M74HC4060M1R - STMICROELECTRONICS

1. General description

The 74HC4060; 74HCT4060 are high-speed Si-gate CMOS device and is pin compatible

with the HEF4060.

The 74HC4060; 74HCT4060 are 14-stage ripple-carry counter/dividers and oscillators

with three oscillator terminals (RS, RTC and CTC), ten buffered outputs (Q3 to Q9 and

Q11 to Q13) and an overriding asynchronous master reset (MR). The oscillator

conﬁguration allows design of either RC or crystal oscillator circuits. The oscillator may be

replaced by an external clock signal at input RS. In this case keep the other oscillator pins

(RTC and CTC) ﬂoating. The counter advances on the negative-going transition of RS. A

HIGH level on MR resets the counter (Q3 to Q9 and Q11 to Q13 = LOW), independent of

other input conditions. In the HCT version, the MR input is TTL compatible, but the RS

input has CMOS input switching levels and can be driven by a TTL output by using a

pull-up resistor to VCC.

2. Features

nAll active components on chip

nRC or crystal oscillator conﬁguration

nComplies with JEDEC standard no. 7 A

nESD protection:

uHBM JESD22-A114E exceeds 2000 V

uMM JESD22-A115-A exceeds 200 V

nMultiple package options

nSpeciﬁed from −40 °Cto+85°C and from −40 °C to +125 °C

3. Applications

nControl counters

nTimers

nFrequency dividers

nTime-delay circuits

74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Rev. 03 — 14 July 2008 Product data sheet

Product data sheet Rev. 03 — 14 July 2008 2 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

4. Ordering information

5. Functional diagram

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74HC4060N −40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4

74HCT4060N

74HC4060D −40 °C to +125 °C SO16 plastic small outline package; 16 leads;

body width 3.9 mm SOT109-1

74HCT4060D

74HC4060DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads;

body width 5.3 mm SOT338-1

74HCT4060DB

74HC4060PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads;

body width 4.4 mm SOT403-1

74HC4060BQ −40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal-enhanced

very thin quad ﬂat package; no leads; 16 terminals;

body 2.5 ×3.5 × 0.85 mm

SOT763-1

74HCT4060BQ

Fig 1. Logic symbol

Q11

RTC

001aai467

Q12 2

Q13 3

CTC

Product data sheet Rev. 03 — 14 July 2008 3 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Fig 2. IEC logic symbol

CTR14

(b)

9CT = 0

001aai468

13 3

AND

CTR14

(a)

9CT = 0

13 3

RCX

Fig 3. Functional diagram

001aai113

910

RTC CTC

14-STAGE BINARY COUNTER

Q11

Q12

Q13

Fig 4. Logic diagram

001aai114

CTC

RTC

MR Q

MR Q13

Q11Q9Q3

MR Q

Product data sheet Rev. 03 — 14 July 2008 4 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

6. Pinning information

6.1 Pinning

6.2 Pin description

(1) The die substrate is attached to this pad using

conductive die attach material. It cannot be used as

supply pin or input.

Fig 5. Pin conﬁguration DIP16, SO16 and (T)SSOP16 Fig 6. Pin conﬁguration DHVQFN16

74HC4060

74HCT4060

Q11 VCC

Q12 Q9

Q13 Q7

Q5 Q8

Q4 MR

Q6 RS

Q3 RTC

GND CTC

001aai115

001aai469

74HC4060

74HCT4060

Q3 RTC

Q6 RS

Q4 MR

Q5 Q8

Q13 Q7

Q12 Q9

GND

CTC

Q11

VCC

Transparent top view

7 10

6 11

5 12

4 13

3 14

2 15

terminal 1

index area

VCC(1)

Table 2. Pin description

Symbol Pin Description

Q11 to Q13 1, 2, 3 counter output

Q3 to Q9 7, 5, 4, 6, 14, 13, 15 counter output

GND 8 ground (0 V)

CTC 9 external capacitor connection

RTC 10 external resistor connection

RS 11 clock input /oscillator pin

MR 12 master reset input (active HIGH)

VCC 16 supply voltage

Product data sheet Rev. 03 — 14 July 2008 5 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

