Product Family Data Sheet_Global Rev.4.1 18.08.24 Middle Power LED Series 3030 LM301B CRI 80 Features & Benefits * 0.3 W class middle power LED * Mold resin for high reliability * Standard form factor for design flexibility (3.0 x 3.0 mm) 1# 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 5 3. Typical Characteristics Graphs ----------------------- 13 4. Outline Drawing & Dimension ----------------------- 16 5. Reliability Test Items & Conditions ----------------------- 17 6. Soldering Conditions ----------------------- 18 7. Tape & Reel ----------------------- 19 8. Label Structure ----------------------- 21 9. Packing Structure ----------------------- 22 Precautions in Handling & Use ----------------------- 25 10. 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +85 - Storage Temperature T stg -40 ~ +120 - LED Junction Temperature Tj 110 - Forward Current IF 200 mA - Pulse Forward Current I FP 300 mA Duty 1/10, pulse width 10ms Assembly Process Temperature - 260 <10 s - ESD (HBM) - 5 kV - b) Electro-optical Characteristics (I F = 65 mA, Ts = 25) Item Forward Voltage (V F ) Unit V Rank XA Bin Min. Typ. Max. AY 2.6 - 2.7 AZ 2.7 - 2.8 A1 2.8 - 2.9 Reverse Voltage (@ 5 mA) V 0.7 - 1.2 Color Rendering Index (R a ) - 80 - - Thermal Resistance (junction to solder point) /W - 7.5 - Beam Angle - 120 - Note: Samsung maintains measurement tolerance of: forward voltage = 0.1 V, luminous flux = 5 %, CRI = 3 4 c) Electro-optical Characteristics (I F = 65 mA, T s = 25) SH Item CRI Nominal CCT (K) SJ SL SK Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 32 34 34 36 36 38 38 40 40 42 2700 3000 3500 Luminous Flux ( v ) 80 SM 4000 5000 5700 6500 Note: Samsung maintains measurement tolerance of: forward voltage = 0.1V, luminous flux = 5 %, CRI = 3 5 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P M W H D 3 2 A M D 5 X A R 0 S 0 Digit PKG Information Code Samsung Package Middle Power SPM Color WH Product Version D Form Factor 32A 10 Sorting Current (mA) M 65 mA 11 Chromaticity Coordinates D ANSI Standard, MacAdam 3 step ellipse bin, MacAdam 5 step ellipse bin 12 CRI 5 Min. 80 1 2 3 4 5 6 7 8 13 15 9 14 16 Forward Voltage (V) XA Specification White Dispensing 3.0 x 3.0 x 0.7 mm; 2.6~2.9 18 AY 2.6~2.7 AZ 2.7~2.8 A1 2.8~2.9 W 2700 WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM, W3 V 3000 VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM, V3 U 3500 UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM, U3 T 4000 R 5000 RA, RB, RC, RD, RE, RF, RG, RH, RJ, RK, RL, RM, R3 Q 5700 QA, QB, QC, QD, QE, QF, QG, QH, QJ, QK, QL, QM, Q3 P 6500 PA, PB, PC, PD, PE, PF, PG, PH, PJ, PK, PL, PM, P3 Bin Code: TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM, T3 CCT (K) 17 Bin Code: 2 pads; Luminous Flux : "0" (Whole bin) "3" (MacAdam 3-step ellipse bin) S0 SH, SJ, SK, SL, SM SH SH SJ Bin Code: SJ SK SK SL SL or "K" (K Kitting) or "S" (S Kitting) 6 a) Luminous Flux Bins(I F = 65 mA, T s = 25) CRI (R a ) Min. Nominal CCT (K) 2700 Product Code SPMWHD32AMD5XAWS0 SPMWHD32AMD5XAWSJ 3000 SPMWHD32AMD5XAVS0 SPMWHD32AMD5XAVSK 3500 SPMWHD32AMD5XAUS0 SPMWHD32AMD5XAUSL 80 4000 SPMWHD32AMD5XATS0 SPMWHD32AMD5XATSL 5000 SPMWHD32AMD5XARS0 SPMWHD32AMD5XARSL 5700 SPMWHD32AMD5XAQS0 SPMWHD32AMD5XAQSL 6500 SPMWHD32AMD5XAPS0 SPMWHD32AMD5XAPSL Flux Bin Flux Range ( v , lm) SH 32.0~34.0 SJ 34.0 ~36.0 SK 36.0 ~38.0 SJ 34.0 ~36.0 SJ 34.0 ~36.