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Intel® Server Board S1200KP

Technical Product Specification

Intel order number G38894-002

Revision 1.1

April, 2012

Enterprise Platforms and Services Division – Marketing

Revision History Error! No text of specified style in document. TPS

Intel Confidential Revision 1.1

Intel order number G38894-002

Revision History

Date

Revision Number

Modifications

July 2011

1.0

Initial release.

April 2012

1.1

Added info for DBS1200KPR and BBS1200KPR.

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express

or implied, by estoppel or otherwise, to any intellectual property rights is granted by this

document. Except as provided in Intel®’s Terms and Conditions of Sale for such products, Intel®

assumes no liability whatsoever, and Intel® disclaims any express or implied warranty, relating

to sale and/or use of Intel® products including liability or warranties relating to fitness for a

particular purpose, merchantability, or infringement of any patent, copyright or other intellectual

property right. Intel® products are not intended for use in medical, life-saving, or life sustaining

applications. Intel® may make changes to specifications and product descriptions at any time,

without notice.

Designers must not rely on the absence or characteristics of any features or instructions

marked “reserved” or “undefined”. Intel® reserves these for future definition and shall have no

responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

This document contains information on products in the design phase of development. Do not

finalize a design with this information. Revised information will be published when the product is

available. Verify with your local sales office that you have the latest datasheet before finalizing

a design.

The server boards/chassis referenced in this document may contain design defects or errors

known as errata which may cause the product to deviate from published specifications. Current

characterized errata are available on request.

Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Intel® Server Board S1200KP TPS Table of Contents

Intel Confidential

iii

Table of Contents

1. Introduction......................................................................................................1

1.1 Intended Audience ....................................................................................................... 1

1.2 What This Document Contains ..................................................................................... 1

1.3 Typographical Conventions .......................................................................................... 1

2. Product Description ........................................................................................3

2.1 Overview ...................................................................................................................... 3

2.1.1 Feature Summary .......................................................................................... 3

2.1.2 Board Layout .................................................................................................. 5

2.1.3 Block Diagram ................................................................................................ 7

2.2 Online Support ............................................................................................................. 7

2.3 Processor ..................................................................................................................... 8

2.3.1 PCI Express* x16 Graphics ............................................................................ 8

2.4 System Memory ......................................................................................................... 10

2.4.1 Memory Configurations ................................................................................ 11

2.5 Intel® C206 Chipset .................................................................................................... 13

2.6 Graphics Subsystem .................................................................................................. 13

2.6.1 Integrated Graphics ..................................................................................... 13

2.6.2 USB ............................................................................................................. 13

2.7 SATA Interfaces ......................................................................................................... 14

2.8 Real-Time Clock Subsystem ...................................................................................... 15

2.9 Legacy I/O Controller ................................................................................................. 15

2.10 LAN Subsystem .......................................................................................................... 16

2.10.1 Intel® 82574L Gigabit Ethernet Controller ..................................................... 16

2.10.2 Intel® 82579LM Gigabit Ethernet Controller .................................................. 16

2.10.3 LAN Subsystem Software ............................................................................ 17

2.10.4 RJ-45 LAN Connector with Integrated LEDs ................................................ 17

2.11 Hardware Management Subsystem ............................................................................ 18

2.11.1 Hardware Monitoring .................................................................................... 18

2.11.2 Fan Monitoring ............................................................................................. 18

2.11.3 Chassis Intrusion and Detection ................................................................... 18

2.11.4 Thermal Monitoring ...................................................................................... 19

2.12 Power Management ................................................................................................... 20

2.12.1 ACPI ............................................................................................................ 20

2.12.2 Hardware Support ........................................................................................ 22

3. Technical Reference......................................................................................27

3.1 Memory Resources .................................................................................................... 27

3.1.1 Addressable Memory ................................................................................... 27

3.1.2 Memory Map ................................................................................................ 29

3.2 Connectors and Headers ............................................................................................ 29

3.2.1 Back Panel Connectors ................................................................................ 29

3.2.2 Component-side Connectors and Headers .................................................. 30

3.3 Jumper Block ............................................................................................................. 38

3.4 Mechanical Considerations ......................................................................................... 39

Table of Contents Intel® Server Board S1200KP TPS

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Intel order number G38894-002

3.4.1 Form Factor ................................................................................................. 39

3.5 Electrical Considerations ............................................................................................ 40

3.5.1 Power Supply Considerations ...................................................................... 40

3.5.2 Fan Header Current Capability ..................................................................... 41

3.5.3 Add-in Board Considerations ....................................................................... 41

3.6 Thermal Considerations ............................................................................................. 41

3.7 Reliability .................................................................................................................... 44

3.8 Environmental ............................................................................................................ 44

4. Overview of BIOS Features ..........................................................................45

4.1 Introduction ................................................................................................................ 45

4.2 BIOS Flash Memory Organization .............................................................................. 46

4.3 System Management BIOS (SMBIOS) ....................................................................... 46

4.4 Legacy USB Support .................................................................................................. 46

4.5 BIOS Updates ............................................................................................................ 47

4.5.1 Language Support ....................................................................................... 47

4.5.2 Custom Splash Screen ................................................................................ 47

4.6 BIOS Recovery ........................................................................................................... 48

4.6.1 Recovery with USB Thumb Drive or CD-ROM ............................................. 48

4.7 Boot Options .............................................................................................................. 48

4.7.1 Optical Drive Boot ........................................................................................ 49

4.7.2 Network Boot ............................................................................................... 49

4.7.3 Booting Without Attached Devices ............................................................... 49

4.7.4 Changing the Default Boot Device During POST ......................................... 49

4.8 Adjusting Boot Speed ................................................................................................. 49

4.8.1 Peripheral Selection and Configuration ........................................................ 49

4.8.2 BIOS Boot Optimizations ............................................................................. 50

4.9 BIOS Security Features .............................................................................................. 50

5. Error Messages and Beep Codes ................................................................52

5.1 Speaker ...................................................................................................................... 52

5.2 BIOS Beep Codes ...................................................................................................... 52

5.3 Front-panel Power LED Blink Codes .......................................................................... 53

5.4 BIOS Error Messages ................................................................................................ 53

5.5 Port 80h POST Codes ................................................................................................ 53

Intel® Server Board S1200KP TPS List of Figures

Intel Confidential

List of Figures

Figure 1. Major Board Components ............................................................................................ 5

Figure 2. Block Diagram ............................................................................................................. 7

Figure 3. Memory Channel and DIMM Configuration ................................................................ 12

Figure 4. LAN Connector LED Locations .................................................................................. 17

Figure 5. Thermal Sensors and Fan Headers ........................................................................... 19

Figure 6. Location of the Standby Power LED .......................................................................... 25

Figure 7. Detailed System Memory Address Map ..................................................................... 28

Figure 8. Back Panel Connectors ............................................................................................. 30

Figure 9. Component-side Connectors and Headers ................................................................ 31

Figure 10. Connection Diagram for Front Panel Header ........................................................... 35

Figure 11. Connection Diagram for Front Panel USB 2.0 Headers ........................................... 36

Figure 12. Location of the Jumper Block ................................................................................... 38

Figure 13. Board Dimensions .................................................................................................... 40

Figure 14. Localized High Temperature Zones ......................................................................... 43

List of Tables Intel® Server Board S1200KP TPS

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Intel order number G38894-002

List of Tables

Table 1. Feature Summary ......................................................................................................... 3

Table 2. Components Shown in Figure 1 .................................................................................... 6

Table 3. Reference URLs for Online Suppot ............................................................................... 7

Table 4. Information on Supported Processors ........................................................................... 8

Table 5. Information on PCI Express* Technology ...................................................................... 9

Table 6. Supported Memory Configurations .............................................................................. 10

Table 7. Information on System Memory .................................................................................. 10

Table 8. Information on Resouces Used by the Chipset ........................................................... 13

Table 9. DVI Port Status Conditions .......................................................................................... 13

Table 10. Information on USB Connectors ................................................................................ 14

Table 11. Information on SATA Connector Locations ............................................................... 14

Table 12. Information on LAN Software and Drivers ................................................................. 16

Table 13. Information on Obtaining LAN Software and Drivers ................................................. 17

Table 14. LAN Connector LED States ....................................................................................... 18

Table 15. Information on the Function of the Fan Headers ....................................................... 18

Table 16. Information on the Chassis Intrusion Headers ........................................................... 18

Table 17. Effects of Pressing the Power Switch ........................................................................ 20

Table 18. Power States and Targeted System Power ............................................................... 21

Table 19. Wake-up Devices and Events ................................................................................... 21

Table 20. Information on Power Connector Locations ............................................................... 22

Table 21. Information of the Fan Headers’ Locations ................................................................ 23

Table 22. System Memory Map ................................................................................................ 29

Table 23. Component-side Connectors and Headers Shown in Figure 9 .................................. 32

Table 24. Front Panel USB 2.0 Headers ................................................................................... 32

Table 25. SATA Connectors ..................................................................................................... 32

Table 26. Chassis Intrusion Header .......................................................................................... 33

Table 27. Processor and System (4-Pin) Fan Headers ............................................................. 33

Table 28. Processor Core Power Connector ............................................................................. 33

Table 29. Main Power Connector .............................................................................................. 33

Table 30. Front Panel Header ................................................................................................... 34

