INTEGRATED CIRCUITS DATA SHEET 74LVC139 Dual 2-to-4 line decoder/demultiplexer Product specification Supersedes data of 2003 May 19 2004 Mar 15 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 FEATURES DESCRIPTION * Wide supply voltage range from 1.2 V to 3.6 V The 74LVC139 is a high-performance, low-voltage and low-power Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. * Inputs accept voltages up to 5.5 V * CMOS low power consumption The 74LVC139 is a dual 2-to-4 line decoder/demultiplexer. This device has two independent decoders, each accepting two binary weighted inputs (nA0 and nA1) and providing four mutually exclusive active LOW outputs (nY0 to nY3). Each decoder has an active LOW input (nE). * Direct interface with TTL levels * Demultiplexing capability * Two independent 2-to-4 decoders * Multifunction capability * Active LOW mutually exclusive outputs When nE is HIGH, every output is forced HIGH. The enable input can be used as the data input for a 1-to-4 demultiplexer application. * Output drive capability 50 transmission lines at 125 C * In accordance with JEDEC standard no. 8-1A * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPHL/tPLH PARAMETER CONDITIONS propagation delay TYPICAL UNIT CL = 50 pF; VCC = 3.3 V nA to nYn 2.9 ns nE to nYn 2.7 ns CI input capacitance 5.0 pF CPD power dissipation capacitance per multiplexer VCC = 3.3 V; notes 1 and 2 17 pF Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC. 2004 Mar 15 2 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 FUNCTION TABLE See note 1 INPUT OUTPUT nE nA0 nA1 nY0 nY1 nY2 nY3 H X X H H H H L L L L H H H L H L H L H H L L H H H L H L H H H H H L Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care. ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE 74LVC139D -40 C to +125 C 16 SO16 plastic SOT109-1 74LVC139DB -40 C to +125 C 16 SSOP16 plastic SOT338-1 74LVC139PW -40 C to +125 C 16 TSSOP16 plastic SOT403-1 74LVC139BQ -40 C to +125 C 16 DHVQFN16 plastic SOT763-1 2004 Mar 15 3 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 PINNING PIN SYMBOL DESCRIPTION 1 1E enable input (active LOW) 2 1A0 address input 3 1A1 address input 4 1Y0 output (active LOW) 5 1Y1 output (active LOW) 6 1Y2 output (active LOW) 7 1Y3 output (active LOW) 8 GND ground (0 V) 9 2Y3 output (active LOW) 10 2Y2 output (active LOW) 11 2Y1 output (active LOW) 12 2Y0 output (active LOW) 13 2A1 address input 14 2A0 address input 15 2E enable input (active LOW) 16 VCC positive supply voltage 1E 1 16 VCC 1A0 2 15 2E 1A1 3 14 2A0 1Y0 4 13 2A1 1Y1 5 1Y2 6 11 2Y1 1Y3 7 10 2Y2 GND 8 9 139 1E VCC 1 16 1A0 2 15 2E 1A1 3 14 2A0 1Y0 4 13 2A1 GND(1) 12 2Y0 2Y3 1Y1 5 12 2Y0 1Y2 6 11 2Y1 1Y3 7 10 2Y2 mna778 Top view 8 9 GND 2Y3 mna972 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig.1 Pin configuration SO16 and (T)SSOP16. 2004 Mar 15 Fig.2 Pin configuration DHVQFN16. 4 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 1 handbook, halfpage 2 1E 1Y0 2 3 1A0 1Y1 1A1 1Y2 1Y3 2Y0 14 13 74LVC139 2A0 2Y1 2A1 2Y2 2Y3 4 3 5 1 3 6 7 12 14 11 13 10 15 DX 0 0 1 G 3 1 2 0 3 9 2E 15 DX 0 0 1 G 3 1 2 0 4 5 6 7 3 1A1 1 1E 14 2A0 13 2A1 DECODER 11 10 9 4 1Y1 5 1Y2 6 1Y3 7 2Y1 11 2Y2 10 9 2E mna780 Fig.5 Functional diagram. 