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SK 36.0 ~38.0 SJ 34.0 ~36.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SL 38.0 ~ 40.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SM 40.0 ~ 42.0 SL 38.0 ~ 40.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SM 40.0 ~ 42.0 SL 38.0 ~ 40.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SM 40.0 ~ 42.0 SL 38.0 ~ 40.0 SK 36.0 ~38.0 SL 38.0 ~ 40.0 SM 40.0 ~ 42.0 SL 38.0 ~ 40.0 Note: "" can be "0" (Whole bin), "3" (MacAdam 3-step ellipse bin), "K" (K Kitting) or "S" (S Kitting) of the color binning 7 b) Kitting Rule 1) S Kitting Bin Concept 1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply kitting bin (VF, Color, lm). 2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY), (AZ+AZ) or (A1+A1) 3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting simulation) 4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ), (SJ+SJ), (SJ+SK), (SK+SK), (SK+SL), (SL+SL), (SL+SM) or (SM+SM) [Kitting example] [Binning Information] VF CIE IV Bin #1 Bin #2 AY AY AZ AZ A1 A1 A G C E D F B H E G F H MacA. 3step(A, B, C, D) MacA. 3step(A, B, C, D) SH SH SH SJ SJ SJ SJ SK SK SK SK SL SL SL SL SM SM SM Remark 8 2) K Kitting Bin Concept 1. Under agreement between customer and SAMSUNG ELECTRONICS, SAMSUNG can supply kitting bin (VF, Color, lm). 2. A forward voltage (VF) of kitting bin is combined by a pair of same VF rank such as (AY+AY), (AY+AZ), (AZ+AZ), (AZ+A1) or (A1+A1) 3. A Chromaticity Coordinates of kitting bin is mixed by kitting procedure.(below kitting simulation) 4. A luminous flux(lm) of kitting bin is combined by a pair of IV rank such as (SH+SH), (SH+SJ), (SJ+SJ), (SJ+SK), (SK+SK), (SK+SL), (SL+SL), (SL+SM) or (SM+SM) [Kitting example] [Binning Information] VF CIE IV Bin #1 Bin #2 AY AY AY AZ AZ AZ AZ A1 A1 A1 H K F M E L G J E G F H MacA. 3step(A, B, C, D) MacA. 3step(A, B, C, D) SH SH SH SJ SJ SJ SJ SK SK SK SK SL SL SL SL SM SM SM Remark 9 c) Color Bins (I F = 65 mA, Ts= 25) min. CRI Nominal CCT (K) 2700 3000 3500 80 4000 5000 5700 6500 Product Code Color Rank Chromaticity Bins SPMWHD32AMD5XAW0S W0 Whole bin WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM SPMWHD32AMD5XAW3S W3 MacAdam 3-step ellipse bin WA, WB, WC, WD SPMWHD32AMD5XAWSS WS S Kitting WA, WB, WC, WD, WE, WF, WG, WH, SPMWHD32AMD5XAWKS WK K Kitting WA, WB, WC, WD, WE, WF, WG, WH, WJ, WK, WL, WM SPMWHD32AMD5XAV0S V0 Whole bin VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM SPMWHD32AMD5XAV3S V3 MacAdam 3-step ellipse bin VA, VB, VC, VD SPMWHD32AMD5XAVSS VS S Kitting VA, VB, VC, VD, VE, VF, VG, VH SPMWHD32AMD5XAVKS VK K Kitting VA, VB, VC, VD, VE, VF, VG, VH, VJ, VK, VL, VM SPMWHD32AMD5XAU0S U0 Whole bin UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM SPMWHD32AMD5XAU3S U3 MacAdam 3-step ellipse bin UA, UB, UC, UD SPMWHD32AMD5XAUSS US S Kitting UA, UB, UC, UD, UE, UF, UG, UH SPMWHD32AMD5XAUKS UK K Kitting UA, UB, UC, UD, UE, UF, UG, UH, UJ, UK, UL, UM SPMWHD32AMD5XAT0S T0 Whole bin TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM SPMWHD32AMD5XAT3S T3 MacAdam 3-step ellipse bin TA, TB, TC, TD SPMWHD32AMD5XATSS TS S Kitting TA, TB, TC, TD, TE, TF, TG, TH SPMWHD32AMD5XATKS