Table 31. States for a One-Color Power LED ........................................................................... 35

Table 32. States for a Two-Color Power LED ........................................................................... 35

Table 33. Alternate Front Panel Power/Sleep LED Header ....................................................... 36

Table 34. LPC Debug Header ................................................................................................... 37

Table 35. BIOS Setup Configuration Jumper Settings .............................................................. 39

Table 36. Recommended Power Supply Current Values .......................................................... 41

Table 37. Fan Header Current Capability .................................................................................. 41

Table 38. Thermal Considerations for Components .................................................................. 43

Table 39. Tcontrol Values for Components ............................................................................... 43

Table 40. Environmental Specifications .................................................................................... 44

Table 41. BIOS Setup Program Menu Bar ................................................................................ 45

Table 42. BIOS Setup Program Function Keys ......................................................................... 45

Table 43. Information on Integrator Toolkit and Software Tools ................................................ 47

Table 44. Acceptable Drives/Media Types for BIOS Recovery .................................................. 48

Table 45. Boot Device Menu Options ........................................................................................ 49

Table 46. Supervisor and User Password Functions ................................................................. 51

Intel® Server Board S1200KP TPS List of Tables

Intel Confidential

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Table 47. Information about Onboard Speaker ......................................................................... 52

Table 48. BIOS Beep Codes ..................................................................................................... 52

Table 49. Front-panel Power LED Blink Codes ......................................................................... 53

Table 50. BIOS Error Messages ............................................................................................... 53

Table 51. Port 80h POST Code Ranges ................................................................................... 54

Table 52. Port 80h POST Codes .............................................................................................. 54

Table 53. Typical Port 80h POST Sequence ............................................................................. 57

List of Tables Intel® Server Board S1200KP TPS

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Intel® Server Board S1200KP TPS Introduction

Revision 1.1

Intel order number G38894-002

1. Introduction

This Technical Product Specification (TPS) specifies the board layout, components, connectors,

power and environmental requirements, and the BIOS for Intel® Server Board S1200KP.

1.1 Intended Audience

The TPS is intended to provide detailed, technical information about Intel® Server Board

S1200KP and its components to the vendors, system integrators, and other engineers and

technicians who need this level of information. It is specifically not intended for

general audiences.

1.2 What This Document Contains

Chapter

Description

A description of the hardware used on Intel® Server Board S1200KP.

A map of the resources of the Intel® Server Board.

The features supported by the BIOS Setup program.

Descriptions of the BIOS error messages, beep codes, and POST codes.

1.3 Typographical Conventions

This section contains information about the conventions used in this specification. Not all of

these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

Note: Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Other Common Notation

Used after a signal name to identify an active-low signal (such as USBP0#).

Gigabyte (1,073,741,824 bytes).

GB/s

Gigabytes per second.

Gb/s

Gigabits per second.

Kilobyte (1024 bytes).

Kbit

Kilobit (1024 bits).

kbits/s

1000 bits per second.

Megabyte (1,048,576 bytes).

MB/s

Megabytes per second.

Mbit

Megabit (1,048,576 bits).

Introduction Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

Mbits/s

Megabits per second.

xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Intel® Server Board S1200KP TPS Product Description

Revision 1.1

Intel order number G38894-002

2. Product Description

2.1 Overview

2.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Feature

Description

Form Factor

Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])

Processor

 Intel® Xeon® E3-1200 Processors, the 2nd Generation Intel® Core™ i3

Processors, Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel®

Core™ i3 Processors with up to 95W TDP in an LGA1155 socket 1, 2

o One PCI Express* 2.0 x16 (with Intel® Xeon® E3-1200 Processors or the

2nd Generation Intel® Core™ i3 Processors) or PCI Express* 3.0 x 16

(with Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel®

Core™ i3 Processors) graphics interface

o Integrated memory controller with dual channel DDR3 memory support

o Integrated graphics processing (processors with Intel® Graphics

Technology)

Memory

 Two 240-pin DDR3 DRAM Dual Inline Memory Module (DIMM) sockets

 Support for DDR3 1066/1333 MHz (with Intel® Xeon® E3-1200 Processors or

the 2nd Generation Intel® Core™ i3 Processors) or DDR3 1333/1600 MHz (with

Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel® Core™ i3

Processors) DIMMs

 Support for 1Gb, 2Gb, and 4Gb memory technology

 Support for up to 16 GB of system memory with two DIMMs using 4 Gb

memory technology

 Support for ECC and non-ECC memory3

Chipset

Intel® C206 Platform Controller Hub (PCH) Chipset

Graphics

 Integrated graphics support for processors with Intel® Graphics Technology:

o DVI-I

 Discrete graphics support for PCI Express* 2.0 x16 (with Intel® Xeon® E3-1200

Processors or the 2nd Generation Intel® Core™ i3 Processors) or PCI Express*

3.0 x 16 (with Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel®

Core™ i3 Processors) add-in graphics card

Peripheral Interfaces

 Eight USB 2.0 ports:

o Four ports are implemented with stacked back panel connectors (black)

o Four front panel ports implemented through three internal headers

 Two SATA 6.0Gb/s interfaces through Intel® C206 Chipset with Intel® Rapid

Storage Technology RAID support (blue)

 Two SATA 3.0Gb/s interfaces through Intel® C206 Chipset with Intel® Rapid

Storage Technology RAID support (black)

Expansion

Capabilities

 One PCI Express* 2.0 x16 (with Intel® Xeon® E3-1200 Processors or the 2nd

Generation Intel® Core™ i3 Processors) or PCI Express* 3.0 x 16 (with Intel®

Xeon® E3-1200 V2 Processors or the 3rd Generation Intel® Core™ i3

Processors) add-in card connector

Product Description Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

Feature

Description

BIOS

 Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device

 Support for Advanced Configuration and Power Interface (ACPI), Plug and

Play, and System Management BIOS (SMBIOS)

Instantly Available PC

Technology

 Support for PCI Express* Revision 2.0 (with Intel® Xeon® E3-1200 Processors

or the 2nd Generation Intel® Core™ i3 Processors) or PCI Express* Revision

3.0 (with Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel®

Core™ i3 Processors)

 Suspend to RAM support

 Wake on PCI Express*, LAN, front panel, and USB ports

LAN Support

 Gigabit (10/100/1000Mbits/s) LAN subsystem using the Intel® 82574 and 82579

Gigabit Ethernet Controller

Legacy I/O Control

 Nuvoton* W83677HG-i I/O controller for hardware management support

Hardware Monitor

Subsystem

 Hardware monitoring through the Nuvoton I/O controller

 Voltage sense to detect out of range power supply voltages

 Thermal sense to detect out of range thermal values

 Two fan headers

 Two fan sense inputs used to monitor fan activity

 Fan speed control

Notes:

1. Pairing a mini-ITX chassis and more than 65W TDP processor with the supplied standard Intel®

thermal solution may not meet Intel®’s thermal requirement standard. Please verify that your thermal

solution and chassis will meet the necessary thermal requirements. Failing to do so may cause the

processor to throttle, significantly decreasing system performance.

2. The product codes of DBS1200KP and BBS1200KP can only support Intel® Xeon® E3-1200

Processors or the 2nd Generation Intel® Core™ i3 Processors. The product codes of DBS1200KPR

and BBS1200KPR can support Intel® Xeon® E3-1200 Processors, the 2nd Generation Intel® Core™ i3

Processors, Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel® Core™ i3 Processors.

3. ECC DIMMS are recommended to use for server system.

Intel® Server Board S1200KP TPS Product Description

Revision 1.1

Intel order number G38894-002

2.1.2 Board Layout

Following figure shows the location of the major components on Intel® Server Board S1200KP:

Figure 1. Major Board Components

Product Description Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item/callout

Description

Back panel connectors

Processor core power connector (2 x 2)

Front panel USB 2.0 header

BIOS Setup configuration jumper block

SATA connectors

Intel® C206 Chipset

Front panel USB 2.0 header

Main power connector (2 x 12)

Front panel header

DIMM 1 (Channel A DIMM 1)

DIMM 2 (Channel B DIMM 1)

Alternate front panel power LED header

Piezoelectric speaker

Standby power LED

Processor fan header

LGA1155 processor socket

PCI Express* x16 bus add-in card connector

Low Pin Count (LPC) Debug header

Chassis intrusion header

System fan header

Battery

Intel® Server Board S1200KP TPS Product Description

Revision 1.1

Intel order number G38894-002

2.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

2.2 Online Support

Table 3. Reference URLs for Online Suppot

To find information about

Visit this World Wide Web site:

Intel® Server Board S1200KP

http://www.intel.com/products/server

Supported processors and tested memory

http://serverconfigurator.intel.com

BIOS and driver updates

http://downloadcenter.intel.com

Product Description Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

2.3 Processor

The board is designed to support the Intel® Xeon® E3-1200 Processors, the 2nd Generation

Intel® Core™ i3 Processors, Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel®

Core™ i3 Processors in an LGA1155 socket.

Other processors may be supported in the future. This board is designed to support processors

with a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed above

are only supported when falling within the wattage requirements of Intel® Server Board

S1200KP. See the Intel® web site listed below for the most up-to-date list of

supported processors.

Table 4. Information on Supported Processors

For information about

Refer to:

Supported processors

http://serverconfigurator.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can

damage the board, the processor, and the power supply.

