1#
Product Family Data Sheet_Global Rev.4.1 18.08.24
Middle Power LED Series
3030
LM301B
CRI 80
Featur
es & Benefits
• 0.3 W class middle power LED
• Mold resin for high reliability
• Standard form factor for design flexibility (3.0 × 3.0 mm)
2
Table of Contents
1. Characteristics ----------------------- 3
2. Product Code Information ----------------------- 5
3. Typical Characteristics Graphs ----------------------- 13
4. Outline Drawing & Dimension ----------------------- 16
5. Reliability Test Items & Conditions ----------------------- 17
6. Soldering Conditions ----------------------- 18
7. Tape & Reel ----------------------- 19
8. Label Structure ----------------------- 21
9. Packing Structure ----------------------- 22
10. Precautions in Handling & Use ----------------------- 25
3
1. Characteristics
a) Absolute Maximum Rating
Item Symbol Rating Unit Condition
Ambient / Operating Temperature Ta -40 ~ +85 ℃ -
Storage Temperature Tstg -40 ~ +120 ℃ -
LED Junction Temperature Tj 110 ℃ -
Forward Current IF 200 mA -
Pulse Forward Current IFP 300 mA Duty 1/10, pulse width 10ms
Assembly Process Temperature - 260
<10
℃
s -
ESD (HBM) - 5 kV -
b) Electro-optical Characteristics (IF = 65 mA, Ts = 25
℃
)
Item Unit Rank Bin Min. Typ. Max.
Forward Voltage (VF) V XA
AY 2.6 - 2.7
AZ 2.7 - 2.8
A1 2.8 - 2.9
Reverse Voltage
(@ 5 mA) V 0.7 - 1.2
Color Rendering Index (R a) - 80 - -
Thermal Resistance
(junction to solder point) ℃/W - 7.5 -
Beam Angle ￮ - 120 -
Note:
Samsung maintains measurement tolerance of: forward voltage = ±0.1 V, luminous flux = ±5 %, CRI = ±3
4
c) Electro-optical Characteristics (IF = 65 mA, Ts= 25
℃
)
Item CRI Nominal
CCT (K)
SH SJ SK
SL
SM
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
32 34 34 36 36 38 38 40 40 42
Luminous
Flux (Φv) 80
2700
3000
3500
4000
5000
5700
6500
Note:
Samsung maintains measurement tolerance of: forward voltage = ±0.1V, luminous flux = ±5 %, CRI = ±3
5
2. Product Code Information
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
S P M W H D 3 2 A M D 5 X A R 0 S 0
Digit PKG Information Code Specification
1 2 3 Samsung Package Middle Power SPM
4 5 Color WH White
6 Product Version D Dispensing
7 8 9 Form Factor 32A 3.0 x 3.0 x 0.7 mm; 2 pads;
10 Sorting Current (mA) M 65 mA
11 Chromaticity Coordinates D ANSI Standard, MacAdam 3 step ellipse bin, MacAdam 5 step ellipse bin
12 CRI 5 Min. 80
13 14 Forward Voltage (V) XA
2.6~2.9 Bin
Code:
AY
2.6~2.7
AZ
2.7~2.8
A1
2.8~2.9
15 16 CCT (K)
W● 2700
Bin
Code
:
WF, WG, WH, WJ, WK, WL, WM, W3
V● 3000
U● 3500
T● 4000
R● 5000
RG, RH, RJ, RK, RL, RM, R3
Q● 5700
P● 6500
● : "0" (Whole bin) "3" (MacAdam 3-step ellipse bin) or "K” (K Kitting) or “S” (S Kitting)
17 18 Luminous Flux
S0
SH
SJ
SK
SL
Bin
Code:
SH, SJ, SK, SL, SM
SH
SJ
SK
SL
6
a) Luminous Flux Bins(IF = 65 mA, Ts= 25
℃
)
CRI (Ra)
Min.