2004 Mar 15 14 13 15 2 EN 3 X/Y 0 1 1 2 2 EN 3 (b) b) decoder. Fig.4 Logic symbol (IEEE/IEC). 1Y0 2Y3 15 2 mna779 2Y0 12 DECODER 1 1 (a) Fig.3 Logic symbol. 1A0 3 X/Y 0 1 12 a) demultiplexer. 2 2 5 4 5 6 7 12 11 10 9 MNA781 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER supply voltage CONDITIONS MIN. MAX. UNIT for maximum speed performance 2.7 3.6 V for low-voltage applications 1.2 3.6 V 0 5.5 V VI input voltage VO output voltage 0 VCC V Tamb operating ambient temperature in free air -40 +125 C tr, tf input rise and fall times VCC = 1.2 V to 2.7 V 0 20 ns/V VCC = 2.7 V to 3.6 V 0 10 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. -0.5 MAX. VCC supply voltage IIK input diode current VI < 0 - -50 mA VI input voltage note 1 -0.5 +6.5 V IOK output diode current VO > VCC or VO < 0 V - 50 mA VO output voltage note 1 -0.5 VCC + 0.5 V IO output source or sink current VO = 0 V to VCC - 50 mA ICC, IGND VCC or GND current - 100 mA Tstg storage temperature -65 +150 C Ptot power dissipation - 500 mW Tamb = -40 C to +125 C; note 2 +6.5 UNIT Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO16 packages: above 70 C derate linearly with 8 mW/K. For SSOP16 and TSSOP16 packages: above 60 C derate linearly with 5.5 mW/K. For DHVQFN16 packages: above 60 C derate linearly with 4.5 mW/K. 2004 Mar 15 6 V Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER TYP.(1) MIN. OTHER MAX. UNIT VCC (V) Tamb = -40 C to +85 C HIGH-level input voltage 1.2 VCC - - V 2.7 to 3.6 2.0 - - V VIL LOW-level input voltage 1.2 - - GND V 2.7 to 3.6 - - 0.8 V VOH HIGH-level output voltage IO = -100 A 2.7 to 3.6 VCC - 0.2 - - V IO = -12 mA 2.7 VCC - 0.5 - - V IO = -18 mA 3.0 VCC - 0.6 - - V IO = -24 mA 3.0 VCC - 0.8 - - V IO = 100 A 2.7 to 3.6 - - 0.2 V IO = 12 mA 2.7 - - 0.4 V IO = 24 mA 3.0 - - 0.55 V VIH VOL LOW-level output voltage VI = VIH or VIL VI = VIH or VIL ILI input leakage current VI = 5.5 V or GND 3.6 - 0.1 5 A ICC quiescent supply current VI = VCC or GND; IO = 0 A 3.6 - 0.1 10 A ICC additional quiescent VI =VCC - 0.6 V; supply current per IO = 0 A input pin 2.7 to 3.6 - 5 500 A 2004 Mar 15 7 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 TEST CONDITIONS SYMBOL PARAMETER TYP.(1) MIN. OTHER MAX. UNIT VCC (V) Tamb = -40 C to +125 C VIH VIL VOH VOL HIGH-level input voltage 1.2 VCC - - V 2.7 to 3.6 2.0 - - V LOW-level input voltage 1.2 - - GND V 2.7 to 3.6 - - 0.8 V HIGH-level output voltage LOW-level output voltage VI = VIH or VIL IO = -100 A 2.7 to 3.6 VCC - 0.3 - - V IO = -12 mA 2.7 VCC - 0.65 - - V IO = -18 mA 3.0 VCC - 0.75 - - V IO = -24 mA 3.0 VCC - 1 - - V IO = 100 A 2.7 to 3.6 - - 0.3 V IO = 12 mA 2.7 - - 0.6 V IO = 24 mA 3.0 - - 0.8 V VI = VIH or VIL ILI input leakage current VI = 5.5 V or GND 3.6 - - 20 A ICC quiescent supply current VI = VCC or GND; IO = 0 A 3.6 - - 40 A ICC additional quiescent VI =VCC - 0.6 V; supply current per IO = 0 A input pin 2.7 to 3.6 - - 5000 A Note 1. Typical values are measured at VCC = 3.3 V and Tamb = 25 C. 2004 Mar 15 8 