7. Functional description

8. Limiting values

Fig 7. Timing diagram

001aai117

Q11

Q12

Q13

12481632641282565121024 2048 4096 8192 16384

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.5 +7 V

IIK input clamping current VI < −0.5 V or VI>V

CC + 0.5 V [1] -±20 mA

IOK output clamping current VO<−0.5 V or VO>V

CC + 0.5 V [1] -±20 mA

IOoutput current −0.5 V < VO < VCC + 0.5 V - ±25 mA

ICC supply current - 50 mA

IGND ground current −50 - mA

Tstg storage temperature −65 +150 °C

Product data sheet Rev. 03 — 14 July 2008 6 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] Ptot derates linearly with 12 mW/K above 70 °C.

[3] Ptot derates linearly with 8 mW/K above 70 °C.

[4] Ptot derates linearly with 5.5 mW/K above 60 °C.

[5] Ptot derates linearly with 4.5 mW/K above 60 °C.

9. Recommended operating conditions

10. Static characteristics

Ptot total power dissipation Tamb = −40 °C to +125 °C

DIP16 package [2] - 750 mW

SO16 package [3] - 500 mW

(T)SSOP16 package [4] - 500 mW

DHVQFN16 package [5] - 500 mW

Table 3. Limiting values

…continued

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

Table 4. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V)

Symbol Parameter Conditions 74HC4060 74HCT4060 Unit

Min Typ Max Min Typ Max

VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V

VIinput voltage 0 - VCC 0-V

CC V

VOoutput voltage 0 - VCC 0-V

CC V

Tamb ambient temperature −40 - +125 −40 - +125 °C

∆t/∆V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V

VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V

VCC = 6.0 V - - 83 - - - ns/V

Table 5. Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

74HC4060

VIH HIGH-level

input voltage MR input

VCC = 2.0 V 1.5 1.3 - 1.5 - 1.5 - V

VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V

VCC = 6.0 V 4.2 3.1 - 4.2 - 4.2 - V

RS input

VCC = 2.0 V 1.7 - - 1.7 - 1.7 - V

VCC = 4.5 V 3.6 - - 3.6 - 3.6 - V

VCC = 6.0 V 4.8 - - 4.8 - 4.8 - V

Product data sheet Rev. 03 — 14 July 2008 7 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

VIL LOW-level

input voltage MR input

VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V

VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V

VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V

RS input

VCC = 2.0 V - - 0.3 - 0.3 - 0.3 V

VCC = 4.5 V - - 0.9 - 0.9 - 0.9 V

VCC = 6.0 V - - 1.2 - 1.2 - 1.2 V

VOH HIGH-level

output

voltage

RTC output; RS = MR = GND

IO=−20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO=−20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V

IO=−2.6 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

IO=−3.3 mA; VCC = 6.0 V 5.48 - - 5.34 - 5.2 - V

RTC output; RS = MR = VCC

IO=−20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO=−20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V

IO=−0.65 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

IO=−0.85 mA; VCC = 6.0 V 5.48 - - 5.34 - 5.2 - V

CTC output;

RS=V

IH;MR=V

IO=−3.2 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

IO=−4.2 mA; VCC = 6.0 V 5.48 - - 5.34 - 5.2 - V

VI=V

IH or VIL;

except RTC output

IO=−20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO=−20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V

VI=V

IH or VIL;

except RTC and CTC outputs

IO=−4.0 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

IO=−5.2 mA; VCC = 6.0 V 5.48 - - 5.34 - 5.2 - V

Table 5. Static characteristics

…continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

Product data sheet Rev. 03 — 14 July 2008 8 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

VOL LOW-level

output

voltage

RTC output; RS = VCC;

MR = GND

IO=20µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V

IO=20µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V

IO=20µA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V

IO= 2.6 mA; VCC = 4.5 V - - 0.26 - 0.33 - 0.4 V

IO= 3.3 mA; VCC = 6.0 V - - 0.26 - 0.33 - 0.4 V

CTC output; RS = VIL;