Notes:

1. The product codes of DBS1200KP and BBS1200KP can only support Intel® Xeon® E3-1200

Processors or the 2nd Generation Intel® Core™ i3 Processors. The product codes of

DBS1200KPR and BBS1200KPR can support Intel® Xeon® E3-1200 Processors, the 2nd

Generation Intel® Core™ i3 Processors, Intel® Xeon® E3-1200 V2 Processors or the 3rd

Generation Intel® Core™ i3 Processors.

2. This board has specific requirements for providing power to the processor. Refer to Section

3.5.1 on page 40 for information on power supply requirements for this board.

3. Pairing a mini-ITX chassis and more than 65W TDP processor with the supplied standard

Intel® thermal solution may not meet Intel®’s thermal requirement standard. Please verify

that your thermal solution and chassis will meet the necessary thermal requirements.

Failing to do so may cause the processor to throttle, significantly decreasing system

performance.

2.3.1 PCI Express* x16 Graphics

The Intel® Xeon® E3-1200 Processors or the 2nd Generation Intel® Core™ i3 Processors in an

LGA1155 socket support discrete add in graphics cards through the PCI Express* 2.0 x16

graphics connector. And the Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel®

Core™ i3 Processors in an LGA1155 socket support discrete add in graphics cards through the

PCI Express* 3.0 x16 graphics connector:

 Supports PCI Express* GEN3 frequency of 8 GHz resulting in 8.0 Gb/s each direction

(1 GB/s) per lane. The maximum theoretical bandwidth on the interface is 16 GB/s in

each direction, simultaneously, for an aggregate of 32 GB/s when operating in x16

GEN3 mode.

Intel® Server Board S1200KP TPS Product Description

Revision 1.1

Intel order number G38894-002

 Supports PCI Express* GEN2 frequency of 5 GHz resulting in 5.0 Gb/s each direction

(500 MB/s) per lane. The maximum theoretical bandwidth on the interface is 8 GB/s in

each direction, simultaneously, for an aggregate of 16 GB/s when operating in x16

GEN2 mode.

 Supports PCI Express* GEN1 frequency of 2.5 GHz resulting in 2.5 Gb/s each

direction (250 MB/s) per lane. The maximum theoretical bandwidth on the interface is

4 GB/s in each direction, simultaneously, for an aggregate of 8 GB/s when operating

in x16 GEN1 mode.

Table 5. Information on PCI Express* Technology

For information about

Refer to

PCI Express* technology

http://www.pcisig.com

Product Description Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

2.4 System Memory

The board has two DIMM sockets and supports the following memory features:

 1.5 V DDR3 DRAM DIMMs with gold plated contacts.

 Two independent memory channels with interleaved mode support

 Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMs with x16 organization are not supported.

 16 GB maximum total system memory (with 4 Gb memory technology). Refer to

Section 3.1.1 on page 27 for information on the total amount of addressable memory.

 Minimum recommended total system memory: 512 MB

 ECC and Non-ECC DIMMs

 Serial Presence Detect

 Support for DDR3 1066/1333 MHz (with Intel® Xeon® E3-1200 Processors or the 2nd

Generation Intel® Core™ i3 Processors) or DDR3 1333/1600 MHz (with Intel® Xeon®

E3-1200 V2 Processors or the 3rd Generation Intel® Core™ i3 Processors) DIMMs

Notes:

1. To be fully compliant with all applicable DDR DRAM memory specifications, the board

should be populated with DIMMs that support the Serial Presence Detect (SPD) data

structure. This allows the BIOS to read the SPD data and program the chipset to accurately

configure memory settings for optimum performance. If non-SPD memory is installed, the

BIOS will attempt to correctly configure the memory settings, but performance and reliability

may be impacted or the DIMMs may not function under the determined frequency.

2. ECC DIMMS are recommended to use for server system.

Table 6 lists the supported DIMM configurations.

Table 6. Supported Memory Configurations

DIMM

Capacity

Configuration

(Note)

DRAM Density

DRAM Organization

Front-side/Back-side

Number of DRAM Devices

Non-ECC/ECC

512 MB

1 Gbit

1 Gb x16/empty

4/NA

1024 MB

1 Gbit

1 Gb x8/empty

8/9

2048 MB

1 Gbit

1 Gb x8/1 Gb x8

16/18

2048 MB

2 Gbit

2 Gb x8/empty

8/9

4096 MB

2 Gbit

2 Gb x8/2 Gb x8

16/18

8192 MB

4 Gbit

4 Gb x8/4Gb x8

16/18

Note: “DS” refers to double-sided memory modules (containing two rows of DRAM) and “SS” refers to

single-sided memory modules (containing one row of DRAM).

Table 7. Information on System Memory

For information about

Refer to:

Tested Memory

http://serverconfigurator.intel.com

Intel® Server Board S1200KP TPS Product Description

Revision 1.1

Intel order number G38894-002

2.4.1 Memory Configurations

The Intel® Xeon® E3-1200 Processors, the 2nd Generation Intel® Core™ i3 Processors, Intel®

Xeon® E3-1200 V2 Processors or the 3rd Generation Intel® Core™ i3 Processors in the

LGA1155 socket support the following types of memory organization:

 Dual channel (Interleaved) mode. This mode offers the highest throughput for real

world applications. Dual channel mode is enabled when the installed memory

capacities of both DIMM channels are equal. Technology and device width can vary

from one channel to the other but the installed memory capacity for each channel

must be equal. If different speed DIMMs are used between channels, the slowest

memory timing will be used.

 Single channel (Asymmetric) mode. This mode is equivalent to single channel

bandwidth operation for real world applications. This mode is used when only a single

DIMM is installed or the memory capacities are unequal. Technology and device width

can vary from one channel to the other. If different speed DIMMs are used between

channels, the slowest memory timing will be used.

 Flex mode. This mode provides the most flexible performance characteristics. The

bottommost DRAM memory (the memory that is lowest within the system memory

map) is mapped to dual channel operation; the topmost DRAM memory (the memory

that is nearest to the 8 GB address space limit), if any, is mapped to single channel

operation. Flex mode results in multiple zones of dual and single channel operation

across the whole of DRAM memory. To use flex mode, it is necessary to populate

both channels.

Product Description Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

Note: The Intel® Xeon® E3-1200 Processors, the 2nd Generation Intel® Core™ i3 Processors,

Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel® Core™ i3 Processors require

memory to be populated in the DIMM_A1 (Channel A, DIMM 1) socket.

Intel® Server Board S1200KP TPS Product Description

Revision 1.1

Intel order number G38894-002

2.5 Intel® C206 Chipset

Intel® C206 Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the

processor and the USB, SATA, LPC, LAN and PCI Express* interfaces. The Intel® C206

Chipset is a centralized controller for the board’s I/O paths.

Table 8. Information on Resouces Used by the Chipset

For information about

Refer to

Resources used by the chipset

Chapter 2

2.6 Graphics Subsystem

The board supports graphics through either Intel® Graphics Technology or a PCI Express* 2.0

x16 (with Intel® Xeon® E3-1200 Processors or the 2nd Generation Intel® Core™ i3 Processors)

or PCI Express* 3.0 x 16 (with Intel® Xeon® E3-1200 V2 Processors or the 3rd Generation Intel®

Core™ i3 Processors) add-in graphics card.

2.6.1 Integrated Graphics

The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI)

for processors with Intel® Graphics Technology.

2.6.1.1 Digital Visual Interface (DVI-I)

The DVI-I port supports both digital and analog DVI displays. The maximum supported

resolution is 1900 x 1200 (WUXGA). The DVI port is compliant with the DVI 1.0 specification.

DVI analog output can also be converted to VGA using a DVI-VGA converter.

Depending on the type of add-in card installed in the PCI Express* x16 connector, the DVI port

will behave as described in Table 9.

Table 9. DVI Port Status Conditions

PCI Express* x16 Connector Status

DVI Digital (DVI-D) Port

Status

DVI Analog (DVI-A) Port

Status(Note 1)

No add-in card installed

Enabled

Non-video PCI Express* x1 add-in card

installed

Enabled

PCI Express* x16 add-in card installed

Enabled

Enabled (Note 2)

Notes:

1. DVI analog output can also be converted to VGA with a DVI-VGA converter.

2. May require BIOS setup menu changes.

2.6.2 USB

The board supports up to eight USB 2.0 ports.

Product Description Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

The Intel® C206 Chipset provides the USB controller for the 2.0 ports. The port arrangement is

as follows:

 Four USB 2.0 ports are implemented with stacked back panel connectors (black)

 Four USB 2.0 front panel ports implemented through three internal headers

All eight USB ports are high-speed, full-speed, and low-speed capable.

Note: Computer systems that have an unshielded cable attached to a USB port may not meet

FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that

meets the requirements for full-speed devices.

Table 10. Information on USB Connectors

For information about

Refer to

The location of the USB connectors on the back panel

Figure 8, page 30

The location of the front panel USB headers

Figure 9, page 31

2.7 SATA Interfaces

The board provides five SATA connectors through the PCH, which support one device per

connector:

 Two internal SATA 6.0 Gb/s connectors (blue)

 Two internal SATA 3.0 Gb/s connectors (black)

The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gb/s

for two ports and 3 Gb/s for the other two ports. A point-to-point interface is used for host to

device connections.

