UC3714NG4 - Texas Instruments

UC1714/5

UC2714/5

UC3714/5

FEATURES

•Single Input (PWM and TTL

Compatible)

•High Current Power FET Driver, 1.0A

Source/2A Sink

•Auxiliary Output FET Driver, 0.5A

Source/1A Sink

•Time Delays Between Power and

Auxiliary Outputs Independently

Programmable from 50ns to 500ns

•Time Delay or True Zero-Voltage

Operation Independently Configurable

for Each Output

•Switching Frequency to 1MHz

•Typical 50ns Propagation Delays

•ENBL Pin Activates 220µA Sleep

Mode

•Power Output is Active Low in Sleep

Mode

•Synchronous Rectifier Driver

DESCRIPTION

These two families of high speed drivers are designed to provide drive

waveforms for complementary switches. Complementary switch configura-

tions are commonly used in synchronous rectification circuits and active

clamp/reset circuits, which can provide zero voltage switching. In order to

facilitate the soft switching transitions, independently programmable delays

between the two output waveforms are provided on these drivers. The de-

lay pins also have true zero voltage sensing capability which allows imme-

diate activation of the corresponding switch when zero voltage is applied.

These devices require a PWM-type input to operate and can be interfaced

with commonly available PWM controllers.

In the UC1714 series, the AUX output is inverted to allow driving a

p-channel MOSFET. In the UC1715 series, the two outputs are configured

in a true complementary fashion.

INPUT

ENBL

TIMER

VREF

TIMER

VREF

50ns –500ns

ENBL

VCC

GND

BIAS

1.4V

ENABLE

UC1714

ONLY

4AUX

2PWR

1VCC

LOGIC

GATES

TIMER

REF

3GND

BLOCK DIAGRAM

Complementary Switch FET Drivers

SLUS170A - FEBRUARY 1999 - REVISED JANUARY 2002

UDG-99028

Note: Pin numbers refer to J, N and D packages.

application

INFO

available

UC1714/5

UC2714/5

UC3714/5

ABSOLUTE MAXIMUM RATINGS

Supply Voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V

Power Driver IOH

continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −200mA

peak. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1A

Power Driver IOL

continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400mA

peak. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2A

Auxiliary Driver IOH

continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −100mA

peak . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −500mA

Auxiliary Driver IOL

continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200mA

peak. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A

Input Voltage Range (INPUT, ENBL) . . . . . . . . . . −0.3V to 20V

Storage Temperature Range . . . . . . . . . . . . . . −65°C to 150°C

Operating Junction Temperature (Note 1) . . . . . . . . . . . . 150°C

Lead Temperature (Soldering 10 seconds) . . . . . . . . . . . 300°C

Note 1: Unless otherwise indicated, voltages are referenced to

ground and currents are positive into, negative out of, the speci-

fied terminals.

Note 2: Consult Packaging Section of databook for thermal limi-

tations and specifications of packages.

CONNECTION DIAGRAMS

DIL-8, SOIC-8 (Top View)

J or N, D Packages

ELECTRICAL CHARACTERISTICS: Unless otherwise stated, VCC = 15V, ENBL ≥2V, RT1 = 100kΩfrom T1 to GND,

RT2 = 100kΩfrom T2 to GND, and −55°C < TA< 125°C for the UC1714/5, −40°C < TA< 85°C for the UC2714/5, and 0°C < TA<

70°C for the UC3714/5, TA=T

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

Overall

VCC 720V

ICC, nominal ENBL = 2.0V 18 24 mA

ICC, sleep mode ENBL = 0.8V 200 300 µA

Power Driver (PWR)

Pre Turn-on PWR Output, Low VCC = 0V, IOUT = 10mA, ENBL 0.8V 0.3 1.6 V

PWR Output Low, Sat. (VPWR) INPUT = 0.8V, IOUT = 40mA 0.3 0.8 V

INPUT = 0.8V, IOUT = 400mA 2.1 2.8 V

PWR Output High, Sat. (VCC −VPWR) INPUT = 2.0V, IOUT =−20mA 2.1 3 V

INPUT = 2.0V, IOUT =−200mA 2.3 3 V

Rise Time CL= 2200pF 30 60 ns

Fall Time CL= 2200pF 25 60 ns

T1 Delay, AUX to PWR INPUT rising edge, RT1 = 10kΩ(Note 4) 20 35 80 ns

T1 Delay, AUX to PWR INPUT rising edge, RT1 = 100kΩ(Note 4) 350 500 700 ns

PWR Prop Delay INPUT falling edge, 50% (Note 3) 35 100 ns

SOIC-16 (Top View)

DP Package

UC1714/5

UC2714/5

UC3714/5

ELECTRICAL CHARACTERISTICS: Unless otherwise stated, VCC = 15V, ENBL ≥2V, RT1 = 100kΩfrom T1 to GND,