MR = VIH

IO= 3.2 mA; VCC = 4.5 V - - 0.26 - 0.33 - 0.4 V

IO= 4.2 mA; VCC = 6.0 V - - 0.26 - 0.33 - 0.4 V

VI=V

IH or VIL;

except RTC output

IO=20µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V

IO=20µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V

IO=20µA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V

VI=V

IH or VIL;

except RTC and CTC outputs

IO= 4.0 mA; VCC = 4.5 V - - 0.26 - 0.33 - 0.4 V

IO= 5.2 mA; VCC = 6.0 V - - 0.26 - 0.33 - 0.4 V

IIinput leakage

current VI=V

CC or GND; VCC = 6.0 V - - ±0.1 - ±1.0 - ±1.0 µA

ICC supply

current VI=V

CC or GND; IO=0A;

VCC = 6.0 V - - 8.0 - 80 - 160 µA

CIinput

capacitance - 3.5 - - - - - pF

74HCT4060

VIH HIGH-level

input voltage MR input;

VCC = 4.5 V to 5.5 V [1] 2.0 - - 2.0 - 2.0 - V

VIL LOW-level

input voltage MR input;

VCC = 4.5 V to 5.5 V [1] - - 0.8 - 0.8 - 0.8 V

Table 5. Static characteristics

…continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

Product data sheet Rev. 03 — 14 July 2008 9 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

[1] For HCT4060, only input MR (pin 12) has TTL input switching levels.

VOH HIGH-level

output

voltage

RTC output; RS = MR = VCC

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO=−0.65 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

RTC output; RS = MR = GND

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO=−2.6 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

CTC output; RS = VIH;

MR = VIL

IO=−3.2 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

VI=V

IH or VIL;

except RTC output

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

VI=V

IH or VIL;

except RTC and CTC outputs

IO=−4.0 mA; VCC = 4.5 V 3.98 - - 3.84 - 3.7 - V

VOL LOW-level

output

voltage

RTC output; RS = VCC;

MR = GND

IO=20µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V

IO= 2.6 mA; VCC = 4.5 V - - 0.26 - 0.33 - 0.4 V

CTC output; RS = VIL;

MR = VIH

IO= 3.2 mA; VCC = 4.5 V - - 0.26 - 0.33 - 0.4 V

VI=V

IH or VIL;

except RTC output

IO=20µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V

VI=V

IH or VIL;

except RTC and CTC outputs

IO= 4.0 mA; VCC = 4.5 V - - 0.26 - 0.33 - 0.4 V

IIinput leakage

current VI=V

CC or GND; VCC = 5.5 V - - ±0.1 - ±1.0 - ±1.0 µA

ICC supply

current VI=V

CC or GND;

VCC = 5.5 V; IO=0A - - 8.0 - 80 - 160 µA

∆ICC additional

supply

current

per input pin;

VI=V

CC −2.1 V; other inputs

at VCC or GND;

VCC = 4.5 V to 5.5 V; IO=0A

- 40 144 - 180 - 196 µA

CIinput

capacitance - 3.5 - - - - - pF

Table 5. Static characteristics

…continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

Product data sheet Rev. 03 — 14 July 2008 10 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

11. Dynamic characteristics

Table 6. Dynamic characteristics

GND = 0 V; C

= 50 pF unless otherwise speciﬁed; for test circuit see Figure 11.

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

74HC4060

tpd propagation

delay RS to Q3; see Figure 8 [1]

VCC = 2.0 V - 99 300 - 375 - 450 ns

VCC = 4.5 V - 36 60 - 75 - 90 ns

VCC = 5.0 V; CL=15pF - 31 - - - - - ns

VCC = 6.0 V - 29 51 - 64 - 77 ns

Qn to Qn+1; see Figure 9 [2]

VCC = 2.0 V - 22 80 - 100 - 120 ns

VCC = 4.5 V - 8 16 - 20 - 24 ns

VCC = 5.0 V; CL=15pF - 6 - - - - - ns

VCC = 6.0 V - 6 14 - 17 - 20 ns

tPHL HIGH to LOW

propagation

delay

MR to Qn; see Figure 10

VCC = 2.0 V - 55 175 - 220 - 265 ns

VCC = 4.5 V - 20 35 - 44 - 53 ns

VCC = 5.0 V; CL=15pF - 17 - - - - - ns

VCC = 6.0 V - 16 30 - 37 - 45 ns

tttransition time Qn; see Figure 8 [3]