TK K Kitting TA, TB, TC, TD, TE, TF, TG, TH, TJ, TK, TL, TM SPMWHD32AMD5XAR0S R0 Whole bin RA, RB, RC, RD, RE, RF, RG, RH RJ,RK,RL,RM SPMWHD32AMD5XAR3S R3 MacAdam 3-step ellipse bin RA, RB, RC, RD SPMWHD32AMD5XARSS RS S Kitting RA, RB, RC, RD, RE, RF, RG, RH SPMWHD32AMD5XARKS RK K Kitting RA, RB, RC, RD, RE, RF, RG, RH RJ,RK,RL,RM SPMWHD32AMD5XAQ0S Q0 Whole bin QA, QB, QC, QD, QE, QF, QG, QH QJ,QK,QL,QM SPMWHD32AMD5XAQ3S Q3 MacAdam 3-step ellipse bin QA, QB, QC, QD SPMWHD32AMD5XAQSS QS S Kitting QA, QB, QC, QD, QE, QF, QG, QH SPMWHD32AMD5XAQKS QK K Kitting QA, QB, QC, QD, QE, QF, QG, QH QJ,QK,QL,QM SPMWHD32AMD5XAP0S P0 Whole bin PA, PB, PC, PD, PE, PF, PG, PH, PJ,PK,PL,PM SPMWHD32AMD5XAP3S P3 MacAdam 3-step ellipse bin PA, PB, PC, PD SPMWHD32AMD5XAPSS PS S Kitting PA, PB, PC, PD, PE, PF, PG, PH SPMWHD32AMD5XAPKS PK K Kitting PA, PB, PC, PD, PE, PF, PG, PH, PJ,PK,PL,PM "" can be "0", "H", "J", "K" or "L" of the luminous flux 10 d) Voltage Bins (I F = 65 mA, T s = 25) CRI (R a ) Min. - Nominal CCT (K) - Product Code - Voltage Rank XA Voltage Bin Voltage Range (V) AY 2.6 ~ 2.7 AZ 2.7 ~ 2.8 A1 2.8 ~ 2.9 11 e) Chromaticity Region & Coordinates (I F = 65 mA, T s = 25) 12 f) Chromaticity Region & Coordinates (I F = 65 mA, T s = 25) CIE x,y MacAdam Ellipse (W3, W5) MacAdam Ellipse (V3, V5) Step CIE x CIE y a b Step CIE x CIE y a b 3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 5-step 0.4578 0.4101 53.70 0.01350 0.00700 5-step 0.4338 0.4030 53.22 0.01390 0.00680 Step CIE x CIE y a b Step CIE x CIE y a b 3-step 0.4073 0.3917 54.00 0.00927 0.00414 3-step 0.3818 0.3797 53.72 0.00939 0.00402 5-step 0.4073 0.3917 54.00 0.01545 0.00690 5-step 0.3818 0.3797 53.72 0.01565 0.00670 a b MacAdam Ellipse MacAdam Ellipse (U3, U5) MacAdam Ellipse (R3,R5) MacAdam Ellipse (T3, T5) (Q3, Q5) Step CIE x CIE y 3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.09 0.00746 0.00320 5-step 0.3447 0.3553 59.62 0.01370 0.00590 5-step 0.3287 0.3417 59.09 0.01243 0.00533 MacAdam Ellipse a b (P3, P5) Step CIE x CIE y a b 3-step 0.3123 0.3282 58.57 0.00669 0.00285 5-step 0.3123 0.3282 58.57 0.01115 0.00475 Note: Samsung maintains measurement tolerance of: Cx, Cy = 0.005 Step CIE x CIE y 13 3. Typical Characteristics Graphs a) Spectrum Distribution CCT : 2700K (80 CRI) CCT : 3500K (80 CRI) CCT : 5000K (80 CRI) (I F = 65 mA, T s = 25) CCT : 3000K (80 CRI) CCT : 4000K (80 CRI) CCT : 5700K (80 CRI) 14 CCT : 6500K (80 CRI) b) Forward Current Characteristics (T s = 25) c) Temperature Characteristics (I F = 65 mA) 15 d) Color Shift Characteristics, T s = 25, I F = 65 mA e) Derating Curve f) Beam Angle Characteristics (T s = 25, I F = 65 mA) 16 4. Outline Drawing & Dimension Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED chip(s). 2) T s point and measurement method: Measure one point at the cathode pad, if necessary remove PSR of PCB to reach T s point. All pads must be soldered to the PCB to dissipate heat properly, otherwise the LED can be damaged. Precautions: 1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LEDs characteristics should be carefully checked before and after such repair. 3) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs. 17 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle Sample No. Room Temperature Life Test 25, DC 200 mA 1000 h 22 High Temperature Life Test 85, DC 200 mA 1000 h 22 High Temperature Humidity Life Test 85, 85 % RH, DC 200 mA 1000 h 22 Low Temperature Life Test -40, DC 200 mA 1000 h 22 Powered Temperature Cycle Test -40 ~ 85, each 10 min, On/Off 5min , Temp. Change Time 20min, DC 200 mA 100 cycles 22 Thermal Cycle -45 / 15 min 125 / 15 min 500 cycles 100 Hot plate 180 High Temperature Storage 120 1000 h 11 Low Temperature Storage -40 1000 h 11 5 times 30 5 times 30 R1: R2: ESD (HBM) 1.5 k C: 100 pF V: 5 kV R1: 10 M R2: ESD (MM) 10 M C: V: 0 200 pF 0.5 kV 2 Vibration Test 20~2000~20 Hz, 200 m/s , sweep 4 min X, Y, Z 3 direction, each 1 cycle 4 cycles 11 Mechanical Shock Test 1500 g, 0.5 ms 3 shocks each X-Y-Z axis 5 cycles 11 b) Criteria for Judging the Damage Item Symbol Forward Voltage VF Luminous Flux v Limit Test Condition (Ts = 25) Min Max I F = 65 mA Init. Value * 0.9 Init. Value * 1.1 I F = 65 mA Init. Value * 0.7 Init. Value * 1.1 18 6. Soldering Conditions a) Reflow Conditions (Pb free) Reflow frequency: 2 times max. b) Manual Soldering Conditions Not more than 5 seconds @ max. 300, under soldering iron. 19 7. Tape & Reel a) Taping Dimension (unit: mm) Taping Direction 500 mm 500 mm 20 b) Reel Dimension (unit: mm) Notes: 1) Quantity: The quantity/reel is 4,000 pcs 2) Cumulative Tolerance: Cumulative tolerance / 10 pitches is 0.2 mm 3) Adhesion Strength of Cover Tape: Adhesion strength is 0.1-0.7 N when the cover tape is turned off from the carrier tape at 10 angle to the carrier tape 4) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag 21 8. Label Structure a) Label Structure AZRASL Bin Code SPMWHD32AMD5XAR0S0 AZRASG 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Product Code GLAYC4001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SPMWHD32AMD7XASS0 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 4,000 pcs QUANITY : 8,000 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII GLAW94002 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted bin code and product code above is only an example (see description on page 5) Bin Code: : Forward Voltage bin : Chromaticity bin : Luminous Flux bin (refer to page 8) (refer to page 10-13) (refer to page 8) b) Lot Number The lot number is composed of the following characters: AZRASL SPMWHD32AMD5XAR0S0 AZRASG 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /1/ 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / I / 4,000 pcs : : Product state : Year : Month : Day : Serial number (001 ~ 999) : Product serial number Production site (GL: Tianjin, China, G4: Guangzhou, China) Sample product (SL: Kiheung, Korea) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Z: 2015, A: 2016, B: 2017...) (1~9, A, B, C) (1~9, A, B~V) (001 ~ 999) 22 9. Packing Structure a) Packing Process (The quantity of PKG on the Reel to be Max 4,000pcs) Reel AZRASL SPMWHD32AMD5XAR0S0 AZRASL 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAYC4001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Aluminum Vinyl Packing Bag AZRASL SPMWHD32AMD5XAR0S0 AZRASL 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAYC4001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Outer Box Material: Paper (SW3B(B)) Size (mm) Type Note L W H L 245 5 220 5 182 5 Up to 10 reels 7 inch S 245 5 