Nominal CCT
(K) Product Code Flux Bin Flux Range
(Φv, lm)
80
2700
SPMWHD32AMD5XAW●S0
SH
32.0~34.0
SJ
34.0 ~36.0
SK
36.0 ~38.0
SPMWHD32AMD5XAW●SJ
SJ
34.0 ~36.0
3000
SPMWHD32AMD5XAV●S0
SJ
34.0 ~36.0
SK
36.0 ~38.0
SL
38.0 ~ 40.0
SPMWHD32AMD5XAV●SK
SK
36.0 ~38.0
3500
SPMWHD32AMD5XAU●S0
SJ
34.0 ~36.0
SK
36.0 ~38.0
SL
38.0 ~ 40.0
SPMWHD32AMD5XAU●SL
SL
38.0 ~ 40.0
4000
SPMWHD32AMD5XAT●S0
SK
36.0 ~38.0
SL
38.0 ~ 40.0
SM
40.0 ~ 42.0
SPMWHD32AMD5XAT●SL
SL
38.0 ~ 40.0
5000
SPMWHD32AMD5XAR●S0
SK
36.0 ~38.0
SL
38.0 ~ 40.0
SM
40.0 ~ 42.0
SPMWHD32AMD5XAR●SL
SL
38.0 ~ 40.0
5700
SPMWHD32AMD5XAQ●S0
SK
36.0 ~38.0
SL
38.0 ~ 40.0
SM
40.0 ~ 42.0
SPMWHD32AMD5XAQ●SL
SL
38.0 ~ 40.0
6500
SPMWHD32AMD5XAP●S0
SK
36.0 ~38.0
SL
38.0 ~ 40.0
SM
40.0 ~ 42.0
SPMWHD32AMD5XAP●SL
SL
38.0 ~ 40.0
Note:
"●" can be "0" (Whole bin), "3" (MacAdam 3-step ellipse bin), "K" (K Kitting) or “S” (S Kitting) of the color binning
7
b) Kitting Rule
1) S Kitting Bin Concept
1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply kitting bin (VF, Color, lm).
2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY), (AZ+AZ) or (A1+A1)
3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting simulation)
4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ), (SJ+SJ), (SJ+SK), (SK+SK), (SK+SL), (SL+SL),
(SL+SM) or (SM+SM)
[Kitting example]
[Binning Information]
Bin #1
Bin #2
Remark
VF
AY
AY
AZ
AZ
A1
A1
CIE
A
G
C
E
D
F
B
H
E
G
F
H
MacA. 3step(A, B, C, D)
MacA. 3step(A, B, C, D)
IV
SH
SH
SH
SJ
SJ
SJ
SJ
SK
SK
SK
SK
SL
SL
SL
SL
SM
SM
SM
8
2) K Kitting Bin Concept
1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply kitting bin (VF, Color, lm).
2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY), (AY+AZ), (AZ+AZ), (AZ+A1) or (A1+A1)
3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting simulation)
4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ), (SJ+SJ), (SJ+SK), (SK+SK), (SK+SL), (SL+SL),
(SL+SM) or (SM+SM)
[Kitting example]
[Binning Information]
Bin #1
Bin #2
Remark
VF
AY
AY
AY
AZ
AZ
AZ
AZ
A1
A1
A1
CIE
H
K
F
M
E
L
G
J
E
G
F
H
MacA. 3step(A, B, C, D)
MacA. 3step(A, B, C, D)
IV
SH
SH
SH
SJ
SJ
SJ
SJ
SK
SK
SK
SK
SL
SL
SL
SL
SM
SM
SM
9
c) Color Bins (IF = 65 mA, Ts= 25
℃
)
min. CRI
Nominal CCT (K)
Product Code
Color Rank
Chromaticity Bins
80
2700
SPMWHD32AMD5XAW0S★ W0 Whole bin
WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK,
WL, WM
SPMWHD32AMD5XAW3S★
W3 MacAdam 3-step ellipse bin WA, WB, WC, WD
SPMWHD32AMD5XAWSS
★
WS S Kitting WA, WB, WC, WD, WE, WF, WG, WH,
SPMWHD32AMD5XAWKS★ WK K Kitting
WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK,
WL, WM
3000
SPMWHD32AMD5XAV0S★ V0 Whole bin
VA, VB, VC, VD, VE, VF, VG, VH,
VJ, VK, VL, VM
SPMWHD32AMD5XAV3S★
V3 MacAdam 3-step ellipse bin VA, VB, VC, VD
SPMWHD32AMD5XAVSS
★
VS S Kitting VA, VB, VC, VD, VE, VF, VG, VH
SPMWHD32AMD5XAVKS★ VK K Kitting
VA, VB, VC, VD, VE, VF, VG, VH,
VJ, VK, VL, VM
3500
SPMWHD32AMD5XAU0S★ U0 Whole bin
UA, UB, UC, UD, UE, UF, UG, UH,
UJ, UK, UL, UM
SPMWHD32AMD5XAU3S★
U3 MacAdam 3-step ellipse bin UA, UB, UC, UD
SPMWHD32AMD5XAUSS★
US S Kitting UA, UB, UC, UD, UE, UF, UG, UH
SPMWHD32AMD5XAUKS★ UK K Kitting
