ADC102S101 2 Channel, 500 ksps to 1 Msps, 10-Bit A/D Converter General Description Features The ADC102S101 is a low-power, two-channel CMOS 10-bit analog-to-digital converter with a high-speed serial interface. Unlike the conventional practice of specifying performance at a single sample rate only, the ADC102S101 is fully specified over a sample rate range of 500 ksps to 1 Msps. The converter is based on a successive-approximation register architecture with an internal track-and-hold circuit. It can be configured to accept one or two input signals at inputs IN1 and IN2. The output serial data is straight binary, and is compatible with several standards, such as SPITM, QSPITM, MICROWIRE, and many common DSP serial interfaces. The ADC102S101 operates with a single supply that can range from +2.7V to +5.25V. Normal power consumption using a +3V or +5V supply is 3.9 mW and 11.4 mW, respectively. The power-down feature reduces the power consumption to just 0.12 W using a +3.6V supply, or 0.47 W using a +5.5V supply. The ADC102S101 is packaged in an 8-lead MSOP package. Operation over the industrial temperature range of -40C to +85C is guaranteed. Specified over a range of sample rates. Two input channels Variable power management Single power supply with 2.7V - 5.25V range Key Specifications DNL INL SNR Power Consumption -- 3V Supply -- 5V Supply + 0.26/-0.16 LSB (typ) + 0.4/-0.1 LSB (typ) 61.7 dB (typ) 3.9 mW (typ) 11.4 mW (typ) Applications Portable Systems Remote Data Acquisition Instrumentation and Control Systems Pin-Compatible Alternatives by Resolution and Speed All devices are fully pin and function compatible. Resolution Specified for Sample Rates of: 50 to 200 ksps 200 to 500 ksps 500 ksps to 1 Msps 12-bit ADC122S021 ADC122S051 ADC122S101 10-bit ADC102S021 ADC102S051 ADC102S101 8-bit ADC082S021 ADC082S051 ADC082S101 Connection Diagram 20125305 Ordering Information Temperature Range Description Top Mark ADC102S101CIMM Order Code -40C to +85C 8-Lead MSOP Package X23C ADC102S101CIMMX -40C to +85C 8-Lead MSOP Package, Tape & Reel X23C ADC102S101EVAL Evaluation Board TRI-STATE(R) is a trademark of National Semiconductor Corporation QSPITM and SPITM are trademarks of Motorola, Inc. (c) 2010 National Semiconductor Corporation 201253 www.national.com ADC102S101 2 Channel, 500 ksps to 1 Msps, 10-Bit A/D Converter January 29, 2010 ADC102S101 Block Diagram 20125307 Pin Descriptions and Equivalent Circuits Pin No. Symbol Description ANALOG I/O 5,4 IN1 and IN2 Analog inputs. These signals can range from 0V to VA. DIGITAL I/O 8 SCLK Digital clock input. This clock directly controls the conversion and readout processes. 7 DOUT Digital data output. The output samples are clocked out of this pin on falling edges of the SCLK pin. 6 DIN Digital data input. The ADC102S101's Control Register is loaded through this pin on rising edges of the SCLK pin. 1 CS Chip select. On the falling edge of CS, a conversion process begins. Conversions continue as long as CS is held low. 2 VA Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source and bypassed to GND with a 1 F capacitor and a 0.1 F monolithic capacitor located within 1 cm of the power pin. 3 GND POWER SUPPLY www.national.com The ground return for the die. 2 Operating Temperature Range 2) Junction Temperature Storage Temperature -40C TA +85C VA Supply Voltage If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Analog Supply Voltage VA Voltage on Any Pin to GND Input Current at Any Pin (Note 3) Package Input Current (Note 3) Power Consumption at TA = 25C ESD Susceptibility (Note 5) Human Body Model Machine Model (Note 1, Note 2) +2.7V to +5.25V -0.3V to VA 50 kHz to 16 MHz 0V to VA Digital Input Pins Voltage Range Clock Frequency Analog Input Voltage -0.3V to 6.5V -0.3V to VA +0.3V 10 mA 20 mA See (Note 4) Package Thermal Resistance Package JA 8-lead MSOP 250C / W Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging. (Note 6) 2500V 250V +150C -65C to +150C ADC102S101 Converter Electrical Characteristics (Note 9) The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, CL = 50 pF, fSCLK = 8 MHz to 16 MHz, fSAMPLE = 500 ksps to 1 Msps, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25C. Symbol Parameter Conditions Typical Limits (Note 7) 10 Bits +0.4 +0.7 LSB (max) Units STATIC CONVERTER