The underlying SATA functionality is transparent to the operating system. The SATA controller

can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ

resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus

resource steering is used. Native mode is the preferred mode for configurations using the

Windows 7* operating systems.

Note: Many SATA drives use new low-voltage power connectors and require adapters or power

supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/.

Table 11. Information on SATA Connector Locations

For information about

Refer to

The location of the SATA connectors

Figure 9, page 31

2.7.1.1 SATA RAID

The board supports Intel® Rapid Storage Technology which provides the following RAID

(Redundant Array of Independent Drives) levels through the Intel® C206 Chipset:

 RAID 0 - data striping

 RAID 1 - data mirroring

Intel® Server Board S1200KP TPS Product Description

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 RAID 0+1 (or RAID 10) - data striping and mirroring

 RAID 5 - distributed parity

2.8 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the

computer is not plugged into a wall socket, the battery has an estimated life of three years.

When the computer is plugged in, the standby current from the power supply extends the life of

the battery. The clock is accurate to  13 minutes/year at 25 ºC with 3.3 VSB applied through

the power supply 5V STBY rail.

Note: If the battery and AC power fail, date and time values will be reset and the user will be

notified during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in

CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with

an equivalent one. Figure 1 on page 5 shows the location of the battery.

2.9 Legacy I/O Controller

The I/O controller provides the following features:

 Serial IRQ interface compatible with serialized IRQ support for PCI systems

 Intelligent power management, including a programmable wake-up event interface

 PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

Product Description Intel® Server Board S1200KP TPS

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Intel order number G38894-002

2.10 LAN Subsystem

The LAN subsystem consists of the following:

 Intel® 82574L and 82579LM Gigabit Ethernet Controllers (10/100/1000 Mbits/s)

 Intel® C206 Chipset

 RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

 CSMA/CD protocol engine

 LAN connect interface between the PCH and the LAN controller

 PCI Conventional bus power management

o ACPI technology support

o LAN wake capabilities

 LAN subsystem software

Table 12. Information on LAN Software and Drivers

For information about

Refer to

LAN software and drivers

http://downloadcenter.intel.com

2.10.1 Intel® 82574L Gigabit Ethernet Controller

The Intel® 82574L Gigabit Ethernet Controller supports the following features:

 10/100/1000 BASE-T IEEE 802.3 compliant

 Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

o PCI Express*-based interface for active state operation (S0) state

o SMBUS* for host and management traffic (Sx low power state)

 Compliant to IEEE 802.3x flow control support

 802.1p and 802.1q

 TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

 Full device driver compatibility

2.10.2 Intel® 82579LM Gigabit Ethernet Controller

The Intel® 82579LM Gigabit Ethernet Controller supports the following features:

 10/100/1000 BASE-T IEEE 802.3 compliant

 Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]

 Dual interconnect between the Integrated LAN Controller and the Physical

Layer (PHY):

o PCI Express*-based interface for active state operation (S0) state

o SMBUS* for host and management traffic (Sx low power state)

 Compliant to IEEE 802.3x flow control support

Intel® Server Board S1200KP TPS Product Description

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 802.1p and 802.1q

 TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

 Full device driver compatibility

2.10.3 LAN Subsystem Software

LAN software and drivers are available from Intel®’s World Wide Web site.

Table 13. Information on Obtaining LAN Software and Drivers

For information about

Refer to

Obtaining LAN software and drivers

http://downloadcenter.intel.com

2.10.4 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).

Item

Description

Link LED (Green)

Data Rate LED (Green/Yellow)

Link LED (Green)

Data Rate LED (Green/Yellow)

Figure 4. LAN Connector LED Locations

Table 14 describes the LED states when the board is powered up and the LAN subsystem

is operating.

Product Description Intel® Server Board S1200KP TPS

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Intel order number G38894-002

Table 14. LAN Connector LED States

LED

LED Color

LED State

Condition

Link

Green

Off

LAN link is not established.

LAN link is established.

Blinking

LAN activity is occurring.

Data Rate

Green/Yellow

Off

10 Mbits/s data rate is selected.

Green

100 Mbits/s data rate is selected.

Yellow

1000 Mbits/s data rate is selected.

2.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for

Management (WfM) specification. The board has several hardware management features,

including the following:

 Thermal and voltage monitoring

 Chassis intrusion detection

2.11.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Nuvoton W83677HG-i

device, which supports the following:

 Processor and system ambient temperature monitoring

 Chassis fan speed monitoring

 Power monitoring of +12 V, +5 V, V_SM, +3.3 V, and +VCCP

 SMBus* interface

2.11.2 Fan Monitoring

Fan monitoring can be implemented using third-party software.

Table 15. Information on the Function of the Fan Headers

For information about

Refer to

The functions of the fan headers

Section 2.12.2.2, page 22

2.11.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The

security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion

header. When the chassis cover is removed, the mechanical switch is in the closed position.

Table 16. Information on the Chassis Intrusion Headers

For information about

Refer to

The location of the chassis intrusion header

Figure 9, page 31

Intel® Server Board S1200KP TPS Product Description

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2.11.4 Thermal Monitoring

Figure 5 shows the locations of the thermal sensors and fan headers.

Item

Description

Thermal diode, located on the Intel® C206 PCH

Remote thermal diode 1

Processor fan header

Thermal diode, located on the processor die

Remote thermal diode 2

System fan header

Figure 5. Thermal Sensors and Fan Headers

Product Description Intel® Server Board S1200KP TPS

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Intel order number G38894-002

2.12 Power Management

Power management is implemented at several levels, including:

 Software support through Advanced Configuration and Power Interface (ACPI)

 Hardware support:

o Power connector

o Fan headers

o LAN wake capabilities

o Instantly Available PC technology

o Wake from USB

o PCI Express* WAKE# signal support

2.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play

functions of a computer. The use of ACPI with this board requires an operating system that

provides full ACPI support. ACPI features include:

 Plug and Play (including bus and device enumeration)

 Power management control of individual devices, add-in boards (some add-in boards

may require an ACPI-aware driver), video displays, and hard disk drives

 Methods for achieving less than 15-watt system operation in the power-on/standby

sleeping state

 A Soft-off feature that enables the operating system to power-off the computer

 Support for multiple wake-up events (see Table 19 on page 21)

 Support for a front panel power and sleep mode switch

Table 17 lists the system states based on how long the power switch is pressed, depending on

how ACPI is configured with an ACPI-aware operating system.

Table 17. Effects of Pressing the Power Switch

System Status

Power Switch Press Time

State of the System

Off

(ACPI G2/G5 – Soft off)

Less than four seconds

Power-on

(ACPI G0 – working state)

Less than four seconds

Soft-off/Standby

(ACPI G1 – sleeping state)

(ACPI G0 – working state)

More than six seconds

Fail safe power-off

(ACPI G2/G5 – Soft off)

Sleep

(ACPI G1 – sleeping state)

Less than four seconds

Wake-up

(ACPI G0 – working state)

Sleep

(ACPI G1 – sleeping state)

More than six seconds

Power-off

(ACPI G2/G5 – Soft off)

2.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The

operating system puts devices in and out of low-power states based on user preferences and

knowledge of how devices are being used by applications. Devices that are not being used can

Intel® Server Board S1200KP TPS Product Description

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be turned off. The operating system uses information from applications and user settings to put

the system as a whole into a low-power state.

Table 18 lists the power states supported by the board along with the associated system power

targets. See the ACPI specification for a complete description of the various system and

power states.

Table 18. Power States and Targeted System Power

Global States

Sleeping States

Processor

States

Device States

Targeted System

Power (Note 1)

G0 – working

state

S0 – working

C0 – working

D0 – working

state.

Full power > 30 W

G1 – sleeping

state

S3 – Suspend to

RAM. Context

saved to RAM.

No power

D3 – no power

except for

wake-up logic.

Power < 5 W (Note 2)

G1 – sleeping

state

S4 – Suspend to

disk. Context saved

to disk.

No power

D3 – no power

except for

wake-up logic.

Power < 5 W (Note 2)

G2/S5

S5 – Soft off.

Context not saved.

Cold boot is

required.

No power

D3 – no power

except for

wake-up logic.

Power < 5 W (Note 2)

G3 –

mechanical off

AC power is

disconnected

from the

computer.

No power to the

system.

No power

D3 – no power for

wake-up logic,

except when

provided by

battery or external

source.

No power to the system.

Service can be performed

safely.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals

2. Dependent on the standby power consumption of wake-up devices used in the system.

2.12.1.2 Wake-up Devices and Events

Table 19 lists the devices or specific events that can wake the computer from specific states.

Table 19. Wake-up Devices and Events

These devices/events can wake up the computer…

…from this state

Power switch

S3, S4, S5 (Note 1)

RTC alarm

S3, S4, S5 (Note 1)

LAN

S3, S4, S5 (Note 1)

USB

WAKE#

S3, S4, S5 (Note 1)

Notes:

1. S4 implies operating system support only.

2. Wake from S4 and S5 is recommended by Microsoft.

Product Description Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

Note: The use of these wake-up events from an ACPI state requires an operating system that

provides full ACPI support. In addition, software, drivers, and peripherals must fully support

ACPI wake events.

2.12.2 Hardware Support

CAUTION

Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities

and Instantly Available PC technology features are used. Failure to do so can damage the

power supply. The total amount of standby current required depends on the wake devices

supported and manufacturing options.