UA, UB, UC, UD, UE, UF, UG, UH,
UJ, UK, UL, UM
4000
SPMWHD32AMD5XAT0S★ T0 Whole bin
TA, TB, TC, TD, TE, TF, TG, TH,
TJ, TK, TL, TM
SPMWHD32AMD5XAT3S★
T3 MacAdam 3-step ellipse bin TA, TB, TC, TD
SPMWHD32AMD5XATSS★
TS S Kitting TA, TB, TC, TD, TE, TF, TG, TH
SPMWHD32AMD5XATKS★ TK K Kitting
TA, TB, TC, TD, TE, TF, TG, TH,
TJ, TK, TL, TM
5000
SPMWHD32AMD5XAR0S★ R0 Whole bin
RA, RB, RC, RD, RE, RF, RG, RH
RJ,RK,RL,RM
SPMWHD32AMD5XAR3S
★
R3 MacAdam 3-step ellipse bin RA, RB, RC, RD
SPMWHD32AMD5XARSS★
RS S Kitting RA, RB, RC, RD, RE, RF, RG, RH
SPMWHD32AMD5XARKS★ RK K Kitting
RA, RB, RC, RD, RE, RF, RG, RH
RJ,RK,RL,RM
5700
SPMWHD32AMD5XAQ0S★ Q0 Whole bin
QA, QB, QC, QD, QE, QF, QG, QH
QJ,QK,QL,QM
SPMWHD32AMD5XAQ3S
★
Q3 MacAdam 3-step ellipse bin QA, QB, QC, QD
SPMWHD32AMD5XAQSS★
QS S Kitting QA, QB, QC, QD, QE, QF, QG, QH
SPMWHD32AMD5XAQKS★ QK K Kitting
QA, QB, QC, QD, QE, QF, QG, QH
QJ,QK,QL,QM
6500
SPMWHD32AMD5XAP0S★ P0 Whole bin
PA, PB, PC, PD, PE, PF, PG, PH,
PJ,PK,PL,PM
SPMWHD32AMD5XAP3S★
P3 MacAdam 3-step ellipse bin PA, PB, PC, PD
SPMWHD32AMD5XAPSS★
PS S Kitting PA, PB, PC, PD, PE, PF, PG, PH
SPMWHD32AMD5XAPKS★ PK K Kitting
PA, PB, PC, PD, PE, PF, PG, PH,
PJ,PK,PL,PM
"★" can be "0", "H", "J", "K" or “L” of the luminous flux
10
d) Voltage Bins (IF = 65 mA, Ts = 25
℃
)
CRI (Ra)
Min.
Nominal CCT
(K) Product Code Voltage Rank Voltage Bin Voltage Range
(V)
- - - XA
AY 2.6 ~ 2.7
AZ 2.7 ~ 2.8
A1 2.8 ~ 2.9
11
e) Chromaticity Region & Coordinates (IF = 65 mA, Ts = 25
℃
)
12
f) Chromaticity Region & Coordinates (IF = 65 mA, Ts = 25
℃
)
MacAdam Ellipse (W3, W5) MacAdam Ellipse (V3, V5)
Step CIE x CIE y θ a b Step CIE x CIE y θ a b
3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041
5-step 0.4578 0.4101 53.70 0.01350 0.00700 5-step 0.4338 0.4030 53.22 0.01390 0.00680
MacAdam Ellipse (U3, U5) MacAdam Ellipse (T3, T5)
Step CIE x CIE y θ a b Step CIE x CIE y θ a b
3-step 0.4073 0.3917 54.00 0.00927 0.00414 3-step 0.3818 0.3797 53.72 0.00939 0.00402
5-step 0.4073 0.3917 54.00 0.01545 0.00690 5-step 0.3818 0.3797 53.72 0.01565 0.00670
MacAdam Ellipse (R3,R5) MacAdam Ellipse (Q3, Q5)
Step CIE x CIE y θ a b Step CIE x CIE y θ a b
3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.09 0.00746 0.00320
5-step 0.3447 0.3553 59.62 0.01370 0.00590 5-step 0.3287 0.3417 59.09 0.01243 0.00533
MacAdam Ellipse (P3, P5)
Step CIE x CIE y θ a b
3-step 0.3123 0.3282 58.57 0.00669 0.00285
5-step 0.3123 0.3282 58.57 0.01115 0.00475
Note:
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
CIE x,y
13
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 65 mA, Ts = 25℃)
CCT : 2700K (80 CRI) CCT : 3000K (80 CRI)
CCT : 3500K (80 CRI) CCT : 4000K (80 CRI)
CCT : 5000K (80 CRI) CCT : 5700K (80 CRI)
14
CCT : 6500K (80 CRI)
b) Forward Current Characteristics (Ts = 25℃)
c) Temperature Characteristics (IF = 65 mA)
15
d) Color Shift Characteristics, Ts = 25℃, IF = 65 mA
e) Derating Curve f) Beam Angle Characteristics (Ts = 25℃, IF = 65 mA)
16
4. Outline Drawing & Dimension
Notes:
1) This LED has built-in ESD protection device(s) connected in parallel to LED chip(s).
