DQS6 DQS6 DM6 DQS7 DQS7 DM7 3 + 5% BA0 - BA2 DDR2 SDRAMs D0 - D3 A0 - A13 DDR2 SDRAMs D0 - D3 RAS DDR2 SDRAMs D0 - D3 CAS DDR2 SDRAMs D0 - D3 WE DDR2 SDRAMs D0 - D3 DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 LDQS CS O D LDQS T LDM I/O 0 I/O 1 D2 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C K E LDQS CS O D LDQS T LDM I/O 0 I/O 1 D3 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C K E SCL SA0 SA1 SCL A0 SPD A1 A2 SDA WP * Clock Wiring VDDSPD Serial PD VREF DDR2 SDRAMs D0 - D3 VDD DDR2 SDRAMs D0 - D3, VDD and VDDQ VSS DDR2 SDRAMs D0 - D3, SPD Clock Input DDR2 SDRAMs *CK0/CK0 *CK1/CK1 2 DDR2 SDRAMs 2 DDR2 SDRAMs * Wire per Clock Loading Table/Wiring Diagrams NOTE : 1. DQ, DM, DQS/DQS resistors : 22 Ohms 5%. 2. BAx, Ax, RAS, CAS, WE resistors : 3.0 Ohms 5%. -7- Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 7.2 1GB, 128Mx64 Module - M470T2863FB3 (Populated as 1 rank of x8 DDR2 SDRAMs) S1 ODT1 CKE1 3 + 5% N.C. N.C. N.C. CKE0 ODT0 S0 DQS0 DQS0 DM0 DQS1 DQS1 DM1 DQS2 DQS2 DM2 DQS3 DQS3 DM3 CS ODT CKE DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS ODT CKE DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS ODT CKE DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS ODT CKE DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D0 D1 D2 D3 DQS4 DQS4 DM4 DQS5 DQS5 DM5 DQS6 DQS6 DM6 DQS7 DQS7 DM7 CS ODT CKE DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS ODT CKE DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS ODT CKE DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS ODT CKE DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 D4 D5 D6 D7 3 + 5% BA0 - BA2 DDR2 SDRAMs D0 - D7 A0 - A13 DDR2 SDRAMs D0 - D7 RAS DDR2 SDRAMs D0 - D7 CAS DDR2 SDRAMs D0 - D7 WE DDR2 SDRAMs D0 - D7 SCL SA0 SA1 VDDSPD Serial PD VREF DDR2 SDRAMs D0 - D7 VDD DDR2 SDRAMs D0 - D7, VDD and VDDQ VSS DDR2 SDRAMs D0 - D7, SPD SCL A0 SPD A1 A2 SDA WP * Clock Wiring Clock Input DDR2 SDRAMs *CK0/CK0 *CK1/CK1 4 DDR2 SDRAMs 4 DDR2 SDRAMs * Wire per Clock Loading Table/Wiring Diagrams NOTE : 1. DQ,DM, DQS/DQS resistors : 22 Ohms 5%. 2. BAx, Ax, RAS, CAS, WE resistors : 3.0 Ohms 5%. -8- Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 7.3 1GB, 128Mx64 Module - M470T2864FB3 (Populated as 2 ranks of x16 DDR2 SDRAMs) 3 + 5% ODT1 ODT0 CKE1 CKE0 S1 S0 DQS0 DQS0 DM0 DQS1 DQS1 DM1 DQS2 DQS2 DM2 DQS3 DQS3 DM3 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 LDQS CS C K LDQS E LDM I/O 0 I/O 1 D0 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T LDQS CS C K LDQS E LDM I/O 0 I/O 1 D1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T LDQS CS C K LDQS E LDM I/O 0 I/O 1 D4 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T LDQS CS C K LDQS E LDM I/O 0 I/O 1 D5 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T DQS4 DQS4 DM4 DQS5 DQS5 DM5 DQS6 DQS6 DM6 DQS7 DQS7 DM7 DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 LDQS CS C K LDQS E LDM I/O 0 I/O 1 D2 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T LDQS CS C K LDQS E LDM I/O 0 I/O 1 D6 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T LDQS CS C K LDQS E LDM I/O 0 I/O 1 D3 