The board provides several power management hardware features, including:

 Power connector

 Fan headers

 LAN wake capabilities

 Instantly Available PC technology

 Wake from USB

 WAKE# signal wake-up support

 +5 V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require power from the +5 V

standby line.

Note: The use of Wake from USB from an ACPI state requires an operating system that

provides full ACPI support.

2.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When

an ACPI-enabled system receives the correct command, the power supply removes all non-

standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in

before power was interrupted (on or off). The computer’s response can be set using the Last

Power State feature in the BIOS Setup program’s Boot menu.

Table 20. Information on Power Connector Locations

For information about

Refer to

The location of the main power connector

Figure 9, page 31

The signal names of the main power connector

Table 29, page 33

2.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:

 The fans are on when the board is in the S0 state

 The fans are off when the board is off or in the S3, S4, or S5 state

Intel® Server Board S1200KP TPS Product Description

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 Each fan header is wired to a fan tachometer input of the hardware monitoring and fan

control ASIC

 All fan headers support closed-loop fan control that can adjust the fan speed or switch

the fan on or off as needed

 All fan headers have a +12 V DC connection

 4-pin fan headers are controlled by Pulse Width Modulation

Table 21. Information of the Fan Headers’ Locations

For information about

Refer to

The location of the fan headers

Figure 9, page 31

The location of the fan headers and sensors for thermal monitoring

Figure 5, page 19

2.12.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of

providing adequate +5 V standby current. Failure to provide adequate standby current when

implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN

subsystem PCI bus network adapter monitors network traffic at the Media Independent

Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal

that powers up the computer. Depending on the LAN implementation, the board supports LAN

wake capabilities with ACPI in the following ways:

 The PCI Express* WAKE# signal

 The onboard LAN subsystem

2.12.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line for the power supply must be

capable of providing adequate +5 V standby current. Failure to provide adequate standby

current when implementing Instantly Available PC technology can damage the power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM)

sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is

off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by

a wake-up device or event, the system quickly returns to its last known wake state. Table 19 on

page 21 lists the devices and events that can wake the computer from the S3 state.

The use of Instantly Available PC technology requires operating system support and PCI

Express* add-in cards and drivers.

2.12.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

Product Description Intel® Server Board S1200KP TPS

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Note: Wake from USB requires the use of a USB peripheral that supports Wake from USB.

2.12.2.6 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express* bus is asserted, the computer wakes from an

ACPI S3, S4, or S5 state.

2.12.2.7 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an

ACPI S5 state.

2.12.2.8 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the

computer appears to be off. Figure 6 shows the location of the standby power LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the

power cord before installing or removing any devices connected to the board. Failure to do so

could damage the board and any attached devices.

Intel® Server Board S1200KP TPS Product Description

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Figure 6. Location of the Standby Power LED

Intel® Server Board S1200KP TPS Technical Reference

Revision 1.1

Intel order number G38894-002

3. Technical Reference

3.1 Memory Resources

3.1.1 Addressable Memory

The board utilizes 16 GB of addressable system memory. Typically the address space that is

allocated for PCI Conventional bus add-in cards, PCI Express* configuration space, BIOS (SPI

Flash device), and chipset overhead resides above the top of DRAM (total system memory). On

a system that has 16 GB of system memory installed, it is not possible to use all of the installed

memory due to system address space being allocated for other system critical functions. These

functions include the following:

 BIOS/SPI Flash device (16 Mbit)

 Local APIC (19 MB)

 Direct Media Interface (40 MB)

 Front side bus interrupts (17 MB)

 PCI Express* configuration space (256 MB)

 PCH base address registers PCI Express* ports (up to 256 MB)

 Memory-mapped I/O that is dynamically allocated for PCI Express* add-in

cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory

mapped I/O logical address space. The board remaps physical memory from the top of usable

DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just

above the 4 GB boundary. Figure 7 shows a schematic of the system memory map. All installed

system memory can be used when there is no overlap of system addresses.

Technical Reference Intel® Server Board S1200KP TPS

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Intel order number G38894-002

Figure 7. Detailed System Memory Address Map

Intel® Server Board S1200KP TPS Technical Reference

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3.1.2 Memory Map

Table 22 lists the system memory map.

Table 22. System Memory Map

Address Range (decimal)

Address Range (hex)

Size

Description

1024 K - 16777216K K

100000 – 400000000

16382 MB

Extended memory

960 K - 1024 K

F0000 - FFFFF

64 KB

Runtime BIOS

896 K - 960 K

E0000 - EFFFF

64 KB

Reserved

800 K - 896 K

C8000 - DFFFF

96 KB

Potential available high DOS

memory (open to the PCI

Conventional bus). Dependent on

video adapter used.

640 K - 800 K

A0000 - C7FFF

160 KB

Video memory and BIOS

639 K - 640 K

9FC00 - 9FFFF

1 KB

Extended BIOS data (movable by

memory manager software)

512 K - 639 K

80000 - 9FBFF

127 KB

Extended conventional memory

0 K - 512 K

00000 - 7FFFF

512 KB

Conventional memory

3.2 Connectors and Headers

CAUTION

Only the following connectors and headers have over-current protection: back panel and front

panel USB.

The other internal connectors and headers are not over-current protected and should connect

only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use

these connectors or headers to power devices external to the computer’s chassis. A fault in the

load presented by the external devices could cause damage to the computer, the power cable,

and the external devices themselves.

Furthermore, improper connection of USB header single wire connectors may eventually

overload the over-current protection and cause damage to the board.

This section describes the board’s connectors. The connectors can be divided into

these groups:

 Back panel I/O connectors

 Component-side I/O connectors and headers (see page 30)

3.2.1 Back Panel Connectors

Figure 8 shows the location of the back panel connectors for the board.

Technical Reference Intel® Server Board S1200KP TPS

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Intel order number G38894-002

Item

Description

LAN port (82574L)

USB 2.0 ports

LAN port (82579LM)

USB 2.0 ports

DVI-I connector

Figure 8. Back Panel Connectors

3.2.2 Component-side Connectors and Headers

Figure 9 shows the locations of the component-side connectors and headers.

Intel® Server Board S1200KP TPS Technical Reference

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Intel order number G38894-002

Figure 9. Component-side Connectors and Headers

Technical Reference Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

Table 23 lists the component-side connectors and headers identified in Figure 9.

Table 23. Component-side Connectors and Headers Shown in Figure 9

Item/callout

Description

Processor core power connector (2 x 2)

Front panel USB header

SATA connectors

Front panel USB header

Main power connector (2 X 12)

Front panel header

Alternate front panel power LED header

Processor fan header

PCI Express* x16 bus add-in card connector

LPC Debug header

Chassis intrusion header

System fan header

3.2.2.1 Signal Tables for the Connectors and Headers

Table 24. Front Panel USB 2.0 Headers

Signal Name

+5 V DC

D-

D+

Ground

KEY (no pin)

No Connect

Table 25. SATA Connectors

Signal Name

Ground

TXP

TXN

Ground

RXN

RXP

Ground

Intel® Server Board S1200KP TPS Technical Reference

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Table 26. Chassis Intrusion Header

Signal Name

Intruder#

Ground

Table 27. Processor and System (4-Pin) Fan Headers

Signal Name

Ground (Note)

+12 V

FAN_TACH

FAN_CONTROL

Jack detect 2

Note: These fan headers use Pulse Width Modulation control for fan speed.

3.2.2.2 Add-in Card Connector

The board has one PCI Express* 2.0 x16 (with Intel® Xeon® E3-1200 Processors or the 2nd

Generation Intel® Core™ i3 Processors) or PCI Express* 3.0 x 16 (with Intel® Xeon® E3-1200

V2 Processors or the 3rd Generation Intel® Core™ i3 Processors) connector supporting

simultaneous transfer speeds up to 16 GB/s of peak bandwidth per direction and up to 32 GB/s

concurrent bandwidth.

3.2.2.3 Power Supply Connectors

The board has the following power supply connectors:

 Main power – a 2 x 12 connector. The board supports the use of ATX12V power

supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply

with a 2 x 10 main power cable, attach that cable on the leftmost pins of the main

power connector, leaving pins 11, 12, 23, and 24 unconnected.

 Processor core power – a 2 x 2 connector. This connector provides power directly to

the processor voltage regulator and must always be used. Failure to do so will prevent

the board from booting.

Table 28. Processor Core Power Connector

Signal Name

Ground

+12 V

Table 29. Main Power Connector

Signal Name

+3.3 V

-12 V

Technical Reference Intel® Server Board S1200KP TPS

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Signal Name

Ground

+5 V

PS-ON# (power supply remote on/off)

Ground

+5 V

Ground

PWRGD (Power Good)

No connect

+5 V (Standby)

+5 V

+12 V

+5 V

+12 V (Note)

+5 V (Note)

2 x 12 connector detect (Note)

Ground (Note)

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

For information about

Refer to

Power supply considerations

Section 3.5.1 on page 40

3.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 30 lists the signal names

of the front panel header. Figure 10 is a connection diagram for the front panel header.