CHARACTERISTICS Resolution with No Missing Codes INL Integral Non-Linearity -0.1 -0.5 LSB (min) +0.26 +0.6 LSB (max) -0.16 -0.6 LSB (min) DNL Differential Non-Linearity VOFF Offset Error +0.19 0.6 LSB (max) OEM Channel to Channel Offset Error Match 0.02 0.6 LSB (max) FSE Full-Scale Error -0.15 0.7 LSB (max) FSEM Channel to Channel Full-Scale Error Match 0.02 0.5 LSB (max) DYNAMIC CONVERTER CHARACTERISTICS SINAD Signal-to-Noise Plus Distortion Ratio VA = +2.7V to 5.25V fIN = 40.3 kHz, -0.02 dBFS 61.6 61 dB (min) SNR Signal-to-Noise Ratio VA = +2.7V to 5.25V fIN = 40.3 kHz, -0.02 dBFS 61.7 61.3 dB (min) THD Total Harmonic Distortion VA = +2.7V to 5.25V fIN = 40.3 kHz, -0.02 dBFS -82 -72 dB (max) SFDR Spurious-Free Dynamic Range VA = +2.7V to 5.25V fIN = 40.3 kHz, -0.02 dBFS 83 75 dB (min) ENOB Effective Number of Bits VA = +2.7V to 5.25V fIN = 40.3 kHz, -0.02 dBFS 9.9 9.8 Bits (min) Channel-to-Channel Crosstalk VA = +5.25V fIN = 40.3 kHz -78 dB Intermodulation Distortion, Second Order Terms VA = +5.25V fa = 40.161 kHz, fb = 41.015 kHz -82 dB Intermodulation Distortion, Third Order Terms VA = +5.25V fa = 40.161 kHz, fb = 41.015 kHz -81 dB VA = +5V 11 MHz VA = +3V 8 MHz IMD FPBW -3 dB Full Power Bandwidth 3 www.national.com ADC102S101 Operating Ratings Absolute Maximum Ratings (Note 1, Note ADC102S101 Symbol Parameter Conditions Typical Limits (Note 7) Units 1 A (max) ANALOG INPUT CHARACTERISTICS VIN Input Range IDCL DC Leakage Current CINA Input Capacitance 0 to VA V Track Mode 33 pF Hold Mode 3 pF DIGITAL INPUT CHARACTERISTICS VIH Input High Voltage VIL Input Low Voltage IIN Input Current CIND Digital Input Capacitance VA = +5.25V 2.4 V (min) VA = +3.6V 2.1 V (min) 0.8 V (max) 0.2 10 A (max) 2 4 pF (max) ISOURCE = 200 A VA - 0.03 VA - 0.5 V (min) ISOURCE = 1mA VA - 0.1 ISINK = 200 A 0.03 ISINK = 1 mA 0.1 VIN = 0V or VA DIGITAL OUTPUT CHARACTERISTICS VOH Output High Voltage VOL Output Low Voltage IOZH, IOZL TRI-STATE(R) Leakage Current COUT TRI-STATE(R) Output Capacitance V 0.4 V (max) V 0.01 1 A (max) 2 4 pF (max) Output Coding Straight (Natural) Binary POWER SUPPLY CHARACTERISTICS (CL = 10 pF) VA IA VA = +5.25V, Supply Current, Normal Mode (Operational, fSAMPLE = 1 Msps, fIN = 40 kHz CS low) VA = +3.6V, fSAMPLE = 1 Msps, fIN = 40 kHz Supply Current, Shutdown (CS high) PD 2.7 V (min) 5.25 V (max) 2.18 2.7 mA (max) 1.08 1.3 mA (max) Supply Voltage Power Consumption, Normal Mode (Operational, CS low) Power Consumption, Shutdown (CS high) VA = +5.25V, fSAMPLE = 0 ksps 90 nA VA = +3.6V, fSAMPLE = 0 ksps 33 nA VA = +5.25V 11.4 14.2 mW (max) VA = +3.6V 3.9 4.7 mW (max) VA = +5.25V 0.47 W VA = +3.6V 0.12 W AC ELECTRICAL CHARACTERISTICS fSCLK Clock Frequency (Note 8) fS Sample Rate (Note 8) tCONV Conversion Time DC SCLK Duty Cycle fCLK = 16 MHz tACQ Track/Hold Acquisition Time Throughput Time www.national.com 8 MHz (min) 16 MHz (max) 500 ksps (min) 1 Msps (max) 13 SCLK cycles 30 % (min) 70 % (max) Full-Scale Step Input 3 SCLK cycles Acquisition Time + Conversion Time 16 SCLK cycles 4 50 The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, CL = 50 pF, fSCLK = 8 MHz to 16 MHz, fSAMPLE = 500 ksps to 1 Msps, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25C. Symbol Parameter Conditions tCSU Setup Time SCLK High to CS Falling Edge (Note 10) tCLH Hold time SCLK Low to CS Falling Edge (Note 10) tEN Delay from CS Until DOUT active tACC Data Access Time after SCLK Falling Edge tSU Data Setup Time Prior to SCLK Rising Edge tH Data Valid SCLK Hold Time tCH SCLK High Pulse Width tCL SCLK Low Pulse Width Units 10 ns (min) 10 ns (min) 30 ns (max) 30 ns (max) +3 10 ns (min) +3 10 ns (min) VA = +3.0V -3.5 VA = +5.0V -0.5 VA = +3.0V +4.5 VA = +5.0V +1.5 VA = +3.0V +4 VA = +5.0V +2 VA = +3.0V +16.5 VA = +5.0V +15 0.5 x tSCLK 0.3 x tSCLK ns (min) 0.5 x tSCLK 0.3 x tSCLK ns (min) Output Falling tDIS Limits (Note 7) Typical CS Rising Edge to DOUT High-Impedance Output Rising VA = +3.0V 1.7 VA = +5.0V 1.2 VA = +3.0V 1 VA = +5.0V 1 20 ns (max) Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified. Note 3: When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the VA pin. The current into the VA pin is limited by the Analog Supply Voltage specification. Note 4: The absolute maximum junction temperature (TJmax) for this device is 