PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
11 December 2015 Product data sheet
1. General description
Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode
in a DSN0603-2 (SOD962-2) leadless ultra small Surface-Mounted Device (SMD)
package designed to protect one signal line from the damage caused by ESD and other
transients.
2. Features and benefits
•Bidirectional ESD protection of one line
•Ultra low diode capacitance Cd = 0.25 pF
•High reverse standoff voltage VRWM = 24 V
•ESD protection up to ±10 kV according to IEC 61000-4-2
3. Applications
•NFC antenna protection
•Protection of high-speed and standard data lines with high signal levels
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Cddiode capacitance f = 1 MHz; VR = 0 V - 0.25 0.4 pF
VRWM reverse standoff
voltage
- - 24 V
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K1 cathode (diode 1)
2 K2 cathode (diode 2)
Transparent
top view
21
DSN0603-2 (SOD962-2)
sym045
21
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 2 / 12
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
PESD24VF1BSF DSN0603-2 Leadless ultra small package; 2 terminals; body 0.6 x
0.3 x 0.3 mm
SOD962-2
7. Marking
Table 4. Marking codes
Type number Marking code
PESD24VF1BSF H
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IPPM peak pulse current tp = 8/20 µs [1] - 1 A
Tjjunction temperature -45 125 °C
Tamb ambient temperature -45 125 °C
Tstg storage temperature -65 150 °C
ESD maximum ratings
IEC 61000-4-2; contact discharge [2] - 10 kV
IEC 61000-4-2; air discharge [2] - 15 kV
VESD electrostatic discharge voltage
MIL-STD-883; human body model;
HBM
- 10 kV
[1] According to IEC 61000-4-5 and IEC 61643-321.
[2] Device stressed with ten non-repetitive ESD pulses.
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 3 / 12
tp (µs)
0 403010 20
001aaa630
40
80
120
IPP
(%)
0
e-t
100 % IPP; 8 µs
50 % IPP; 20 µs
Fig. 1. 8/20 µs pulse waveform according to
IEC 61000-4-5 and IEC 61643-321
001aaa631
IPP
100 %
90 %
t
30 ns
60 ns
10 %
tr= 0.6 ns to 1 ns
Fig. 2. ESD pulse waveform according to
IEC 61000-4-2
9. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
VRWM reverse standoff
voltage
- - 24 V
IRM reverse leakage
current
VR = 24 V - 1 30 nA
Cddiode capacitance f = 1 MHz; VR = 0 V - 0.25 0.4 pF
VBR breakdown voltage IR = 1 mA 24.5 28 - V
VCL clamping voltage IPPM = 1 A [1] - - 17 V
Rdyn dynamic resistance IR = 5 A [2] - 0.7 - Ω
[1] According to IEC 61000-4-5 and IEC 61643-321.
[2] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse;
ANSI / ESD STM5.5.1-2008.
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 4 / 12
aaa-013492
VR (V)
-30 3010-10
0.20
0.15
0.25
0.30
Cd
(pF)
0.10
f = 1 MHz; VR = 0 V; Tamb = 25 °C
Fig. 3. Diode capacitance as a function of reverse
voltage; typical values
006aab325
-VCL -VBR -VRWM
VCL
VBR
VRWM
-IRM
IRM
-IR
IR
-IPP
IPP
-+
IPPM
-IPPM
Fig. 4. V-I characteristics for a bidirectional ESD
protection diode
VCL (V)
0 403010 20
aaa-013493
10
15
5
20
25
I
(A)
0
tp = 100 ns; Transmission Line Pulse (TLP)
Fig. 5. Dynamic resistance
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 5 / 12
50 Ω
Rd
Cs
DUT
(DEVICE
UNDER
TEST)
RG 223/U
50 Ω coax
ESD TESTER
IEC 61000-4-2 ed.2
Cs = 150 pF; Rd = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
40 dB
ATTENUATOR
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
0
6
2
10
V
(kV)
-2
t (ns)
-10 7030
4
8
4020100 50 60
unclamped -8 kV ESD pulse waveform
(IEC 61000-4-2 network)
-8
-2
-6
2
V
(kV)
-10
t (ns)
-10 7030
-4
0
4020100 50 60
aaa-003952
Fig. 6. ESD clamping test setup and waveforms
t (ns)
-10 705010 30
aaa-013494
20
60
100
VCL
(V)
-20
Fig. 7. Clamped +8 kV pulse waveform (IEC 61000-4-2
network)
t (ns)
-10 705010 30
aaa-013495
-60
-20
20
VCL
(V)
-100
Fig. 8. Clamped -8 kV pulse waveform (IEC 61000-4-2
network)
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 6 / 12
10. Application information
The device is designed for the protection of one bidirectional data line from surge pulses
and ESD damage. The device is suitable on lines where the signal polarities are both
positive and negative with respect to ground.
aaa-002737
ESD protection diode
GND
line to be protected
Fig. 9. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. Minimize the path length between the device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 7 / 12
11. Package outline
Fig. 10. Package outline DSN0603-2 (SOD962-2)
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 8 / 12
12. Soldering
Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2
sod962-2_fr
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
R0.025 (8×)
0.14
(2×)
0.2
(2×)
0.24
(2×)
0.4
0.85
0.4
Fig. 11. Reflow soldering footprint for DSN0603-2 (SOD962-2)
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 9 / 12
13. Revision history
Table 7. Revision history
Data sheet ID Release date Data sheet status Change notice Supersedes
PESD24VF1BSF v.1 20151211 Product data sheet - -
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 10 / 12
14. Legal information
14.1 Data sheet status
Document
status [1][2]
Product
status [3]
Definition
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nexperia.com.
14.2 Definitions
Preview — The document is a preview version only. The document is still
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Short data sheet — A short data sheet is an extract from a full data sheet
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 11 / 12
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14.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
© Nexperia B.V. 2017. All rights reserved
Nexperia PESD24VF1BSF
Ultra low capacitance bidirectional ESD protection diode
PESD24VF1BSF All information provided in this document is subject to legal disclaimers.
Product data sheet 11 December 2015 12 / 12
15. Contents
1 General description ............................................... 1
2 Features and benefits ............................................1
3 Applications ........................................................... 1
4 Quick reference data ............................................. 1
5 Pinning information ............................................... 1
6 Ordering information .............................................2
7 Marking ................................................................... 2
8 Limiting values .......................................................2
9 Characteristics .......................................................3
10 Application information .........................................6
11 Package outline ..................................................... 7
12 Soldering ................................................................ 8
13 Revision history ..................................................... 9
14 Legal information .................................................10
14.1 Data sheet status ............................................... 10
14.2 Definitions ...........................................................10
14.3 Disclaimers .........................................................10
14.4 Trademarks ........................................................ 11
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Date of release:
11 December 2015