Table 30. Front Panel Header

Signal Name

Description

Signal Name

Description

HDD_POWER_LE

Pull-up resistor

(750 Ω) to +5V

POWER_LED_MAI

[Out] Front panel LED

(main color)

HDD_LED#

[Out] Hard disk

activity LED

POWER_LED_ALT

[Out] Front panel LED

(alt color)

GROUND

Ground

POWER_SWITCH#

[In] Power switch

RESET_SWITCH#

[In] Reset switch

GROUND

Ground

+5V_DC

Power

Key

No pin

Intel® Server Board S1200KP TPS Technical Reference

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Figure 10. Connection Diagram for Front Panel Header

3.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read

from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive

connected to an onboard SATA connector.

3.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch

that is normally open. When the switch is closed, the board resets and runs the POST.

3.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 31 shows the possible states

for a one-color LED. Table 32 shows the possible states for a two-color LED.

Table 31. States for a One-Color Power LED

LED State

Description

Off

Power off/sleeping

Steady Green

Running

Table 32. States for a Two-Color Power LED

LED State

Description

Off

Power off

Steady Green

Running

Steady Yellow

Sleeping

Technical Reference Intel® Server Board S1200KP TPS

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Note: The colors listed in Table 31 and Table 32 are suggested colors only. Actual LED colors

are chassis-specific.

3.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch

must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on

or off. (The time requirement is due to internal debounce circuitry on the board.) At least two

seconds must pass before the power supply will recognize another on/off signal.

3.2.2.5 Alternate Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header.

Table 33. Alternate Front Panel Power/Sleep LED Header

Signal Name

Description

POWER_LED_MAIN

[Out] Front panel LED (main color)

Key (no pin)

POWER_LED_ALT

[Out] Front panel LED (alt color)

3.2.2.6 Front Panel USB 2.0 Headers

Figure 11 is a connection diagram for the front panel USB 2.0 headers.

Note: The +5 V DC power on the USB headers is fused. Use only a front panel USB connector

that conforms to the USB 2.0 specification for high-speed USB devices.

Figure 11. Connection Diagram for Front Panel USB 2.0 Headers

3.2.2.7 Low Pin Count (LPC) Debug header

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port

80h. If the POST fails, execution stops and the last POST code generated is left at port 80h.

This code is useful for determining the point where an error occurred.

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Displaying the POST codes requires a POST card that can interface with the Low Pin Count

(LPC) Debug header. The POST card can decode the port and display the contents on a

medium such as a seven-segment display.

Table 34. LPC Debug Header

Signal Name

CK_33M_DEBUG

GND

PLTRST#

LFRAME#

LAD0

LAD1

LAD2

LAD3

GND

+3.3 V

Not Connected

+3.3 V

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3.3 Jumper Block

CAUTION

Do not move the jumper with the power on. Always turn off the power and unplug the power

cord from the computer before changing a jumper setting. Otherwise, the board could

be damaged.

Figure 12 shows the location of the jumper block. The 3-pin jumper block determines the BIOS

Setup program’s mode. Table 35 describes the jumper settings for the three modes: normal,

configure, and recovery. When the jumper is set to configure mode and the computer is

powered-up, the BIOS compares the processor version and the microcode version in the BIOS

and reports if the two match.

Figure 12. Location of the Jumper Block

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Table 35. BIOS Setup Configuration Jumper Settings

Function/Mode

Jumper Setting

Configuration

Normal

1-2

The BIOS uses current configuration information and

passwords for booting.

Configure

2-3

After the POST runs, Setup runs automatically. The

maintenance menu is displayed.

Note that this Configure mode is the only way to clear the

BIOS/CMOS settings. Press F9 (restore defaults) while in

Configure mode to restore the BIOS/CMOS settings to their

default values.

Recovery

None

The BIOS attempts to recover the BIOS configuration. A

recovery CD or flash drive is required.

3.4 Mechanical Considerations

3.4.1 Form Factor

The board is designed to fit into a Mini-ITX form-factor chassis. Figure 13 illustrates the

mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer

dimensions are 6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]. Location of

the I/O connectors and mounting holes are in compliance with the ATX specification.

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Figure 13. Board Dimensions

3.5 Electrical Considerations

3.5.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capable of providing adequate +5 V

standby current. Failure to do so can damage the power supply. The total amount of standby

current required depends on the wake devices supported and manufacturing options.

Additional power required will depend on configurations chosen by the integrator.

The power supply must comply with the indicated parameters of the ATX form factor

specification.

 The potential relation between 3.3 V DC and +5 V DC power rails

 The current capability of the +5 VSB line

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 All timing parameters

 All voltage tolerances

For example, for a system consisting of a supported 95 W processor (see Section 2.3 on page

8 for a list of supported processors), 1 GB DDR3 RAM, one high end video card, one hard disk

drive, one optical drive, and all board peripherals enabled, the minimum recommended power

supply is 350 W. Table 36 lists the recommended power supply current values.

Table 36. Recommended Power Supply Current Values

Output Voltage

3.3 V

5 V

12 V1

12 V2

-12 V

5 VSB

Current

17 A

18 A

12 A

18 A

0.8 A

2 A

3.5.2 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan header.

Connecting the processor fan to a chassis fan header may result in onboard component

damage that will halt fan operation.

Table 37 lists the current capability of the fan headers.

Table 37. Fan Header Current Capability

Fan Header

Maximum Available Current

Processor fan

2.0 A

System fan

1.5 A

3.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from the +5 V

rail. The total +5 V current draw for add-in boards for a fully loaded board (one expansion slot

filled) must not exceed the system’s power supply +5 V maximum current or 14 A in total.

3.6 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38º C at the processor fan inlet is a

requirement. Use a processor heat sink that provides omni-directional airflow to maintain

required airflow across the processor voltage regulator area.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor

and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that

have been tested with Intel® server boards please refer to the product support web page.

Technical Reference Intel® Server Board S1200KP TPS

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All responsibility for determining the adequacy of any thermal or system design remains solely

with the reader. Intel® makes no warranties or representations that merely following the

instructions presented in this document will result in a system with adequate thermal

performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating

temperature. Failure to do so could cause components to exceed their maximum case

temperature and malfunction. For information about the maximum operating temperature, see

the environmental specifications in Section 3.8.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do

so may result in damage to the voltage regulator circuit. The processor voltage regulator area

(shown in Figure 14) can reach a temperature of up to 120 C in an open chassis.

Figure 14 shows the locations of the localized high temperature zones.

Intel® Server Board S1200KP TPS Technical Reference

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Item

Description

Intel® C206 Chipset

Processor voltage regulator area

Processor

Figure 14. Localized High Temperature Zones

Table 38 provides maximum case temperatures for the components that are sensitive to

thermal changes. The operating temperature, current load, or operating frequency could affect

case temperatures. Maximum case temperatures are important when considering proper airflow

to cool the board.

Table 38. Thermal Considerations for Components

Component

Maximum Case Temperature

Processor

For processor case temperature, see processor datasheets and

processor specification updates

Intel® C206 Express Chipset

104oC

To ensure functionality and reliability, the component is specified for proper operation when

Case Temperature is maintained at or below the maximum temperature listed in Table 39. This

is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is

specified as the maximum sustainable power to be dissipated by the components). When the

component is dissipating less than TDP, the case temperature should be below the Maximum

Case Temperature. The surface temperature at the geometric center of the component

corresponds to Case Temperature.

It is important to note that the temperature measurement in the system BIOS is a value

reported by embedded thermal sensors in the components and does not directly correspond to

the Maximum Case Temperature. The upper operating limit when monitoring this thermal

sensor is Tcontrol.

Table 39. Tcontrol Values for Components

Component

Tcontrol

Processor

For processor case temperature, see processor datasheets and

processor specification updates

Intel® C206 Express Chipset

104oC

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3.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and

subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I

Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair

rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC.

The MTBF for the board is 255,227 hours.

3.8 Environmental

Table 40 lists the environmental specifications for the board.

Table 40. Environmental Specifications

Parameter

Specification

Temperature

Non-Operating

-20 C to +70 C

Operating

0 C to +55 C

Shock

Unpackaged

50 g trapezoidal waveform

Velocity change of 170 inches/s²

Packaged

Half sine 2 millisecond

Product Weight (pounds)

Free Fall (inches)

Velocity Change (inches/s²)

<20

167

21-40

152

41-80

136

81-100

118

Vibration

Unpackaged

5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

Packaged

5 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Intel® Server Board S1200KP TPS Overview of BIOS Features

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4. Overview of BIOS Features

4.1 Introduction

The board uses an Intel® BIOS that is stored in the Serial Peripheral Interface Flash Memory

(SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS

Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug

and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code.

When the BIOS Setup configuration jumper is set to configure mode and the computer is

powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and

reports if the two match.

The BIOS Setup program can be used to view and change the BIOS settings for the computer.

The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test

(POST) memory test begins and before the operating system boot begins. The menu bar is

shown below.

Maintenance

Main

Configuration

Performance

Security

Power

Boot

Exit

Note: The maintenance menu is displayed only when the board is in configure mode.

Section 3.3 on page 38 shows how to put the board in configure mode.

Table 41 lists the BIOS Setup program menu features.

Table 41. BIOS Setup Program Menu Bar

Maintenance

Main

Configuratio

Performance

Security

Power

Boot

Exit

Clears

passwords

and displays

processor

information

Displays

processor

and memory

configuration

Configures

advanced

features

available

through the

chipset

Configures

Processor

overrides

Sets

passwords

and

security

features

Configures

power

management

features and

power supply

controls

Selects

boot

options

Saves or

discards

changes to

Setup

program

options

Table 42 lists the function keys available for menu screens.