RT2 = 100kΩfrom T2 to GND, and −55°C < TA< 125°C for the UC1714/5, −40°C < TA< 85°C for the UC2714/5, and 0°C < TA<

70°C for the UC3714/5, TA=T

PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

Auxiliary Driver (AUX)

AUX Output Low, Sat (VAUX)VIN = 2.0V, IOUT = 20mA 0.3 0.8 V

VIN = 2.0V, IOUT = 200mA 1.8 2.6 V

AUX Output High, Sat (VCC –V

AUX)V

IN = 0.8V, IOUT = -10mA 2.1 3.0 V

VIN = 0.8V, IOUT = -100mA 2.3 3.0 V

Rise Time CL= 1000pF 45 60 ns

Fall Time CL= 1000pF 30 60 ns

T2 Delay, PWR to AUX INPUT falling edge, RT2 = 10kΩ(Note 4) 20 50 80 ns

T2 Delay, PWR to AUX INPUT falling edge, RT2 = 100kΩ(Note 4) 250 350 550 ns

AUX Prop Delay INPUT rising edge, 50% (Note 3) 35 80 ns

Enable (ENBL)

Input Threshold 0.8 1.2 2.0 V

Input Current, IIH ENBL = 15V 1 10 µA

Input Current, IIL ENBL = 0V −1−10 µA

Current Limit T1 = 0V −1.6 −2mA

Nominal Voltage at T1 2.7 3 3.3 V

Minimum T1 Delay T1 = 2.5V, (Note 4) 40 70 ns

Current Limit T2 = 0V −1.2 −2mA

Nominal Voltage at T2 2.7 3 3.3 V

Minumum T2 Delay T2 = 2.5V, (Note 4) 50 100 ns

Input (INPUT)

Input Threshold 0.8 1.4 2.0 V

Input Current, IIH INPUT = 15V 1 10 µA

Input Current, IIL INPUT = 0V −5−20 µA

Note 3: Propagation delay times are measured from the 50% point of the input signal to the 10% point of the output signal’s transi-

tion with no load on outputs.

Note 4: T1 delay is defined from the 50% point of the transition edge of AUX to the 10% of the rising edge of PWR. T2 delay is de-

fined from the 90% of the falling edge of PWR to the 50% point of the transition edge of AUX.

PIN DESCRIPTIONS

AUX: The AUX switches immediately at INPUT’s rising

edge but waits through the T2 delay after INPUT’s falling

edge before switching. AUX is capable of sourcing 0.5A

and sinking 1.0A of drive current. See the Time Relation-

ships diagram below for the difference between the

UC1714 and UC1715 for INPUT, MAIN, and AUX. During

sleep mode, AUX is inactive with a high impedance.

ENBL: The ENBL input switches at TTL logic levels (ap-

proximately 1.2V), and its input range is from 0V to 20V.

The ENBL input will place the device into sleep mode

when it is a logical low. The current into VCC during the

sleep mode is typically 220µA.

GND: This is the reference pin for all input voltages and

the return point for all device currents. It carries the full

peak sinking current from the outputs. Any tendency for

the outputs to ring below GND voltage must be damped

or clamped such that GND remains the most negative

potential.

UC1714/5

UC2714/5

UC3714/5

INPUT: The input switches at TTL logic levels (approxi-

mately 1.4V) but the allowable range is from 0V to 20V,

allowing direct connection to most common IC PWM con-

troller outputs. The rising edge immediately switches the

AUX output, and initiates a timing delay, T1, before

switching on the PWR output. Similarly, the INPUT falling

edge immediately turns off the PWR output and initiates

a timing delay, T2, before switching the AUX output.

It should be noted that if the input signal comes from a

controller with FET drive capability, this signal provides

another option. INPUT and PWR provide a delay only at

the leading edge while INPUT and AUX provide the delay

at the trailing edge.

PWR: The PWR output waits for the T1 delay after the

INPUT’s rising edge before switching on, but switches off

immediately at INPUT’s falling edge (neglecting propaga-

tion delays). This output is capable of sourcing 1A and

sinking 2A of peak gate drive current. PWR output in-

cludes a passive, self-biased circuit which holds this pin

active low, when ENBL ≥0.8V regardless of VCC’s volt-

age.

T1: A resistor to ground programs the time delay be-

tween AUX switch turn-off and PWR turn-on.

T2: This pin functions in the same way as T1 but controls

the time delay between PWR turn-off and activation of

the AUX switch.

T1, T2: The resistor on each of these pins sets the

charging current on internal timing capacitors to provide

independent time control. The nominal voltage level at

each pin is 3V and the current is internally limited to

1mA. The total delay from INPUT to each output includes

a propagation delay in addition to the programmable

timer but since the propagation delays are approximately

equal, the relative time delay between the two outputs

can be assumed to be solely a function of the pro-

grammed delays. The relationship of the time delay vs.

