Multilayer Chip Bead
CIM Series- CIM21 (2012/ EIA 0805)
CIM Series display high impedance because it is composed of
amultilayered internal conductor and has excellent attenuation
characteristics for wide band frequency.
The smallest beads suitable for surface mounting
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is suitable for high
density PCBs.
APPLICATION
High frequency EMI prevention application to computers, printers, VCRs, TVs and
portable telephones.
SPECIFICATION
PRODUCT IDENTIFICATION
CI M 21 U 800 N E
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads
(2) Multi-layer type
(3) Dimension
(4) Material Code
P,U: Broad impedance, especially suppresses noise in the 10~200MHz range
J: Suppresses noise in the 100~300MHz range
K: Suppresses noise in the 200MHz above
N: Suppresses noise in the 200~500MHz range
(5) Nominal impedance (300:30Ω, 121:120Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
FEATURES
Operating temperature range –55 to +125°C
Storage temperature range –10 to +40°C
Relative humidity 30 to 70%