2) Ts point and measurement method:
① Measure one point at the cathode pad, if necessary remove PSR of PCB to reach Ts point.
② All pads must be soldered to the PCB to dissipate heat properly, otherwise the LED can be damaged.
Precautions:
1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do
not put stress on the LEDs during heating.
2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be
carefully checked before and after such repair.
3) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause
catastrophic failure of the LEDs.
17
5. Reliability Test Items & Conditions
a) Test Items
Test Item Test Condition Test
Hour / Cycle Sample No.
Room Temperature
Life Test 25℃, DC 200 mA 1000 h 22
High Temperature
Life Test 85℃, DC 200 mA 1000 h 22
High Temperature
Humidity Life Test 85℃, 85 % RH, DC 200 mA 1000 h 22
Low Temperature
Life Test -40℃, DC 200 mA 1000 h 22
Powered Temperature
Cycle Test
-40 ℃ ~ 85℃, each 10 min, On/Off 5min ,
Temp. Change Time 20min, DC 200 mA
100 cycles 22
Thermal Cycle -45℃ / 15 min ↔ 125℃ / 15 min
→ Hot plate 180℃
500 cycles 100
High Temperature
Storage 120℃ 1000 h 11
Low Temperature
Storage -40℃ 1000 h 11
ESD (HBM)
R
1
: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±5 kV
5 times 30
ESD (MM)
R
1
: 10 MΩ
R2: 0
C: 200 pF
V: ±0.5 kV
5 times 30
Vibration Test 20~2000~20 Hz, 200 m/s
2
, sweep 4 min
X, Y, Z 3 direction, each 1 cycle 4 cycles 11
Mechanical Shock Test 1500 g, 0.5 ms
3 shocks each X-Y-Z axis 5 cycles 11
b) Criteria for Judging the Damage
Item Symbol Test Condition
(Ts = 25℃)
Limit
Min
Max
Forward Voltage VF IF = 65 mA Init. Value * 0.9 Init. Value * 1.1
Luminous Flux Φv IF = 65 mA Init. Value * 0.7 Init. Value * 1.1
18
6. Soldering Conditions
a) Reflow Conditions (Pb free)
Reflow frequency: 2 times max.
b) Manual Soldering Conditions
Not more than 5 seconds @ max. 300℃, under soldering iron.