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T LDQS CS C K LDQS E LDM I/O 0 I/O 1 D7 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 UDQS UDQS UDM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 O D T 3 + 5% BA0 - BA2 DDR2 SDRAMs D0 - D7 A0 - A13 DDR2 SDRAMs D0 - D7 RAS DDR2 SDRAMs D0 - D7 CAS DDR2 SDRAMs D0 - D7 WE DDR2 SDRAMs D0 - D7 SCL SA0 SA1 SCL A0 SPD A1 A2 SDA WP * Clock Wiring VDDSPD Serial PD VREF DDR2 SDRAMs D0 - D7 VDD DDR2 SDRAMs D0 - D7, VDD and VDDQ VSS DDR2 SDRAMs D0 - D7, SPD NOTE : 1. DQ,DM, DQS/DQS resistors : 22 Ohms 5%. 2. BAx, Ax, RAS, CAS, WE resistors : 3.0 Ohms 5%. -9- Clock Input DDR2 SDRAMs *CK0/CK0 *CK1/CK1 4 DDR2 SDRAMs 4 DDR2 SDRAMs * Wire per Clock Loading Table/Wiring Diagrams Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 7.4 2GB, 256Mx64 Module - M470T5663FB3 (Populated as 2 ranks of x8 DDR2 SDRAMs) 3 + 5% CKE1 ODT1 S1 CKE0 ODT0 S0 DQS0 DQS0 DM0 DQS1 DQS1 DM1 DQS2 DQS2 DM2 DQS3 DQS3 DM3 CS0 O D T 0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 CS0 O DQS DQS D DM T 0 I/O 8 I/O 9 D1 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C K E 0 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 C K E 0 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 CS0 O DQS D DQS T DM 0 I/O 8 I/O 9 D3 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C K E 0 D0 CS0 O D T 0 D2 C K E 0 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS1 O D T 1 D8 CS1 O DQS DQS D DM T 1 I/O 8 I/O 9 D9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 C K E 1 CS1 O D T 1 C K E 1 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 DQS4 DQS4 DM4 C K E 1 DQS5 DQS5 DM5 DQS6 DQS6 DM6 D10 CS1 O DQS D DQS T DM 1 I/O 8 I/O 9 D11 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 DQS7 DQS7 DM7 C K E 1 DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS0 O D T 0 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DQS DQS DM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 CS0 O D T 0 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS0 O D T 0 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 DQS DQS DM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 CS0 O D T 0 C K E 0 D4 C K E 0 D5 C K E 0 D6 C K E 0 D7 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS1 O D T 1 DQS DQS DM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 CS1 O D T 1 DQS DQS DM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 CS1 O D T 1 DQS DQS DM I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 CS1 O D T 1 C K E 1 D12 C K E 1 D13 C K E 1 D14 C K E 1 D15 10 + 5% BA0 - BA2 DDR2 SDRAMs D0 - D15 A0 - A13 DDR2 SDRAMs D0 - D15 RAS DDR2 SDRAMs D0 - D15 CAS DDR2 SDRAMs D0 - D15 WE DDR2 SDRAMs D0 - D15 SCL SA0 SA1 VDDSPD Serial PD VREF DDR2 SDRAMs D0 - D15 VDD DDR2 SDRAMs D0 - D15, VDD and VDDQ VSS DDR2 SDRAMs D0 - D15, SPD SCL A0 SPD A1 A2 WP SDA * Clock Wiring Clock Input DDR2 SDRAMs *CK0/CK0 *CK1/CK1 8 DDR2 SDRAMs 8 DDR2 SDRAMs * Wire per Clock Loading Table/Wiring Diagrams NOTE : 1. DQ,DM, DQS/DQS resistors : 22 Ohms 5%. 