VCC = 2.0 V - 19 75 - 95 - 110 ns

VCC = 4.5 V - 7 15 - 19 - 22 ns

VCC = 6.0 V - 6 13 - 16 - 19 ns

tWpulse width RS (HIGH or LOW);

see Figure 8

VCC = 2.0 V 80 17 - 100 - 120 - ns

VCC = 4.5 V 16 6 - 20 - 24 - ns

VCC = 6.0 V 14 5 - 17 - 20 - ns

MR (HIGH); see Figure 10

VCC = 2.0 V 80 25 - 100 - 120 - ns

VCC = 4.5 V 16 9 - 20 - 24 - ns

VCC = 6.0 V 14 7 - 17 - 20 - ns

trec recovery time MR to RS; see Figure 10

VCC = 2.0 V 100 28 - 125 - 150 - ns

VCC = 4.5 V 20 10 - 25 - 30 - ns

VCC = 6.0 V 17 8 - 21 - 26 - ns

Product data sheet Rev. 03 — 14 July 2008 11 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

fmax maximum

frequency RS; see Figure 8

VCC = 2.0 V 6 26 - 4.8 - 4 - MHz

VCC = 4.5 V 30 80 - 24 - 20 - MHz

VCC = 5.0 V; CL= 15 pF - 87 - - - - - MHz

VCC = 6.0 V 35 95 - 28 - 24 - MHz

CPD power

dissipation

capacitance

VI = GND to VCC;

VCC =5V; f

i= 1 MHz [4] -40- - - - -pF

74HCT4060

tpd propagation

delay RS to Q3; see Figure 8 [1]

VCC = 4.5 V - 33 66 - 83 - 99 ns

VCC = 5.0 V; CL=15pF - 31 - - - - - ns

Qn to Qn+1; see Figure 9 [2]

VCC = 4.5 V - 8 16 - 20 - 24 ns

VCC = 5.0 V; CL=15pF - 6 - - - - - ns

tPHL HIGH to LOW

propagation

delay

MR to Qn; see Figure 10

VCC = 4.5 V - 21 44 - 55 - 66 ns

VCC = 5.0 V; CL=15pF - 18 - - - - - ns

tttransition time Qn; see Figure 8 [3]

VCC = 4.5 V - 7 15 - 19 - 22 ns

tWpulse width RS (HIGH or LOW);

see Figure 8

VCC = 4.5 V 16 6 - 20 - 24 - ns

MR (HIGH); see Figure 10

VCC = 4.5 V 16 6 - 20 - 24 - ns

trec recovery time MR to RS; see Figure 10

VCC = 4.5 V 26 13 - 33 - 39 - ns

fmax maximum

frequency RS; see Figure 8

VCC = 4.5 V 30 80 - 24 - 20 - MHz

VCC = 5.0 V; CL= 15 pF - 88 - - - - - MHz

Table 6. Dynamic characteristics

…continued

GND = 0 V; C

= 50 pF unless otherwise speciﬁed; for test circuit see Figure 11.

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

Product data sheet Rev. 03 — 14 July 2008 12 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

[1] tpd is the same as tPHL and tPLH.

[2] Qn+1 is the next Qn output.

[3] tt is the same as tTHL and tTLH.

[4] CPD is used to determine the dynamic power dissipation (PD in µW):

PD=C

PD ×VCC2×fi×N+∑(CL×VCC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in V;

N = number of inputs switching;

∑(CL×VCC2×fo) = sum of outputs.

12. Waveforms

CPD power

dissipation

capacitance

VI = GND to VCC −1.5 V;

VCC =5V; f

i= 1 MHz [4] -40- - - - -pF

Table 6. Dynamic characteristics

…continued

GND = 0 V; C

= 50 pF unless otherwise speciﬁed; for test circuit see Figure 11.

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

Measurement points are given in Table 7.

VOL and VOH are typical voltage output levels that occur with the output load.

Fig 8. Waveforms showing the clock (RS) to output (Q3) propagation delays, the clock pulse width, the output

transition times and the maximum clock frequency

001aai118

RS input

1/fmax

tTHL tTLH

tPHL tPLH

VOH

GND

VOL

10 %

90 %90 %

10 %

Q3 output

Product data sheet Rev. 03 — 14 July 2008 13 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Measurement points are given in Table 7.