19
7. Tape & Reel
a) Taping Dimension
(unit: mm)
Taping Direction
500 mm
500 mm
20
b) Reel Dimension
(unit: mm)
Notes:
1) Quantity: The quantity/reel is 4,000 pcs
2) Cumulative Tolerance: Cumulative tolerance / 10 pitches is ±0.2 mm
3) Adhesion Strength of Cover Tape: Adhesion strength is 0.1-0.7 N when the cover tape is turned off from the carrier tape at 10° angle
to the carrier tape
4) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag
21
AZRASL
SPMWHD32AMD5XAR0S0 AZRASG 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAYC4001 / I001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Bin Code
Product Code
Lot Number
AZRASL
SPMWHD32AMD5XAR0S0 AZRASG 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SPMWHD32AMD7XA★SS0
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 4,000 pcs QUANITY : 8,000
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94002 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
8. Label Structure
a) Label Structure
Note: Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ: Forward Voltage bin (refer to page 8)
ⓒⓓ: Chromaticity bin (refer to page 10-13)
ⓔⓕ: Luminous Flux bin (refer to page 8)
b) Lot Number
The lot number is composed of the following characters:
①②③③②③④⑤⑥⑦⑧⑨
/ Iⓐⓑⓒ / 4,000 pcs
①②
: Production site (GL: Tianjin, China, G4: Guangzhou, China)
※ Sample product (SL: Kiheung, Korea)
③
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
④
: Year (Z: 2015, A: 2016, B: 2017…)
⑤
: Month (1~9, A, B, C)
⑥
: Day (1~9, A, B~V)
⑦⑧⑨
: Serial number (001 ~ 999)
ⓐⓑⓒ
: Product serial number (001 ~ 999)
ⓐⓑⓒⓓⓔⓕ
22
AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAYC4001 / 1001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAYC4001 / 1001 / 40,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAYC4001 / 1001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
9. Packing Structure
a) Packing Process (The quantity of PKG on the Reel to be Max 4,000pcs)
Material: Paper (SW3B(B))
Type
Size (mm)
Note
L
W
H
7 inch L 245 ± 5 220 ± 5 182 ± 5 Up to 10 reels
7 inch S 245 ± 5 220 ± 5 86 ± 5 Up to 5 reels
Reel
Aluminum Vinyl Packing Bag
Outer Box
LED
①
H
W
L
① Side Label
23
AY★DSK
SPMWHD32AMD5XA★SS0 A Y ★DSK 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AY★DSK
SPMWHD32AMD5XA★SS0 A Y ★DSK 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AY★FSK
SPMWHD32AMD5XA★SS0 AY★FSK 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94002 / 1001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AY★FSK
SPMWHD32AMD5XA★SS0 AY★FSK 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94002 / 1001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AY★DSK
SPMWHD32AMD5XA★SS0 AY ★DSK 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 40,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
[BOX Label]
AY★FSK
SPMWHD32AMD5XA★SS0 AY ★FSK 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 40,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
[BOX Label]
SPMWHD32AMD5XA★SS0
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 4,000 pcs QUANITY : 8,000
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94002 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
b) Packing Process for kitting (The quantity of PKG on the Reel to be Max 4,000pcs)
Material: Paper (SW3B(B))
Type
Size (mm)
Note
L
W
H
7 inch L 245 ± 5 220 ± 5 182 ± 5 Up to 10 reels
Reel
Kitting ‘A’
Kitting ‘A’
Kitting ‘B’
Aluminum Vinyl Packing Bag
Kitting ‘A’
Kitting ‘B’
Kitting ‘B’
Outer Box
Kitting ‘A’
Kitting ‘B’
Note: "★" can be Nominal CCT code.
A
B
A
B
A
B
A
B
A
B
LED
Kitting ‘B’ (back Side)
B
A
B
Kitting ‘B’ (Back Side)
①
H
W
L
24
c) Aluminum Vinyl Packing Bag
c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag
AZRASL
SPMWHD32AMD5XAR0S0 AZRASL 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAYC4001 / 1001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
25
10. Precautions in Handling & Use
1) For over-current protection, users are recommended to apply resistors connected in series with the LEDs to mitigate sudden change
of the forward current caused by shift of forward voltage.
2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is
recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device.
3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient
temperature and corresponding junction temperature.
4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from
Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 ºC,
0~90 % RH).
5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH*Note 1, or
b. Mounted within 24 hours (1 day) at an assembly line with a condition of more than 30 ºC / 70 % RH*Note 2, or
c. Stored at <10 % RH.
*Note 1, 2: IPC/JEDEC J-STD-033A, Recommended Equivalent Total Floor Life Table
6) Repack unused devices with anti-moisture packing, fold to close any opening and then store in a dry place.
7) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
8) Devices must be baked for 10~24 hours at 60 ± 5 ºC, if baking is required.
9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-electrostatic glove
when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even
destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered
turn-on voltage, or abnormal lighting of LEDs at low current.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires
(fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of
encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the
luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in
luminaires and they must be carefully selected.
11) Risk of sulfurization (or tarnishing)
The LED from Samsung uses a silver-plated lead frame and its surface color may change to black (or dark colored) when it is exposed
to sulfur (S), chlorine (Cl) or other halogen compound. Sulfurization of lead frame may cause intensity degradation, change of
chromaticity coordinates and, in extreme cases, open circuit. It requires caution. Due to possible sulfurization of lead frame, LED
should not be used and stored together with oxidizing substances made of materials such as rubber, plain paper, lead solder cream,
etc.
Legal and additional information.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies.
The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital
appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest
news, please visit the Samsung Newsroom at news.samsung.com.
Copyright © 2018 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand, product,
service names and logos are trademarks and/or registered trademarks of their
respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com