150C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (JA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax - TA)/JA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k resistor. Machine model is 220 pF discharged through zero ohms Note 6: Reflow temperature profiles are different for lead-free and non-lead-free packages. Note 7: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level). Note 8: This is the frequency range over which the electrical performance is guaranteed. The device is functional over a wider range which is specified under Operating Ratings. Note 9: Min/max specification limits are guaranteed by design, test, or statistical analysis. Note 10: Clock may be either high or low when CS is asserted as long as setup and hold times tCSU and tCLH are strictly observed. 5 www.national.com ADC102S101 ADC102S101 Timing Specifications ADC102S101 Timing Diagrams 20125351 ADC102S101 Operational Timing Diagram 20125308 Timing Test Circuit 20125306 ADC102S101 Serial Timing Diagram www.national.com 6 ADC102S101 20125350 SCLK and CS Timing Parameters Specification Definitions ACQUISITION TIME is the time required to acquire the input voltage. That is, it is time required for the hold capacitor to charge up to the input voltage. APERTURE DELAY is the time between the fourth falling SCLK edge of a conversion and the time when the input signal is acquired or held for conversion. CONVERSION TIME is the time required, after the input voltage is acquired, for the ADC to convert the input voltage to a digital word. CROSSTALK is the coupling of energy from one channel into the other channel, or the amount of signal energy from one analog input that appears at the measured analog input. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The specification here refers to the SCLK. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. FULL SCALE ERROR (FSE) is a measure of how far the last code transition is from the ideal 11/2 LSB below VREF+ and is defined as: frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in the second and third order intermodulation products to the sum of the power in both of the original frequencies. IMD is usually expressed in dB. MISSING CODES are those output codes that will never appear at the ADC outputs. These codes cannot be reached with any input value. The ADC102S101 is guaranteed not to have any missing codes. OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND + 0.5 LSB). SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal at the converter output to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including d.c. or harmonics included in the THD specification.. SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding d.c. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input signal and the peak spurious signal where a spurious signal is any signal present in the output spectrum that is not present at the input, excluding d.c. TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB or dBc, of the rms total of the first five harmonic components at the output to the rms level of the input signal frequency as seen at the output. THD is calculated as VFSE = Vmax + 1.5 LSB - VREF+ where Vmax is the voltage at which the transition to the maximum code occurs. FSE can be expressed in Volts, LSB or percent of full scale range. GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF - 1.5 LSB), after adjusting for offset error. INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative full scale (1/2 LSB below the first code transition) through positive full scale (1/2 LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two sinusoidal where Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the RMS power in the first 5 harmonic frequencies. Accurate THD measurement requires a spectrally pure sine wave (monotone) at the ADC input. THROUGHPUT TIME is the minimum time required between the start of two successive conversion. It is the acquisition time plus the conversion time. In the case of the ADC102S101, this is 16 SCLK periods. 