Table 42. BIOS Setup Program Function Keys

BIOS Setup Program

Function Key

Description

<> or <>

Selects a different menu screen (Moves the cursor left or right)

<> or <>

Selects an item (Moves the cursor up or down)

<Tab>

Selects a field (Not implemented)

<Enter>

Executes command or selects the submenu

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BIOS Setup Program

Function Key

Description

<F9>

Load the default configuration values for the current menu

<F10>

Save the current values and exits the BIOS Setup program

<Esc>

Exits the menu

4.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mbit (4096 KB) flash

memory device.

4.3 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers

in a managed network.

The main component of SMBIOS is the Management Information Format (MIF) database, which

contains information about the computing system and its components. Using SMBIOS, a

system administrator can obtain the system types, capabilities, operational status, and

installation dates for system components. The MIF database defines the data and provides the

method for accessing this information. The BIOS enables applications such as third-party

management software to use SMBIOS. The BIOS stores and reports the following SMBIOS

information:

 BIOS data, such as the BIOS revision level

 Fixed-system data, such as peripherals, serial numbers, and asset tags

 Resource data, such as memory size, cache size, and processor speed

 Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS

information. The BIOS supports an SMBIOS table interface for such operating systems. Using

this support, an SMBIOS service-level application running on a non-Plug and Play operating

system can obtain the SMBIOS information. Additional board information can be found in the

BIOS under the Additional Information header under the Main BIOS page.

4.4 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB

drivers are not yet available. Legacy USB support is used to access the BIOS Setup program,

and to install an operating system that supports USB. By default, Legacy USB support is set

to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to

enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

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5. The operating system loads. While the operating system is loading, USB keyboards

and mice are recognized and may be used to configure the operating system.

(Keyboards and mice are not recognized during this period if Legacy USB support was

set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB

devices are recognized by the operating system, and Legacy USB support from the

BIOS is no longer used.

7. Additional USB legacy feature options can be access by using Intel® Integrator Toolkit.

To install an operating system that supports USB, verify that Legacy USB support in the BIOS

Setup program is set to Enabled and follow the operating system’s installation instructions.

4.5 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel®

World Wide Web site:

 Intel® Flash Memory Update Utility, which requires booting from DOS. Using this utility,

the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a

USB hard drive), or a CD-ROM.

 Intel® F7 switch during POST allows a user to select where the BIOS .bio file is located

and perform the update from that location/device. Similar to performing a BIOS

Recovery without removing the BIOS configuration jumper.

Both utilities verify that the updated BIOS matches the target system to prevent accidentally

installing an incompatible BIOS.

Note: Review the instructions distributed with the upgrade utility before attempting

a BIOS update.

4.5.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel®

web site for support.

4.5.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can be

augmented with a custom splash screen. The Intel® Integrator’s Toolkit that is available from

Intel® can be used to create a custom splash screen.

Note: If you add a custom splash screen, it will share space with the Intel® branded logo.

Table 43. Information on Integrator Toolkit and Software Tools

For information about

Refer to

Intel® Integrator Toolkit

http://developer.intel.com/design/motherbd/software/itk/

Additional Intel® software tools

http://developer.intel.com/design/motherbd/software.htm

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4.6 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the

BIOS could be damaged. Table 44 lists the drives and media types that can and cannot be

used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 44. Acceptable Drives/Media Types for BIOS Recovery

Media Type

Can be used for BIOS recovery?

CD-ROM drive connected to the SATA interface

Yes

USB removable drive (a USB Flash Drive, for example)

Yes

USB diskette drive (with a 1.44 MB diskette)

USB hard disk drive

4.6.1 Recovery with USB Thumb Drive or CD-ROM

1. Download and save the Recovery BIOS file to a temporary directory.

2. Copy the recovery file (*.BIO) to a USB thumb drive or a CD.

3. Plug the thumb drive into a USB port of the target computer, or place the CD in the CD-

ROM drive of the target computer.

4. Shut down the computer and unplug the AC power adapter.

5. Open the chassis and remove the BIOS Configuration Jumper. Please refer to section

2.3 for details including the location of this jumper.

6. Power the computer on.

7. Wait 2-5 minutes for the update to complete.

8. The computer will either turn off when the recovery process is completed or it will

prompt you to turn it off.

9. Remove the thumb drive or the CD.

10. Replace the BIOS Configuration Jumper.

11. Close the chassis.

12. Restart the computer.

4.7 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive,

removable drive, or the network. The default setting is for the optical drive to be the first boot

device, the hard drive second, removable drive third, and the network fourth.

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4.7.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM

format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed

as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a

bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

4.7.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard

LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this

key during POST, the User Access Level in the BIOS Setup program's Security menu must be

set to Full.

4.7.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the

POST, the operating system loader is invoked even if the following devices are not present:

 Video adapter

 Keyboard

 Mouse

4.7.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu

displays the list of available boot devices. Table 45 lists the boot device menu options.

Table 45. Boot Device Menu Options

Boot Device Menu Function Keys

Description

<> or <>

Selects a default boot device

<Enter>

Exits the menu, and boots from the selected device

<Esc>

Exits the menu and boots according to the boot priority

defined through BIOS setup

4.8 Adjusting Boot Speed

These factors affect system boot speed:

 Selecting and configuring peripherals properly

 Optimized BIOS boot parameters

 Enabling the new Hyperboot feature

4.8.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:

 Choose a hard drive with parameters such as “power-up to data ready” in less than

eight seconds that minimizes hard drive startup delays.

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 Select a CD-ROM drive with a fast initialization rate. This rate can influence POST

execution time.

 Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints,

or mode changes in POST. These features may add time to the boot process.

 Try different monitors. Some monitors initialize and communicate with the BIOS more

quickly, which enables the system to boot more quickly.

4.8.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

 In the Boot Menu, set the hard disk drive as the first boot device. As a result, the

POST does not first seek a diskette drive, which saves about one second from the

POST execution time.

 In the Peripheral Configuration submenu, disable the LAN device if it will not be used.

This can reduce up to four seconds of option ROM boot time.

Note: It is possible to optimize the boot process to the point where the system boots so quickly

that the Intel® logo screen (or a custom logo splash screen) will not be seen. Monitors and hard

disk drives with minimum initialization times can also contribute to a boot time that might be so

fast that necessary logo screens and POST messages cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If this condition

should occur, it is possible to introduce a programmable delay ranging from zero to 30 seconds

by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the

Drive Configuration Submenu of the BIOS Setup program).

4.9 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who

can boot the computer. A supervisor password and a user password can be set for the BIOS

Setup program and for booting the computer, with the following restrictions:

 The supervisor password gives unrestricted access to view and change all the Setup

options in the BIOS Setup program. This is the supervisor mode.

 The user password gives restricted access to view and change Setup options in the

BIOS Setup program. This is the user mode.

 If only the supervisor password is set, pressing the <Enter> key at the password

prompt of the BIOS Setup program allows the user restricted access to Setup.

 If both the supervisor and user passwords are set, users can enter either the

supervisor password or the user password to access Setup. Users have access to

Setup respective to which password is entered.

 Setting the user password restricts who can boot the computer. The password prompt

will be displayed before the computer is booted. If only the supervisor password is set,

the computer boots without asking for a password. If both passwords are set, the user

can enter either password to boot the computer.

 For enhanced security, use different passwords for the supervisor and user

passwords.

 Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16

characters in length.

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Table 46 shows the effects of setting the supervisor password and user password. This table is

for reference only and is not displayed on the screen.

Table 46. Supervisor and User Password Functions

Password Set

Supervisor Mode

User Mode

Setup Options

Password to

Enter Setup

Password

During Boot

Neither

Can change all

options (Note)

Can change all

options (Note)

None

Supervisor

only

Can change all

options

Can change a

limited number

of options

Supervisor Password

Supervisor

None

User only

N/A

Can change all

options

Enter Password

Clear User Password

User

Supervisor

and user set

Can change all

options

Can change a

limited number

of options

Supervisor Password

Enter Password

Supervisor or

user

Supervisor or

user

Note: If no password is set, any user can change all Setup options.

Error Messages and Beep Codes Intel® Server Board S1200KP TPS

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5. Error Messages and Beep Codes

5.1 Speaker

The board-mounted speaker provides audible error code (beep code) information during POST.

Table 47. Information about Onboard Speaker

For information about

Refer to

The location of the onboard speaker

Figure 1, page 5

5.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to

beep an error message describing the problem (see Table 48).

Table 48. BIOS Beep Codes

Type

Pattern

Frequency

F2 Setup/F10 Boot

Menu Prompt

One 0.5 second beep when BIOS is ready to

accept keyboard input

932 Hz

BIOS update in progress

None

Video error

On-off (1.0 second each) two times, then

2.5-second pause (off), entire pattern repeats

(beeps and pause) once and the BIOS will

continue to boot.

932 Hz

When no VGA option ROM is

found.

Memory error

On-off (1.0 second each) three times, then

2.5-second pause (off), entire pattern repeats

(beeps and pause) until the system is powered

off.