2. BAx, Ax, RAS, CAS, WE resistors : 10.0 Ohms 5%. - 10 - Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 8. Absolute Maximum DC Ratings Symbol Parameter Rating Units NOTE VDD Voltage on VDD pin relative to VSS - 1.0 V ~ 2.3 V V 1 VDDQ Voltage on VDDQ pin relative to VSS - 0.5 V ~ 2.3 V V 1 VDDL Voltage on VDDL pin relative to VSS - 0.5 V ~ 2.3 V V 1 VIN, VOUT Voltage on any pin relative to VSS - 0.5 V ~ 2.3 V V 1 TSTG Storage Temperature -55 to +100 C 1, 2 NOTE : 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard. 9. AC & DC Operating Conditions 9.1 Recommended DC Operating Conditions (SSTL - 1.8) Symbol Parameter Rating Min. Typ. Max. Units NOTE VDD Supply Voltage 1.7 1.8 1.9 V VDDL Supply Voltage for DLL 1.7 1.8 1.9 V 4 VDDQ Supply Voltage for Output 1.7 1.8 1.9 V 4 VREF Input Reference Voltage 0.49*VDDQ 0.50*VDDQ 0.51*VDDQ mV 1,2 Termination Voltage VREF-0.04 VREF VREF+0.04 V 3 Units NOTE V 5 VTT Symbol VDDSPD Parameter Core Supply Voltage Rating Min. Max. 1.7 3.6 NOTE : There is no specific device VDD supply voltage requirement for SSTL-1.8 compliance. However under all conditions VDDQ must be less than or equal to VDD. 1. The value of VREF may be selected by the user to provide optimum noise margin in the system. Typically the value of VREF is expected to be about 0.5 x VDDQ of the transmitting device and VREF is expected to track variations in VDDQ. 2. Peak to peak AC noise on VREF may not exceed +/-2% VREF(DC). 3. VTT of transmitting device must track VREF of receiving device. 4. AC parameters are measured with VDD, VDDQ and VDDL tied together. 5. SODIMMs that include an optional temperature sensor may require a restricted VDDSPD operating voltage range for proper operation of the temperature sensor. Refer to the thermal sensor specification for details regarding the supported voltage range. All other functions of the SODIMM SPD are supported across the full VDDSPD range. - 11 - Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 9.2 Operating Temperature Condition Symbol Parameter Rating Units NOTE TOPER Operating Temperature 0 to 95 C 1, 2 NOTE : 1. Operating Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51.2 standard. 2. At 85 - 95 C operation temperature range, doubling refresh commands in frequency to a 32ms period ( tREFI=3.9 us ) is required, and to enter to self refresh mode at this temperature range, an EMRS command is required to change internal refresh rate. 9.3 Input DC Logic Level Symbol Parameter Min. Max. Units VIH(DC) DC input logic high VREF + 0.125 VDDQ + 0.3 V VIL(DC) DC input logic low - 0.3 VREF - 0.125 V NOTE 9.4 Input AC Logic Level DDR2-667/800 Symbol Parameter VIH(AC) AC input logic high VIL(AC) AC input logic low Min. Units Max. VREF + 0.200 V VREF - 0.200 V 9.5 AC Input Test Conditions Symbol VREF VSWING(MAX) SLEW Condition Value Units NOTE 0.5 * VDDQ V 1 Input signal maximum peak to peak swing 1.0 V 1 Input signal minimum slew rate 1.0 V/ns 2, 3 Input reference voltage NOTE : 1. Input waveform timing is referenced to the input signal crossing through the VIH/IL(AC) level applied to the device under test. 2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(AC) min for rising edges and the range from VREF to VIL(AC) max for falling edges as shown in the below figure. 