7 www.national.com ADC102S101 Typical Performance Characteristics TA = +25C, fSAMPLE = 500 ksps to 1 Msps, fSCLK = 8 MHz to 16 MHz, fIN = 40.3 kHz unless otherwise stated. DNL - VA = 3.0V INL - VA = 3.0V 20125320 20125321 DNL - VA = 5.0V INL - VA = 5.0V 20125362 20125363 DNL vs. Supply INL vs. Supply 20125322 www.national.com 20125323 8 ADC102S101 DNL vs. Clock Frequency INL vs. Clock Frequency 20125324 20125325 DNL vs. Clock Duty Cycle INL vs. Clock Duty Cycle 20125326 20125327 DNL vs. Temperature INL vs. Temperature 20125328 20125329 9 www.national.com ADC102S101 SNR vs. Supply THD vs. Supply 20125330 20125335 SNR vs. Clock Frequency THD vs. Clock Frequency 20125331 20125336 SNR vs. Clock Duty Cycle THD vs. Clock Duty Cycle 20125332 www.national.com 20125337 10 ADC102S101 SNR vs. Input Frequency THD vs. Input Frequency 20125333 20125338 SNR vs. Temperature THD vs. Temperature 20125334 20125339 SFDR vs. Supply SINAD vs. Supply 20125340 20125345 11 www.national.com ADC102S101 SFDR vs. Clock Frequency SINAD vs. Clock Frequency 20125341 20125346 SFDR vs. Clock Duty Cycle SINAD vs. Clock Duty Cycle 20125342 20125347 SFDR vs. Input Frequency SINAD vs. Input Frequency 20125343 www.national.com 20125348 12 ADC102S101 SFDR vs. Temperature SINAD vs. Temperature 20125344 20125349 ENOB vs. Supply ENOB vs. Clock Frequency 20125352 20125353 ENOB vs. Clock Duty Cycle ENOB vs. Input Frequency 20125354 20125355 13 www.national.com ADC102S101 ENOB vs. Temperature Spectral Response - 3V, 500 ksps 20125356 20125364 Spectral Response - 5V, 500 ksps Spectral Response - 3V, 1.0 Msps 20125365 20125359 Spectral Response - 5V, 1.0 Msps Power Consumption vs. Throughput 20125360 www.national.com 20125361 14 1.0 ADC102S101 OPERATION The ADC102S101 is a successive-approximation analog-todigital converter designed around a charge-redistribution digital-to-analog converter. Simplified schematics of the ADC102S101 in both track and hold modes are shown in Figures 1, 2, respectively. In Figure 1, the ADC102S101 is in track mode: switch SW1 connects the sampling capacitor to one of two analog input channels through the multiplexer, and SW2 balances the comparator inputs. The ADC102S101 is in this state for the first three SCLK cycles after CS is brought low. Figure 2 shows the ADC102S101 in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining the 20125309 FIGURE 1. ADC102S101 in Track Mode 20125310 FIGURE 2. ADC102S101 in Hold Mode Additionally, the device goes into a power down state when CS is high and also between continuous conversion cycles. During the first 3 cycles of SCLK, the ADC is in the track mode, acquiring the input voltage. For the next 13 SCLK cycles the conversion is accomplished and the data is clocked out, MSB first, starting at the 5th clock. If there is more than one conversion in a frame, the ADC will re-enter the track mode on the falling edge of SCLK after the N*16th rising edge of SCLK, and re-enter the hold/convert mode on the N*16+4th falling edge of SCLK, where "N" is an integer. When CS is brought high, SCLK is internally gated off. If SCLK is stopped in the low state while CS is high, the subsequent fall of CS will generate a falling edge of the internal version of SCLK, putting the ADC into the track mode. This is seen by the ADC as the first falling edge of SCLK. If SCLK is stopped with SCLK high, the ADC enters the track mode on the first falling edge of SCLK after the falling edge of CS. 2.0 USING THE ADC102S101 An ADC102S101 timing diagram and a serial interface timing diagram for the ADC102S101 are shown in the Timing Diagrams section. CS is chip select, which initiates conversions and frames the serial data transfers. SCLK (serial clock) controls both the conversion process and the timing of serial data. DOUT is the serial data output pin, where a conversion result is sent as a serial data stream, MSB first. Data to be written to the ADC102S101's Control Register is placed at DIN, the serial data input pin. New data is written to DIN with each conversion. A serial frame is initiated on the falling edge of CS and ends on the rising edge of CS. Each frame must contain an integer multiple of 16 rising SCLK edges. The ADC output data (DOUT) is in a high impedance state when CS is high and is active when CS is low. Thus, CS acts as an output enable. 