SCL
SDA
AD0
Analog
Matrix
Touch
Screen
Drivers
Interface
I C
Serial
Interface
and
Control
2
VDD
AUX
TEMP
Sensor
DAV
PENIRQ
PINTDAV
RESET
GND
Multi-Touch
Control
TouchEngine
with
Analog
Signal
Processing
Internal
Clock
Zoning
Control
Pre-
processing
X
X +
Y +
i
j
i
j
-
-Y
TSC2020
www.ti.com
SBAS536B –FEBRUARY 2011–REVISED MARCH 2011
Analog Matrix TOUCH SCREEN CONTROLLER
with I2C™Serial Interface for 3 ×5 Array
Check for Samples: TSC2020
1FEATURES APPLICATIONS
•Smart Phones, Feature Phones
23•Supports up to 3.5-Inch Analog Matrix Sensor •MIDs, Netbooks, and eBooks
with 3 ×5 Multiple Touch Resolution and
12-Bit Global Resolution •Digital Picture Frames
•Portable Instruments
•Supports Both Finger and Stylus
•MP3 Players, GPSs, PNDs, and PMPs
•Ratiometric Conversion
•Single 1.6V to 3.6V Supply DESCRIPTION
•Preprocessing to Reduce Bus Activity The TSC2020 is a very low power, resistive touch
•I2C Interface Supports Standard, Fast, and screen controller designed to work with
High-Speed Modes power-sensitive, handheld applications that are based
on advanced low-voltage processors. This device
•Internal Detection of Screen Touch works with a supply voltage as low as 1.6V that can
•Register-Based, Programmable: be supplied by a single-cell battery. The TSC2020
–Sampling Rates, System Timing, Zoning, contains a complete, ultra-low power, 12-bit,
Normal/Fast Scan Mode analog-to-digital converter (ADC) including sensor
drivers and the control logic to measure touch
•On-Chip Temperature Measurement pressure. Unlike other resistive touch screen
•Auto Power-Down Control controllers, the TSC2020 is capable of detecting at
•Low Power: least three touches simultaneously and delivers a
very low power standby touch detection scheme. This
–70.72µW at 1.6V, at 8.2kSPS Eq Rate, ST flexibility allows for many new applications that
–87.5µW at 1.8V, at 8.2kSPS Eq Rate, ST require multiple touches but must remain at low
–675µW at 1.8V, at 250SSPS Worst-Case, MT power.
(average 300µW at 1.8V, 50SSPS, 3T) The TSC2020 supports the I2C serial bus and data
•Enhanced ESD Protection to Assist IEC transmission protocol for all three defined modes:
Testing: standard, fast, and high-speed. The TSC2020 offers
– ±12kV Air programmable resolution, single-/multi-touch modes
to accommodate different screen types, sizes, and
– ±11kV Contact application needs.
•Packages: 5 ×5 QFN-32, 2.5 ×2.5 WCSP(1) The TSC2020 is available in a 32-pin 5 ×5 QFN
(1) WCSP (YZK) package available Q2, 2011. package, and is characterized for the –40°C to +85°C
U.S. Patent Nos. 6,246,394; 7,812,830; other patents pending. industrial temperature range.
Functional Block Diagram
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2I2C is a trademark of NXP Semiconductors.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright ©2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TSC2020
SBAS536B –FEBRUARY 2011–REVISED MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TYPICAL TYPICAL NO MISSING
INTEGRAL GAIN CODES SPECIFIED TRANSPORT
LINEARITY ERROR RESOLUTION PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT (LSB) (LSB) (BITS) TYPE DESIGNATOR RANGE MARKING NUMBER QUANTITY
Small Tape
TSC2020IRTVT
32-Pin, and Reel, 250
0.75 ×5 x 5 RTV –40°C to +85°C TSC2020I Tape and
Thin QFN TSC2020IRTVR Reel, 3000
TSC2020I ±0.5 +0.1 11 Small Tape
25-Pin TSC2020IYZKT and Reel, 250
2.5 ×2.5 YZK(2) –40°C to +85°C TSC2020I
WCSP Tape and
TSC2020IYZKR
5×5 Matrix Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or visit
the device product folder at www.ti.com.
(2) WCSP (YZK) package available Q2, 2011.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted). TSC2020 UNIT
Analog inputs Xi+, Xi–, Yj+, Yj–, AUX to GND –0.4 to VDD + 0.1 V
Voltage range VDD to GND –0.3 to 5 V
Digital pin voltages to GND –0.3 to 5 V
Operating free-air temperature range, TA–40 to +85 °C
Storage temperature range, TSTG –65 to +150 °C
Junction temperature, TJMax +150 °C
IEC contact discharge(2) Xi+, Xi–, Yj+, Yj– ±11 kV
IEC air discharge(2) Xi+, Xi–, Yj+, Yj– ±12 kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.
THERMAL INFORMATION TSC2020
THERMAL METRIC(1) RTV YZK UNITS
32 PINS 25 PINS
θJA Junction-to-ambient thermal resistance 32.1 99.4
θJCtop Junction-to-case (top) thermal resistance 15.4 5.5
θJB Junction-to-board thermal resistance 5.8 35 °C/W
ψJT Junction-to-top characterization parameter 0.2 13.0
ψJB Junction-to-board characterization parameter 5.7 37.7
θJCbot Junction-to-case (bottom) thermal resistance 1.2 N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2Submit Documentation Feedback Copyright ©2011, Texas Instruments Incorporated
Product Folder Link(s): TSC2020
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TSC2020IRTVR ACTIVE WQFN RTV 32 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TSC2020IRTVT ACTIVE WQFN RTV 32 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TSC2020IRTVR WQFN RTV 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
TSC2020IRTVT WQFN RTV 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TSC2020IRTVR WQFN RTV 32 3000 367.0 367.0 35.0
TSC2020IRTVT WQFN RTV 32 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Aug-2012
Pack Materials-Page 2
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