© Semiconductor Components Industries, LLC, 2015
December, 2019 Rev. 2
1Publication Order Number:
US1MFA/D
Super Fast Surface Mount
Rectifiers
US1AFA-US1MFA
Features
Glass Passivated Chip Junction
Low Power Loss, High Efficiency
Fast Switching Reverse Recovery Time: 50~75 ns Maximum
High Surge Capacity
UL Flammability 94V0 Classification
MSL 1 per JSTD020
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ101
Qualified and PPAP Capable
These Devices are PbFree, Halogen Free and are RoHS Compliant
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SOD123FL
CASE 425AB
MARKING DIAGRAM
$Y = ON Semiconductor Logo
&Z = Assembly Plant Code
H*L = Specific Device Code
* = A/B/D/F/G/J/K/M
&G = 1Digit Weekly Date Code (Week)
See detailed ordering and shipping information on page 2 of
this data sheet.
ORDERING INFORMATION
&Y
&ZH*L&G
1
2
1
Cathode
2
Anode
US1AFAUS1MFA
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2
ABSOLUTE MAXIMUM RATINGS (Values are at TA = 25°C unless otherwise noted)
Symbol Parameter
US1
AFA
US1
BFA
US1
DFA
US1
FFA
US1
GFA
US1
JFA
US1
KFA
US1
MFA Unit
VRRM Repetitive Peak Reverse Voltage 50 100 200 300 400 600 800 1000 V
VRMS RMS Reverse Voltage 35 70 140 210 280 420 560 700 V
VRDC Blocking Voltage 50 100 200 300 400 600 800 1000 V
IF(AV) Average Forward Rectified Current 1 A
IFSM Peak Forward Surge Current: 8.3 ms Single Half
SineWave Superimposed on Rated Load
30 A
TJOperating Junction Temperature Range 55 to +150 °C
TSTG Storage Temperature Range 55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (Values are at TA = 25°C unless otherwise noted)
Symbol Parameter Value Unit
YJL Typical Thermal Resistance, Junction to Lead 21 °C/W
RθJA Typical Thermal Resistance, Junction to Ambient 153 °C/W
NOTE: Device mounted at minimum pad.
ELECTRICAL CHARACTERISTICS (Values are at TA = 25°C unless otherwise noted)
Symbol Parameter Conditions US1
AFA
US1
BFA
US1
DFA
US1
FFA
US1
GFA
US1
JFA
US1
KFA
US1
MFA
Unit
VFMaximum Instantaneous Forward
Voltage (Note 1)
IF = 1 A 0.95 1.30 1.70 V
IRMaximum Reverse Current at
Rated VR
TJ = 25°C5mA
TJ = 125°C150
CJTypical Junction Capacitance VR = 4.0 V,
f = 1.0 MHz
20 15 pF
Trr Maximum Reverse Recovery
Time
IF = 0.5 A,
IR = 1 A,
Irr = 0.25 A
50 75 ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse test with PW = 300 ms, 1% duty cycle.
ORDERING INFORMATION
Part Number Top Mark Package Shipping
US1AFA, NRVUS1AFA* HAL SOD123FL
(PbFree / Halogen Free)
3,000 / Tape & Reel
US1BFA, NRVUS1BFA* HBL
US1DFA, NRVUS1DFA* HDL
US1FFA, NRVUS1FFA* HFL
US1GFA, NRVUS1GFA* HGL
US1JFA, NRVUS1JFA* HJL
US1KFA, NRVUS1KFA* HKL
US1MFA, NRVUS1MFA* HML
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP
Capable
US1AFAUS1MFA
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3
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 1. Maximum Forward Current Derating
Voltage
Figure 2. Typical Reverse Characteristics
Figure 3. Maximum NonRepetitive Forward Surge
Current
Figure 4. Typical Instantaneous Forward
Characteristics
Figure 5. Typical Junction Capacitance Figure 6. Reverse Recovery Time Characteristic
and Test Circuit Diagram
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
INSTANTANEOUS REVERSE CURRENT
( A)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TJ=25
TJ=125
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
8.3 ms Single Half Sine Wave
INSTANTANEOUS FORWARD
CURRENT (A)
FORWARD VOLTAGE (V)
US1AFAUS1DFA
US1GFA
US1JFAUS1MFA
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
US1AFAUS1GFA
US1JFAUS1MFA
SOD123FL
CASE 425AB
ISSUE O
DATE 31 AUG 2016
1.40
1.20
1.90 1.40
1.20
4.30
1.43
1.23
0.30
0.16
3.80
3.40
1.90
1.70
2.90
2.70
1.20
0.80
0.85
0.35 2.60
2.45 NOTES:
A. NO INDUSTRY STANDARD APPLIES TO THIS
PACKAGE.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
TOP VIEW
LAND PATTERN RECOMMENDATION
BOTTOM VIEW
FRONT VIEW
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13722G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SOD123FL
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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1
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