15 www.national.com ADC102S101 sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the charge-redistribution DAC to add fixed amounts of charge to the sampling capacitor until the comparator is balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of the analog input voltage. The ADC102S101 is in this state for the fourth through sixteenth SCLK cycles after CS is brought low. The time when CS is low is considered a serial frame. Each of these frames should contain an integer multiple of 16 SCLK cycles, during which time a conversion is performed and clocked out at the DOUT pin and data is clocked into the DIN pin to indicate the multiplexer address for the next conversion. Applications Information ADC102S101 During each conversion, data is clocked into the ADC at DIN on the first 8 rising edges of SCLK after the fall of CS. For each conversion, it is necessary to clock in the data indicating the input that is selected for the conversion after the current one. See Tables 1, 2 and Table 3. If CS and SCLK go low within the times defined by tCSU and tCLH, the rising edge of SCLK that begins clocking data in at DIN may be one clock cycle later than expected. It is, there- fore, best to strictly observe the minimum tCSU and tCLH times given in the Timing Specifications. There are no power-up delays or dummy conversions required with the ADC102S101. The ADC is able to sample and convert an input to full conversion immediately following power up. The first conversion result after power-up will be that of IN1. TABLE 1. Control Register Bits Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 DONTC DONTC ADD2 ADD1 ADD0 DONTC DONTC DONTC TABLE 2. Control Register Bit Descriptions Bit #: Symbol: 7 - 6, 2 - 0 DONTC 3 ADD0 4 ADD1 5 ADD2 Description Don't care. The value of these bits do not affect the device. These bits determine which input channel will be sampled and converted in the next track/hold cycle. The mapping between codes and channels is shown in Table 3. TABLE 3. Input Channel Selection www.national.com ADD2 ADD1 ADD0 Input Channel x 0 0 IN1 (Default) x 0 1 IN2 x 1 x Not allowed. The output signal at the DOUT pin is indeterminate if ADD1 is high. 16 The output format of the ADC102S101 is straight binary. Code transitions occur midway between successive integer LSB values. The LSB width for the ADC102S101 is VA/1024. The ideal transfer characteristic is shown in Figure 3. The transition from an output code of 00 0000 0000 to a code of 00 0000 0001 is at 1/2 LSB, or a voltage of VA/2048. Other code transitions occur at steps of one LSB. 20125311 FIGURE 3. Ideal Transfer Characteristic degrade device noise performance. To keep noise off the supply, use a dedicated linear regulator for this device, or provide sufficient decoupling from other circuitry to keep noise off the ADC102S101 supply pin. Because of the ADC102S101's low power requirements, it is also possible to use a precision reference as a power supply to maximize performance. The four-wire interface is shown connected to a microprocessor or DSP. 4.0 TYPICAL APPLICATION CIRCUIT A typical application of the ADC102S101 is shown in Figure 4. Power is provided, in this example, by the National Semiconductor LP2950 low-dropout voltage regulator, available in a variety of fixed and adjustable output voltages. The power supply pin is bypassed with a capacitor network located close to the ADC102S101. Because the reference for the ADC102S101 is the supply voltage, any noise on the supply will 20125313 FIGURE 4. Typical Application Circuit 17 www.national.com ADC102S101 3.0 ADC102S101 TRANSFER FUNCTION ADC102S101 The user may trade off throughput for power consumption by simply performing fewer conversions per unit time. The Power Consumption vs. Sample Rate curve in the Typical Performance Curves section shows the typical power consumption of the ADC102S101 versus throughput. To calculate the power consumption, simply multiply the fraction of time spent in the normal mode by the normal mode power consumption , and add the fraction of time spent in shutdown mode multiplied by the shutdown mode power dissipation. 