VOL and VOH are typical voltage output levels that occur with the output load.

Fig 9. Waveforms showing the output Qn to output Qn+1 propagation delays

001aai120

Qn output

tPLH tPHL

VOH

VOL

Qn+1 output

Measurement points are given in Table 7.

VOL and VOH are typical voltage output levels that occur with the output load.

Fig 10. Waveforms showing the master reset (MR) pulse width, the master reset to output (Qn) propagation

delays and the master reset to clock (RS) recovery time

001aai119

RS input

MR input

tPHL

trec

VOH

GND

VOL

GND

Qn output

Table 7. Measurement points

Type Input Output

VMVM

74HC4060 0.5 ×VCC 0.5 ×VCC

74HCT4060 1.3 V 1.3 V

Product data sheet Rev. 03 — 14 July 2008 14 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Test data is given in Table 8.

Deﬁnitions test circuit:

RT = Termination resistance should be equal to output impedance Zo of the pulse generator.

CL = Load capacitance including jig and probe capacitance.

Fig 11. Test circuit for measuring switching times

001aah768

negative

pulse

GND

positive

pulse

GND

10 %

90 %

10 % VMVM

VCC

DUT

VIVO

Table 8. Test data

Type Input Load

VItr, tfCL

74HC4060 VCC 6 ns 15 pF, 50 pF

74HCT4060 3 V 6 ns 15 pF, 50 pF

Product data sheet Rev. 03 — 14 July 2008 15 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

13. RC oscillator

13.1 Timing component limitations

The oscillator frequency is mainly determined by RtCt, provided R2 ≈ 2Rt and

R2C2 << RtCt. The function of R2 is to minimize the inﬂuence of the forward voltage

across the input protection diodes on the frequency. The stray capacitance C2 should be

kept as small as possible. In consideration of accuracy, Ctmust be larger than the inherent

stray capacitance. Rtmust be larger than the ON resistance in series with it, which

typically is 280 Ωat VCC = 2.0 V, 130 Ωat VCC = 4.5 V and 100 Ωat VCC = 6.0 V.

The recommended values for these components to maintain agreement with the typical

oscillation formula are:

Ct> 50 pF, up to any practical value and 10 kΩ<R

t<1 MΩ.

In order to avoid start-up problems, Rt≥ 1 kΩ.

13.2 Typical crystal oscillator circuit

In Figure 13, R2 is the power limiting resistor. For starting and maintaining oscillation a

minimum transconductance is necessary, so R2 should not be too large. A practical value

for R2 is 2.2 kΩ.

Typical formula for oscillator frequency:

Fig 12. Example of a RC oscillator

001aai121

MR (from logic)

C2 R2 Rt

RTC

11 RS

CTC

10 9

74HC4060

74HCT4060

fosc 1

2.5 Rt

×Ct

-------------------------------

Product data sheet Rev. 03 — 14 July 2008 16 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

gfs =∆IO / ∆VI at VO is constant; MR = LOW.

See also Figure 15.

Fig 13. External component connection for a crystal

oscillator Fig 14. Test set-up for measuring forward

transconductance

001aai122

MR (from logic)

100 pF

22 pF to 37 pF

Rbias

100 kΩ to 1MΩR2

2.2 kΩ

RTC

11 RS

74HC4060

74HCT4060

001aai123

560 kΩ

Rbias

input

0.47 pF 100 µF

output

GND

VDD

(fi = 1 kHz) IO

Tamb =25°C.

(1) Maximum.

(2) Typical.

(3) Minimum.

Fig 15. Typical forward transconductance as function of the supply voltage

001aai124

VCC (V)

0642

gfs

(mA/V)

(1)

(2)

(3)

Product data sheet Rev. 03 — 14 July 2008 17 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

VCC = 2.0 V to 6.0 V; Tamb =25°C.

For Rtcurve: Ct= 1 nF; R2 = 2 × Rt.VCC = 2.0 V to 6.0 V; Tamb =25°C.

For Ctcurve: Rt= 100 kΩ; R2 = 200 kΩ.