3. AC timings are referenced with input waveforms switching from VIL(AC) to VIH(AC) on the positive transitions and VIH(AC) to VIL(AC) on the negative transitions. VDDQ VIH(AC) min VIH(DC) min VSWING(MAX) VREF VIL(DC) max VIL(AC) max delta TF Falling Slew = VSS delta TR VREF - VIL(AC) max Rising Slew = delta TF VIH(AC) min - VREF Figure 1. AC Input Test Signal Waveform - 12 - delta TR Unbuffered SODIMM datasheet Rev. 1.2 DDR2 SDRAM 10. IDD Specification Parameters Definition (IDD values are for full operating range of Voltage and Temperature) Symbol Proposed Conditions Units IDD0 Operating one bank active-precharge current; tCK = tCK(IDD), tRC = tRC(IDD), tRAS = tRASmin(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING mA IDD1 Operating one bank active-read-precharge current; IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD = tRCD(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W mA IDD2P Precharge power-down current; All banks idle; tCK = tCK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING mA IDD2Q Precharge quiet standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING mA IDD2N Precharge standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING mA IDD3P Active power-down current; All banks open; tCK = tCK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING IDD3N Active standby current; All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING mA IDD4W Operating burst write current; All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING mA IDD4R Operating burst read current; All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W mA IDD5B Burst auto refresh current; tCK = tCK(IDD); Refresh command at every tRFC(IDD) interval; CKE is HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING mA Fast PDN Exit MRS(12) = 0 mA Slow PDN Exit MRS(12) = 1 mA Normal mA Low Power mA IDD6 Self refresh current; CK and CK at 0V; CKE 0.2V; Other control and address bus inputs are FLOATING; Data bus inputs are FLOATING IDD7 Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = tRCD(IDD)-1*tCK(IDD); tCK = tCK(IDD), tRC = tRC(IDD), tRRD = tRRD(IDD), tFAW = tFAW(IDD), tRCD = 1*tCK(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4R; Refer to the following page for detailed timing conditions - 13 - mA NOTE Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 11. Operating Current Table : 11.1 M470T6464FBS : 64Mx64 512MB Module (TA=0oC, VDD= 1.9V) 800@CL=5 800@CL=6 667@CL=5 CE7 CF7 CE6 IDD0 220 220 200 mA IDD1 260 260 240 mA IDD2P 40 40 40 mA IDD2Q 88 88 88 mA Symbol Units IDD2N 116 116 108 mA IDD3P-F 100 100 96 mA IDD3P-S 80 80 80 mA IDD3N 160 160 148 mA IDD4W 380 380 360 mA IDD4R 420 420 380 mA IDD5 440 440 420 mA IDD6 40 40 40 mA IDD7 720 720 660 mA NOTE NOTE : Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap. 11.2 M470T2863FB3 : 128Mx64 1GB Module (TA=0oC, VDD= 1.9V) 800@CL=5 800@CL=6 667@CL=5 CE7 CF7 CE6 IDD0 360 360 344 mA IDD1 408 408 384 mA IDD2P 80 80 80 mA Symbol Units IDD2Q 160 160 160 mA IDD2N 200 200 192 mA IDD3P-F 184 184 176 mA IDD3P-S 160 160 160 mA IDD3N 296 296 280 mA IDD4W 576 576 520 mA IDD4R 640 