LESHAN RADIO COMPANY, LTD.
S5–1/3
High –Speed Switching Diode
CASE 477– 02, STYLE 1
SOD– 323
1
2
MMDL914T1
2
ANODE
1
CATHODE
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage V R100 Vdc
Forward Current I F200 mAdc
Peak Forward Surge Current I FM(surge) 500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR-5 Board,* P D200 mW
T A = 25°C
Derate above 25°C 1.57 mW/°C
Thermal Resistance Junction to Ambient R θJA 635 °C/W
Junction and Storage Temperature T J , T stg 150 °C
**FR-4 Minimum Pad
DEVICE MARKING
MMDL914T1 = 5D
ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I R = 100 µAdc) V (BR) 100 — Vdc
Reverse Voltage Leakage Current I R
(V R = 20Vdc) — 25 nAdc
(V R = 75Vdc) — 5.0 µAdc
Diode V oltage C T— 4.0 pF
(V R =0, f =1.0MHz )
Forward Voltage V F— 1.0 Vdc
(I F = 10 mAdc)
Reverse Recovery Time t rr — 4.0 ns
(I F = I R = 10 mAdc ) (Figure 1)
LESHAN RADIO COMPANY, LTD.
S5–2/3
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (I F ) of 10mA.
Notes: 2. Input pulse is adjusted so I R(peak) is equal to 10mA.
Notes: 3. t p » t rr
Figure 1. Recovery Time Equivalent Test Circuit
+10 V 2.0 k
820 Ω
100 µH0.1µF
D U T
0.1 µF
50 Ω OUTPUT
PULSE
GENERATOR
t r
50 Ω INPUT
SAMPLING
OSCILLOSCOPE
t pt
10%
90%
I F
I R
t rr t
i R(REC) = 1.0 mA
OUTPUT PULSE
(I F = I R = 10 mA; MEASURED
at i R(REC) = 1.0 mA)
INPUT SIGNAL
I F
V R
MMDL914T1
T A = 85°C
V F , FORWARD VOLTAGE (VOLTS)
Figure 2. Forward Voltage V R , REVERSE VOLT AGE (VOLTS)
Figure 3. Leakage Current
V R , REVERSE VOLT AGE (VOLTS)
Figure 4. Capacitance
T A = –40°C
T A = 25°C
T A = 25°C
T A = 55°C
T A = 85°C
T A = 150°C
T A = 125°C
100
10
1.0
0.1 0.2 0.4 0.6 0.8 1.0 1.2
10
1.0
0.1
0.01
0.001 01020304050
I F , FORWARD CURRENT (mA)
I R , REVERSE CURRENT (µA)
0.68
0.64
0.60
0.56
0.52 0 0.2 0.4 0.6 0.8
C D , DIODE CAPACITANCE (pF)
LESHAN RADIO COMPANY, LTD.
S5–3/3
MMDL914T1
PACKAGE DIMENSIONS
SOD–323
PLASTIC P ACKAGE
CASE 477–02
ISSUE A
K
A
DB
12
J
NOTE 3
H
E
C
0.63 mm
0.025’’
1.60 mm
0.063’’
2.85 mm
0.112’’
0.83 mm
0.033’’
()
mm
inches
SOD–323
Soldering Footprint
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH
SOLDER PLA TING.
DIM MILLIMETERS INCHES
MIN MAX MIN MAX
A1.60 1.80 0.063 0.071
B1.15 1.35 0.045 0.053
C0.80 1.00 0.031 0.039
D0.25 0.40 0.010 0.016
E0.15 REF 0.006 REF
H0.00 0.10 0.000 0.004
J0.089 0.177 0.0035 0.0070
K2.30 2.70 0.091 0.106
STYLE 1:
PIN 1. CATHODE
2. ANODE
