LESHAN RADIO COMPANY, LTD. High -Speed Switching Diode MMDL914T1 1 CATHODE 1 2 ANODE 2 CASE 477- 02, STYLE 1 SOD- 323 MAXIMUM RATINGS Rating Reverse Voltage Forward Current Peak Forward Surge Current Symbol VR IF I FM(surge) Value 100 200 500 Unit Vdc mAdc mAdc Symbol PD Max 200 Unit mW R JA T J , T stg 1.57 635 150 mW/C C/W C THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR-5 Board,* T A = 25C Derate above 25C Thermal Resistance Junction to Ambient Junction and Storage Temperature **FR-4 Minimum Pad DEVICE MARKING MMDL914T1 = 5D ELECTRICAL CHARACTERISTICS (T A = 25C unless otherwise noted) Characteristic Symbol Min Max Unit V (BR) 100 -- Vdc -- -- 25 5.0 nAdc Adc CT -- 4.0 pF V -- 1.0 Vdc -- 4.0 ns OFFCHARACTERISTICS Reverse Breakdown Voltage (I R = 100 Adc) Reverse Voltage Leakage Current (V R = 20Vdc) (V R = 75Vdc) Diode Voltage (V R =0, f =1.0MHz ) Forward Voltage (I F = 10 mAdc) Reverse Recovery Time (I F = I R = 10 mAdc ) (Figure 1) IR F t rr S5-1/3 LESHAN RADIO COMPANY, LTD. MMDL914T1 2.0 k 820 +10 V 100 H IF 0.1 F tp tr 0.1F IF t t rr 10% t 90% DUT 50 OUTPUT PULSE GENERATOR 50 INPUT SAMPLING OSCILLOSCOPE i IR INPUT SIGNAL V R(REC) = 1.0 mA OUTPUT PULSE (I F = I R = 10 mA; MEASURED R at i R(REC) = 1.0 mA) Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (I F ) of 10mA. Notes: 2. Input pulse is adjusted so I R(peak) is equal to 10mA. Notes: 3. t p t rr Figure 1. Recovery Time Equivalent Test Circuit 100 10 I R , REVERSE CURRENT (A) T A = 85C T A = -40C 10 T A = 25C 1.0 0.1 T A = 125C 1.0 T A = 85C 0.1 T A = 55C 0.01 T A = 25C 0.001 0.2 0.4 0.6 0.8 1.0 0 1.2 10 20 30 40 V F , FORWARD VOLTAGE (VOLTS) V R , REVERSE VOLTAGE (VOLTS) Figure 2. Forward Voltage Figure 3. Leakage Current 50 0.68 C D , DIODE CAPACITANCE (pF) I F , FORWARD CURRENT (mA) T A = 150C 0.64 0.60 0.56 0.52 0 0.2 0.4 0.6 0.8 V R , REVERSE VOLTAGE (VOLTS) Figure 4. Capacitance S5-2/3 LESHAN RADIO COMPANY, LTD. MMDL914T1 PACKAGE DIMENSIONS SOD-323 PLASTIC PACKAGE CASE 477-02 ISSUE A K A D 2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. B MILLIMETERS INCHES DIM E C H J NOTE 3 A B C D E H J K MIN MAX 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 MIN MAX 0.063 0.071 0.045 0.053 0.031 0.039 0.010 0.016 0.006 REF 0.000 0.004 0.0035 0.0070 0.091 0.106 STYLE 1: PIN 1. CATHODE 2. ANODE 0.63 mm 0.025'' 1.60 mm 0.063'' 0.83 mm 0.033'' 2.85 mm 0.112'' ( mm inches ) SOD-323 Soldering Footprint S5-3/3