640 560 mA IDD5 840 840 800 mA IDD6 80 80 80 mA IDD7 1280 1280 1160 mA NOTE : Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap. Operating Current Table : - 14 - NOTE Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 11.3 M470T2864FB3 : 128Mx64 1GB Module (TA=0oC, VDD= 1.9V) 800@CL=5 800@CL=6 667@CL=5 CE7 CF7 CE6 IDD0 336 336 308 mA IDD1 376 376 348 mA Symbol Units IDD2P 80 80 80 mA IDD2Q 176 176 176 mA IDD2N 232 232 216 mA IDD3P-F 200 200 192 mA IDD3P-S 160 160 160 mA IDD3N 276 276 256 mA IDD4W 496 496 468 mA IDD4R 536 536 488 mA IDD5 556 556 528 mA IDD6 80 80 80 mA IDD7 836 836 768 mA NOTE NOTE : Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap. 11.4 M470T5663FB3 : 256Mx64 2GB Module (TA=0oC, VDD= 1.9V) 800@CL=5 800@CL=6 667@CL=5 CE7 CF7 CE6 IDD0 560 560 536 mA IDD1 608 608 576 mA IDD2P 160 160 160 mA Symbol Units IDD2Q 320 320 320 mA IDD2N 400 400 384 mA IDD3P-F 368 368 352 mA IDD3P-S 320 320 320 mA IDD3N 496 496 472 mA IDD4W 776 776 712 mA IDD4R 840 840 752 mA IDD5 1040 1040 992 mA IDD6 160 160 160 mA IDD7 1480 1480 1352 mA NOTE : Module IDD was calculated on the basis of component IDD and can be differently measured according to DQ loading cap. - 15 - NOTE Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 12. Input/Output Capacitance (VDD=1.8V, VDDQ=1.8V, TA=25oC) Parameter Min Symbol Non-ECC Input capacitance, CK and CK Non-ECC - CI - 34 CIO(667/800) - 5.5 24 Symbol Input capacitance, CK and CK Input/output capacitance, DQ, DM, DQS, DQS Non-ECC - 32 - 42 CIO(667/800) - Non-ECC M470T2864FB3 - 32 CI - 34 CIO(667/800) - 9 Symbol Input capacitance, CK and CK pF M470T5663FB3 Units CCK - 48 CI - 42 CIO(667/800) - 9 Input capacitance, CKE , CS, Addr, RAS, CAS, WE Input/output capacitance, DQ, DM, DQS, DQS Units CCK Input capacitance, CKE , CS, Addr, RAS, CAS, WE pF 5.5 Symbol Input/output capacitance, DQ, DM, DQS, DQS Units CI Input capacitance, CK and CK pF M470T2863FB3 CCK Input capacitance, CKE , CS, Addr, RAS, CAS, WE Units M470T6464FBS CCK Input capacitance, CKE , CS, Addr, RAS, CAS, WE Input/output capacitance, DQ, DM, DQS, DQS Max pF NOTE : DM is internally loaded to match DQ and DQS identically. 13. Electrical Characteristics & AC Timing for DDR2-800/667 (0 C < TOPER < 95 C; VDDQ = 1.8V + 0.1V; VDD = 1.8V + 0.1V) 13.1 Refresh Parameters by Device Density Parameter Symbol Refresh to active/Refresh command time Average periodic refresh interval 256Mb 512Mb 1Gb 2Gb 4Gb tRFC tREFI Units 75 105 127.5 195 327.5 ns 0 C TCASE 85C 7.8 7.8 7.8 7.8 7.8 s 85 C < TCASE 95C 3.9 3.9 3.9 3.9 3.9 s 13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin Speed DDR2-800(E7) DDR2-800(F7) DDR2-667(E6) Bin(CL - tRCD - tRP) 5-5-5 6 - 6- 6 5-5-5 Parameter Units min max min max min max tCK, CL=3 5 8 - - 5 8 ns tCK, CL=4 3.75 8 3.75 8 3.75 8 ns tCK, CL=5 2.5 8 3 8 3 8 ns tCK, CL=6 - - 2.5 8 - - ns tRCD 12.5 - 15 - 15 - ns tRP 12.5 - 15 - 15 - ns tRC 57.5 - 60 - 60 - ns 45 70000 45 70000 45 70000 ns tRAS - 16 - Unbuffered SODIMM Rev. 1.2 datasheet DDR2 SDRAM 13.3 Timing Parameters by Speed Grade (Refer to notes for informations related to this table at the component datasheet) Parameter