5.0 ANALOG INPUTS An equivalent circuit for one of the ADC102S101's input channels is shown in Figure 5. Diodes D1 and D2 provide ESD protection for the analog inputs. At no time should any input go beyond (VA + 300 mV) or (GND - 300 mV), as these ESD diodes will begin conducting, which could result in erratic operation. For this reason, these ESD diodes should NOT be used to clamp the input signal. The capacitor C1 in Figure 5 has a typical value of 3 pF, and is mainly the package pin capacitance. Resistor R1 is the on resistance of the multiplexer and track / hold switch, and is typically 500 ohms. Capacitor C2 is the ADC102S101 sampling capacitor and is typically 30 pF. The ADC102S101 will deliver best performance when driven by a low-impedance source to eliminate distortion caused by the charging of the sampling capacitance. This is especially important when using the ADC102S101 to sample AC signals. Also important when sampling dynamic signals is a band-pass or low-pass filter to reduce harmonics and noise, improving dynamic performance. 7.1 Power Supply Noise Considerations The charging of any output load capacitance requires current from the power supply, VA. The current pulses required from the supply to charge the output capacitance will cause voltage variations on the supply. If these variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore, discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current into the die substrate, which is resistive. Load discharge currents will cause "ground bounce" noise in the substrate that will degrade noise performance if that current is large enough. The larger is the output capacitance, the more current flows through the die substrate and the greater is the noise coupled into the analog channel, degrading noise performance. To keep noise out of the power supply, keep the output load capacitance as small as practical. If the load capacitance is greater than 50 pF, use a 100 series resistor at the ADC output, located as close to the ADC output pin as practical. This will limit the charge and discharge current of the output capacitance and improve noise performance. 7.2 Power Supply Noise Considerations The charging of any output load capacitance requires current from the power supply, VA. The current pulses required from the supply to charge the output capacitance will cause voltage variations on the supply. If these variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore, discharging the output capacitance when the digital output goes from a logic high to a logic low will dump current into the die substrate, which is resistive. Load discharge currents will cause "ground bounce" noise in the substrate that will degrade noise performance if that current is large enough. The larger is the output capacitance, the more current flows through the die substrate and the greater is the noise coupled into the analog channel, degrading noise performance. To keep noise out of the power supply, keep the output load capacitance as small as practical. If the load capacitance is greater than 50 pF, use a 100 series resistor at the ADC output, located as close to the ADC output pin as practical. This will limit the charge and discharge current of the output capacitance and improve noise performance. 20125314 FIGURE 5. Equivalent Input Circuit 6.0 DIGITAL INPUTS AND OUTPUTS The ADC102S101's digital output DOUT is limited by, and cannot exceed, the supply voltage, VA. The digital input pins are not prone to latch-up and, and although not recommended, SCLK, CS and DIN may be asserted before VA without any latchup risk. 7.0 POWER SUPPLY CONSIDERATIONS The ADC102S101 is fully powered-up whenever CS is low, and fully powered-down whenever CS is high, with one exception: the ADC102S101 automatically enters power-down mode between the 16th falling edge of a conversion and the 1st falling edge of the subsequent conversion (see Timing Diagrams). The ADC102S101 can perform multiple conversions back to back; each conversion requires 16 SCLK cycles. The ADC102S101 will perform conversions continuously as long as CS is held low. www.national.com 18 ADC102S101 Physical Dimensions inches (millimeters) unless otherwise noted 8-Lead MSOP Order Number ADC102S101CIMM, ADC102S101CIMMX NS Package Number P0MUA08A 19 www.national.com ADC102S101 2 Channel, 500 ksps to 1 Msps, 10-Bit A/D Converter Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH(R) Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise(R) Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagicTM www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise(R) Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. 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