Semiconductor Components Industries, LLC, 2004
March, 2004 − Rev. 2 1Publication Order Number:
SMDA05−6R2/D
SMDA05−6R2
Unidirectional TVS Array for
High−Speed Data Line
Protection
The SMDA05−6R2 transient voltage suppressor is designed to
protect equipment attached to up to six high speed communication
lines from ESD, EFT, and lightning.
Features:
SO−8 Package
Peak Power − 400 Watts 8 x 20 S
ESD Rating:
IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact)
IEC 61000−4−4 (EFT) 40 A (5/50 ns)
IEC 61000−4−5 (lightning) 12 (8/20 s)
UL Flammability Rating of 94 V−0
Typical Applications:
High Speed Communication Line Protection
5.0 V Data and I/O Lines
Microprocessor Based Equipment
LAN/WAN Equipment
Servers
Notebook and Desktop PC
Instrumentation
Peripherals
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation
8 x 20 s @ TA = 25°C (Note 1) Ppk 400 W
Peak Pulse Current
8 x 20 s @ TA = 25°C (Note 1) IPP 17 A
Junction and Storage
Temperature Range TJ, Tstg 55 to
+150 °C
Lead Solder Temperature −
Maximum 10 Seconds Duration TL260 °C
1. Non−repetitive current pulse 8 x 20 S exponential decay waveform
SO−8
VOLTAGE SUPPRESSOR
300 WATTS PEAK POWER
6 VOLTS
1
SMDA5 = Device Code
L = Location Code
Y = Year
WW = Work Week
MARKING DIAGRAM
Device Package Shipping
ORDERING INFORMATION
SMDA05−6R2 SO−8 2500 Tape & Reel
SMDA5
LYWW
SO−8
CASE 751
PLASTIC
2
3
4
8
7
6
5
PIN CONFIGURATION
AND SCHEMATIC
PINS 1−5: CATHODE
PINS 6−7: ANODE
PIN 8: CATHODE
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8
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
SMDA05−6R2
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ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
Reverse Breakdown Voltage @ It = 1.0 mA VBR 6.0 V
Reverse Leakage Current @ VRWM = 5.0 Volts IRN/A 20 A
Maximum Clamping Voltage @ IPP = 1.0 A, 8 x 20 S VCN/A 9.8 V
Maximum Clamping Voltage @ IPP = 5.0 A, 8 x 20 S VCN/A 11 V
Maximum Peak Pulse Current IPP 17 A
% OF PEAK PULSE CURRENT
Figure 1. Pulse Width Figure 2. 8 × 20 s Pulse Waveform
100
10
11 10 100 1000
t, TIME (s)
1000
NOTE: Non−Repetitive Surge.
100
90
80
70
60
50
40
30
20
10
0020406080
t, TIME (s)
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 s
PEAK VALUE IRSM @ 8 s
HALF VALUE IRSM/2 @ 20 s
Ppk, PEAK SURGE POWER (WATTS)
SMDA05−6R2
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PACKAGE DIMENSIONS
SO−8
CASE 751−07
ISSUE AB
SEATING
PLANE
1
4
58
N
J
X 45
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDAARD IS 751−07
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) Z SXS
M

*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
0.6
0.024 1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
SMDA05−6R2
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SMDA05−6R2/D
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