Symbol DDR2-800 DDR2-667 min max min max -400 400 - 450 450 Units NOTE ps 40 DQ output access time from CK/CK tAC DQS output access time from CK/CK tDQSCK -350 350 - 400 400 ps 40 Average clock HIGH pulse width tCH(avg) 0.48 0.52 0.48 0.52 tCK(avg) 35,36 Average clock LOW pulse width tCL(avg) 0.48 0.52 0.48 0.52 tCK(avg) 35,36 Min(tCL(abs), tCH(abs)) x Min(tCL(abs), tCH(abs)) x ps 37 CK half pulse period tHP Average clock period tCK(avg) 2500 8000 3000 8000 ps 35,36 DQ and DM input hold time tDH(base) 125 x 175 x ps 6,7,8,21,28,31 DQ and DM input setup time tDS(base) 50 x 100 x ps 6,7,8,20,28,31 Control & Address input pulse width for each input tIPW 0.6 x 0.6 x tCK(avg) DQ and DM input pulse width for each input tDIPW 0.35 x 0.35 x tCK(avg) Data-out high-impedance time from CK/CK tHZ x tAC(max) x tAC(max) ps 18,40 DQS/DQS low-impedance time from CK/CK tLZ(DQS) tAC(min) tAC(max) tAC(min) tAC(max) ps 18,40 DQ low-impedance time from CK/CK tLZ(DQ) 2* tAC(min) tAC(max) 2* tAC(min) tAC(max) ps 18,40 DQS-DQ skew for DQS and associated DQ signals tDQSQ x 200 x 240 ps 13 DQ hold skew factor tQHS x 300 x 340 ps 38 DQ/DQS output hold time from DQS tQH tHP - tQHS x tHP - tQHS x ps 39 DQS latching rising transitions to associated clock edges tDQSS - 0.25 0.25 -0.25 0.25 tCK(avg) 30 DQS input HIGH pulse width tDQSH 0.35 x 0.35 x tCK(avg) DQS input LOW pulse width tDQSL 0.35 x 0.35 x tCK(avg) DQS falling edge to CK setup time tDSS 0.2 x 0.2 x tCK(avg) 30 DQS falling edge hold time from CK tDSH 0.2 x 0.2 x tCK(avg) 30 Mode register set command cycle time tMRD 2 x 2 x nCK MRS command to ODT update delay tMOD 0 12 0 12 ns 32 Write postamble tWPST 0.4 0.6 0.4 0.6 tCK(avg) 10 Write preamble tWPRE 0.35 x 0.35 x tCK(avg) Address and control input hold time tIH(base) 250 x 275 x ps 5,7,9,23,29 Address and control input setup time tIS(base) 175 x 200 x ps 5,7,9,22,29 Read preamble tRPRE 0.9 1.1 0.9 1.1 tCK(avg) 19,41 Read postamble tRPST 0.4 0.6 0.4 0.6 tCK(avg) 19,42 Activate to activate command period for 1KB page size products tRRD 7.5 x 7.5 x ns 4,32 Activate to activate command period for 2KB page size products tRRD 10 x 10 x ns 4,32 - 17 - Unbuffered SODIMM Parameter Rev. 1.2 datasheet Symbol DDR2 SDRAM DDR2-800 DDR2-667 min max min max Units NOTE Four Activate Window for 1KB page size products tFAW 35 x 37.5 x ns 32 Four Activate Window for 2KB page size products tFAW 45 x 50 x ns 32 CAS to CAS command delay tCCD 2 x 2 x nCK Write recovery time tWR 15 x 15 x ns Auto precharge write recovery + precharge time tDAL WR + tnRP x WR + tnRP x nCK 33 Internal write to read command delay tWTR 7.5 x 7.5 x ns 24,32 Internal read to precharge command delay tRTP 7.5 x 7.5 x ns 3,32 Exit self refresh to a non-read command tXSNR tRFC + 10 x tRFC + 10 x ns 32 Exit self refresh to a read command tXSRD 200 x 200 x nCK Exit precharge power down to any command tXP 2 x 2 x nCK Exit active power down to read command tXARD 2 x 2 x nCK 1 Exit active power down to read command (slow exit, lower power) tXARDS 8 - AL x 7 - AL x nCK 1,2 27 32 CKE minimum pulse width (HIGH and LOW pulse width) tCKE 3 x 3 x nCK ODT