RT is shown in the Typical Characteristics curves.

Either or both pins can alternatively be used for voltage

sensing in lieu of delay programming. This is done by

pulling the timer pins below their nominal voltage level

which immediately activates the timer output.

VCC: The VCC input range is from 7V to 20V. This pin

should be bypassed with a capacitor to GND consistent

with peak load current demands.

PIN DESCRIPTIONS (cont.)

PROPAGATION

DELAYS

INPUT

PWR OUTPUT

T1 DELAY T2 DELAY

UC1714 AUX OUTPUT

UC1715 AUX OUTPUT

TYPICAL CHARACTERISTICS

Time relationships. (Notes 3, 4)

UDG-99027

100

200

300

400

500

0 102030405060708090100

RT (kW)

DELAY (ns)

T1 vs RT1 T2 vs RT2

T1 Delay, T2 Delay vs. R

UC1714/5

UC2714/5

UC3714/5

0 102030405060708090100

RT(kΩ)

Icc (mA)

ICC vs RTwith Opposite RT= 50k

100

200

300

400

500

600

-75 -50 -25 0 25 50 75 100 125

Temperature (°C)

Deadband Delay (ns)

RT1 = 100k

RT1 = 50k

RT1 = 10k

RT1 < 6k

T1 Deadband vs. Temperature AUX to PWR

Figure 1. Typical application with timed delays.

TYPICAL APPLICATIONS

UDG-94011

Figure 2. Using the timer input for

zero-voltage sensing.

UDG-94012

100

200

300

400

500

600

-75 -50 -25 0 25 50 75 100 125

Temperature (°C)

Deadband Delay (ns)

RT2 = 100k

RT2 = 50k

RT2 = 10k

RT2 < 6k

T2 Deadband vs. Temperature PWR to AUX

0 100 200 300 400 500 600 700 800 9001000

Switching Frequency (kHz)

Icc (mA)

TYPICAL CHARACTERISTICS (cont.)

ICC vs Switching Frequency with No Load and 50%

Duty Cycle RT1 = RT2 = 50k

UC1714/5

UC2714/5

UC3714/5

Figure 5. Synchronous rectifier application with a charge pump to drive the high-side n-channel buck switch.

VIN is limited to 10V as VCC will rise to approximately 2VIN.

UDG-94014-1

Figure 4. Using the UC1715 as a complementary synchronous rectifier switch driver with n-channel FETs

UDG-94015-2

Figure 3. Self-actuated sleep mode with the absence of an input PWM signal. Wake up occurs with the first

pulse while turn-off is determined by the (RTO CTO) time constant.

TYPICAL APPLICATIONS (cont.)

UDG-94013

UC1714/5

UC2714/5

UC3714/5

Figure 7. Using an N-channel active reset switch with a floating drive command.

UDG-94017-1

Figure 6. Typical forward converter topology with active reset provided by the UC1714 driving an N-channel

switch (Q1) and a P-channel auxilliary switch (Q2).

TYPICAL APPLICATIONS (cont.)

UDG-94016-1

PACKAGE OPTION ADDENDUM

www.ti.com 17-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

UC1714J OBSOLETE CDIP J 8 TBD Call TI Call TI

UC1715J OBSOLETE CDIP J 8 TBD Call TI Call TI

UC1715J883B OBSOLETE CDIP J 8 TBD Call TI Call TI

UC2714D ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC2714DG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC2714DTR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC2714DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC2714J OBSOLETE CDIP J 8 TBD Call TI Call TI

UC2714N ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2714NG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2715D ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC2715DG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC2715DP ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2715DPG4 ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2715DTR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2715DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2715N ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2715NG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

PACKAGE OPTION ADDENDUM

www.ti.com 17-Aug-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

UC3714D ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC3714DG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC3714DTR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC3714DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC3714N ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3714NG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3715D ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3715DG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3715DP ACTIVE SOIC D 16 TBD Call TI Call TI

UC3715DPG4 ACTIVE SOIC D 16 TBD Call TI Call TI

UC3715DTR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC3715DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-250C-1 YEAR

UC3715N ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3715NG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

PACKAGE OPTION ADDENDUM

www.ti.com 17-Aug-2012

Addendum-Page 3

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC1714, UC1715, UC2714, UC2714M, UC3714, UC3715 :

•Catalog: UC3714, UC3715, UC2714

•Military: UC2714M, UC1714, UC1715

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

UC2714DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UC2715DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UC3714DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

UC3715DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

UC2714DTR SOIC D 8 2500 367.0 367.0 35.0

UC2715DTR SOIC D 8 2500 367.0 367.0 35.0

UC3714DTR SOIC D 8 2500 367.0 367.0 35.0

UC3715DTR SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

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