932 Hz

Thermal trip warning

Alternate high and low beeps (1.0 second each)

for eight beeps, followed by system shut down.

High beep 2000 Hz

Low beep 1500 Hz

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5.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel

power LED to blink an error message describing the problem (see Table 49).

Table 49. Front-panel Power LED Blink Codes

Type

Pattern

Note

F2 Setup/F10 Boot

Menu Prompt

None

BIOS update in progress

Off when the update begins, then on for

0.5 seconds, then off for 0.5 seconds. The

pattern repeats until the BIOS update is

complete.

Video error

On-off (1.0 second each) two times, then

2.5-second pause (off), entire pattern repeats

(blink and pause) until the system is powered off.

When no VGA option ROM is

found.

Memory error

On-off (1.0 second each) three times, then

2.5-second pause (off), entire pattern repeats

(blinks and pause) until the system is powered

off.

Thermal trip warning

Each beep will be accompanied by the following

blink pattern: .25 seconds on, .25 seconds off,

.25 seconds on, .25 seconds off. This will result in

a total of 16 blinks.

5.4 BIOS Error Messages

Table 50 lists the error messages and provides a brief description of each.

Table 50. BIOS Error Messages

Error Message

Explanation

CMOS Battery Low

The battery may be losing power. Replace the battery soon.

CMOS Checksum Bad

The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.

Memory Size Decreased

Memory size has decreased since the last boot. If no memory was

removed, then memory may be bad.

No Boot Device Available

System did not find a device to boot.

5.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port

80h. If the POST fails, execution stops and the last POST code generated is left at port 80h.

This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a POST card that can interface with the Low Pin Count

(LPC) Debug header. The POST card can decode the port and display the contents on a

Error Messages and Beep Codes Intel® Server Board S1200KP TPS

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medium such as a seven-segment display. Refer to the location of the LPC Debug header in

Figure 1.

The following tables provide information about the POST codes generated by the BIOS:

 Table 51 lists the Port 80h POST code ranges

 Table 52 lists the Port 80h POST codes themselves

 Table 53 lists the Port 80h POST sequence

Note: In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 51. Port 80h POST Code Ranges

Range

Subsystem

0x00 – 0x05

Entering SX states S0 to S5.

0x10, 0x20, 0x30,

0x40, 0x50

Resuming from SX states. 0x10 –0x20 – S2, 0x30 – S3, and so on.

0x08 – 0x0F

Security (SEC) phase

0x11 0x1F

PEI phase pre MRC execution

0x21 – 0x29

MRC memory detection

0x2A – 0x2F

PEI phase post MRC execution

0x31 – 0x35

Recovery

0x36 – 0x3F

Platform DXE driver

0x41 – 0x4F

CPU Initialization (PEI, DXE, SMM)

0x50 – 0x5F

I/O Buses: PCI, USB, ATA and so on. 0x5F is an unrecoverable error. Start with PCI.

0x60 – 0x6F

BDS

0x70 – 0x7F

Output devices: All output consoles.

0x80 – 0x8F

For future use

0x90 – 0x9F

Input devices: Keyboard/Mouse.

0xA0 – 0xAF

For future use

0xB0 – 0xBF

Boot Devices: Includes fixed media and removable media. Not that critical since

consoles should be up at this point.

0xC0 – 0xCF

For future use

0xD0 – 0xDF

For future use

Table 52. Port 80h POST Codes

Port 80 Code

Progress Code Enumeration

ACPI S States

0x00,0x01,0x02,0x03,0x04,0x05

Entering S0, S2, S3, S4, or S5 state

0x10,0x20,0x30,0x40,0x50

Resuming from S2, S3, S4, S5

Security Phase (SEC)

0x08

Starting BIOS execution after CPU BIST

0x09

SPI prefetching and caching

0x0A

Load BSP microcode

Intel® Server Board S1200KP TPS Error Messages and Beep Codes

Revision 1.1

Intel order number G38894-002

Port 80 Code

Progress Code Enumeration

0x0B

Load APs microcodes

0x0C

Platform program baseaddresses

0x0D

Wake Up All APs

0x0E

Initialize NEM

0x0F

Pass entry point of the PEI core

PEI before MRC

PEI Platform driver

0x11

Set bootmode, GPIO init

0x12

Early chipset register programming including graphics init

0x13

Basic PCH init, discrete device init (1394, SATA)

0x14

LAN init

0x15

Exit early platform init driver

PEI SMBUS*

0x16

SMBUSriver init

0x17

Entry to SMBUS* execute read/write

0x18

Exit SMBUS* execute read/write

PEI CK505 Clock Programming

0x19

Entry to CK505 programming

0x1A

Exit CK505 programming

PEI Over-Clock Programming

0x1B

Entry to entry to PEI over-clock programming

0x1C

Exit PEI over-clock programming

Memory

0x21

MRC entry point

0x23

Reading SPD from memory DIMMs

0x24

Detecting presence of memory DIMMs

0x27

Configuring memory

0x28

Testing memory

0x29

Exit MRC driver

PEI after MRC

0x2A

Start to Program MTRR Settings

0x2B

Done Programming MTRR Settings

PEIMs/Recovery

0x31

Crisis Recovery has initiated

0x33

Loading recovery capsule

0x34

Start recovery capsule/valid capsule is found

CPU Initialization

CPU PEI Phase

0x41

Begin CPU PEI Init

0x42

XMM instruction enabling

0x43

End CPU PEI Init

CPU PEI SMM Phase

Error Messages and Beep Codes Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

Port 80 Code

Progress Code Enumeration

0x44

Begin CPU SMM Init smm relocate bases

0x45

Smm relocate bases for APs

0x46

End CPU SMM Init

CPU DXE Phase

0x47

CPU DXE Phase begin

0x48

Refresh memory space attributes according to MTRRs

0x49

Load the microcode if needed

0x4A

Initialize strings to HII database

0x4B

Initialize MP support

0x4C

CPU DXE Phase End

CPU DXE SMM Phase

0x4D

CPU DXE SMM Phase begin

0x4E

Relocate SM bases for all APs

0x4F

CPU DXE SMM Phase end

I/O BUSES

0x50

Enumerating PCI buses

0x51

Allocating resources to PCI bus

0x52

Hot Plug PCI controller initialization

USB

0x58

Resetting USB bus

0x59

Reserved for USB

ATA/ATAPI/SATA

0x5A

Resetting PATA/SATA bus and all devices

0x5B

Reserved for ATA

BDS

0x60

BDS driver entry point initialize

0x61

BDS service routine entry point (can be called multiple times)

0x62

BDS Step2

0x63

BDS Step3

0x64

BDS Step4

0x65

BDS Step5

0x66

BDS Step6

0x67

BDS Step7

0x68

BDS Step8

0x69

BDS Step9

0x6A

BDS Step10

0x6B

BDS Step11

0x6C

BDS Step12

0x6D

BDS Step13

0x6E

BDS Step14

0x6F

BDS return to DXE core (should not get here)

Keyboard (PS/2 or USB)

Intel® Server Board S1200KP TPS Error Messages and Beep Codes

Revision 1.1

Intel order number G38894-002

Port 80 Code

Progress Code Enumeration

0x90

Resetting keyboard

0x91

Disabling the keyboard

0x92

Detecting the presence of the keyboard

0x93

Enabling the keyboard

0x94

Clearing keyboard input buffer

0x95

Instructing keyboard controller to run Self Test (PS/2 only)

Mouse (PS/2 or USB)

0x98

Resetting mouse

0x99

Detecting mouse

0x9A

Detecting presence of mouse

0x9B

Enabling mouse

Fixed Media

0xB0

Resetting fixed media

0xB1

Disabling fixed media

0xB2

Detecting presence of a fixed media (IDE hard drive detection and so

on.)

0xB3

Enabling/configuring a fixed media

Removable Media

0xB8

Resetting removable media

0xB9

Disabling removable media

0xBA

Detecting presence of a removable media (IDE, CDROM detection

and so on.)

0xBB

Enabling/configuring a removable media

DXE Core

0xE4

Entered DXE phase

BDS

0xE7

Waiting for user input

0xE8

Checking password

0xE9

Entering BIOS setup

0xEB

Calling Legacy Option ROMs

Runtime Phase/EFI OS Boot

0xF8

EFI boot service ExitBootServices ( ) has been called

0xF9

EFI runtime service SetVirtualAddressMap ( ) has been called

Table 53. Typical Port 80h POST Sequence

POST Code

Description

Initializing a chipset component

Reading SPD from memory DIMMs

Detecting presence of memory DIMMs

Configuring memory

Error Messages and Beep Codes Intel® Server Board S1200KP TPS

Revision 1.1

Intel order number G38894-002

POST Code

Description

Testing memory

Loading recovery capsule

Entered DXE phase

Starting application processor initialization

SMM initialization

Enumerating PCI busses

Allocating resourced to PCI bus

Detecting the presence of the keyboard

Resetting keyboard

Clearing keyboard input buffer

Keyboard Self Test

Calling Video BIOS

Resetting USB bus

Resetting PATA/SATA bus and all devices

Detecting the presence of the keyboard

Resetting keyboard

Clearing keyboard input buffer

Resetting PATA/SATA bus and all devices

Testing memory

Resetting keyboard

Clearing keyboard input buffer

Waiting for user input

INT 19

Ready to boot

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