220 5 86 5 Up to 5 reels 7 inch Side Label AZRASL SPMWHD32AMD5XAR0S0 AZRASL 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAYC4001 / 1001 / 40,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII H LED W L 23 b) Packing Process for kitting (The quantity of PKG on the Reel to be Max 4,000pcs) Reel Kitting `A' Kitting `B' Kitting `A' Kitting `B' AYFSK AYDSK SPMWHD32AMD5XASS0 AYDSK 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SPMWHD32AMD5XASS0 AYFSK 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94002 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Aluminum Vinyl Packing Bag Kitting `A' Kitting `B' AYFSK AYDSK SPMWHD32AMD5XASS0 AYDSK 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SPMWHD32AMD5XASS0 AYFSK 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94002 / 1001 / 4,000 pcs GLAW94001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Kitting `B' (back Side) SPMWHD32AMD5XASS0 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 4,000 pcs QUANITY : 8,000 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII A GLAW94002 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII B Kitting `B' (Back Side) B Outer Box Kitting `B' Kitting `A' AYFSK AYDSK SPMWHD32AMD5XASS0 AYDSK 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SPMWHD32AMD5XASS0 AYFSK 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 40,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 40,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII A B [BOX Label] [BOX Label] A B A B A B A B Note: "" can be Nominal CCT code. Material: Paper (SW3B(B)) Type 7 inch L Size (mm) L W H 245 5 220 5 182 5 Note H LED W Up to 10 reels L 24 c) Aluminum Vinyl Packing Bag AZRASL SPMWHD32AMD5XAR0S0 AZRASL 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAYC4001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag 25 10. Precautions in Handling & Use 1) For over-current protection, users are recommended to apply resistors connected in series with the LEDs to mitigate sudden change of the forward current caused by shift of forward voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient temperature and corresponding junction temperature. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 C, 0~90 % RH). 5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: Note 1 a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 C / 60 % RH* , or Note 2 b. Mounted within 24 hours (1 day) at an assembly line with a condition of more than 30 C / 70 % RH* , or c. Stored at <10 % RH. *Note 1, 2: IPC/JEDEC J-STD-033A, Recommended Equivalent Total Floor Life Table 6) Repack unused devices with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading is >60 % at 23 5 C. 8) Devices must be baked for 10~24 hours at 60 5 C, if baking is required. 9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) Risk of sulfurization (or tarnishing) The LED from Samsung uses a silver-plated lead frame and its surface color may change to black (or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other halogen compound. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials such as rubber, plain paper, lead solder cream, etc. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com. Copyright (c) 2018 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com