turn-on delay tAOND 2 2 2 2 nCK 16 ODT turn-on tAON tAC(min) tAC(max)+0.7 tAC(min) tAC(max)+0.7 ns 6,16,40 ODT turn-on (Power-Down mode) tAONPD tAC(min)+2 2*tCK(avg) +tAC(max)+1 tAC(min)+2 2*tCK(avg) +tAC(max)+1 ns ODT turn-off delay tAOFD ODT turn-off tAOF ODT turn-off (Power-Down mode) tAOFPD ODT to power down entry latency tANPD 2.5 2.5 2.5 2.5 nCK 17,45 tAC(min) tAC(max)+0.6 tAC(min) tAC(max)+0.6 ns 17,43,45 tAC(min)+2 2.5*tCK(avg)+ tAC(max)+1 tAC(min)+2 2.5*tCK(avg)+ tAC(max)+1 ns 3 x 3 x nCK ODT power down exit latency tAXPD 8 x 8 x nCK OCD drive mode output delay tOIT 0 12 0 12 ns 32 x tIS+tCK(avg) +tIH x ns 15 Minimum time clocks remains ON after CKE asynchronously tDelay drops LOW tIS+tCK(avg) +tIH - 18 - Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 14. Physical Dimensions : 14.1 64Mbx16 based 64Mx64 Module (1Rank) - M470T6464FBS Units : Millimeters 67.60 0.15 mm 3.8 mm Max b 11.40 0.15 mm 199 30.00 0.15 mm 4.00 0.10 a 1 20.00 0.15 mm SPD 6.00 0.15 mm min 2.00 1.1 mm Max 47.40 0.15 mm 16.25 0.15 mm 63.00 0.15 mm 2 200 30.00 0.15 mm a 67.60 0.15 mm DETAIL a 1.0 0.05 1.50 0.10 1.80 0.10 4.00 0.10 2.40 0.10 0.60 0.15 1.0 0.05 0.45 0.03 4.20 0.15 The used device is 64M x16 DDR2 SDRAM, Flip-chip. DDR2 SDRAM Part NO : K4T1G164QF - 19 - 2.55 0.15 2.70 0.10 BACK SIDE 4.00 0.10 0.20 0.15 FRONT SIDE 4.20 0.15 DETAIL b Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 14.2 128Mbx8 based 128Mx64 Module (1Rank) - M470T2863FB3 Units : Millimeters 67.60 0.15 mm 3.8 mm Max a 1 b 11.40 0.15 mm 199 30.00 0.15 mm 4.00 0.10 20.00 0.15 mm SPD 6.00 0.15 mm min 2.00 1.1 mm Max 47.40 0.15 mm 16.25 0.15 mm 63.00 0.15 mm 2 200 30.00 0.15 mm a 67.60 0.15 mm DETAIL a 1.0 0.05 1.50 0.10 1.80 0.10 4.00 0.10 2.40 0.10 0.60 0.15 1.0 0.05 0.45 0.03 4.20 0.15 The used device is 128M x8 DDR2 SDRAM, Flip-chip DDR2 SDRAM Part NO : K4T1G084QF - 20 - 2.55 0.15 2.70 0.10 BACK SIDE 4.00 0.10 0.20 0.15 FRONT SIDE 4.20 0.15 DETAIL b Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 14.3 64Mbx16 based 128Mx64 Module (2Ranks) - M470T2864FB3 Units : Millimeters 67.60 0.15 mm 3.8 mm Max a 1 b 11.40 0.15 mm 199 30.00 0.15 mm 4.00 0.10 20.00 0.15 mm 6.00 0.15 mm min 2.00 1.1 mm Max 47.40 0.15 mm 16.25 0.15 mm 63.00 0.15 mm 2 200 SPD 30.00 0.15 mm a 67.60 0.15 mm Detail A BACK SIDE FRONT SIDE 1.0 0.05 1.50 0.10 1.80 0.10 4.00 0.10 2.40 0.10 0.60 0.15 1.0 0.05 0.45 0.03 4.20 0.15 The used device is 64M x16 DDR2 SDRAM, Flip-chip. DDR2 SDRAM Part NO : K4T1G164QF - 21 - 2.55 0.15 2.70 0.10 4.00 0.10 0.20 0.15 4.20 0.15 Detail B Rev. 1.2 datasheet Unbuffered SODIMM DDR2 SDRAM 14.4 128Mbx8 based 256Mx64 Module (2Ranks) - M470T5663FB3 Units : Millimeters 3.8 mm max 67.60 0.15 mm b 11.40 0.15 mm 199 4.00 0.10 20.00 0.15 mm 6.00 0.15 mm a 1 30.00 0.15 mm min 2.00 SPD 1.1mm max 47.40 0.15 mm 16.25 0.15 mm 63.00 0.15 mm 2 200 30.00 0.15 mm a 67.60 0.15 mm DETAIL a 1.0 0.05 1.50 0.10 1.80 0.10 4.00 0.10 2.40 0.10 0.60 0.15 1.0 0.05 0.45 0.03 4.20 0.15 The used device is 128M x8 DDR2 SDRAM, Flip-chip DDR2 SDRAM Part NO : K4T1G084QF - 22 - 2.55 0.15 2.70 0.10 BACK SIDE 4.00 0.10 0.20 0.15 FRONT SIDE 4.20 0.15 DETAIL b