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns; CL = 50 pF; RL = 500 . TEST CONDITIONS SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC (V) WAVEFORMS Tamb = -40 C to +85 C; note 1 tPHL/tPLH tPHL/tPLH tsk(0) propagation delay nAn to Yn propagation delay nE to Yn skew - 14 2.7 1.0 3.5 6.3 ns 3.0 to 3.6 1.0 2.9(2) 5.3 ns - 14 - ns 2.7 1.0 3.1 5.4 ns 3.0 to 3.6 1.0 2.7(2) 5.0 ns 3.0 to 3.6 - - 1.0 ns - - - ns 1.0 - 8.0 ns see Figs 6 and 8 1.2 see Figs 7 and 8 1.2 note 3 - ns Tamb = -40 C to +125 C tPHL/tPLH propagation delay nAn to Yn see Figs 6 and 8 1.2 propagation delay nE to Yn see Figs 7 and 8 1.2 skew note 3 2.7 1.0 - 7.0 ns - - - ns 1.0 - 7.0 ns 3.0 to 3.6 1.0 - 6.5 ns 3.0 to 3.6 - - 1.5 ns 3.0 to 3.6 tPHL/tPLH tsk(0) 2.7 Notes 1. All typical values are measured at Tamb = 25 C. 2. This typical value is measured at VCC = 3.3 V and Tamb = 25 C. 3. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design. 2004 Mar 15 9 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 AC WAVEFORMS VI VM nAn input GND t PHL t PLH VOH VM nYn output VOL mna782 VM = 1.5 V at VCC 2.7 V. VM = 0.5 x VCC at VCC < 2.7 V. VOL and VOH are the typical output voltage drop that occur with the output load.s Fig.6 Input (nAn) to output (nYn) propagation delays. VI VM nE input GND tPHL tPLH VOH VM nYn output VOL mna783 VM = 1.5 V at VCC 2.7 V. VM = 0.5 x VCC at VCC < 2.7 V. VOL and VOH are the typical output voltage drop that occur with the output load. Fig.7 Enable input (nE) to output (nYn) propagation delays. 2004 Mar 15 10 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 VEXT VCC PULSE GENERATOR VI RL VO D.U.T. CL RT RL mna616 VCC VI CL RL VEXT tPLH/tPHL tPZH/tPHZ tPZL/tPLZ 1.2 V VCC 50 pF 500 (1) open GND 2 x VCC 2.7 V 2.7 V 50 pF 500 open GND 2 x VCC 3.0 V to 3.6 V 2.7 V 50 pF 500 open GND 2 x VCC Note 1. The circuit performs better when RL = 1000 . Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.8 Load circuitry for switching times. 2004 Mar 15 11 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 2004 Mar 15 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 12 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.00 0.55 8 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 2004 Mar 15 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 13 o Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 2004 Mar 15 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 14 o Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 7 y y1 C v M C A B w M C b L 1 8 16 9 Eh e 15 10 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 3.6 3.4 2.15 1.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 2.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT763-1 --- MO-241 --- 2004 Mar 15 15 EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Philips Semiconductors Product specification Dual 2-to-4 line decoder/demultiplexer 74LVC139 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Mar 15 16 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA76 (c) Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R20/04/pp17 Date of release: 2004 Mar 15 Document order number: 9397 750 12971