Fig 16. RC oscillator frequency as a function of RtFig 17. RC oscillator frequency as a function of Ct

001aai125

Rt (Ω)

103106

105

104

102

103

104

105

fosc

(Hz)

001aai127

Ct (µF)

10−410−1

10−2

10−3

102

103

104

105

fosc

(Hz)

Product data sheet Rev. 03 — 14 July 2008 18 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

14. Package outline

Fig 18. Package outline SOT38-4 (DIP16)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT38-4 95-01-14

03-02-13

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.30 0.53

0.38 0.36

0.23 19.50

18.55 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 0.764.2 0.51 3.2

inches 0.068

0.051 0.021

0.015 0.014

0.009

1.25

0.85

0.049

0.033 0.77

0.73 0.26

0.24 0.14

0.12 0.010.1 0.3 0.32

0.31 0.39

0.33 0.030.17 0.02 0.13

DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4

Product data sheet Rev. 03 — 14 July 2008 19 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Fig 19. Package outline SOT109-1 (SO16)

detail X

vMA

(A )

pin 1 index

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 10.0

9.8 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT109-1 99-12-27

03-02-19

076E07 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.39

0.38 0.16

0.15 0.05

1.05

0.041

0.244

0.228 0.028

0.020 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

Product data sheet Rev. 03 — 14 July 2008 20 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Fig 20. Package outline SOT338-1 (SSOP16)

UNIT A1A2A3bpcD

(1) E(1) eH

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.21

0.05 1.80

1.65 0.25 0.38

0.25 0.20

0.09 6.4

6.0 5.4

5.2 0.65 1.25

7.9

7.6 1.03

0.63 0.9

0.7 1.00

0.55 8

0.130.2 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT338-1 99-12-27

03-02-19

(1)

vMA

16 9

detail X

(A )

MO-150

pin 1 index

0 2.5 5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1

max.

Product data sheet Rev. 03 — 14 July 2008 21 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Fig 21. Package outline SOT403-1 (TSSOP16)

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 5.1

4.9 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.40

0.06 8

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1 MO-153 99-12-27

03-02-18

0.25

16 9

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

max.

1.1

pin 1 index

Product data sheet Rev. 03 — 14 July 2008 22 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

Fig 22. Package outline SOT763-1 (DHVQFN16)

terminal 1

index area

0.51

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 3.6

3.4

2.15

1.85

2.6

2.4 1.15

0.85

2.5

0.30

0.18

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT763-1 MO-241 - - -- - -

0.5

0.3

0.1

0.05

0 2.5 5 mm

scale

SOT763-1

DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

16 terminals; body 2.5 x 3.5 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

15 10

terminal 1

index area

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

02-10-17

03-01-27

Product data sheet Rev. 03 — 14 July 2008 23 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

15. Abbreviations

16. Revision history

Table 9. Abbreviations

Acronym Description

CMOS Complementary Metal-Oxide Semiconductor

DUT Device Under Test

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

TTL Transistor-Transistor Logic

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74HC_HCT4060_3 20080714 Product data sheet - 74HC_HCT4060_CNV_2

Modiﬁcations: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Section 4: DHVQFN16 package added.

•Section 8: derating values added for DHVQFN16 package.

•Section 14: outline drawing added for DHVQFN16 package.

74HC_HCT4060_CNV_2 19970901 Product speciﬁcation - -

Product data sheet Rev. 03 — 14 July 2008 24 of 25

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

17. Legal information

18. Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

18.1 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

18.2 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

18.3 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors 74HC4060; 74HCT4060

14-stage binary ripple counter with oscillator

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 July 2008

Document identifier: 74HC_HCT4060_3

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

20. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 5

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Recommended operating conditions. . . . . . . . 6

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6

11 Dynamic characteristics . . . . . . . . . . . . . . . . . 10

12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13 RC oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

13.1 Timing component limitations. . . . . . . . . . . . . 15

13.2 Typical crystal oscillator circuit . . . . . . . . . . . . 15

14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18

15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23

16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23

17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24

18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24

18.1 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

18.2 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24

18.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24

19 Contact information. . . . . . . . . . . . . . . . . . . . . 24

20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25